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TWI320421B - Epoxy resin composition and semiconductor device - Google Patents

Epoxy resin composition and semiconductor device Download PDF

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Publication number
TWI320421B
TWI320421B TW093103542A TW93103542A TWI320421B TW I320421 B TWI320421 B TW I320421B TW 093103542 A TW093103542 A TW 093103542A TW 93103542 A TW93103542 A TW 93103542A TW I320421 B TWI320421 B TW I320421B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
resin composition
epoxy resin
coupling agent
formula
Prior art date
Application number
TW093103542A
Other languages
English (en)
Other versions
TW200420658A (en
Inventor
Atsunori Nishikawa
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200420658A publication Critical patent/TW200420658A/zh
Application granted granted Critical
Publication of TWI320421B publication Critical patent/TWI320421B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

第93103542號專利申請案 中文說明書更正頁 民國99年7月Μ日修正
1320421 (10) 成型’注射成型之成型方法進行硬化成型即可。 以下代表本發明實施例，惟，本發明並未. 配合比例爲重量份者。 又，有關使用實施例及比較例之偶合劑及^ 下所示。 偶合劑1 :式（7 )所示偶合劑（信越化學 ’ ΚΒΜ - 573 ) NH-(CH2)3 — Si(OCH3)3 偶合劑2 :式（8 )所示偶合劑（信越化學 ，X 1 2 - 806 ) CH3(CH2)3 -NH-(CH2)3-Si(OCH3)3 偶合劑3 :式（9 )所示之偶合劑（信越化 製，KBM - 8 03 ) HS-(CH2)3-Si(OCH3)3 (9) 偶合劑4 :式（10 )所示之偶合劑（信越 )製，KBM-403) g限於此， 匕合物者如 (股份）製 (7) 〔股份）製 (8) $ (股份） ;學（股份
TW093103542A 2003-02-18 2004-02-13 Epoxy resin composition and semiconductor device TWI320421B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003039620 2003-02-18

Publications (2)

Publication Number Publication Date
TW200420658A TW200420658A (en) 2004-10-16
TWI320421B true TWI320421B (en) 2010-02-11

Family

ID=32905179

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103542A TWI320421B (en) 2003-02-18 2004-02-13 Epoxy resin composition and semiconductor device

Country Status (6)

Country Link
JP (1) JP4692885B2 (zh)
KR (1) KR100982123B1 (zh)
CN (1) CN1315905C (zh)
MY (1) MY146460A (zh)
TW (1) TWI320421B (zh)
WO (1) WO2004074344A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206696A (ja) * 2005-01-26 2006-08-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006328360A (ja) * 2005-04-28 2006-12-07 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP5062714B2 (ja) * 2006-01-19 2012-10-31 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びその用途
KR100699191B1 (ko) * 2006-03-13 2007-03-23 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자
JP4984722B2 (ja) * 2006-07-28 2012-07-25 住友ベークライト株式会社 エポキシ樹脂組成物、エポキシ樹脂成形材料及び半導体装置
KR100834351B1 (ko) * 2006-11-24 2008-06-02 제일모직주식회사 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지
KR100798675B1 (ko) 2006-12-12 2008-01-28 제일모직주식회사 반도체 소자 밀봉용 에폭시수지 조성물 및 이를 이용한반도체 소자
JP5473196B2 (ja) * 2007-05-16 2014-04-16 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物およびその硬化物
KR100934558B1 (ko) * 2007-10-08 2009-12-29 제일모직주식회사 실란커플링제와 선반응된 페놀형 경화수지를 포함하는반도체 조립용 접착 필름 조성물 및 이에 의한 접착 필름
KR101023241B1 (ko) * 2009-12-28 2011-03-21 제일모직주식회사 반도체용 접착제 조성물 및 이를 이용한 접착 필름
JP5423402B2 (ja) * 2010-01-06 2014-02-19 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
CN102372899A (zh) * 2010-08-11 2012-03-14 江苏中鹏新材料股份有限公司 一种阻燃绿色环氧模塑料
CN101962466B (zh) * 2010-09-25 2012-01-04 江苏中鹏新材料股份有限公司 半导体封装用本征阻燃环氧树脂组合物
CN101967266A (zh) * 2010-09-25 2011-02-09 江苏中鹏新材料股份有限公司 无卤阻燃环氧树脂组合物
JP2013108024A (ja) * 2011-11-24 2013-06-06 Sumitomo Bakelite Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
CN104136532B (zh) * 2012-03-01 2016-05-18 住友电木株式会社 转子固定用树脂组合物、转子和汽车
JP2013234303A (ja) * 2012-05-11 2013-11-21 Panasonic Corp 半導体封止用エポキシ樹脂組成物と半導体装置
JP5949674B2 (ja) 2013-06-12 2016-07-13 信越化学工業株式会社 新規有機ケイ素化合物、その製造方法及び密着向上剤
CN106592281B (zh) * 2016-12-15 2019-05-28 武汉纺织大学 一种改善涂料浸透效率的方法
JP7750169B2 (ja) 2022-05-02 2025-10-07 信越化学工業株式会社 メルカプト基およびアルコキシシリル基含有オルガノポリシロキサン、ならびにそれを含む組成物
KR20250139561A (ko) * 2024-03-15 2025-09-23 주식회사 케이씨씨 절연재 조성물 및 이를 포함하는 회전 전기 기기

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3192953B2 (ja) * 1995-12-27 2001-07-30 住友ベークライト株式会社 半導体封止用エポキシ樹脂成形材料及びその製造方法
JP3267144B2 (ja) * 1996-03-22 2002-03-18 松下電工株式会社 封止材用エポキシ樹脂組成物及びそれを用いた半導体装置
JPH11140277A (ja) * 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
JPH11140166A (ja) * 1997-11-11 1999-05-25 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3582576B2 (ja) * 1998-05-15 2004-10-27 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2000281751A (ja) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2001040186A (ja) * 1999-08-03 2001-02-13 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2001207031A (ja) * 2000-01-28 2001-07-31 Nitto Denko Corp 半導体封止用樹脂組成物及び半導体装置
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JP2002012742A (ja) * 2000-06-28 2002-01-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4568985B2 (ja) * 2000-10-31 2010-10-27 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2002179882A (ja) * 2000-12-07 2002-06-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002220511A (ja) * 2001-01-25 2002-08-09 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
JP4734731B2 (ja) * 2001-02-23 2011-07-27 パナソニック電工株式会社 半導体封止用エポキシ樹脂組成物の製造方法
JP2002317102A (ja) * 2001-04-20 2002-10-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4849290B2 (ja) * 2001-06-26 2012-01-11 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP2003082068A (ja) * 2001-06-29 2003-03-19 Toray Ind Inc エポキシ系樹脂組成物およびそれを用いた半導体装置
JP5098125B2 (ja) * 2001-07-30 2012-12-12 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2003252961A (ja) * 2002-03-05 2003-09-10 Toray Ind Inc エポキシ系樹脂組成物およびそれを用いた半導体装置

Also Published As

Publication number Publication date
TW200420658A (en) 2004-10-16
JPWO2004074344A1 (ja) 2006-06-01
KR100982123B1 (ko) 2010-09-14
JP4692885B2 (ja) 2011-06-01
WO2004074344A1 (ja) 2004-09-02
KR20050107416A (ko) 2005-11-11
CN1315905C (zh) 2007-05-16
MY146460A (en) 2012-08-15
CN1745119A (zh) 2006-03-08

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