1324641 九、發明說明： 【發明所屬之技術領域】 一種電鍍裝置與遮板’尤指一種電路板之電鐘裝置與遮 板。 【先前技術】 現今大多數的電子產品，都必需藉由印刷電路板(printed circuit board，PCB)來嵌載各種電子零組件。所以，〆項電 子產品的性能優劣或耐用程度，與印刷電路板的電鍍品 * 質、設計良窳有很大的關係。 請參閱第1圖’第1圖係為一習知印刷電路板電鍍裝置 之示意圖。如第1圖所示，電鍍裝置係一框架10，其二側 設置數個由鈦金屬製成之鈦籃(titanium basket)12,其具有 可導電且不被電解析之特性，故鈦籃丨2内可分別設置一可 電解出1%離子金屬之陽極金屬材料(an〇de nugget)，如銅金 # 屬塊’同時一待電鍍之基板2〇係設置於框架1〇中。接下 來框架10、鈦籃12、以及基板20係一同浸入一充滿電锻 溶液(plating bath)之電鍍槽（未繪示）中進行電鍍製程。電 鍍製程中，鈦籃12内之銅金屬塊係與陽極導通，而基板 20係與陰極導通，而連通陽極之銅金屬塊係適度電解於電 鍍溶液中形成銅離子’並隨電力線游離至與陰極導通之基 板20表面’以形成一電鍍積層。 1324641 請參閱第2圖與第3圖，第2圖係為一習知遮板之示意 圖；第3圖係為第2圖之部分放大示意圖。由於一般電鍍 槽之特性，其上、下端電流明顯大於中間部位，而鍍層之 厚度又與電流大小有關，因應此電流差異造成電路電鍍積 層厚度不均之狀況，習知技術係於框架10中基板20之二 侧分別設置一遮板30，並如第2圖所示，遮板30係於上、 下端分別設置一固定式遮條32，用以避免上述因上下端電 流較大造成電鍍積層厚度不均之狀況。 請繼續參閱第2圖與第3圖。遮板30更包含有複數個 大小、排列方式固定之開孔34，用以減緩銅離子游離至基 板20表面之速度。如第3圖所示，由於銅離子係於電鍍溶 液中隨電力線36游離至基板20表面，而電力線36會隨開 孔34聚集在框架10之橫截面方向上，開孔34處相對之基 板20可獲得較厚之電鍍積層；而受到遮板30遮蔽之基板 20則獲得較薄之電鍍積層，甚至無電鍍積層。 請再參閱第1圖。由於銅金屬塊電解時，解離出來之銅 離子除隨電力線分佈外，尚有由離子濃度高處往離子濃度 低處移動之擴散特性。而習知電鍍裝置中，遮板30之設置 係相對較靠近具銅金屬塊之鈦籃12，但相對較遠離基板 20，此配置關係造成遮板30相對於銅金屬塊之一側銅離子 濃度較高；而遮板30相對於基板20之一側銅離子濃度較 1324641 • 低，故銅離子將以開孔34為中心向周圍擴散。而擴散出去 的銅離子，亦游離至基板20表面形成電鍍積層，換句話 說，原本使用遮板30減緩銅離子游離至基板20表面之速 ' 度，或避免銅離子游離至基板20不欲形成電鍍積層部位之 實際效果有限。 另外，習知遮板30係具有固定式開孔34，因此每當待 電鍍之基板20尺寸不一，或基板20待電鍍圖案不同時， • 必須手動調整遮板30之定置位置，或更換具不同開孔尺寸 或不同開孔排列方式之遮板30，以調整電力線的分布位 . 置；甚或採用多鍍槽式生產方式。而上述解決方式不僅繁 瑣不方便，有損於電鍍效率；更換電鍍槽之法更可能由於 各電鍍槽中不一致之條件造成電鍍積層厚度分佈不均之缺 點，而降低良率。另外，上述方法需要具有不同開孔尺寸 與開孔排列方式之遮板，且仍未能解決銅離子擴散問題。 【發明内容】 因此本發明之主要目的係提供一種電鍍裝置與遮板，以 解決上述習知電鍍裝置所造成之電鍍基板效率、電鍍均勻 性與良率不彰之問題。 根據本發明之申請專利範圍，係提供一種電鍍裝置，包 含有一用以容置至少一生產板之框架，以及一對遮板，設 1324641 ， 置於該框架中，且分別設置於該生產板之兩側。而該遮板 包含有一遮板框，形成至少一中空部分、至少一可調式子 · 遮板，用以可調整的遮蔽該中空部分並形成至少一遮蔽圖 * 案、以及一至少覆蓋該中空部分之過濾膜。 . 根據本發明之申請專利範圍，更提供一種電鍍遮板，包 含有一遮板框，用以形成至少一中空部分、至少一可調式 子遮板，用以可調整的遮蔽該中空部分並形成至少一遮蔽 • 圖案、以及一至少覆蓋該中空部分之過濾膜。 本發明所提供之電鍍裝置與遮板係利用遮板所包含之 遮板框與至少一可調式子遮板，可根據不同尺寸之待電鍍 基板與不同電鍍圖案調整該等可調式子遮板，以於同一電 鍍槽與同一電鍍製程中得到具不同電鍍圖案之基板，該等 可調式子遮板之使用更避免購買數種不同開孔尺寸與不同 $ 開孔排列方式之遮板需求，進而降低設備成本。 【實施方式】 請同時參閱第4圖與第5圖，第4圖與第5圖分別為本 發明所提供之電鍍遮板之一較佳實施例之正視圖與背視 圖。如第4圖與第5圖所示，本發明所提供之電鍍遮板40 • 包含有一遮板框42，如一矩形框，用以形成至少一中空部 分44、至少一可調式子遮板46，相對於中空部分44之至 8 1324641 少一内緣呈平行、垂直或傾斜設置、以及一過濾膜48 (示 於第4圖），至少覆蓋部分遮板框42、可調式子遮板46以 及中空部分44，並藉由一組第二固定件（圖未示），例如 可夾箝過濾膜48之夾頭，固定於遮板框上42。過濾膜48 可為一雜質過濾膜或一電力線均佈膜，如一多孔性聚丙烯 (porous polypropylene)布0 值得注意的是，可調式子遮板46之位置與數量皆可調 • 整，以遮蔽中空部分44並形成至少一遮蔽圖案。而依據產 品規格及電鍍圖案之要求調整完可調式子遮板46之位置 後，可調式子遮板46可分別藉由一組第一固定件（圖未 示），例如螺絲或卡循，固定於遮板框42上。 由於本發明所提供之可調式子遮板46之數量與位置係 可根據不同產品之要求調整，因此根據本發明所提供之電 I 鍍遮板40係可於同一電鍍槽與同一電鍍製程中得到具不 同電鍍圖案之基板，解決習知電鍍製程中，更換不同開口 尺寸遮板等繁瑣複雜之方法，而提高電鍍效率；同時避免 更換電鍍槽而造成電鍍積層厚度不均之缺點，而提高良 率。另外，根據本發明所提供電鍍基板，更可避免習用購 置數種具不同開孔尺寸與開孔排列方式之遮板需求，進而 降低設備成本。 1324641 ' 接下來請參閱第6圖，第6圖係為本發明所提供之電鍍 裝置之一較佳實施例之示意圖。如第6圖所示，一種電鍍 ^ 裝置，包含有一用以容置至少一生產板50之框架6〇，以 • 及一對電鍍遮板40。電鍍遮板40係設置於框架6〇中，且 分別設置於生產板5〇之兩側。電鍍遮板4〇包含有一遮板 框42，如一矩形框，用以形成至少一中空部分44、至少一 可調式子遮板46，相對於中空部分44之至少—内緣呈平 行、垂直，傾斜設置，並藉由一第一固定件，例如螺絲或 • 卡循，固定於遮板框42上、以及一過濾膜48，至少覆蓋 中空部分44，並藉由一組第二固定件固定於遮板框上=。 過濾膜48可為一雜質過濾膜或一電力線均佈獏，如一多孔 性聚丙烯布。由於電鍍遮板40之實施樣態與功致係與本發 明所提供之電鍍遮板實施例與第4圖及第5圖所示相同， 故於此不再贅述。再者，該生產板50可選自基板 (substrate)、導線架（lead frame) ’或其他待加工之板體 請繼續參閱第6圖。根據本發明所提供之較佳實施例， 框架60更包含有複數個鈦籃62(或其他惰性材質製成β之籃 體），以供容置至少一種陽極金屬材料，例如鋼 '鋁、鎳、 金，設置於框架60之内部周圍，同時生產板5〇係作為陰 極。另外電鍍遮板40之面積係大於生產板5〇之面積，且 為一不導電板體。 值得注意的是’如第6圖所示，本 置中，電鍍遮板40與生產柘+ μ h供之電鍍駿 框架6。内侧)與生產板5〇之間距的金，(或 遮板4〇之設置係相對較靠近生產板50，同時相^電鍍 銘藍62之陽極金屬材料。如該領域具通常知識者戶T遠離 近陽極金屬材料62部分之電鑛溶液中知’靠 解金由屬離子’而金屬離子係由漠度較高處向濃:較; 故=離子可於陽極金屬材料62與電㈣板4。間^ 大1擴散’使電鍵遮板40兩侧之金屬離子濃度差異降 ==程中’金屬離子之游離完全仰賴電力線 ^ & 又到擴散影響而騎至*欲形成電鍍積層 之雜，故能得到符合期望之均句電鍍積層圖案。 由於本發明所提供之電鍍裝置所包含之電鍍遮板，可依 據不同產品之要求調整其可調式子遮板之數量與位置，因 此根據本發明所提供之電鍍遮板係可於同—電鍍槽與同一 電鑛製私中付到具不同電鍍圖案之基板，同時提高電鍛效 率”良率並避免具不同開孔尺寸之電鍛遮板需求。另外， 根據本發明所提供之電鍍裝置，由於電鑛遮板係較靠近生 產板，電解之陽極金屬材料可獲得較大空間擴散，降低電 鍍遮板兩侧之離子浪度差異，從而使電鑛製程中，金屬離 子之游離兀王仰賴電力線之影響，故能得到符合期望之電 1^24641 錢積層圖案，更提升電鍍生產板之良率。 以上所述僅為本發明之較佳實施例，凡依本發明申請 專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範 圍。 【圖式簡單說明】 第1圖係為一習知印刷電路板電鍍裝置之示意圖。 第2圖係為一習知遮板之示意圖。 第3圖係為第2圖之部分放大示意圖。 第4圊與第5圖係為本發明所提供之電鍍遮板之一較佳實施例之 正視圊與背視圖。 第ό圖係為本發明所提供之電鍍裝置之一較佳實施例之示意圖。 【主要元件符號說明】 10 框架 12 鈦籃 20 基板 30 遮板 32 固定式遮條 34 開孔 36 電力線 40 電鍍遮板 42 遮板框 44 中空部分 46 可調式子遮板 48 過濾膜 50 生產板 60 框架 62 鈦籃1324641 IX. Description of the invention: [Technical field to which the invention pertains] A plating apparatus and a shutter ” particularly an electric clock device and a shutter of a circuit board. [Prior Art] Most electronic products today require a variety of electronic components to be embedded by a printed circuit board (PCB). Therefore, the performance or durability of the electronic products of the electronic products has a great relationship with the quality and design of the printed circuit boards. Please refer to Fig. 1 which is a schematic view of a conventional printed circuit board plating apparatus. As shown in Fig. 1, the electroplating apparatus is a frame 10, and two titanium baskets 12 made of titanium metal are provided on both sides thereof, which are electrically conductive and not electrically analyzed, so the titanium basket is 2, an anode metal material (such as a copper metal block) capable of electrolyzing 1% ionic metal, and a substrate 2 to be plated are disposed in the frame 1〇. Next, the frame 10, the titanium basket 12, and the substrate 20 are immersed together in an electroplating bath (not shown) filled with an electric plating bath to perform an electroplating process. In the electroplating process, the copper metal block in the titanium basket 12 is electrically connected to the anode, and the substrate 20 is electrically connected to the cathode, and the copper metal block connecting the anode is moderately electrolyzed in the plating solution to form copper ions' and is separated from the power line to the cathode. The surface of the substrate 20 is turned on to form a plating laminate. 1324641 Please refer to Fig. 2 and Fig. 3, Fig. 2 is a schematic view of a conventional shutter; Fig. 3 is a partial enlarged view of Fig. 2. Due to the characteristics of the general plating bath, the current at the upper and lower ends is significantly larger than that in the middle portion, and the thickness of the plating layer is related to the magnitude of the current. In view of the uneven current thickness of the circuit plating due to the difference in current, the conventional technique is based on the substrate in the frame 10. A shielding plate 30 is respectively disposed on the second side of the 20th, and as shown in FIG. 2, the shielding plate 30 is respectively provided with a fixed cover 32 at the upper and lower ends, so as to avoid the thickness of the plating layer caused by the large current at the upper and lower ends. Uneven situation. Please continue to see Figures 2 and 3. The shutter 30 further includes a plurality of openings 34 of fixed size and arrangement to slow the release of copper ions to the surface of the substrate 20. As shown in FIG. 3, since the copper ions are separated from the power line 36 to the surface of the substrate 20 in the plating solution, the power line 36 is collected in the cross-sectional direction of the frame 10 with the opening 34, and the substrate 20 is opposed to the opening 30. A thicker plating layer can be obtained; and the substrate 20 shielded by the shutter 30 obtains a thinner plating layer or even an electroless plating layer. Please refer to Figure 1 again. When the copper metal block is electrolyzed, the copper ions dissociated from the power line are distributed, and there is a diffusion characteristic that moves from a high ion concentration to a low ion concentration. In the conventional electroplating apparatus, the shielding plate 30 is disposed relatively close to the titanium basket 12 having the copper metal block, but is relatively far away from the substrate 20. This arrangement relationship causes the copper ion concentration of the shielding plate 30 relative to one side of the copper metal block. Higher; and the copper ion concentration of the shutter 30 on one side of the substrate 20 is lower than 1324641, so the copper ions will spread around the opening 34 as a center. The diffused copper ions are also released to the surface of the substrate 20 to form a plating layer. In other words, the shutter 30 is used to slow the release of copper ions to the surface of the substrate 20, or to prevent the copper ions from being released to the substrate 20. The practical effect of plating the laminate site is limited. In addition, the conventional shutter 30 has a fixed opening 34, so whenever the size of the substrate 20 to be plated is different, or the pattern to be plated of the substrate 20 is different, • the fixed position of the shutter 30 must be manually adjusted, or the replacement device must be replaced. The shutters 30 of different aperture sizes or different aperture arrangements are used to adjust the distribution of the power lines; or even multi-plated production. The above solution is not only cumbersome and inconvenient, but also detrimental to the plating efficiency; the method of replacing the plating bath is more likely to reduce the yield unevenness due to the inconsistent conditions in each plating bath, and reduce the yield. In addition, the above method requires a shutter having a different opening size and opening arrangement, and the copper ion diffusion problem has not been solved. SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a plating apparatus and a shutter to solve the problems of plating substrate efficiency, plating uniformity, and yield caused by the above-described conventional plating apparatus. According to the scope of the invention, there is provided a plating apparatus comprising a frame for accommodating at least one production plate, and a pair of shutters, 13246441, disposed in the frame, and respectively disposed on the production plate On both sides. The shutter comprises a shutter frame forming at least one hollow portion and at least one adjustable sub-shade for adjusting the hollow portion to form at least one shielding pattern and at least covering the hollow portion Filter membrane. According to the scope of the invention, there is further provided a plating shield, comprising a shutter frame for forming at least one hollow portion, at least one adjustable sub-shroud for adjusting the hollow portion and forming at least a masking pattern, and a filter film covering at least the hollow portion. The electroplating device and the shielding plate provided by the invention utilize the shielding frame and the at least one adjustable sub-shutter included in the shielding plate, and the adjustable sub-shading plates can be adjusted according to different sizes of the substrate to be plated and different plating patterns. In order to obtain substrates with different plating patterns in the same plating bath and the same electroplating process, the use of the adjustable sub-shields avoids the need to purchase a plurality of different aperture sizes and different aperture arrangements, thereby reducing Equipment cost. [Embodiment] Please refer to FIG. 4 and FIG. 5 at the same time. FIGS. 4 and 5 are respectively a front view and a rear view of a preferred embodiment of the electroplated shutter provided by the present invention. As shown in FIG. 4 and FIG. 5, the plating shield 40 of the present invention includes a shutter frame 42, such as a rectangular frame, for forming at least one hollow portion 44 and at least one adjustable sub-shutter 46. With respect to the hollow portion 44 to 8 1324641, one inner edge is parallel, perpendicular or inclined, and a filter film 48 (shown in FIG. 4) covers at least a portion of the shutter frame 42, the adjustable sub-shutter 46, and the hollow The portion 44 is secured to the shutter frame 42 by a set of second fasteners (not shown), such as a collet that clamps the filter membrane 48. The filter film 48 can be an impurity filter film or a power line uniform film, such as a porous polypropylene cloth. It is worth noting that the position and number of the adjustable sub-shield 46 can be adjusted to cover The hollow portion 44 forms at least one shielding pattern. After the position of the adjustable sub-shutter 46 is adjusted according to the product specifications and the plating pattern, the adjustable sub-shield 46 can be fixed by a set of first fixing members (not shown), such as screws or card cycles. On the shutter frame 42. Since the number and position of the adjustable sub-shrouds 46 provided by the present invention can be adjusted according to the requirements of different products, the electric I-shield shield 40 provided according to the present invention can be obtained in the same electroplating bath and the same electroplating process. The substrate with different electroplating patterns can solve the complicated and complicated methods such as replacing different opening size shutters in the conventional electroplating process, thereby improving the electroplating efficiency, and avoiding the disadvantage of uneven plating thickness due to the replacement of the plating bath, and improving the yield. . In addition, according to the plated substrate provided by the present invention, it is possible to avoid the need to purchase a plurality of shutters having different opening sizes and opening arrangements, thereby reducing equipment costs. 1324641' Next, please refer to Fig. 6, which is a schematic view of a preferred embodiment of the electroplating apparatus provided by the present invention. As shown in Fig. 6, a plating apparatus includes a frame 6 for accommodating at least one of the production plates 50, and a pair of plating shutters 40. The plating shutters 40 are disposed in the frame 6〇 and are respectively disposed on both sides of the production plate 5〇. The electroplated shutter 4 includes a shutter frame 42, such as a rectangular frame, for forming at least one hollow portion 44, at least one adjustable sub-shutter 46, which is parallel, perpendicular, and inclined with respect to at least the inner edge of the hollow portion 44. Provided and fixed to the shutter frame 42 by a first fixing member, such as a screw or a card, and a filter film 48 covering at least the hollow portion 44 and being fixed to the cover by a set of second fixing members On the board frame =. The filter membrane 48 can be an impurity filter membrane or a power line, such as a porous polypropylene cloth. Since the embodiment of the electroplated shutter 40 and the electro-optical system are the same as those of the electroplated shutter provided by the present invention, as shown in Figs. 4 and 5, they will not be described again. Further, the production plate 50 may be selected from a substrate, a lead frame, or other plate to be processed. Please continue to refer to Fig. 6. According to a preferred embodiment of the present invention, the frame 60 further includes a plurality of titanium baskets 62 (or other baskets of inert material made of β) for accommodating at least one anode metal material, such as steel 'aluminum, nickel. The gold is disposed around the inside of the frame 60 while the production plate 5 is used as a cathode. In addition, the area of the plating shutter 40 is larger than the area of the production board, and is a non-conductive plate body. It is worth noting that, as shown in Fig. 6, in the present embodiment, the plating shutter 40 is produced and the 框架+ μ h is supplied to the plating frame 6. The inner side is the gold from the production plate 5〇, (or the setting of the shutter 4〇 is relatively close to the production plate 50, and at the same time, the anode metal material of the blue plate 62 is plated. If the field has the usual knowledge, the household T is far away. Near the anode metal material 62 part of the electromineral solution knows that 'reliance on gold by the genus ion' and the metal ion system from the higher degree of infiltration to the rich: relatively; therefore = ions can be in the anode metal material 62 and the electric (four) plate 4. The difference between the metal ion concentration on both sides of the key panel 40 is reduced by the difference between the metal ion concentration on the two sides of the switch panel == The process of the metal ion is completely dependent on the power line ^ & and the influence of the diffusion is also required to form the plating layer. The electroplated laminate pattern can be obtained according to the requirements. The electroplating shutter included in the electroplating device provided by the invention can adjust the number and position of the adjustable sub-shield according to the requirements of different products, and thus is provided according to the present invention. The electroplating shutter can pay the substrate with different electroplating patterns in the same electroplating tank and the same electric ore making, and at the same time improve the yield of electric forging efficiency and avoid the demand for electric forging shutters with different opening sizes. According to this According to the electroplating device provided by Ming, the electroplating plate is closer to the production plate, and the electrolyzed anode metal material can obtain a larger space to diffuse, reducing the difference in ion wave distance between the two sides of the electroplating plate, thereby making the metal in the electric ore process. The free ion of the ion depends on the influence of the power line, so that the desired electric pattern of 1^24641 money layer can be obtained, and the yield of the electroplating production board can be further improved. The above description is only a preferred embodiment of the present invention, and the present invention is The equivalent changes and modifications made to the scope of the patent application are all covered by the present invention. [Simplified Schematic] Fig. 1 is a schematic diagram of a conventional printed circuit board plating apparatus. Fig. 2 is a conventional Fig. 3 is a partial enlarged view of Fig. 2. Fig. 4 and Fig. 5 are front and rear views of a preferred embodiment of the electroplated shield provided by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a preferred embodiment of a plating apparatus provided by the present invention. [Main component symbol description] 10 frame 12 titanium basket 20 substrate 30 shutter 32 fixed cover 34 opening 36 power line 40 Electroplated shutters 42 Shutter frame 44 Hollow part 46 Adjustable sub-shroud 48 Filter film 50 Production board 60 Frame 62 Titanium basket