TWI318439B - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor deviceInfo
- Publication number
- TWI318439B TWI318439B TW095139553A TW95139553A TWI318439B TW I318439 B TWI318439 B TW I318439B TW 095139553 A TW095139553 A TW 095139553A TW 95139553 A TW95139553 A TW 95139553A TW I318439 B TWI318439 B TW I318439B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- manufacturing semiconductor
- manufacturing
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/50—Peripheral circuit region structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
- H10B12/053—Making the transistor the transistor being at least partially in a trench in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Element Separation (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005313661A JP4773182B2 (ja) | 2005-10-28 | 2005-10-28 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200733306A TW200733306A (en) | 2007-09-01 |
| TWI318439B true TWI318439B (en) | 2009-12-11 |
Family
ID=37995129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095139553A TWI318439B (en) | 2005-10-28 | 2006-10-26 | Method for manufacturing semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7935595B2 (zh) |
| JP (1) | JP4773182B2 (zh) |
| CN (1) | CN100447985C (zh) |
| TW (1) | TWI318439B (zh) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7547945B2 (en) * | 2004-09-01 | 2009-06-16 | Micron Technology, Inc. | Transistor devices, transistor structures and semiconductor constructions |
| US7384849B2 (en) * | 2005-03-25 | 2008-06-10 | Micron Technology, Inc. | Methods of forming recessed access devices associated with semiconductor constructions |
| US7282401B2 (en) | 2005-07-08 | 2007-10-16 | Micron Technology, Inc. | Method and apparatus for a self-aligned recessed access device (RAD) transistor gate |
| US7612411B2 (en) * | 2005-08-03 | 2009-11-03 | Walker Andrew J | Dual-gate device and method |
| US7867851B2 (en) | 2005-08-30 | 2011-01-11 | Micron Technology, Inc. | Methods of forming field effect transistors on substrates |
| JP4773182B2 (ja) * | 2005-10-28 | 2011-09-14 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
| US7700441B2 (en) * | 2006-02-02 | 2010-04-20 | Micron Technology, Inc. | Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gates |
| US7602001B2 (en) | 2006-07-17 | 2009-10-13 | Micron Technology, Inc. | Capacitorless one transistor DRAM cell, integrated circuitry comprising an array of capacitorless one transistor DRAM cells, and method of forming lines of capacitorless one transistor DRAM cells |
| US7772632B2 (en) * | 2006-08-21 | 2010-08-10 | Micron Technology, Inc. | Memory arrays and methods of fabricating memory arrays |
| US7589995B2 (en) * | 2006-09-07 | 2009-09-15 | Micron Technology, Inc. | One-transistor memory cell with bias gate |
| US7595262B2 (en) * | 2006-10-27 | 2009-09-29 | Qimonda Ag | Manufacturing method for an integrated semiconductor structure |
| KR100801746B1 (ko) * | 2006-12-29 | 2008-02-11 | 주식회사 하이닉스반도체 | 벌브 타입의 리세스 채널을 갖는 반도체 소자의 제조방법 |
| US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
| TWI346364B (en) * | 2007-08-14 | 2011-08-01 | Nanya Technology Corp | Method for fabricating line type recess channel mos transistor device |
| JP2009076575A (ja) * | 2007-09-19 | 2009-04-09 | Elpida Memory Inc | 半導体装置の製造方法 |
| JP2009182114A (ja) * | 2008-01-30 | 2009-08-13 | Elpida Memory Inc | 半導体装置およびその製造方法 |
| KR20090087645A (ko) | 2008-02-13 | 2009-08-18 | 삼성전자주식회사 | 리세스 채널 어레이 트랜지스터를 구비하는 반도체 소자의제조 방법 |
| JP2009231772A (ja) | 2008-03-25 | 2009-10-08 | Nec Electronics Corp | 半導体装置の製造方法および半導体装置 |
| KR101535222B1 (ko) * | 2008-04-17 | 2015-07-08 | 삼성전자주식회사 | 반도체 소자 및 그의 제조 방법 |
| JP2010021295A (ja) | 2008-07-09 | 2010-01-28 | Nec Electronics Corp | 半導体装置およびその製造方法 |
| US8691649B2 (en) * | 2008-09-22 | 2014-04-08 | Samsung Electronics Co., Ltd. | Methods of forming recessed channel array transistors and methods of manufacturing semiconductor devices |
| US9190495B2 (en) * | 2008-09-22 | 2015-11-17 | Samsung Electronics Co., Ltd. | Recessed channel array transistors, and semiconductor devices including a recessed channel array transistor |
| KR20100033918A (ko) * | 2008-09-22 | 2010-03-31 | 삼성전자주식회사 | 리세스 채널 트랜지스터 및 그 형성 방법, 이를 포함하는 반도체 소자 및 그 제조 방법 |
| JP4862878B2 (ja) * | 2008-10-30 | 2012-01-25 | ソニー株式会社 | 固体撮像装置、その製造方法および撮像装置 |
| JP5407282B2 (ja) * | 2008-11-07 | 2014-02-05 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| KR101077302B1 (ko) * | 2009-04-10 | 2011-10-26 | 주식회사 하이닉스반도체 | 반도체 소자의 제조 방법 |
| KR101159900B1 (ko) * | 2009-04-22 | 2012-06-25 | 에스케이하이닉스 주식회사 | 반도체 소자 및 그 제조방법 |
| JP5515434B2 (ja) * | 2009-06-03 | 2014-06-11 | ソニー株式会社 | 半導体装置及びその製造方法、固体撮像素子 |
| KR101075526B1 (ko) * | 2009-07-03 | 2011-10-20 | 주식회사 하이닉스반도체 | 매립게이트를 구비한 반도체장치의 자기정렬콘택 형성 방법 |
| KR101096875B1 (ko) * | 2009-12-09 | 2011-12-22 | 주식회사 하이닉스반도체 | 매립 게이트를 갖는 반도체 소자 제조 방법 |
| KR101576296B1 (ko) * | 2009-12-11 | 2015-12-10 | 주식회사 동부하이텍 | 반도체 소자용 커패시터 및 반도체 소자용 커패시터의 제조 방법 |
| JP5662865B2 (ja) | 2010-05-19 | 2015-02-04 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| KR101061296B1 (ko) * | 2010-07-01 | 2011-08-31 | 주식회사 하이닉스반도체 | 반도체 소자 및 그 형성 방법 |
| JP2012255766A (ja) | 2011-05-19 | 2012-12-27 | Elpida Memory Inc | 結晶材料の格子歪分布評価方法及び格子歪分布評価システム |
| EP2728612A4 (en) | 2011-06-30 | 2015-03-11 | Fuji Electric Co Ltd | METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE |
| JP5895947B2 (ja) * | 2012-02-14 | 2016-03-30 | トヨタ自動車株式会社 | Ｉｇｂｔの製造方法 |
| KR20140084913A (ko) * | 2012-12-27 | 2014-07-07 | 에스케이하이닉스 주식회사 | 리세스게이트를 구비한 반도체장치 및 그 제조 방법 |
| US20150017774A1 (en) * | 2013-07-10 | 2015-01-15 | Globalfoundries Inc. | Method of forming fins with recess shapes |
| US10096696B2 (en) * | 2014-06-03 | 2018-10-09 | Micron Technology, Inc. | Field effect transistors having a fin |
| TWI555120B (zh) * | 2014-10-14 | 2016-10-21 | 力晶科技股份有限公司 | 半導體元件及其製作方法 |
| KR102316160B1 (ko) * | 2014-12-22 | 2021-10-26 | 삼성전자주식회사 | 반도체 소자 및 이를 제조하는 방법 |
| US20160211348A1 (en) * | 2015-01-21 | 2016-07-21 | Maxchip Electronics Corp. | Trench lateral diffusion metal oxide semiconductor device and manufacturing method of the same |
| US9768175B2 (en) * | 2015-06-21 | 2017-09-19 | Micron Technology, Inc. | Semiconductor devices comprising gate structure sidewalls having different angles |
| DE102020112203B4 (de) * | 2020-03-13 | 2024-08-08 | Taiwan Semiconductor Manufacturing Co. Ltd. | Integrierte schaltung und verfahren zum einbetten planarer fets mit finfets |
| CN118645136A (zh) | 2021-06-30 | 2024-09-13 | 长江存储科技有限责任公司 | 具有凹陷栅极晶体管的外围电路及其形成方法 |
| CN113678253B (zh) | 2021-06-30 | 2025-03-18 | 长江存储科技有限责任公司 | 具有凹陷栅极晶体管的外围电路及其形成方法 |
| CN113906551A (zh) * | 2021-08-31 | 2022-01-07 | 长江存储科技有限责任公司 | 一种半导体器件及其制备方法 |
| US11848048B2 (en) * | 2021-11-30 | 2023-12-19 | Micron Technology, Inc. | Memory device decoder configurations |
| US20250016997A1 (en) * | 2023-07-05 | 2025-01-09 | Nanya Technology Corporation | Semiconductor structure and method of manufacturing the same |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3150496B2 (ja) | 1993-06-30 | 2001-03-26 | 株式会社東芝 | 半導体記憶装置 |
| JP2751909B2 (ja) * | 1996-02-26 | 1998-05-18 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP3303789B2 (ja) | 1998-09-01 | 2002-07-22 | 日本電気株式会社 | フラッシュメモリ、その書き込み・消去方法 |
| JP4860022B2 (ja) | 2000-01-25 | 2012-01-25 | エルピーダメモリ株式会社 | 半導体集積回路装置の製造方法 |
| JP4439142B2 (ja) | 2001-06-26 | 2010-03-24 | 株式会社東芝 | 不揮発性半導体メモリの製造方法 |
| JP4322477B2 (ja) * | 2001-06-28 | 2009-09-02 | 株式会社東芝 | 半導体装置の製造方法 |
| US6624031B2 (en) * | 2001-11-20 | 2003-09-23 | International Business Machines Corporation | Test structure and methodology for semiconductor stress-induced defects and antifuse based on same test structure |
| JP2003174158A (ja) * | 2001-12-07 | 2003-06-20 | Sony Corp | 半導体装置の製造方法 |
| US7078296B2 (en) * | 2002-01-16 | 2006-07-18 | Fairchild Semiconductor Corporation | Self-aligned trench MOSFETs and methods for making the same |
| US6686624B2 (en) * | 2002-03-11 | 2004-02-03 | Monolithic System Technology, Inc. | Vertical one-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region |
| US6661042B2 (en) * | 2002-03-11 | 2003-12-09 | Monolithic System Technology, Inc. | One-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region |
| AU2003232995A1 (en) * | 2002-05-31 | 2003-12-19 | Koninklijke Philips Electronics N.V. | Trench-gate semiconductor device and method of manufacturing |
| JP4319809B2 (ja) | 2002-06-05 | 2009-08-26 | 株式会社デンソー | 半導体装置の製造方法 |
| JP2004022915A (ja) * | 2002-06-19 | 2004-01-22 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| KR100511045B1 (ko) * | 2003-07-14 | 2005-08-30 | 삼성전자주식회사 | 리세스된 게이트 전극을 갖는 반도체 소자의 집적방법 |
| US7714384B2 (en) * | 2003-09-15 | 2010-05-11 | Seliskar John J | Castellated gate MOSFET device capable of fully-depleted operation |
| JP2005142203A (ja) | 2003-11-04 | 2005-06-02 | Elpida Memory Inc | 半導体装置およびその製造方法 |
| DE102004017768B3 (de) * | 2004-04-13 | 2005-10-27 | Infineon Technologies Ag | Elektrisch programmierbare Speicherzelle und Verfahren zum Programmieren und Auslesen einer solchen Speicherzelle |
| US7560359B2 (en) * | 2004-11-26 | 2009-07-14 | Samsung Electronics Co., Ltd. | Methods of forming asymmetric recesses and gate structures that fill such recesses and related methods of forming semiconductor devices that include such recesses and gate structures |
| US7482223B2 (en) * | 2004-12-22 | 2009-01-27 | Sandisk Corporation | Multi-thickness dielectric for semiconductor memory |
| US7432139B2 (en) * | 2005-06-29 | 2008-10-07 | Amberwave Systems Corp. | Methods for forming dielectrics and metal electrodes |
| JP2007134674A (ja) * | 2005-10-11 | 2007-05-31 | Elpida Memory Inc | 半導体装置の製造方法及び半導体装置 |
| JP4773182B2 (ja) * | 2005-10-28 | 2011-09-14 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
| KR100744691B1 (ko) * | 2006-03-21 | 2007-08-02 | 주식회사 하이닉스반도체 | 벌브형 리세스 게이트를 갖는 반도체 소자 및 그의제조방법 |
| KR100724575B1 (ko) * | 2006-06-28 | 2007-06-04 | 삼성전자주식회사 | 매립 게이트전극을 갖는 반도체소자 및 그 형성방법 |
| KR100763337B1 (ko) * | 2006-10-02 | 2007-10-04 | 삼성전자주식회사 | 매립 게이트 라인을 갖는 반도체소자 및 그 제조방법 |
| US7396738B1 (en) * | 2006-12-13 | 2008-07-08 | Hynix Semiconductor Inc. | Method of forming isolation structure of flash memory device |
| KR100843715B1 (ko) * | 2007-05-16 | 2008-07-04 | 삼성전자주식회사 | 반도체소자의 콘택 구조체 및 그 형성방법 |
-
2005
- 2005-10-28 JP JP2005313661A patent/JP4773182B2/ja not_active Expired - Lifetime
-
2006
- 2006-10-17 US US11/581,346 patent/US7935595B2/en active Active
- 2006-10-26 TW TW095139553A patent/TWI318439B/zh active
- 2006-10-30 CN CNB2006101428341A patent/CN100447985C/zh active Active
-
2010
- 2010-10-15 US US12/905,687 patent/US20110034005A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1956170A (zh) | 2007-05-02 |
| JP4773182B2 (ja) | 2011-09-14 |
| US20070096204A1 (en) | 2007-05-03 |
| JP2007123551A (ja) | 2007-05-17 |
| TW200733306A (en) | 2007-09-01 |
| US7935595B2 (en) | 2011-05-03 |
| CN100447985C (zh) | 2008-12-31 |
| US20110034005A1 (en) | 2011-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI318439B (en) | Method for manufacturing semiconductor device | |
| TWI366218B (en) | Method for manufacturing semiconductor device | |
| TWI348746B (en) | Method for fabricating semiconductor device | |
| TWI365490B (en) | Semiconductor device and method for manufacturing same | |
| TWI349346B (en) | Semiconductor device and method for manufacturing the same | |
| TWI372462B (en) | Method for manufacturing semiconductor device | |
| TWI370516B (en) | Semiconductor device manufacturing method | |
| TWI372445B (en) | Semiconductor device and method for making the same | |
| TWI365508B (en) | Manufacturing method of semiconductor device | |
| TWI369717B (en) | Method for forming semiconductor device | |
| TWI373182B (en) | Method for manufacturing semiconductor optical device | |
| TWI371836B (en) | Semiconductor device and method for fabricating the same | |
| TWI320596B (en) | Semiconductor device | |
| TWI366892B (en) | Method for fabricating semiconductor device | |
| TWI347635B (en) | Method for fabricating semiconductor device including recess gate | |
| TWI316293B (en) | Semiconductor device and method for manufacturing the same | |
| TWI349982B (en) | Semiconductor device and method for making the same | |
| TWI366864B (en) | Method for fabricating semiconductor device | |
| TWI346985B (en) | Methods for forming the semiconductor devices | |
| TWI351074B (en) | Semiconductor device and method for manufacturing semiconductor device | |
| TWI371844B (en) | Semiconductor device and method for manufacturing the same | |
| TWI318008B (en) | Method of manufacturing semiconductor device | |
| TWI317977B (en) | Method for forming semiconductor device having fin structure | |
| TWI341062B (en) | Method for manufacturing semiconductor optical device | |
| TWI351055B (en) | Method for manufacturing semiconductor device |