丄 九、發明說明： ·.【發明所屬之技術領域】 • 本發明涉及一種散熱装置，尤其涉及一種用於電子元 件散熱之散熱裝置。 【先前技術】 中央處理器等電子元件在運行過程中產生大量之熱， 為確保電子元件之正常運行，其產生之熱量需及時地散發 •出去。通常，該電子元件上加裝一散熱器以為其散熱。 由鋁擠一體成型之散熱器常被用來為所述電子元件散 熱。該種鋁擠型散熱器通常包括一底板及從該底板一表面 .一體延伸之複數鰭片。使用時，該底板緊貼發熱電子元件 •而吸收該電子元件產生之熱，該底板上之熱量進而傳遞至 該鰭片而散發至周圍空間。然而，由於材料之傳熱性能等 因素之影響’該底板從電子元件吸收之熱量不能很快地到 鲁達所述鰭片遠離該底板之部位，而使該鰭片不能充分地利 用’電子元件產生之熱量不能及時地散發出去。為解決所 述問題，另一種散熱器用來散發電子元件產生之熱量，該 種散熱器包括一 “T”形導熱體及與該導熱體結合之散熱 體。該導熱體包括一較大之吸熱部及從該吸熱部一體延伸 之縱長導熱部。該散熱體設有一收容該導熱體導熱部之容 置孔。使用時，該導熱體之吸熱部從發熱電子元件吸熱， 該吸熱部上之熱量通過導熱部傳遞至散熱體而由該散熱體 散發出去。然而，該種散熱器之導熱體與散熱體之結合較 7 1321443 為麻煩，且導熱體和散熱體之間容易產生較大之熱阻，& 而影響該散熱器之散熱性能。故該散熱器需進—步地改進~ 【發明内容】 ° 有鑒於此’實有必要提供一種散熱性能良好之散熱事 一種散熱裝置，其包括一底板，位於該底板上之二散 熱器及連結該底板和該二散熱器之二熱管，每—散熱器^ |括一導熱板及從該導熱板兩相對侧面向外延伸之複數第— 鰭片及複數第二鰭片，該導熱板垂直於該底板，該二散熱 之第一鰭片位於該二散熱器之二導熱板之間，每一熱管 包括一結合至邊底板之第一傳熱段及遠離該底板之二第二 傳熱段，其中一熱管之二第二傳熱段結合至其中—散^ 之導熱板’另一轨管之-筮-德拍P从人 ”'、6之一苐一傳熱段結合至另一散熱器之 …、反，S亥一散熱器於其二導熱板之間形成二上下貫通且 t可用來通風的通槽’該二熱管之第二傳熱段位於該通槽内。 與習知技術相比，所述二散熱器之 述吸熱底板，所料管連龄㈣直於所 ☆ ^ …、s運接5亥底板及該導熱板，從而將該 底板上之熱量均勻分佈至 ^ 饰至該寺熱板，進而均勻地到達該二 政‘.、、态之弟一鰭片和第_ 散熱性能提升。弟--片而放發出去’該散熱裝置之 【實施方式】 上之：：閲=至圖4，本發明散熱裝置用於對設於電路板 Y放熱。4散熱裝置包括一底板1〇、位於該底 8 1321443 板10上之二散熱器30及連接該底板10和散熱器30之二熱管 .20 ° . 所述底板10為一導熱性能良好之方形板體，該底板10 之上表面於其相對兩邊部設有二平行溝槽111，以結合所述 二熱管20。 所述二熱管20均呈“U”形。每一熱管20包括一第一傳 熱段211及從該第一傳熱段211兩端垂直於該第一傳熱段 擊211延伸之二平行第二傳熱段213。該第一傳熱段211和第二 傳熱段213之連接處呈弧形。 所述二散熱器30均由鋁擠一體成型。每一散熱器30包 括一縱長導熱板310及從該導熱板310相對兩側向外延伸之 複數第一鰭片330及複數第二鰭片350。該導熱板310為一個 方形板體，其具有豎直方向上相對之第一表面（未標示） 和第二表面（未標示），該第一鰭片330從該第一表面且垂 直於該第一表面向外延伸而出，該複數第一鰭片330以一定 •間隔相互平行，每一第一鰭片330上下貫穿該導熱板310之 第一表面。該第二鰭片350從該第二表面且垂直於該第二表 面向外延伸而出，該複數第二鰭片350以一定間隔相互平 行，每一第二鰭片350上下貫穿該導熱板310之第二表面。 該第一鰭片330之長度在垂直於導熱板310方向上大於該第 二鰭片350在該方向上之長度，每一第二鰭片350之長度大 致為每一第一鰭片330長度之一半。該導熱板310之第二表 面設有豎直方向上平行之二凹槽311，以結合所述熱管20之 第二傳熱段213。每一散熱器30於對應該凹槽311處無第二 9 1321443 鰭片設置，從而於二第二鰭片350之間形成與相應凹槽311 ， 相連通之缺槽（未標示）。該複數第一鰭片330之間形成複 數氣流通道，該複數第二鰭片350之間形成複數氣流通道。 所述風扇40具有一葉輪（未標示），該葉輪包括一中 央輪轂部（未標示）及從該輪轂部周圍向外輻射延伸之複 數葉片（未標示）。 組裝時，所述二熱管20之第一傳熱段211結合至所述底 _板10之溝槽111内。該二第二熱管20之第二傳熱段213大致 垂直於該底板10向上延伸而結合至所述相對應之散熱器30 之凹槽311内。其中一熱管20之二第二傳熱段213豎直方向 上緊貼其中一散熱器30之導熱板310。另一熱管20之二第二 傳熱段213豎直方向上緊貼另一散熱器30之導熱板310。該 _二散熱器30呈鏡像對稱，該二散熱器30之二導熱板310相互 平行且垂直於該底板10，該二散熱器30之第二鰭片350位於 該二散熱器30之二導熱板310之間，且其端部相對應。該二 #散熱器30之第一鰭片330於該二導熱板310外侧向外延伸。 該二散熱器30之缺槽相對連通形成位於該二導熱板310之 間之通槽360。該通槽360自上而下貫通該二散熱器30，該 二熱管20之第二傳熱段213位於該二通槽360内。所述風扇 40固定至該二散熱器30之頂端。該風扇40之輪轂部位於該 二散熱器30之二導熱板310之間，且位於該二通槽360之 間，該二通槽360對應該風扇40之葉片。 使用時，所述底板10緊貼發熱電子元件而吸收該電子 元件產生之熱量，該底板10上之熱量由所述熱管20之第一 1321443 傳熱部211吸收，而通過該熱管20之第二傳熱段213傳遞至 所述二散熱器30之導熱板310。該導熱板310上之熱量進而 到達該二散熱器30之第一鰭片330及第二鰭片350。在所述 風扇40之輔助下，該第一鰭片330、第二鰭片350、導熱板 310及熱管20之第二傳熱段213上之熱量快速地散發至周圍 空間。IX. Description of the invention: 1. Technical field to which the invention pertains. The present invention relates to a heat sink, and more particularly to a heat sink for heat dissipation of electronic components. [Prior Art] Electronic components such as a central processing unit generate a large amount of heat during operation. To ensure the normal operation of electronic components, the heat generated by them must be dissipated in time. Usually, a heat sink is attached to the electronic component to dissipate heat therefrom. A heat sink integrally molded from aluminum is often used to dissipate heat from the electronic components. The aluminum extruded heat sink generally comprises a bottom plate and a plurality of fins extending integrally from a surface of the bottom plate. In use, the bottom plate is in close contact with the heat-generating electronic component. • The heat generated by the electronic component is absorbed, and the heat on the bottom plate is further transmitted to the fin to be radiated to the surrounding space. However, due to factors such as the heat transfer performance of the material, the heat absorbed by the substrate from the electronic component cannot be quickly reached to the portion of the Ruda from the bottom plate, so that the fin cannot fully utilize the 'electronic component. The heat generated cannot be dissipated in time. In order to solve the problem, another heat sink is used to dissipate the heat generated by the electronic component. The heat sink includes a "T" shaped heat conductor and a heat sink combined with the heat conductor. The heat conductor includes a larger heat absorbing portion and an elongated heat conducting portion integrally extending from the heat absorbing portion. The heat dissipating body is provided with a receiving hole for receiving the heat conducting portion of the heat conductor. In use, the heat absorbing portion of the heat conductor absorbs heat from the heat generating electronic component, and the heat on the heat absorbing portion is transmitted to the heat radiating body through the heat conducting portion, and is radiated from the heat radiating body. However, the combination of the heat conductor of the heat sink and the heat sink is more troublesome than the 7 1321443, and a large thermal resistance is easily generated between the heat conductor and the heat sink, and the heat dissipation performance of the heat sink is affected. Therefore, the heat sink needs to be improved step by step. [Inventive content] ° In view of this, it is necessary to provide a heat dissipating device with good heat dissipation performance, which includes a bottom plate, two heat sinks and connections on the bottom plate. The bottom plate and the two heat pipes of the two heat sinks each include a heat conducting plate and a plurality of first fins and a plurality of second fins extending outward from opposite sides of the heat conducting plate, the heat conducting plate being perpendicular to The bottom plate, the first fins of the two heat dissipation are located between the two heat conducting plates of the two heat sinks, and each heat pipe comprises a first heat transfer section coupled to the side bottom plate and two second heat transfer sections away from the bottom plate. The second heat transfer section of one of the heat pipes is coupled to the heat-dissipating plate of the other--the other track--the 轨-德拍P is coupled to the other heat sink from one of the heat transfer sections of the person In the opposite direction, a heat sink is formed between the two heat conducting plates, and two through holes are provided for ventilation. The second heat transfer section of the two heat pipes is located in the through groove. Than, the heat sink of the two radiators, the length of the tube (four) is straighter than ☆ ^ ..., s transport 5 hai floor and the heat conduction plate, so that the heat on the bottom plate is evenly distributed to the temple hot plate, and then evenly reach the second dynasty. And the _ heat dissipation performance is improved. The younger--the film is released to the 'the heat sink'. [Embodiment] On::== Figure 4, the heat sink of the present invention is used to dissipate the heat provided on the circuit board Y. 4 heat dissipation The device comprises a bottom plate 1 , two heat sinks 30 on the bottom plate 13 1321443 , and two heat pipes connected to the bottom plate 10 and the heat sink 30 . The bottom plate 10 is a square plate body with good thermal conductivity. The upper surface of the bottom plate 10 is provided with two parallel grooves 111 on opposite sides thereof to join the two heat pipes 20. The two heat pipes 20 are all in a "U" shape. Each heat pipe 20 includes a first heat transfer section. And a second parallel second heat transfer section 213 extending from the first heat transfer section 211 perpendicular to the first heat transfer section 211. The junction of the first heat transfer section 211 and the second heat transfer section 213 The two heat sinks 30 are integrally formed by extrusion of aluminum. Each heat sink 30 includes a longitudinal heat conducting plate 310 and The heat conducting plate 310 has a plurality of first fins 330 and a plurality of second fins 350 extending outwardly from opposite sides of the heat conducting plate 310. The heat conducting plate 310 is a square plate body having a first surface opposite to the vertical direction (not labeled) And a second surface (not shown), the first fin 330 extends outwardly from the first surface and perpendicular to the first surface, and the plurality of first fins 330 are parallel to each other at a certain interval, each of the first A fin 330 extends up and down through the first surface of the heat conducting plate 310. The second fin 350 extends outwardly from the second surface and perpendicular to the second surface, and the plurality of second fins 350 are mutually spaced at intervals Parallelly, each second fin 350 extends up and down through the second surface of the heat conducting plate 310. The length of the first fin 330 is greater than the length of the second fin 350 in the direction perpendicular to the heat conducting plate 310. Each second fin 350 has a length that is approximately one-half the length of each first fin 330. The second surface of the heat conducting plate 310 is provided with two grooves 311 which are parallel in the vertical direction to join the second heat transfer portion 213 of the heat pipe 20. Each of the heat sinks 30 has no second 9 1321443 fins disposed at the corresponding recesses 311, so that a gap (not labeled) is formed between the second and second fins 350 to communicate with the corresponding recesses 311. A plurality of airflow channels are formed between the plurality of first fins 330, and a plurality of airflow channels are formed between the plurality of second fins 350. The fan 40 has an impeller (not shown) that includes a central hub portion (not labeled) and a plurality of blades (not labeled) that radiate outwardly from around the hub portion. When assembled, the first heat transfer section 211 of the two heat pipes 20 is incorporated into the grooves 111 of the bottom plate 10. The second heat transfer section 213 of the second heat pipe 20 extends upwardly substantially perpendicular to the bottom plate 10 to be coupled into the recess 311 of the corresponding heat sink 30. The heat transfer plate 310 of one of the heat pipes 20 and the second heat transfer portion 213 of the heat pipe 20 lie in the vertical direction. The second heat transfer section 213 of the other heat pipe 20 is in close contact with the heat conducting plate 310 of the other heat sink 30 in the vertical direction. The two heat sinks 30 are mirror-symmetrical, and the two heat spreaders 310 of the two heat sinks 30 are parallel to each other and perpendicular to the bottom plate 10. The second fins 350 of the two heat sinks 30 are located on the two heat spreaders of the two heat sinks 30. Between 310, and its ends correspond. The first fins 330 of the two heat sinks 30 extend outwardly outside the two heat conducting plates 310. The slots of the two heat sinks 30 are relatively connected to each other to form a through slot 360 between the two heat conducting plates 310. The through slot 360 extends through the two heat sinks 30 from top to bottom. The second heat transfer section 213 of the two heat pipes 20 is located in the two-way groove 360. The fan 40 is fixed to the top end of the two heat sinks 30. The hub portion of the fan 40 is located between the two heat conducting plates 310 of the two heat sinks 30 and is located between the two through slots 360, and the two-way slots 360 correspond to the blades of the fan 40. In use, the bottom plate 10 abuts the heat-generating electronic component to absorb the heat generated by the electronic component, and the heat on the bottom plate 10 is absorbed by the first 1321443 heat transfer portion 211 of the heat pipe 20, and passes through the second heat pipe 20 The heat transfer section 213 is transferred to the heat conducting plate 310 of the two heat sinks 30. The heat on the heat conducting plate 310 further reaches the first fins 330 and the second fins 350 of the two heat sinks 30. With the aid of the fan 40, the heat on the first fin 330, the second fin 350, the heat conducting plate 310 and the second heat transfer section 213 of the heat pipe 20 is quickly radiated to the surrounding space.
與習知技術相比，所述底板10從發熱電子元件吸收之 熱量通過所述熱管20傳遞至二鋁擠型散熱器30之導熱板 310，由於熱管20迅速之穿熱性能且該導熱板310垂直該底 板10、該熱管20之第二傳熱段213在豎直方向上緊貼該二散 熱器30之導熱板310，從而使發熱電子元件產生之熱量均勻 地分佈至該導熱板310，進而均勻地到達該二散熱器30之第 一鰭片330及第二鰭片350散發出去。另外，該二散熱器30 之導熱板310位於所述風扇40之輪轂部之外，該風扇40產生 之氣流直接吹向該導熱板310而帶走該導熱板310上之部分 熱量。該二散熱器30對應熱管20處形成上下貫通之通槽 360，且該通槽360對應該風扇40之葉片，從而該風扇40產 生之氣流直接吹向該熱管20之第二傳熱段213及該底板 10，將熱量更快地散發出去。 可以理解地，所述每一熱管20之二第二傳熱段213可以 分別結合至所述二散熱器30之導熱板310。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 π 變化，皆應涵蓋於以下之申請專利範圍内 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係圖1中散熱器立體圖。 圖3係圖1之部分組裝圖。Compared with the prior art, the heat absorbed by the bottom plate 10 from the heat-generating electronic component is transmitted to the heat-conducting plate 310 of the two-aluminum extruded heat sink 30 through the heat pipe 20, because the heat pipe 20 quickly wears heat and the heat-conducting plate 310 The bottom plate 10 and the second heat transfer portion 213 of the heat pipe 20 are vertically adjacent to the heat conducting plate 310 of the two heat sinks 30, so that the heat generated by the heat generating electronic components is evenly distributed to the heat conducting plate 310, and further The first fins 330 and the second fins 350 that uniformly reach the two heat sinks 30 are emitted. In addition, the heat conducting plate 310 of the two heat sinks 30 is located outside the hub portion of the fan 40, and the airflow generated by the fan 40 is directly blown toward the heat conducting plate 310 to take away part of the heat on the heat conducting plate 310. The two heat sinks 30 form a through-hole 360 corresponding to the heat pipe 20, and the through-hole 360 corresponds to the blade of the fan 40, so that the airflow generated by the fan 40 is directly blown to the second heat transfer section 213 of the heat pipe 20 and The bottom plate 10 dissipates heat more quickly. It can be understood that the second heat transfer segments 213 of each of the heat pipes 20 can be respectively coupled to the heat conducting plates 310 of the two heat sinks 30. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalent modifications or π variations in the spirit of the present invention. Brief Description of the Drawings Fig. 1 is an exploded perspective view of a heat sink of the present invention. 2 is a perspective view of the heat sink of FIG. 1. Figure 3 is a partial assembled view of Figure 1.
圖4係圖1之組裝 圖。 要元件符號說明 ] 底板 10 溝槽 熱管 20 第一傳熱段 第二傳熱段 213 散熱器 導熱板 310 凹槽 第一鰭片 330 第二縛片 通槽 360 風扇 111 211 30 311 350 40 12Figure 4 is an assembled view of Figure 1. Element symbol description] Base plate 10 Groove Heat pipe 20 First heat transfer section Second heat transfer section 213 Heat sink Heat transfer plate 310 Groove First fin 330 Second die Passing groove 360 Fan 111 211 30 311 350 40 12