1307371 九、發明說明： 【發明所屬之技術領域】 本發明係有關印刷電路板之電鍍方法，特別是有關 於，在利用面板電鍍用固定架對電子機器中所使用之印刷 電路板的通孔進行導通電鍍時，可使製品内的電鍍厚度均 等化且防止電鍍物往印刷電路板端部附著，並可防止因來 自印刷電路板端部的電鍍銅粉飛散而造成各種不理想的狀 況者。 【先前技術】 以往，在以面板電鍍的方式對電子機器所使用之印刷 電路板的通孔進行導通電鍍之情況，係藉由預先將既施予 導電化處理的基板以導電性固定架作保持而形成陰極，且 使陽極浸潰於充滿有電鍍液的槽内以與設置在兩端的陽極 間之中央部分呈對峙並進行通電。 而此時所運用的固定架為，在一方與他方的直線狀構 件之上端部安裝有上部連接支架，同時在下端部安裝下部 連接支架，並在各個連接支架上設有長度調整用長孔用來 鎖固螺絲以形成固定架部，並在各個直線狀構件上形成有 用以挾持印刷電路板的溝，該等構成係屬習知(例如參照專 利文獻1)〇 通常，在面板電鍍的情況，印刷電路板端部周邊的電 鍍與中央部附近的電鍍相較之下係傾向較厚。此係如囷7 所示，浸潰在電鍍槽51之屬陰極的印刷電路板53其中央 部附近係從對峙的陽極52承受略均等的電流，而周邊部因 1307371 為也會承受來自周圍的返轉電流，因此，在印刷電路板53 周邊部的電流密度分布變高而傾向於附著較厚的電錢。 而在先行技術的對策方面，係提案一種將金屬線所成 的網狀遮蔽板插入陽極與基板之間，以使電流密度分布均 等化者(例如參照專利文獻2)。又，藉由使用開設有複數 個貫通孔的箱型遮蔽板而使印刷電路板的電链厚度均勻之 裝置係屬習知(例如參照專利文獻3) » 另一方面，使用一種設定有複數個孔部之孔徑和配置 密度不同的區域之遮蔽板而使印刷電路板之中央部的電流 密度和周圍部的電流密度成為均勻的電鍍方法係屬習知 (例如參照專利文獻4)。再者，於保持具（固定架；rack) 上設置有遮蔽板的構成亦廣習知(例如參照專利文獻5)。 【專利文獻1】曰本專利實開昭61 —182071號公報 【專利文獻2】日本專利特開昭50—50236號公報 【專利文獻3】日本專利實開昭56—21485號公報 【專利文獻4】曰本專利特開2002—54000號公報 【專利文獻5】曰本專利特開2002—161398號公報 【發明内容】 【發明所欲解決之課題】 如上述，藉由設置遮蔽扳得以改善印刷電路板表面的 電鍍厚度之不均。但是’針對附著於印刷電路板端部側面 的電鍵厚度，就算是設置遮蔽板也會受到來自周圍返轉之 電流的影響，所以並未獲得改善。例如圖8所示，將印刷 電路板60以3段式掛上固定架的情況，位在上下的印刷電 6 1307371 路板60之端部側面中，由虛線所圍繞的處所（塗黑的處 所)61附著著厚厚的電鍍。圖9係前述印刷電路板端部側 面61部分之斷面照片，可獲知其周圍也是附著厚厚的電鍍 之狀況。 因為印刷電路板表面的電鍍厚度並不是那麼地不均 等’所以在形成囷案之際對製品自體的蝕刻並不會造成障 礙，但是針對印刷電路板之端部側面及其周圍，如圖1〇 之照片所示’係在61a部分產生蚀刻殘留物。該姓刻殘留 # 物，如囷丨1之照片的6比部分所示，剝落之後係成為導電 性之污染物（contaminant)，例如在其後的抗銲層形成工 程’當該污染物一被捲入則會產生短路不良等各種問題。 以往’僅重視印刷電路板表面的電鍍厚度之不均，然而像 此種蝕刻殘留物之飛散所造成的不理想狀況也不由得放 過。 為了防止電鍍附著在印刷電路板端部側面，也考慮到 將印刷電路板端部進行遮蔽，然而為了將印刷電路板端部 遮蔽係會增加多餘的工程而造成成本上昇。且亦有所謂在 • 被遮蔽的處所周圍的電鍍變厚的弊端〇因此，印刷電路板 端部側面幾乎被遮蔽，成為有必要採用伴隨著到達該周圍 而逐漸增加電流密度那樣的電鍍方法。 於是’本發明係以提供一種在利用面板電鍍用固定架 對電子機器中所使用之印刷電路板的通孔進行導通電鍍 時，可使製品内的電鍵厚度均等化且防止電鍵物往印刷電 路板端部附著，並可防止因來自印刷電路板端部的電鍵銅 粉飛散所造成各種不理想狀況的印刷電路板之電鍵方法為 1307371 目的。 【解決課題之手段】 本發明係為達成上述目的而提案者，申請專利範圍第 1項所記載之發明係提供一種印刷電路板之電鍍方法，該 電鍍方法係使用面板電鍍用固定架，係以該面板電鍍用固 定架的橫框將成對的導電性之縱框保持間隔並作固定，前 述縱框係作為陰極而對印刷電路板供電且以將印刷電路板 挟入前述縱框之間的方式一邊進行保持一邊浸潰於電鍍液 • 中’該電鍍方法之特徵為：於前述面板電鍍用固定架的上 下裝設由絕緣物質所構成之遮蔽物，該絕緣物質具有可將 前述印刷電路板挾入之由v字形和方形组合成的斷面形 狀。 若依該構成’刿裝設在面板電鍍用固定架的上下之遮 蔽物係減少電流之未接而得以防止多餘的電鍍附著β該遮 蔽物因為具有將印刷電路板挾入般之V字形和方形組合成 的斷面形狀，所以在不會承接來自周圍的返轉電流之下， 在印刷電路板的中央部附近和端部周邊之電流密度係成為 大致均勻0 申請專利範圍第2項記載之發明係提供如申請專利範 圍第1項所記載之印刷電路板之電鍍方法，其中，於上述 面板電鍍用固定架之縱框，具有用以使電鍍厚度均等化的 開口部之板狀遮蔽物係安裝成在印刷電路板裝卸之際可作 開閉。 依該構成’係將設置在面板電鍍用固定架的縱框之板 狀遮蔽物開放於兩側，將印刷電路板插入上述下側之遮蔽 8 1307371 « » 物的v字形溝的部分。接著，將前述板狀遮蔽物閉合，再 將上側之遮蔽物之V字形溝的部分朝下而對印刷電路板插 入’以將印刷電路板固定於面板電鍍用固定架。 【發明效果】 本發明係如同上述’利用具有開口部的板狀遮蔽物而 使印刷電路板的電鍵厚度被均等化，而利用V字形和方形 組合之上下的遮蔽物使得印刷電路板端部側面及其周邊被 遮蔽以防止電鍍附著，並可防止因來自印刷電路板端部的 > 電鍵銅粉飛散而造成各種不理想的狀況。 【實施方式】 【發明實施最佳形態】 以下，茲針對本發明所涉及的印刷電路板之電鍍方 法’例舉較佳實施例進行說明。在利用面板電鍍用固定架 對電子機器中所使用的印刷電路板之通孔進行導通電鍍 時，欲使製品内的電鍍厚度均等化且防止電鍵往印刷電路 _ 板端部附著，並防止因來自印刷電路板端部的電鍍銅粉飛 散造成各種不理想狀況，而針對這樣的目的，係採用如此 的方式來實現，亦即，在面板電鍍用固定架的上下，裝設 具有可將前述印刷電路板挾入之具有V字形和方形組合成 的斷面形狀之絶緣物質所構成的遮蔽物，而在面板電鍍用 固定架的縱框，將具有用以使電鍍厚度均等化的開口部之 板狀遮蔽物安裝成在印刷電路板裝卸之際可開閉的方式以 施行電鍍者。 【實施例1】 9 1307371 圊1係本發明之電鍍方法所使用之面板電鍍用固定架 的前視圖，此面板電鍍用固定架（以下僅稱之為固定架）1〇 的主構件係由左右成對的導電性構件所成的縱框11、11， 以及安裝在此縱框11、11上下並用以保持左右間隔的橫框 12、12所構成，前述縱框11、11係形成為挾入印刷電路 板13、13···之兩側的方式一邊進行保持一邊浸潰於電鑛液 中，並作為陰極而對印刷電路板13、13…進行供電。 在前述縱框11，各個板狀遮蔽物14係安裝成可往左 φ 右方向開閉，該板狀遮蔽物14的上部和下部形成有延伸部 14a、14b用以將印刷電路板13的上下端部復蓋至中央部 分，該板狀遮蔽物14的中間設置有開口部14c。又，在該 板狀遮蔽物14之對應處開設有孔I4d、14d…。此外，該 板柊遮蔽物14係在固定架1 〇之前後的面（圖面之眼前側與 裏‘），各自以可往左右方向開閉的方式被裝設著。 其次，於前述板狀遮蔽物14的内側，在前述固定架 10的上下位置各自設置遮蔽物15a、15b。圖2係設置在固 定架10的下部之遮蔽物15b的照片，圖3係遮蔽物15b 之側面的照片，圖4係表示遮蔽物的斷面形狀之說明圖β 如囷2至圖4所示，遮蔽物15a、15b係由具有ν字 形和方形組合斷面形狀的絕緣物質所構成，在印刷電路板 13挾入該遮蔽物15a、15b的溝之後’在方形的c區間中， 印刷電路板端部側面及其周邊幾乎被遮蔽而可抑制電錄之 附著。而且，V字形的區間b係形成伴隨著往其周圍前進 電流密度會依序增加的形狀。 而為了使整體可附著更均等厚度的電鍍，遮蔽物 1307371 15a、15b 之各部尺寸係以 a : 20mm，b : 50mm，c : 20mni，d : 40mm為最佳。其中容許± 10%左右的尺寸變更。此外，e 部的尺寸也可依印刷電路板13的大小而任意地設定。此 外’上部的遮蔽物15a係以溝朝下的方式設置成可上下移 動’而下部的遮蔽物15b則以溝朝上的方式作設置》 在利用前述固定架10進行前述印刷電路板13的電鍍 處理時’如囷1所示’將固定架所安裝的板狀遮蔽物 14、14兩側開放，使1片印刷電路板13的兩端挾持於左 • 右的縱框11、11，同時將該印刷電路板13的下端插入被 設置在固定架10下部的遮蔽物15b之溝内，再以未圖式的 定位手段作固定之後，於前述下段的印刷電路板13之上 部依序重疊剩餘的2片印刷電路板13、13，再挾持於左右 的縱框11、11並以定位手段作固定。 接著’將左右的板狀遮蔽物、14閉合之後，將被 設置在固定架10上部的遮蔽物15a在下方閉合，再將該遮 蔽物15a的溝插入上段的印刷電路板13之上端並進行固 定。 如此一來，在前述固定架10使複數個印刷電路板13 保持且以板狀遮蔽物14作遮蔽，同時利用該板狀遮蔽物 14之内側所設置的上下之遮蔽物15a、15b來遮蔽印刷電 路板13之端部側面，藉此使得電流密度在印刷電路板之中 央部附近和端部周邊成為大致均勻》 囷5係使用遮蔽物15a、15b進行電鍍後的印刷電路 板端部之斷面照片，其與進行了圖9所示以往的電鍍方法 後的印刷電路板之斷面照片比較可知，印刷電路板端部的 11 1307371 電鍍厚度係變薄。 圖6(1)〜(2)係為未具有遮蔽物的情況之電鍍厚度分 布及使用了本發明之遮蔽物的情況之電鐘厚度分布的比較 圖，由同圖6(2)所示之本發明的電鍍方法與同圖6(i)所示 之以往的電鍍方法相較之下可知，本發明之印刷電路板端 部的電鍵厚度薄且整體之電鍍厚度分布更加均勻化。如此 係可確認本發明在固定架之上下配置有遮蔽物此種電鍍方 法之有效性。 此外’本發明可在未逸脫本發明精神的範圍内進行各 種改變，而且本發明可及於該改變者亦理所當然。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of electroplating a printed circuit board, and more particularly to a through hole for a printed circuit board used in an electronic device by using a panel plating holder. When the plating is turned on, the plating thickness in the product can be equalized and the plating can be prevented from adhering to the end of the printed circuit board, and various undesired conditions caused by the scattering of the electroplated copper powder from the end portion of the printed circuit board can be prevented. [Prior Art] Conventionally, in the case of conducting plating of a through hole of a printed circuit board used in an electronic device by panel plating, the substrate to which the conductive treatment is applied is previously held by a conductive holder. The cathode is formed, and the anode is immersed in a bath filled with a plating solution to face and be electrically connected to a central portion between the anodes provided at both ends. In this case, the fixing frame used is such that an upper connecting bracket is attached to the upper end portion of one of the linear members, and a lower connecting bracket is attached to the lower end portion, and a long hole for length adjustment is provided on each of the connecting brackets. The fixing screws are formed to form the fixing frame portion, and a groove for holding the printed circuit board is formed on each of the linear members. Such a configuration is known (for example, refer to Patent Document 1). Generally, in the case of panel plating, The plating around the end of the printed circuit board tends to be thicker than the plating near the central portion. As shown in FIG. 7, the printed circuit board 53 which is immersed in the cathode of the plating tank 51 receives a slightly equal current from the opposite anode 52 in the vicinity of the center portion, and the peripheral portion is also subjected to the surrounding from the surrounding 1303731. Since the current is reversed, the current density distribution at the peripheral portion of the printed circuit board 53 becomes high and tends to adhere to a thick electric money. In the countermeasure against the prior art, a mesh shielding plate made of a metal wire is inserted between the anode and the substrate to equalize the current density distribution (see, for example, Patent Document 2). Further, it is known to use a box type shielding plate in which a plurality of through holes are formed to make the thickness of the electric wiring of the printed circuit board uniform (for example, refer to Patent Document 3). On the other hand, a plurality of settings are used. A plating method in which the hole diameter of the hole portion and the shielding plate in the region where the density is different is uniform, and the current density at the central portion of the printed circuit board and the current density in the peripheral portion are uniform (see, for example, Patent Document 4). Further, a configuration in which a shielding plate is provided on a holder (a rack) is also widely known (for example, refer to Patent Document 5). [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 5] [Patent Document 5] Japanese Patent Laid-Open Publication No. 2002-161398 [Draft of the Invention] [Problems to be Solved by the Invention] As described above, the printed circuit can be improved by providing a shield plate The plating thickness on the surface of the board is uneven. However, the thickness of the key attached to the side of the end portion of the printed circuit board is not affected by the influence of the current from the surrounding return even if the shielding plate is provided. For example, as shown in FIG. 8, in the case where the printed circuit board 60 is attached to the holder in a three-stage manner, the space is placed in the end side of the upper and lower printed circuit 6 1307371, and the space surrounded by the broken line (blackened place) ) 61 is attached with a thick plating. Fig. 9 is a cross-sectional photograph of a portion of the side surface 61 of the printed circuit board, and it is known that a thick plating is applied around the printed circuit board. Because the plating thickness of the surface of the printed circuit board is not so uneven, the etching of the product itself does not pose an obstacle when forming the defect, but for the side of the end of the printed circuit board and its surroundings, as shown in Figure 1. The photo shown in the photo shows the etch residue in section 61a. The surname is residue #物, as shown in the 6-portion of the photograph of 囷丨1, after peeling off, it becomes a conductive contaminant, for example, in the subsequent solder resist formation process 'when the contaminant is Entanglement can cause various problems such as short circuit failure. In the past, only the unevenness of the plating thickness on the surface of the printed circuit board was emphasized, but the unfavorable situation caused by the scattering of such an etching residue was not allowed to be released. In order to prevent plating from adhering to the side of the end portion of the printed circuit board, it is also considered to shield the end portion of the printed circuit board. However, in order to shield the end portion of the printed circuit board, additional work is added to increase the cost. There is also a drawback that plating is thickened around the sheltered space. Therefore, the side surface of the printed circuit board is almost shielded, and it is necessary to use a plating method in which the current density is gradually increased as it reaches the periphery. Thus, the present invention provides a method for equalizing the thickness of a key in a product and preventing the electric key from being printed on a printed circuit board when the through hole of the printed circuit board used in the electronic device is electrically plated by the panel for plating. The terminal is attached, and the key method of the printed circuit board which is caused by the scattering of the copper powder from the end of the printed circuit board is prevented to be 1307371. [Means for Solving the Problems] The present invention provides a method for electroplating a printed circuit board, which is a method for achieving the above-mentioned object. The cross frame of the panel for the panel plating maintains a spacing and fixing of the pair of conductive vertical frames, and the vertical frame serves as a cathode to supply power to the printed circuit board and to break the printed circuit board between the vertical frames. The method is characterized in that: the plating method is characterized in that a shield composed of an insulating material is provided on the upper and lower sides of the fixing plate for panel plating, and the insulating material has the printed circuit board The cross-sectional shape formed by the combination of a v-shape and a square. According to the configuration, the shields provided on the upper and lower sides of the panel plating holder are used to reduce the current leakage, thereby preventing excessive plating adhesion. The mask has a V-shape and a square shape because the printed circuit board is inserted. The combined cross-sectional shape is such that the current density near the central portion of the printed circuit board and the periphery of the end portion is substantially uniform under the fact that the return current from the surroundings is not received. The method of electroplating a printed circuit board according to the first aspect of the invention, wherein the vertical frame of the panel for mounting the panel has a plate-shaped shield for opening an opening for equalizing the thickness of the plating It can be opened and closed when the printed circuit board is loaded and unloaded. According to this configuration, the plate-shaped shield provided in the vertical frame of the panel plating holder is opened on both sides, and the printed circuit board is inserted into the lower portion of the v-shaped groove of the lower side of the cover 13 1307371 « . Next, the plate-like shield is closed, and the portion of the V-shaped groove of the upper shield is placed downward to be inserted into the printed circuit board to fix the printed circuit board to the panel plating holder. [Effect of the Invention] The present invention is such that the thickness of the key of the printed circuit board is equalized by using the plate-shaped shield having the opening portion, and the side of the end portion of the printed circuit board is made by using the shield above and below the V-shaped and square combination. The periphery and its periphery are shielded to prevent plating adhesion, and various undesirable conditions due to the scattering of the copper powder from the end of the printed circuit board can be prevented. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the plating method for a printed circuit board according to the present invention will be described. When the through hole of the printed circuit board used in the electronic device is turned on by the panel plating holder, the plating thickness in the product is equalized and the key is prevented from adhering to the end of the printed circuit board, and the cause is prevented from coming. The electroplating of copper powder at the end of the printed circuit board causes various undesired conditions, and for such a purpose, it is realized in such a manner that the printed circuit is provided on the upper and lower sides of the fixing plate for panel plating. A shield formed of an insulating material having a cross-sectional shape in which a V-shaped shape and a square shape are combined, and a vertical frame having a mounting plate for panel plating has a plate shape having an opening portion for equalizing the plating thickness. The shield is mounted to open and close the printed circuit board to perform electroplating. [Embodiment 1] 9 1307371 圊1 is a front view of a panel plating fixing frame used in the plating method of the present invention, and the main component of the panel plating fixing frame (hereinafter simply referred to as a fixing frame) is left and right. The vertical frames 11 and 11 formed by the pair of conductive members and the horizontal frames 12 and 12 which are mounted on the vertical frames 11 and 11 to maintain the left and right intervals, and the vertical frames 11 and 11 are formed as intrusion The two sides of the printed circuit boards 13 and 13 are immersed in the electro-mineral liquid while being held, and the printed circuit boards 13, 13 are supplied as a cathode. In the vertical frame 11, each of the plate-like shields 14 is attached to be openable and closable to the left φ, and the upper and lower portions of the plate-like shield 14 are formed with extensions 14a and 14b for upper and lower ends of the printed circuit board 13. The portion is covered to the central portion, and an opening portion 14c is provided in the middle of the plate-shaped shield 14. Further, holes I4d, 14d, ... are opened at the corresponding portions of the plate-like shield 14. Further, the sill shield 14 is attached to the front surface (front side and inner side of the drawing) before and after the fixing frame 1 ,, and is attached so as to be openable and closable in the left-right direction. Next, on the inner side of the plate-like shield 14, shields 15a and 15b are provided on the upper and lower positions of the holder 10. 2 is a photograph of the shield 15b provided at the lower portion of the holder 10, FIG. 3 is a photograph of the side surface of the shield 15b, and FIG. 4 is an explanatory view showing the sectional shape of the shield. FIG. 2 to FIG. The shields 15a, 15b are composed of an insulating material having a ν-shaped and square combined sectional shape, and after the printed circuit board 13 is immersed in the grooves of the shields 15a, 15b, in the square c section, the printed circuit board The side of the end portion and its periphery are almost shielded to suppress the attachment of the electric recording. Further, the section b of the V-shape forms a shape in which the current density increases in order as it progresses toward the periphery. In order to make the plating more uniform in thickness, the dimensions of the respective portions 1307371 15a, 15b are preferably a: 20 mm, b: 50 mm, c: 20 mni, d: 40 mm. It allows a size change of about ± 10%. Further, the size of the e portion can be arbitrarily set depending on the size of the printed circuit board 13. Further, 'the upper shield 15a is provided so as to be movable up and down in a groove-down manner, and the lower shield 15b is disposed in a groove-upward manner". The plating of the printed circuit board 13 is performed by the above-described fixing frame 10. During processing, as shown in Fig. 1, the plate-shaped shields 14, 14 mounted on the holder are opened on both sides, so that both ends of one printed circuit board 13 are held by the left and right vertical frames 11, 11 and The lower end of the printed circuit board 13 is inserted into the groove of the shielding member 15b disposed at the lower portion of the fixing frame 10, and then fixed by the positioning means (not shown), and then the remaining portions of the lower printed circuit board 13 are sequentially overlapped. The two printed circuit boards 13, 13 are held by the left and right vertical frames 11, 11 and fixed by positioning means. Then, after the left and right plate-shaped shields 14 are closed, the shield 15a provided on the upper portion of the holder 10 is closed below, and the groove of the shield 15a is inserted into the upper end of the printed circuit board 13 of the upper stage and fixed. . In this manner, the plurality of printed circuit boards 13 are held by the holder 10 and shielded by the plate-shaped shields 14, and the upper and lower shields 15a and 15b provided on the inner side of the plate-shaped shields 14 are used to shield the printing. The end side of the circuit board 13 is such that the current density is substantially uniform near the central portion of the printed circuit board and the periphery of the end portion. 囷5 The cross section of the printed circuit board after plating using the shields 15a, 15b In comparison with the cross-sectional photograph of the printed circuit board after the conventional plating method shown in FIG. 9, the photograph shows that the thickness of the 11 1307371 plating portion at the end of the printed circuit board is thin. 6(1) to (2) are comparison diagrams of the plating thickness distribution in the case where the shielding is not provided and the thickness distribution of the electric clock in the case where the shielding of the present invention is used, as shown in Fig. 6 (2) In the plating method of the present invention, as compared with the conventional plating method shown in Fig. 6(i), the thickness of the terminal of the printed circuit board of the present invention is thin and the overall plating thickness distribution is more uniform. Thus, the effectiveness of the plating method in which the present invention is disposed with a shield over the holder can be confirmed. Further, the present invention can be variously modified without departing from the spirit and scope of the invention, and the present invention can be taken as a matter of course.
12 1307371 【圖式簡單說明】 圓1係本發明之電鍵方法所使用之面板電鑛用固定架的前 視圖。 圖2係圖1所示固定架的下部所設置的遮蔽物的照片。 圖3係囷1所示之遮蔽物的側面之照片。 圖4係表示圖1所示之遮蔽物的斷面形狀之說明圖。 圖5係進行了本發明的電鍍方法後之印刷電路板端部的斷 面照片。 # 圖6(1)〜（2)係本發明之電錄方法和以往的電鍍方法間之 電鍵厚度分布比較圖。 圖7係表示以往的電鍍方法之不理想狀況的說明圖。 圖8係表示以往的電鍍方法之不理想狀況的說明圖。。 圖9係進行了以往的電鍍方法後之印刷電路板端部的斷面 照片。 ' 圖10係表示以往的電鍍方法的不理想狀況之說明照片。 圖11係表示以往的電鍍方法的不理想狀況之說明照片。 13 1307371 【主要元件符號說明】 ίο......面板電鍵用固定架 11.. ....縱框 12……橫框 13.. ....印刷電路板 14板狀遮蔽物 14a...延伸部 14b...延伸部 14c…開口部 14d...孔 15a...遮蔽物 15b...遮蔽物 51.. ....電鍍槽 52.. ....陽極 53.. ....印刷電路板 60.. ....印刷電路板 61.. ....印刷電路板端部侧面12 1307371 BRIEF DESCRIPTION OF THE DRAWINGS A circle 1 is a front view of a panel electric ore fixing frame used in the key method of the present invention. Figure 2 is a photograph of the shelter provided in the lower portion of the holder shown in Figure 1. Figure 3 is a photograph of the side of the shelter shown in Figure 1. Fig. 4 is an explanatory view showing a sectional shape of the shield shown in Fig. 1; Fig. 5 is a cross-sectional photograph of the end portion of the printed circuit board after the plating method of the present invention is carried out. #Fig. 6(1) to (2) are graphs showing a comparison of the thickness distribution of the electric keys between the electro-recording method of the present invention and the conventional electroplating method. Fig. 7 is an explanatory view showing an unsatisfactory state of the conventional plating method. Fig. 8 is an explanatory view showing an unsatisfactory state of a conventional plating method. . Fig. 9 is a cross-sectional photograph of the end portion of the printed circuit board after the conventional plating method. Fig. 10 is a photograph showing an unsatisfactory state of the conventional plating method. Fig. 11 is a photograph showing an unsatisfactory state of the conventional plating method. 13 1307371 [Description of main component symbols] ίο...... Fixing frame for panel keys 11..... Vertical frame 12... Horizontal frame 13... Printed circuit board 14 plate-shaped shield 14a ...extension portion 14b...extension portion 14c...opening portion 14d...hole 15a...shield 15b...shield 51.....plating tank 52.....anode 53 .. .... printed circuit board 60.....printed circuit board 61.....printed circuit board end side