201231735 六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及電鍍技術，特別涉及一種電鍍系統及電鍍方 法0 【先前技術】 [0002] [0003] 隨著電子產業之飛速發展，作為電子產品基本構件之電 路板之製作肋顯讀來愈重要。電路板―般由覆銅基 板經裁切、鑽孔、電鍍、曝光、顯影、姓刻、壓合、印 刷、成型等-系列製程製作而成。具體可參閱c· H.201231735 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to electroplating technology, and more particularly to an electroplating system and a plating method. [Prior Art] [0002] [0003] With the rapid development of the electronics industry, as The production ribs of the basic components of electronic products are more important. The circuit board is made of a series of processes, such as cutting, drilling, electroplating, exposure, development, surname, press, printing, molding, etc. For details, please refer to c·H.
Steer等人在Pr°CeedingS of the IEEE，Vol.39, Ν〇·2 (2002 年8 月）中發表夕“ ηι·〇1。+ .， ’ 対衣之 Dielectric characterization of printed η. .丄1 ill：ed circuit board substrates" 一文。 其中’電鍍係電路板製作之重要製程，其主要使用電鍍 系統對電路板表㈣行_性脑錢在軌孔壁鍵銅 。先前之電鍵系統包括1箱槽 '併電裝置、陽極桿 、電鐘陽極、陰極桿輿掛架裝載有電鑛液， 用於對電路板進行電鍍。供«置之正負極分別與陽極 桿與陰極桿電連接。電鑛陽極連接於陽極桿，掛架連接 於陰極桿。電鑛陽極與掛架均設置在電鑛槽内且浸入電 鍍槽之電舰t。電鑛陽極分別與掛架之相對。掛架用 於懸掛固定待電錄之電路板，從而使電路板之表面與該 電鍍陽極相對。供電裝置通電後’電鍍陽極析出之金屬 離子在電流翻下沈積鍍覆在該電路板上，此時，該電 路板相當於陰極。然而 由於電路板之電流係藉由掛架 100102749 表單編號A0101 第4頁/共34頁 1002004859-0 201231735 之導電夾點導人’因此造成待鍍電路板靠近導電夹點之 兩個邊緣區域㈣密度較高，㈣料電夾點之電路板 之中心區域之電絲度較低。並且，㈣金屬離子之沈 積量與電流密度成正比，從而使電路板與導電夹畔連接 之兩個邊緣區域沈積之金屬較厚，而電路板之中心 沈積之金屬較薄，造成金屬沈積之厚度不均，影響電錢 [0004]Steer et al., published in Pr ° CeedingS of the IEEE, Vol. 39, Ν〇 2 (August 2002) “ " ηι·〇1.+ ., 'Dielectric characterization of printed η. .丄1 Ill: ed circuit board substrates" article. Among them, 'electroplating system is an important process for the production of circuit boards, which mainly uses electroplating system for the circuit board table (4). _ Sexual brain money in the rail hole wall key copper. The previous key system includes 1 box slot' The electric device, the anode rod, the electric clock anode and the cathode rod truss are loaded with electro-mineral liquid for electroplating the circuit board. The positive and negative poles of the electric pole are respectively electrically connected with the anode rod and the cathode rod. The electric ore anode is connected to The anode rod and the pylon are connected to the cathode rod. The electric ore anode and the pylon are both disposed in the electric ore tank and immersed in the electroplating tank of the electroplating tank. The electric ore anode is respectively opposite to the pylon. Recording the circuit board so that the surface of the circuit board is opposite to the plating anode. After the power supply device is energized, the metal ions deposited by the electroplating anode are deposited on the circuit board under current tumbling, and at this time, the circuit board is equivalent to the cathode. . And because the current of the board is led by the conductive pinch of the rack 100102749 Form No. A0101 Page 4 of 341002004859-0 201231735, thus causing the density of the two edge regions (four) of the board to be plated close to the conductive pinch Higher, (4) the center of the circuit board of the electrical pinch has a lower wire thickness, and (4) the deposition amount of metal ions is proportional to the current density, thereby depositing the two edge regions of the circuit board and the conductive clip. The metal is thicker, and the metal deposited in the center of the circuit board is thinner, resulting in uneven thickness of metal deposition, affecting electricity money [0004]
有鑑於此，針對上述問題 板之金屬沈積厚度均勻性 統及電鍍方法實屬必要。 提供—種可提高電鍍時電路 從而提升電鍍品質之電鍍系 [0005] [0006]In view of this, it is necessary to apply the metal deposition thickness uniformity and plating method to the above problem board. Providing a plating system that can improve the plating quality and improve the plating quality [0005] [0006]
100102749 【發明内容】 下面將以具體實關說明-種電料統及電鑛方法。 ^電鍍系統，用於對至少—個電路板進㈣锻。該電 :系統包括電鍍槽、供電裝置、陽極桿、電鍵陽極降 掛架、—個輔助陰極桿與—個輔助陰極罩。.該電 :槽裝載有電錢液。該供電襄置具有正極與負極。該陽 ^桿連接㈣桿連胁該貞極。該電錢陽 軸掛料設置在該電錢槽Μ浸人電舰中。該電錢 ^極固疋在該陽極桿’該電錢陽極驗供應電路板電錢 所需之金屬離子。該掛架固定在該陰極桿且與該電鑛陽 極：對’該賤具錢數導衫I該複數導電爽點用 ^持固定該至少一個電路板並給該至少-個電路板供 罢、仃㈣捕助陰極桿連接於該負極。該輔助陰 定在該輔助陰極桿。該辅助陰極罩與該掛架相對 且位於該職與該錢陽極⑶。該御陰極罩包括至 表單編珑Α0101 第5頁/共34頁 1002004859-0 201231735 100102749 [0007] [0008] >一個罩體，該至少一個罩體與該至少一個電路板正對 °亥至 >、一個罩體包括第一邊緣區、第二邊緣區與中心 區，該中心區位於第一邊緣區與第二邊緣區之間。該掛 架之複數導電夾點與該第一邊緣區與第二邊緣區相對。 °亥至J 一個罩體之第一邊緣區與第二邊緣區均開設有複 數第一通孔。該複數第一通孔之口徑隨著與中心區距離 之減小而增大。該至少一個罩體之中心區開設有一個第 二通孔，該第二通孔之口徑大於任一第一通孔之口徑。 -種電鑛方法，包括步驟：提供至少一個電路板及如上 所述之電m職少—個電路板具有待電鑛之第— 表面；利用複數導電失點將該至少—個電路板夾持固定 至掛架並浸人電鑛槽之電鍵液中，使第—表面與該輔助 陰極罩相對；以及供電裝置給電賴極、掛架與輔靜 極罩供電，以使電鍍陽極析出金屬離子，電鍍陽極析： 之金屬離子穿補助陰極罩之複數第—通孔及—個第二 通孔並還原沈積在第—表面讀該至少-個電路板進行 電鍍。 τ —種電鍍系統，用於對至少—個電路板進行電鍵。該電 鍍系統包括電鍍槽、供雷 供電裴置、陽極桿、電鍍陽極、陰 極桿、掛架、兩_助陰極桿與兩侧 鍍槽裝載有電鍍液。該^ _ η 供電裝置具有正極與負極。該陽 極桿連接於該正極，該险太 ,& 哙極桿連接於該負極。該電鍍陽 極與掛架均設置在該電鍍 与 陽極駭在該陽極桿，㈣心 鍍除極用於供應電路板電鍍 所需之金屬離子。該掛架!^ '、固疋在該陰極桿且與該電鍍陽 表單編號A0101 第6頁/共34頁 1002004859-fl 201231735 極相對。該掛架具有複數導電夹點，該複數導電夾點用 於夾持固定該至少一個電路板並給該至少一個電路板供 電以進行電鍍。該兩個輔助陰極桿分別連接於該負極。 Ο 該兩個輔助陰極罩分別固定在該兩個輔助陰極桿。該電 鍍陽極之數目為兩個，該兩個電鍍陽極分別設置在該掛 架之相對兩侧。該兩個輔助陰極罩分別設置在該掛架之 相對兩側，且每一個輔助陰極罩位於該掛架與一個電鍍 陽極之間。每一個輔助陰極罩包括至少一個罩體，該至 少一個罩體與該至少一個電路板正對。該至少一個罩體 包括第一邊緣區、第二邊緣區與中心區，該中心區位於 第一邊緣區與第二邊緣區之間。該掛架之複數導電夾點 與該第一邊緣區與第二邊緣區相對。該至少一個罩體之 第一邊緣區與第二邊緣區均開設有複數第一通孔。該複 數第一通孔之口徑隨著與中心區距離之減小而增大。該 至少一個罩體之中心區開設有一個第二通孔，該第二通 孔之口徑大於任一第一通孔之口徑。 [0009] 一種電鍍方法，包括步驟：提供至少一個電路板及如上 所述之電鍍系統，該至少一個電路板具有待電鍍之第一 表面與第二表面；利用複數導電夾點將該至少一個電路 板夾持固定至掛架並浸入電鍍槽之電鍍液中，使第一表 面與第二表面分別與該兩個輔助陰極罩相對；以及供電 裝置給兩個電鍍陽極、掛架與兩個輔助陰極罩供電，以 使該兩個電鍍陽極析出金屬離子，電鍍陽極析出之金屬 離子穿過該兩個輔助陰極罩之複數第一通孔及一個第二 通孔並還原沈積在第一表面與第二表面以對該至少一個 100102749 表單編號A0101 第7頁/共34頁 1002004859-0 201231735 電路板進行電鍍。 [0010] 種m銀糸既’用於對 鍍系統包括電鍵槽、供電袭置:陽極桿、極該電 極桿、掛架、輔助陰極桿與輔助陰極 二: 有電鍍液。該供電裝置具有正極盘負極電鍍槽裝載 於該正極，該陰極桿連接於該負極。該極桿連接 均設置在該錢如且浸 二％極與掛架 敬欣r *亥電鍍陽極固定 在該陽極桿1電鍍陽極用於供應電路板電鍍所泰之全 屬離子。該掛架固定在該陰極桿且與該電«極^對。 該掛架具錢料電失點。該錢導輕㈣於夹持固 定該至少-個電路板並給該至少—個電路板供電以進行 電鍍。該輔助陰極桿連接於該負極，該輔助陰極罩固定 在該輔助陰極桿。該輔助陰極罩位於該掛架與該電鐘陽 個 極之間。該輔助陰極罩包括至少一個罩體，該至少 罩體與該至少一個電路板正對。該至少一個罩懸包括周 邊區與中心區’該周邊區與該掛架乏複數導電失點相對 。該至少一個罩體之周邊區開設f複數第一通孔，該複 數第一通孔之口徑隨著與中心區距離之增大而滅小。該 中心區開設複數第二通孔，該複數第二通孔之橫載面積 之加總占該中心區之橫截面積之比例大於複數第一通孔 之橫截面積之加總占該周邊區之橫戴面積之比例。 [0011] 相較於先前技術，本技術方案之電鍍系統及電鍍方法， 其可利用輔助陰極罩控制穿過第一通孔與第二通孔之金 屬離子之數量，使金屬離子經過該輔助陰極罩後之密度 分佈較為均勻’提高沈積在電路板上之金屬層厚度之均 100102749 表單編號A0101 第8頁/共34頁 1002004859-0 201231735 勻性，從而提升電路板之電鍍品質。 【實施方式】 [0012] 下面將結合附圖與實施例對本技術方案之電鍍系統及電 鍍方法作進一步詳細說明。 [0013] 請參閱圖1至圖2，本技術方案第一實施例提供一種電鍍 系統10，用於對至少一個電路板20進行電鍍。該電鍍系 統10包括電鍍槽11、供電裝置12、陽極桿13、電鍍陽極 14、陰極桿15、掛架16、輔助陰極桿17與輔助陰極罩18 。該電鍍陽極14、掛架16與輔助陰極罩18均設置在電鍍 槽11内。該輔助陰極罩18位於該電鍍陽極14與該掛架16 之間。 [0014] 具體地，該電鍍槽11具有底壁111、第一側壁112與第二 側壁113。該第一側壁112與第二侧壁113分別垂直連接 於該底壁111。該第一側壁112與第二側壁113平行相對 。該電鍍槽11裝載有電鍍液101。 [0015] 該供電裝置12具有正極121與負極122。該供電裝置12用 於提供電路板20電鍍所需之直流電。 [0016] 該陽極桿13連接於該供電裝置12之正極121。該陰極桿 15與該輔助陰極桿17均連接於該供電裝置12之負極122 [0017] 該電鍍陽極14固定在該陽極桿13，從而供電裝置12可藉 由陽極桿13給電鍍陽極14供電。該電鍍陽極14浸入電鍍 槽11之電鍍液101中。該電鍍陽極14用於供應電路板20 電鍍所需之金屬離子，例如銅離子。本實施例中，電鍍 100102749 表單編號 A0101 第 9 頁/共 34 頁 1002004859-0 201231735 陽極14之數目為兩個，該兩個電鍍陽極14分別與電鍍槽 11之第一側壁112與第二侧壁113平行相對。此外，當僅 需對電路板20之一個表面進行電鍍時，該電鍍陽極14之 數目亦可為一個，該一個電鍍陽極14與電鍛槽11之第一 側壁11 2相對。 \ [0018] 該掛架16固定在該陰極桿15且與該電鍍陽極14相對，該 供電裝置12可藉由陰極桿15給掛架16供電。該掛架16位 於該電鍍陽極14與該電鍍槽11之第二侧壁113之間。該掛 架16浸入該電鍍槽11之電鍍液101中。本實施例中，該兩 個電鍍陽極14分別設置在該掛架1 6之相對兩側。 [0019] 該掛架16包括兩根豎桿161、兩根橫桿162、掛鈎163與 複數導電夾點164。該兩根豎桿161相互平行，該兩根橫 桿162相互平行且分別活動連接在該兩根豎桿1 61之兩端 ，以使得該兩根豎桿161之間距可藉由該兩根橫桿162進 行調節，從而夾持具有不同尺寸之電路板20。該掛釣163 可連接在該豎桿161或者橫桿162。本實施例中，掛鈎 163之數目為兩個，該兩個掛鈎163分別固定連接於該兩 根豎桿161。該複數導電夾點164設置在該兩根豎桿161 上。該複數導電夾點164用於夾持固定該至少一個電路板 20並給該至少一個電路板20供電以進行電鍍。 [0020] 該輔助陰極罩18固定在該輔助陰極桿17。該輔助陰極罩 18與該掛架16相對且位於該掛架16與該電鍍陽極14之間 。該輔助陰極桿17、該輔助陰極罩18之數目均可為一個 或兩個。本實施例中，該輔助陰極桿17、該輔助陰極罩 18之數目為兩個，該兩個輔助陰極罩18分別固定在該兩 100102749 表單編號A0101 第10頁/共34頁 1002004859-0 201231735 [0021] Ο [0022] Ο 個輔助陰極桿17。該兩個輔助陰極罩18分別設置在該掛 架16之相對兩側，且每一個輔助陰極罩18位於該掛架16 與一個電鍍陽極14之間。 請一併參閱圖3及圖4，每一個輔助陰極罩18包括至少一 個罩體182。該至少一個罩體182與該至少一個電路板2〇 正對。β玄罩體182之形狀與電路板20之形狀相對應，該至 少一個罩體182包括第一邊緣區1821 '第二邊緣區1822 與中心區1825。該中心區1825位於第一邊緣區1821與第 二邊緣區1822之間。該掛架16之兩根豎桿161分別與該 第一邊緣區1821、第二邊緣區1822相對，亦即，該掛架 16之複數導電夾點164分別與該第一邊緣區182ΐ、第二 邊緣區18 2 2相對。本實施例中’該罩競1 μ之形狀為矩形 〇 該至少一個罩體182之第一邊緣區1821與第二邊緣區 1822均開設有複數第一通孔1〇2。該複數第一通孔1〇2之 口徑隨著與中心區1825距離之減小而增大，即位於第一 邊緣區18 21與.第二邊緣區18 22ι中間之第一通孔1 〇 2之口 徑最大。並且，該至少一個罩體182之中心區1825開設有 一個第二通孔103。本實施例中，該第二通孔1〇3位於中 心區1825之中心。該第二通孔1〇3之口徑大於任一第一通 孔102之口徑。該第一通孔102與第二通孔1〇3之形狀均 可為圓形、橢圓形、方形'矩形、多邊形或者其他不規 則形狀。 本實施例中’該第一通孔102與第二通孔103之形狀均為 圓形。該第一通孔102之直徑之一種設置方式如下：設該 100102749 表單编號A0101 第11頁/共34頁 1002004859-0 [0023] 201231735 罩體182在垂直於掛架16之豎桿161之方向為χ方向在 平行於豎桿161之方向為γ方向。該罩體182在乂方向之長 度為XQ，在Υ方向之長度為^將該罩體182在χ方向之長 度均分為五等份，每份之長度Ά/5。該罩體182開設 有平行於X方向之九行第一通孔1〇2。每一行之第一通孔 102有九個。該九個第一通孔丨〇2中位於第—邊緣區1821 與第二邊緣區1822最外側之兩個第一通孔1〇2之直徑為 Α1 ’自该直径為Α1之兩個第一通孔102向内之三對第一通 孔102之直控依次為Α2、A3與Α4，中間之一個第一通孔 102之孔徑為Α5 ’ 具A1 = 0. 2X1，A2 = l. 2Α1，A3 = l. 2Α2 ，A4=l.2Α3 ， A5=l.2Α4 » [0024] 進一步地，該罩體182還包括相對之第三邊緣區1 823與第 四邊緣區1824。該第一邊緣區1821、第三邊緣區1823、 第二邊緣區1822與第四邊緣區1824依次連接，且圍繞該 中心區1825。該第一邊緣區1821、第二邊緣區1 822、第 三邊緣區1823與第四邊緣區1824之材質為金屬，該中心 區1825之材質為非金屬。該中心區1825之形狀為圓形。 該圓形之中心區1825與電路板20之距離逐漸變化，且中 心區1825之圓周與電路板20之距離小於中心區1825之圓 心與電路板20之距離。 [0025] 優選地，該辅助陰極罩18為矩形，該輔助陰極罩18之四 周邊緣分別向靠近電路板20之方向延伸形成一個彎折部 184。該彎折部184之延伸長度為10毫米至20毫米。該彎 折部184與待電鍍之電路板20之距離為2毫米至5毫米。本 實施例中，該彎折部184之延伸長度為15毫米。該彎折部 100102749 表單編號Α0101 第12頁/共34頁 1002004859-0 201231735 [0026] [0027] ❹ [0028] [0029] Ο 184與待電鍍之電路板20之距離為5毫米。 此外’在其他實施方式中，該輔助陰極罩還可以設計成 其他結構。具體如下： 在第二實施例中，請參閱圖5，輔助陰極罩28包括至少一 個罩體282。該罩體282與第一實施例中之罩體182之區 別在於，該罩體282與電路板之距離逐漸變化，且第一邊 緣區2821、第二邊緣區2822、第三邊緣區2823與第四邊 緣區2824與電路板之距離小於中心區2825與電路板之距 離。 在第三實施例中，請參閱圖β，輔助陰極罩38包括至少一 個罩體382。該罩體382與第一實施例中之罩體182之區 別在於’該罩體382與電路板之距離逐漸雙化，且第一邊 緣區3821、第二邊緣區3822與電路板之距離小於中心區 3825與電路板之距離。 j ·|ί . ；, ;； 在第四實施例令，請參閱圖7，辅助陰極罩48包括至少一 個罩體482。該罩體482與第一實施，例中之罩體182之區 別在於，該罩體482包括周邊區4^21與中心區4825。該 周邊區4821與掛架之複數導電夾點相對。該罩韹482之周 邊區4821開設有複數第一通孔402。該複數第一通孔402 之口徑隨著與中心區4825距離之增大而減小。該罩體482 之中心區4825為平板狀。該中心區4825開設複數第二通 孔403。該複數第二通孔403之橫截面積之加總占該中心 區4825之橫截面積之比例大於複數第一通孔4〇2之橫截面 積之加總占該周邊區4821之橫截面積之比例。 100102749 表單編號A0101 第13頁/共34頁 1002004859-0 201231735 [0030] 請進一步參閱圖8，本技術方案實施例還提供一種利用上 述之電鍍系統1 0對電路板2 0進行電鍍之電鍍方法，當該 電路板20僅需電鍍其中一個表面時，該電鍍方法包括以 下步驟： [0031] 步驟110，提供至少一個電路板20及如上所述之電鍍系統 10，該至少一個電路板20具有待電鍍之第一表面21。 [0032] 具體地，每一個電路板20具有相對之第一表面21與第二 表面22。其中，該第一表面21為待電鍍之表面。此時， 該電鍍系統10可僅包括一個電鍍陽極14、一個輔助陰極 桿17與一個輔助陰極罩18即可。 [0033] 步驟120，利用複數導電夾點164將該至少一個電路板20 夾持固定至掛架16並浸入電鍍槽11之電鍍液101中，使第 一表面21與該輔助陰極罩18相對。 [0034] 具體地，可先將該至少一個電路板20藉由導電夾點164夾 持固定至掛架16 ;接著，將輔助陰極罩18固定在輔助陰 極桿17上，該輔助陰極罩18與該至少一個電路板20之第 一表面21相對；然後，將該掛架16、至少一個電路板20 與輔助陰極罩18浸入電鍍槽11之電鍍液101中。此時，該 輔助陰極罩18與電鍍陽極14相對，且該輔助陰極罩18位 於該電鍍陽極14與該掛架16之間。 [0035] 步驟130，供電裝置12給電鍍陽極14、掛架16與輔助陰 極罩18供電，以使電鍍陽極14析出金屬離子，電鍍陽極 14析出之金屬離子穿過輔助陰極罩18之複數第一通孔102 及一個第二通孔1 03並還原沈積在第一表面21以對該至少 100102749 表單編號A0101 第14頁/共34頁 1002004859-0 201231735 [0036] 〇 [0037] [0038] Ο [0039] 一個電路板2〇進行電鍍。 具體地’供電裝置12之正極m給電鍍陽極Μ通入正電， 負極122給掛架16與輔助陰極罩18通人負電。電鍛陽極 U浸在電鑛液1()1中並析出金屬離子，金屬離子在電流之 作用下從電鑛陽極14向輔助陰極罩18與掛架财向移動 。金屬離子隨電觀1G1穿糊助陰極罩18之第-通孔 102及第二通孔1G3，織沈積在電路板20之第-表面21 形成電鍍層。 電鍍完成後，便可將該至少一傭電路板2〇從電鍍槽U中 取出。具體地，將掛架16及固定在掛架16上之至少—個 電路板20從電鍍槽1】中取出，然後，再將讓至少〜個電 路板20從該掛架16上取下來，該電路板20便完成電鍍。 電鍍完成後，電路板20進入下一道製作流程繼續進行製 作。 請進一步參閱圓9 ’本技術方案實施例還挺供第二種利用 上述之電鍍系統10對電路板20進行電鍍之電鍍方法，當 該電路板20相對之兩個表备均需要趣行電鍍時，讀電鐘 方法包括以下步驟： 步驟210，提供至少一個電路板20及如上所述之電錢系統 10 ’該至少一個電路板20具有待電鍍之第一表面21與第 二表面22。 具體地，每一個電路板20具有相對之第一表面21與第二 表面22。其中，該第一表面21與第二表面22均為待電鑛 之表面。此時，該電鍍系統10包括兩個電鍍陽極14、兩 100102749 表單编號A0101 第15頁/共34頁 1002004859-0 [0040] 201231735 個輔助陰極桿17與兩個輔助陰極罩18。 [0041] [0042] [0043] [0044] 步驟220，利用複數導電夾點164將該至少一個電路板2〇 夾持固定至掛架16並浸入電鍍槽u之電鍍液1〇1中，使第 表面21與第二表面22分別與該兩個輔助陰極罩Η相對 〇 八體地，可先將該至少一個電路板2〇藉由導電夾點164夾 持固定至掛架16 ;接著，將該兩個輔助陰極罩18分別固 定在該兩個輔助陰極桿17上，該兩個輔助陰極罩18分別 與該至少一個電路板20之第一表面21與第二表面22相對 ，然後，將該掛架16、至少一個電路板2〇與兩個輔助陰 極罩18浸入電鍍槽^之電鍍液1〇1中β:此時，該兩個辅助 陰極罩18分別與該兩個電鍍陽極14相對，且該每一個輔 助陰極罩18位於一個電鍍陽極14與該掛架16之間。 步驟230，供電裝置12給兩個電鍍陽極14、掛架16與兩 個輔助陰極罩18供電，以使讀兩個電鍍_極14析出金屬 離子，電鍍陽極14析出之金;|離子分_穿過兩個輔助陰 極罩18之複數第一通孔i〇i及一個第二通孔1〇3並還原沈 積在第一表面21與第二表面22以對該至少—個電路板2〇 進行電鍍。 具體地’供電裝置12之正極121給該兩個電鍍陽極14通入 正電’負極122給該掛架16與該兩個輔助陰極罩μ通入負 電。該兩個電鍍陽極14浸在電鍍液1〇i中並析出金屬離子 ’金屬離子在電流之作用下從兩個電鍍陽極〗4分別向兩 個辅助陰極罩18方向移動。金屬離子隨電鍍液1〇1穿過兩 100102749 表單編號A0101 第16頁/共34頁 1002004859- 201231735 個輔助陰極罩18之第一通孔1〇2及第二通孔1〇3，然後分 別沈積在電路板20之第一表面21與第二表面22形成電鍍 層0 [0045]電鍍完成後’將電鍍後之至少一個電路板2〇從電鍍槽^ 中取出。具體地，將掛架16及固定在掛架16上之至少一 個電路板2G從電鑛槽11中取出，然、後，再將該至少-個 電路板2G從該掛架16上取下來，該電路板20便完成電錢 。電鑛完錢’電路板20進人下—道製作絲繼續進行 製作。 [_彳目較於先前技術，本技術方案m絲電鐘方法， 其可利關助陰極罩控制穿過第—叫與第二通孔之金 屬離子之數#，使金屬離子經軸輔助陰極罩後之密度 分佈較為均勻，提高沈積在電路板上之命屬層厚度之均 勻性’從而提升電路板之電鑛品質。 剛㉟上所述，本發明確已符合發明專利之祕，遂依法提 出專利中請。先前技術，以上所述者僅為本發明之較佳 實施方式，自不能以此限制本案之申請專利範圍。舉凡 热悉本案技藝之人士援依本發明之精神所作之等效修飾 或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 陶]m係本技術方案第-實_提供之_线之示意圖。 [_圖2縣技財案第-實施難供之電μ狀掛架之示 意圖。 [0050] 100102749 圖3係本技術方案第一實施例提供之電鍍系統之輔助陰極 表單編號Α0101 第17頁/共34頁 1002004859-0 201231735 罩之示意圖。 [0051] [0052] [0053] [0054] [0055] [0056] [0057] [0058] [0059] [0060] [0061] [0062] [0063] [0064] [0065] [0066] 100102749 圖4係圖3之輔助陰極罩沿IV-IV方向之剖視圖。 圖5係本技術方案第二實施例提供之電鍍系統之輔助陰極 罩之示意圖。 圖6係本技術方案第三實施例提供之電鍍系統之輔助陰極 罩之示意圖。 圖7係本技術方案第θ實施例提供之電鍍系統之輔助陰極 罩之示意圖。 圖8係本技術方案第一實施例提供之電鍍方法之流程圖。 圖9係本技術方案第二實施例提供之電鍍方法之流程圖。 【主要元件符號說明】 電鍍系統：1 0 電鍍槽：11 供電裝置：12 陽極桿：13 電鍍陽極：14 陰極桿：15 掛架：16 輔助陰極桿：17 輔助陰極罩：18、28、38 ' 48 底壁：111 表單編號A0101 第18頁/共34頁 1002004859-0 1f 201231735 、[0067]第一側壁：112 [0068] 第二側壁：113 [0069] 電鍍液：101 [0070] 正極：121 [0071] 負極：122 [0072] 豎桿：161 , [0073] 橫桿：162 〇 [0074] 掛鈎：163 [0075] 導電失點.16 4 [0076] 罩體：182、282、382、482 [0077] 彎折部：184 [0078] 第一邊緣區：1821、2821、3821 [0079] ❹ 第二邊緣區：1822、2822、3822 [0080] 第三邊緣區：1 823、2823、4823 [0081] 第四邊緣區：1834、2824 [0082] 中心區：1825、2825、3825、4825 [0083] 周邊區：4821 [0084] 第一通孔：102、402 [0085] 第二通孔：103、403 100102749 表單編號A0101 第19頁/共34頁 1002004859-0 [0086] [0087] [0088] 201231735 電路板： 第一表面 第二表面 20 ••21 ：22 100102749 表單編號A0101 第20頁/共34頁 1002004859-0100102749 [Summary of the Invention] The following is a detailed description of the electric material system and the electric ore method. ^ Electroplating system for forging (four) for at least one board. The electricity: the system includes a plating tank, a power supply device, an anode rod, a key anode pylon, an auxiliary cathode rod and an auxiliary cathode cover. The electricity: the tank is loaded with electricity liquid. The power supply device has a positive pole and a negative pole. The male rod is connected to the (four) rod to threaten the bungee. The electric money anode shaft hanging material is arranged in the electric money tank immersed in the electric ship. The electric money is extremely solid at the anode rod. The electric money anode is used to supply the metal ions required for the circuit board. The pylon is fixed to the cathode rod and is connected to the electric ore anode: the plurality of circuit boards are fixed to the at least one circuit board, and the at least one circuit board is fixed.仃 (4) A trapping cathode rod is connected to the anode. The auxiliary is fixed to the auxiliary cathode rod. The auxiliary cathode cover is opposite the pylon and is located at the position of the money anode (3). The cathode cover is included in the form editor 0101, page 5, page 34, 1002004859-0, 201231735, 100102749 [0007] [0008] [0008] > a cover body, the at least one cover body and the at least one circuit board facing each other >, a cover body includes a first edge region, a second edge region, and a central region, the central region being located between the first edge region and the second edge region. The plurality of conductive clips of the pylon are opposite the first edge region and the second edge region. The first edge region and the second edge region of a cover body are respectively provided with a plurality of first through holes. The diameter of the plurality of first through holes increases as the distance from the central portion decreases. A central portion of the at least one cover is provided with a second through hole having a larger diameter than any of the first through holes. - an electric ore method, comprising the steps of: providing at least one circuit board and the electrical power as described above - a circuit board having a first surface to be electro-elected; and fixing at least one of the circuit boards by using a plurality of electrical conduction points To the pylon and immersed in the electric key solution of the electric ore tank, so that the first surface is opposite to the auxiliary cathode cover; and the power supply device supplies power to the electric pylon, the pylon and the auxiliary static pole cover, so that the electroplating anode precipitates metal ions, and electroplating The anodic precipitation: the metal ions penetrate the plurality of first through holes and the second through holes of the auxiliary cathode cover and are reduced and deposited on the first surface to read the at least one circuit board for electroplating. τ — An electroplating system for performing electrical bonding on at least one of the boards. The electroplating system includes a plating tank, a lightning supply device, an anode rod, an electroplated anode, a cathode rod, a pylon, two yoke rods, and plating tanks on both sides of the plating tank. The ^_η power supply device has a positive pole and a negative pole. The anode rod is connected to the positive electrode, and the <RTIgt; The electroplated anode and the pylon are both disposed on the anode of the plating and the anode, and the core is used to supply metal ions required for plating the board. The hanger! ^ ' is fixed to the cathode rod and is opposite to the electroplated positive form No. A0101, page 6 of 34, 1002004859-fl 201231735. The pylon has a plurality of conductive clips for clamping and securing the at least one circuit board and for powering the at least one circuit board for electroplating. The two auxiliary cathode rods are respectively connected to the negative electrode. Ο The two auxiliary cathode covers are respectively fixed to the two auxiliary cathode rods. The number of the electroplated anodes is two, and the two electroplated anodes are respectively disposed on opposite sides of the rack. The two auxiliary cathode covers are respectively disposed on opposite sides of the pylon, and each auxiliary cathode cover is located between the pylon and a plating anode. Each of the auxiliary cathode covers includes at least one cover, the at least one cover being contiguous with the at least one circuit board. The at least one cover includes a first edge region, a second edge region, and a central region, the central region being located between the first edge region and the second edge region. The plurality of conductive clips of the pylon are opposite the first edge region and the second edge region. A plurality of first through holes are defined in the first edge region and the second edge region of the at least one cover. The diameter of the plurality of first through holes increases as the distance from the central portion decreases. A central portion of the at least one cover is provided with a second through hole, and the second through hole has a larger diameter than any of the first through holes. [0009] An electroplating method comprising the steps of: providing at least one circuit board and a plating system as described above, the at least one circuit board having a first surface and a second surface to be plated; the at least one circuit board using a plurality of conductive pinch points Clamping and fixing to the pylon and immersing in the plating solution of the plating tank, so that the first surface and the second surface are respectively opposite to the two auxiliary cathode hoods; and the power supply device is provided with two plating anodes, a pylon and two auxiliary cathode hoods Supplying electricity to cause metal ions to be deposited in the two electroplating anodes, and metal ions deposited by the electroplating anode pass through the plurality of first through holes and the second through holes of the two auxiliary cathode covers and are reduced and deposited on the first surface and the second surface The board is plated with the at least one 100102749 form number A0101 page 7 / page 34 1002004859-0 201231735 circuit board. [0010] The m silver crucible is used for the plating system including the keyway, the power supply: the anode rod, the pole, the pylon, the auxiliary cathode rod and the auxiliary cathode. The power supply device has a positive electrode negative electrode plating tank mounted on the positive electrode, and the cathode rod is connected to the negative electrode. The pole connection is set in the money such as and dip 2% pole and hanger. Jingxin r * Hai plating anode fixed in the anode rod 1 plated anode is used to supply all the ions of the circuit board plating. The pylon is fixed to the cathode rod and is opposite to the electric pole. The pylon has lost money. The money guides lightly (d) clamping the at least one circuit board and powering the at least one circuit board for electroplating. The auxiliary cathode rod is coupled to the negative electrode, and the auxiliary cathode cover is fixed to the auxiliary cathode rod. The auxiliary cathode cover is located between the hanger and the anode of the electric clock. The auxiliary cathode cover includes at least one cover that faces the at least one circuit board. The at least one cover overhang includes a peripheral zone and a central zone. The peripheral zone is opposite the pedestal lack of a plurality of conductive points of loss. The peripheral portion of the at least one cover defines a plurality of first through holes, and the diameter of the plurality of first through holes is reduced as the distance from the central portion increases. The central area defines a plurality of second through holes, wherein the sum of the cross-sectional areas of the plurality of second through holes occupies a larger proportion of the cross-sectional area of the central area than the cross-sectional area of the plurality of first through holes occupies the peripheral area The proportion of the area worn across. [0011] Compared with the prior art, the electroplating system and the electroplating method of the present technical solution can utilize an auxiliary cathode cover to control the amount of metal ions passing through the first through hole and the second through hole, so that the metal ions pass through the auxiliary cathode. The density distribution behind the cover is relatively uniform 'increasing the thickness of the metal layer deposited on the board 100102749 Form No. A0101 Page 8 / Total 34 pages 1002004859-0 201231735 Uniformity, thereby improving the plating quality of the board. [Embodiment] [0012] The electroplating system and the electroplating method of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments. Referring to FIG. 1 to FIG. 2, a first embodiment of the present technical solution provides an electroplating system 10 for electroplating at least one circuit board 20. The plating system 10 includes a plating tank 11, a power supply unit 12, an anode rod 13, a plated anode 14, a cathode rod 15, a pylon 16, an auxiliary cathode rod 17, and an auxiliary cathode cover 18. The plated anode 14, the pylon 16 and the auxiliary cathode cover 18 are both disposed in the plating tank 11. The auxiliary cathode cover 18 is located between the plating anode 14 and the hanger 16. [0014] Specifically, the plating tank 11 has a bottom wall 111, a first side wall 112, and a second side wall 113. The first sidewall 112 and the second sidewall 113 are perpendicularly connected to the bottom wall 111, respectively. The first sidewall 112 is parallel to the second sidewall 113. The plating bath 11 is loaded with a plating solution 101. [0015] The power supply device 12 has a positive electrode 121 and a negative electrode 122. The power supply unit 12 is used to provide the direct current required for plating the circuit board 20. [0016] The anode rod 13 is connected to the positive electrode 121 of the power supply device 12. The cathode rod 15 and the auxiliary cathode rod 17 are both connected to the negative electrode 122 of the power supply device 12. [0017] The plating anode 14 is fixed to the anode rod 13 so that the power supply device 12 can supply the plating anode 14 with the anode rod 13. The plating anode 14 is immersed in the plating solution 101 of the plating bath 11. The plated anode 14 is used to supply metal ions, such as copper ions, required for plating of the circuit board 20. In this embodiment, electroplating 100102749 Form No. A0101 Page 9 of 34 1002004859-0 201231735 The number of anodes 14 is two, and the two electroplating anodes 14 and the first side wall 112 and the second side wall of the plating tank 11, respectively. 113 parallel relative. Further, when only one surface of the circuit board 20 needs to be plated, the number of the plating anodes 14 may be one, and the one plating anode 14 is opposed to the first side wall 11 2 of the electric forging groove 11. [0018] The pylon 16 is fixed to the cathode rod 15 and opposite to the plating anode 14, and the power supply device 12 can supply power to the pylon 16 by the cathode rod 15. The pylon 16 is located between the plating anode 14 and the second sidewall 113 of the plating bath 11. The hanger 16 is immersed in the plating solution 101 of the plating tank 11. In this embodiment, the two plated anodes 14 are respectively disposed on opposite sides of the hanger 16. [0019] The pylon 16 includes two vertical rods 161, two cross bars 162, hooks 163 and a plurality of conductive pinch points 164. The two vertical rods 161 are parallel to each other, and the two horizontal rods 162 are parallel to each other and are respectively movably connected to the two ends of the two vertical rods 1 61 so that the distance between the two vertical rods 161 can be separated by the two horizontal rods The rod 162 is adjusted to clamp the circuit board 20 having different sizes. The hanging fishing 163 can be attached to the vertical rod 161 or the crossbar 162. In this embodiment, the number of the hooks 163 is two, and the two hooks 163 are fixedly connected to the two vertical rods 161, respectively. The plurality of conductive clips 164 are disposed on the two vertical rods 161. The plurality of conductive clips 164 are used to clamp the at least one circuit board 20 and power the at least one circuit board 20 for plating. [0020] The auxiliary cathode cover 18 is fixed to the auxiliary cathode rod 17. The auxiliary cathode cover 18 is opposite the pylon 16 and is located between the pylon 16 and the plating anode 14. The number of the auxiliary cathode rods 17 and the auxiliary cathode cover 18 may be one or two. In this embodiment, the number of the auxiliary cathode rods 17 and the auxiliary cathode cover 18 are two, and the two auxiliary cathode covers 18 are respectively fixed at the two 100102749 Form No. A0101 Page 10 / Total 34 Pages 1002004859-0 201231735 [ 0021] Ο [0022] 辅助 Auxiliary cathode rods 17. The two auxiliary cathode covers 18 are respectively disposed on opposite sides of the hanger 16, and each auxiliary cathode cover 18 is located between the hanger 16 and a plating anode 14. Referring to Figures 3 and 4 together, each of the auxiliary cathode covers 18 includes at least one cover 182. The at least one cover 182 is opposite the at least one circuit board 2A. The shape of the beta cover 182 corresponds to the shape of the circuit board 20, and the at least one cover 182 includes a first edge region 1821' and a second edge region 1822 and a central region 1825. The central zone 1825 is located between the first edge zone 1821 and the second edge zone 1822. The two vertical rods 161 of the pylon 16 are respectively opposite to the first edge area 1821 and the second edge area 1822, that is, the plurality of conductive clips 164 of the pylon 16 are respectively associated with the first edge area 182 and the second edge area. The edge regions 18 2 2 are opposite. In the present embodiment, the shape of the cover is a rectangle. The first edge region 1821 and the second edge region 1822 of the at least one cover 182 are each provided with a plurality of first through holes 1〇2. The diameter of the plurality of first through holes 1〇2 increases as the distance from the central portion 1825 decreases, that is, the first through hole 1 〇2 located between the first edge region 18 21 and the second edge region 18 22 ι The caliber is the largest. Moreover, a central portion 1825 of the at least one cover 182 defines a second through hole 103. In this embodiment, the second through hole 1〇3 is located at the center of the central portion 1825. The diameter of the second through hole 1〇3 is larger than the diameter of any of the first through holes 102. The shape of the first through hole 102 and the second through hole 1〇3 may be circular, elliptical, square 'rectangular, polygonal or other irregular shape. In the present embodiment, the shape of the first through hole 102 and the second through hole 103 are both circular. One of the diameters of the first through holes 102 is set as follows: the 100102749 form number A0101 page 11 / total 34 pages 1002004859-0 [0023] 201231735 The cover 182 is perpendicular to the vertical rod 161 of the pylon 16 The χ direction is the γ direction in a direction parallel to the vertical rod 161. The length of the cover 182 in the x direction is XQ, and the length in the x direction is equal to the length of the cover 182 in the x direction, which is divided into five equal parts, and the length per part is Ά/5. The cover 182 is provided with nine rows of first through holes 1〇2 parallel to the X direction. There are nine first through holes 102 in each row. The diameters of the two first through holes 1〇2 of the nine first through holes 位于2 located at the outermost sides of the first edge region 1821 and the second edge region 1822 are Α1 'from the first two of the diameters Α1 The direct control of the three pairs of first through holes 102 in the through hole 102 is Α2, A3 and Α4, and the aperture of the first one of the first through holes 102 is Α5' with A1 = 0. 2X1, A2 = l. 2Α1, A3 = l. 2Α2, A4=l.2Α3, A5=l.2Α4 » [0024] Further, the cover 182 further includes a third edge region 1 823 and a fourth edge region 1824. The first edge region 1821, the third edge region 1823, the second edge region 1822, and the fourth edge region 1824 are sequentially connected and surround the central region 1825. The material of the first edge region 1821, the second edge region 1 822, the third edge region 1823 and the fourth edge region 1824 is made of metal, and the material of the central region 1825 is non-metal. The central area 1825 is circular in shape. The distance between the central portion 1825 of the circle and the circuit board 20 is gradually changed, and the distance between the circumference of the central portion 1825 and the circuit board 20 is smaller than the distance between the center of the central portion 1825 and the circuit board 20. [0025] Preferably, the auxiliary cathode cover 18 is rectangular, and the peripheral edges of the auxiliary cathode cover 18 respectively extend toward the circuit board 20 to form a bent portion 184. The bent portion 184 has an extension length of 10 mm to 20 mm. The bent portion 184 is spaced from the circuit board 20 to be plated by a distance of 2 mm to 5 mm. In this embodiment, the bent portion 184 has an extension length of 15 mm. The bent portion 100102749 Form No. Α 0101 Page 12 / Total 34 1002004859-0 201231735 [0027] [0029] [0029] The distance between the 184 and the circuit board 20 to be plated is 5 mm. Further, in other embodiments, the auxiliary cathode cover can also be designed in other configurations. Specifically as follows: In the second embodiment, referring to Fig. 5, the auxiliary cathode cover 28 includes at least one cover 282. The cover 282 is different from the cover 182 of the first embodiment in that the distance between the cover 282 and the circuit board is gradually changed, and the first edge region 2821, the second edge region 2822, and the third edge region 2823 and The distance between the four edge regions 2824 and the circuit board is less than the distance between the central region 2825 and the circuit board. In the third embodiment, referring to Fig. β, the auxiliary cathode cover 38 includes at least one cover 382. The cover 382 is different from the cover 182 in the first embodiment in that the distance between the cover 382 and the circuit board is gradually doubled, and the distance between the first edge region 3821 and the second edge region 3822 and the circuit board is smaller than the center. The distance between the area 3825 and the board. In the fourth embodiment, referring to Fig. 7, the auxiliary cathode cover 48 includes at least one cover 482. The cover 482 is different from the cover 182 of the first embodiment, in that the cover 482 includes a peripheral zone 4^21 and a central zone 4825. The peripheral zone 4821 is opposite the plurality of conductive pinch points of the pylon. A plurality of first through holes 402 are defined in the peripheral portion 4281 of the cover 482. The diameter of the plurality of first through holes 402 decreases as the distance from the central portion 4825 increases. The central portion 4825 of the cover 482 has a flat shape. The central area 4825 defines a plurality of second through holes 403. The sum of the cross-sectional areas of the plurality of second through holes 403 occupies a larger proportion of the cross-sectional area of the central portion 4825 than the cross-sectional area of the plurality of first through holes 4〇2 occupies the cross-sectional area of the peripheral portion 4821. The ratio. 100102749 Form No. A0101 Page 13 of 34 1002004859-0 201231735 [0030] Please refer to FIG. 8 further, the embodiment of the present invention further provides an electroplating method for electroplating the circuit board 20 by using the electroplating system 10 described above. When the circuit board 20 only needs to plate one of the surfaces, the plating method includes the following steps: [0031] Step 110, providing at least one circuit board 20 and the plating system 10 as described above, the at least one circuit board 20 having a plating to be plated The first surface 21 is. [0032] Specifically, each of the circuit boards 20 has a first surface 21 and a second surface 22 opposite thereto. Wherein, the first surface 21 is a surface to be plated. At this time, the plating system 10 may include only one plating anode 14, one auxiliary cathode rod 17, and one auxiliary cathode cover 18. [0033] Step 120: The at least one circuit board 20 is clamped and fixed to the pylon 16 by a plurality of conductive clips 164 and immersed in the plating solution 101 of the plating bath 11, so that the first surface 21 is opposed to the auxiliary cathode cover 18. [0034] Specifically, the at least one circuit board 20 may be first fixed to the pylon 16 by the conductive pinch 164; then, the auxiliary cathode cover 18 is fixed on the auxiliary cathode rod 17, the auxiliary cathode cover 18 and The first surface 21 of the at least one circuit board 20 is opposite; then, the pylon 16, the at least one circuit board 20 and the auxiliary cathode cover 18 are immersed in the plating solution 101 of the plating bath 11. At this time, the auxiliary cathode cover 18 is opposed to the plating anode 14, and the auxiliary cathode cover 18 is located between the plating anode 14 and the hanger 16. [0035] Step 130, the power supply device 12 supplies power to the plating anode 14, the pylon 16, and the auxiliary cathode cover 18, so that the plating anode 14 precipitates metal ions, and the metal ions deposited by the plating anode 14 pass through the auxiliary cathode cover 18. The through hole 102 and a second through hole 103 are reduced and deposited on the first surface 21 to the at least 100102749. The form number A0101 is 14 pages/total 34 pages 1002004859-0 201231735 [0036] 〇[0037] [0038] Ο [ 0039] A board 2 is plated. Specifically, the positive electrode m of the power supply device 12 is positively charged to the plating anode, and the negative electrode 122 is negatively charged to the pylon 16 and the auxiliary cathode cover 18. The electric forged anode U is immersed in the electric ore liquid 1 () 1 and precipitates metal ions, and the metal ions move from the electric ore anode 14 to the auxiliary cathode cover 18 and the yoke by the current. The metal ions are etched onto the first surface 21 of the circuit board 20 to form a plating layer along with the first through hole 102 and the second through hole 1G3 of the anode cover 1G1. After the plating is completed, the at least one commission board 2 can be taken out of the plating tank U. Specifically, the pylon 16 and at least one circuit board 20 fixed on the pylon 16 are taken out from the plating tank 1 , and then at least ~ the circuit board 20 is removed from the pylon 16 . Circuit board 20 completes the plating. After the plating is completed, the board 20 proceeds to the next production process to continue the production. Please refer to the circle 9'. The embodiment of the technical solution is also suitable for the second electroplating method for electroplating the circuit board 20 by using the electroplating system 10 described above. When the two boards of the circuit board 20 are required to be electroplated. The read clock method includes the following steps: Step 210, providing at least one circuit board 20 and a battery money system 10' as described above. The at least one circuit board 20 has a first surface 21 and a second surface 22 to be plated. Specifically, each of the circuit boards 20 has a first surface 21 and a second surface 22 opposite thereto. Wherein, the first surface 21 and the second surface 22 are both surfaces of the toe. At this time, the plating system 10 includes two plated anodes 14, two 100102749 Form No. A0101 Page 15 of 34 1002004859-0 [0040] 201231735 Auxiliary cathode rods 17 and two auxiliary cathode casings 18. [0044] [0044] Step 220, the at least one circuit board 2 is clamped and fixed to the pylon 16 by a plurality of conductive clips 164 and immersed in the plating solution 1〇1 of the plating bath u, so that [0044] The first surface 21 and the second surface 22 are respectively opposite to the two auxiliary cathode covers, and the at least one circuit board 2 can be first clamped and fixed to the hanger 16 by the conductive pinch 164; then, The two auxiliary cathode covers 18 are respectively fixed on the two auxiliary cathode rods 17, and the two auxiliary cathode covers 18 are respectively opposed to the first surface 21 and the second surface 22 of the at least one circuit board 20, and then The pylon 16, the at least one circuit board 2 〇 and the two auxiliary cathode hoods 18 are immersed in the plating bath 1 〇 1 of the plating bath: at this time, the two auxiliary cathode hoods 18 are respectively opposed to the two plating anodes 14 And each of the auxiliary cathode covers 18 is located between a plated anode 14 and the pylon 16. Step 230, the power supply device 12 supplies power to the two electroplating anodes 14, the pylons 16, and the two auxiliary cathode hoods 18, so that the two electroplating electrodes 14 are separated to deposit metal ions, and the electroplating anode 14 is deposited with gold; Passing through the plurality of first through holes i〇i and the second through holes 1〇3 of the two auxiliary cathode covers 18 and depositing them on the first surface 21 and the second surface 22 to plate the at least one circuit board 2〇 . Specifically, the positive electrode 121 of the power supply device 12 supplies the two electroplated anodes 14 with a positive electric negative electrode 122 to the pylon 16 and the two auxiliary cathode hoods μ to be negatively charged. The two plating anodes 14 are immersed in the plating solution 1〇i and precipitate metal ions. The metal ions move from the two plated anodes 4 to the two auxiliary cathode covers 18 by the action of current. Metal ions are passed through the plating solution 1〇1 through two 100102749 Form No. A0101 Page 16 / Total 34 pages 1002004859- 201231735 The first through hole 1〇2 and the second through hole 1〇3 of the auxiliary cathode cover 18 are respectively deposited Forming a plating layer on the first surface 21 and the second surface 22 of the circuit board 20 [0045] After plating is completed, 'at least one of the boards 2' after plating is taken out from the plating bath. Specifically, the pylon 16 and the at least one circuit board 2G fixed on the pylon 16 are taken out from the electric ore tank 11, and then the at least one circuit board 2G is removed from the pylon 16 . The circuit board 20 completes the money. The electricity mine is finished. The circuit board 20 enters the people--the road is made and continues to be produced. [_彳目 Compared to the prior art, the technical solution m wire clock method, which can help the cathode cover control the number of metal ions passing through the first and second through holes, so that the metal ions are through the shaft auxiliary cathode The density distribution behind the cover is relatively uniform, which improves the uniformity of the thickness of the layer deposited on the circuit board, thereby improving the electric ore quality of the circuit board. As described on the 35th, the present invention has indeed met the secret of the invention patent, and the patent is requested in accordance with the law. In the prior art, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by those skilled in the art of the present invention in light of the spirit of the invention are intended to be included within the scope of the following claims. [Simple description of the diagram] Tao]m is a schematic diagram of the line of the technical solution of the present invention. [_ Figure 2 County financial case - the implementation of the difficult to supply the electric μ-shaped rack display intention. 100102749 FIG. 3 is an auxiliary cathode of the electroplating system provided by the first embodiment of the present technical solution. Form No. 1010101 Page 17 of 34 1002004859-0 201231735 Schematic diagram of the cover. [0058] [0056] [0058] [0058] [0064] [0064] [0064] [0065] [0066] [0066] 4 is a cross-sectional view of the auxiliary cathode cover of FIG. 3 taken along the IV-IV direction. Fig. 5 is a schematic view showing an auxiliary cathode cover of an electroplating system according to a second embodiment of the present technical solution. Fig. 6 is a schematic view showing an auxiliary cathode cover of an electroplating system according to a third embodiment of the present technical solution. Fig. 7 is a schematic view showing an auxiliary cathode cover of the electroplating system provided by the θ embodiment of the present technical solution. FIG. 8 is a flow chart of a plating method provided by the first embodiment of the present technical solution. FIG. 9 is a flow chart of a plating method provided by a second embodiment of the present technical solution. [Main component symbol description] Plating system: 1 0 Plating tank: 11 Power supply: 12 Anode rod: 13 Electroplated anode: 14 Cathode rod: 15 Hanger: 16 Auxiliary cathode rod: 17 Auxiliary cathode cover: 18, 28, 38 ' 48 Bottom wall: 111 Form No. A0101 Page 18 of 34 1002004859-0 1f 201231735, [0067] First side wall: 112 [0068] Second side wall: 113 [0069] Plating solution: 101 [0070] Positive electrode: 121 [0071] Negative electrode: 122 [0072] Vertical rod: 161, [0073] Crossbar: 162 〇 [0074] Hook: 163 [0075] Conductive loss point. 16 4 [0076] Cover: 182, 282, 382, 482 [0077] Bending portion: 184 [0078] First edge region: 1821, 2821, 3821 [0079] ❹ Second edge region: 1822, 2822, 3822 [0080] Third edge region: 1 823, 2823, 4823 [ 0081] Fourth edge region: 1834, 2824 [0082] Center region: 1825, 2825, 3825, 4825 [0083] Peripheral region: 4821 [0084] First through hole: 102, 402 [0085] Second through hole: 103 403 100102749 Form No. A0101 Page 19/Total 34 Page 1002004859-0 [0086] [0088] 201231735 Circuit Board: First Surface Second Surface 20 ••21 :22 100102749 Form No. A0101 Page 20 of 34 1002004859-0