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TWI320421B - Epoxy resin composition and semiconductor device - Google Patents

Epoxy resin composition and semiconductor device Download PDF

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Publication number
TWI320421B
TWI320421B TW093103542A TW93103542A TWI320421B TW I320421 B TWI320421 B TW I320421B TW 093103542 A TW093103542 A TW 093103542A TW 93103542 A TW93103542 A TW 93103542A TW I320421 B TWI320421 B TW I320421B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
resin composition
epoxy resin
coupling agent
formula
Prior art date
Application number
TW093103542A
Other languages
Chinese (zh)
Other versions
TW200420658A (en
Inventor
Atsunori Nishikawa
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200420658A publication Critical patent/TW200420658A/en
Application granted granted Critical
Publication of TWI320421B publication Critical patent/TWI320421B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

第93103542號專利申請案 中文說明書更正頁 民國99年7月Μ日修正Patent Application No. 93103542 Chinese Correction Page Corrected the following day of July 1999

1320421 (10) 成型’注射成型之成型方法進行硬化成型即可。 以下代表本發明實施例，惟，本發明並未. 配合比例爲重量份者。 又，有關使用實施例及比較例之偶合劑及^ 下所示。 偶合劑1 :式（7 )所示偶合劑（信越化學 ’ ΚΒΜ - 573 ) NH-(CH2)3 — Si(OCH3)3 偶合劑2 :式（8 )所示偶合劑（信越化學 ，X 1 2 - 806 ) CH3(CH2)3 -NH-(CH2)3-Si(OCH3)3 偶合劑3 :式（9 )所示之偶合劑（信越化 製，KBM - 8 03 ) HS-(CH2)3-Si(OCH3)3 (9) 偶合劑4 :式（10 )所示之偶合劑（信越 )製，KBM-403) g限於此， 匕合物者如 (股份）製 (7) 〔股份）製 (8) $ (股份） ;學（股份1320421 (10) Molding 'Injection molding method can be hardened. The following are representative of the examples of the present invention, but the present invention is not. The blending ratio is in parts by weight. Further, the coupling agents of the examples and the comparative examples were used. Coupling agent 1: coupling agent represented by formula (7) (Shin-Etsu Chemical ' ΚΒΜ - 573 ) NH-(CH2) 3 - Si(OCH3) 3 coupling agent 2 : coupling agent represented by formula (8) (Xin Yue Chemical, X 1 2 - 806 ) CH3(CH2)3 -NH-(CH2)3-Si(OCH3)3 coupling agent 3: coupling agent represented by formula (9) (manufactured by Shin-Etsu Chemical Co., Ltd., KBM - 8 03 ) HS-(CH2) 3-Si(OCH3)3 (9) Coupling agent 4: The coupling agent (Shin-Etsu) of the formula (10), KBM-403) g is limited to this, and the compound of the compound such as (share) (7) [shares System (8) $ (shares); learning (shares

TW093103542A 2003-02-18 2004-02-13 Epoxy resin composition and semiconductor device TWI320421B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003039620 2003-02-18

Publications (2)

Publication Number Publication Date
TW200420658A TW200420658A (en) 2004-10-16
TWI320421B true TWI320421B (en) 2010-02-11

Family

ID=32905179

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103542A TWI320421B (en) 2003-02-18 2004-02-13 Epoxy resin composition and semiconductor device

Country Status (6)

Country Link
JP (1) JP4692885B2 (en)
KR (1) KR100982123B1 (en)
CN (1) CN1315905C (en)
MY (1) MY146460A (en)
TW (1) TWI320421B (en)
WO (1) WO2004074344A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206696A (en) * 2005-01-26 2006-08-10 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2006328360A (en) * 2005-04-28 2006-12-07 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP5062714B2 (en) * 2006-01-19 2012-10-31 日本化薬株式会社 Active energy ray-curable resin composition and use thereof
KR100699191B1 (en) * 2006-03-13 2007-03-23 제일모직주식회사 Epoxy resin composition for sealing semiconductor devices and semiconductor device using the same
JP4984722B2 (en) * 2006-07-28 2012-07-25 住友ベークライト株式会社 Epoxy resin composition, epoxy resin molding material and semiconductor device
KR100834351B1 (en) * 2006-11-24 2008-06-02 제일모직주식회사 Multichip package Epoxy resin composition for sealing and multichip package using the same
KR100798675B1 (en) 2006-12-12 2008-01-28 제일모직주식회사 Epoxy Resin Composition for Semiconductor Device Sealing and Semiconductor Device Using the Same
JP5473196B2 (en) * 2007-05-16 2014-04-16 東レ・ダウコーニング株式会社 Curable epoxy resin composition and cured product thereof
KR100934558B1 (en) * 2007-10-08 2009-12-29 제일모직주식회사 Adhesive film composition for semiconductor assembly comprising phenol type curable resin reacted with silane coupling agent and adhesive film
KR101023241B1 (en) * 2009-12-28 2011-03-21 제일모직주식회사 Adhesive composition for semiconductor and adhesive film using same
JP5423402B2 (en) * 2010-01-06 2014-02-19 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
CN102372899A (en) * 2010-08-11 2012-03-14 江苏中鹏新材料股份有限公司 Flame-retarding green epoxy molding compound
CN101962466B (en) * 2010-09-25 2012-01-04 江苏中鹏新材料股份有限公司 Intrinsic flame-retardant epoxy resin composition for semiconductor package
CN101967266A (en) * 2010-09-25 2011-02-09 江苏中鹏新材料股份有限公司 Halogen-free fire-retarding epoxy resin composition
JP2013108024A (en) * 2011-11-24 2013-06-06 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing and electronic component device
CN104136532B (en) * 2012-03-01 2016-05-18 住友电木株式会社 Rotor fixing resin composition, rotor and automobile
JP2013234303A (en) * 2012-05-11 2013-11-21 Panasonic Corp Epoxy resin composition for sealing semiconductor and semiconductor device
JP5949674B2 (en) 2013-06-12 2016-07-13 信越化学工業株式会社 Novel organosilicon compound, process for producing the same and adhesion improver
CN106592281B (en) * 2016-12-15 2019-05-28 武汉纺织大学 A method of improving coating and is impregnated with efficiency
JP7750169B2 (en) 2022-05-02 2025-10-07 信越化学工業株式会社 Mercapto- and alkoxysilyl-containing organopolysiloxane and composition containing same
KR20250139561A (en) * 2024-03-15 2025-09-23 주식회사 케이씨씨 Insulating material composition and rotating electrical machine comprising the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3192953B2 (en) * 1995-12-27 2001-07-30 住友ベークライト株式会社 Epoxy resin molding material for semiconductor encapsulation and method for producing the same
JP3267144B2 (en) * 1996-03-22 2002-03-18 松下電工株式会社 Epoxy resin composition for sealing material and semiconductor device using the same
JPH11140277A (en) * 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device using the same
JPH11140166A (en) * 1997-11-11 1999-05-25 Shin Etsu Chem Co Ltd Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP3582576B2 (en) * 1998-05-15 2004-10-27 信越化学工業株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP2000281751A (en) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2001040186A (en) * 1999-08-03 2001-02-13 Nitto Denko Corp Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP2001207031A (en) * 2000-01-28 2001-07-31 Nitto Denko Corp Resin composition for semiconductor encapsulation and semiconductor device
JP2001213942A (en) * 2000-02-03 2001-08-07 Nec Corp Flame-retardant epoxy resin composition
JP2002012742A (en) * 2000-06-28 2002-01-15 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4568985B2 (en) * 2000-10-31 2010-10-27 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP2002179882A (en) * 2000-12-07 2002-06-26 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2002220511A (en) * 2001-01-25 2002-08-09 Matsushita Electric Works Ltd Epoxy resin composition for sealing and semiconductor device
JP4734731B2 (en) * 2001-02-23 2011-07-27 パナソニック電工株式会社 Method for producing epoxy resin composition for semiconductor encapsulation
JP2002317102A (en) * 2001-04-20 2002-10-31 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4849290B2 (en) * 2001-06-26 2012-01-11 日立化成工業株式会社 Epoxy resin molding material for sealing and electronic component device
JP2003082068A (en) * 2001-06-29 2003-03-19 Toray Ind Inc Epoxy resin composition and semiconductor device using the same
JP5098125B2 (en) * 2001-07-30 2012-12-12 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP2003252961A (en) * 2002-03-05 2003-09-10 Toray Ind Inc Epoxy resin composition and semiconductor device using the same

Also Published As

Publication number Publication date
TW200420658A (en) 2004-10-16
JPWO2004074344A1 (en) 2006-06-01
KR100982123B1 (en) 2010-09-14
JP4692885B2 (en) 2011-06-01
WO2004074344A1 (en) 2004-09-02
KR20050107416A (en) 2005-11-11
CN1315905C (en) 2007-05-16
MY146460A (en) 2012-08-15
CN1745119A (en) 2006-03-08

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