1311459 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係指一種用於電子元件 之散熱裝置。 【先前技術】 現階段由於中央處理器（CPU)等電子元件工作能力 的不斷提升及體積的不斷變小，業界普遍使用具有熱管的 散熱器來代替以前純金屬實體散熱器，來滿足散發電子元 件的熱量，使其處於能夠正常工作的溫度。 熱g散熱裝置係主要利用熱管的傳熱速度快以及兩端 溫度差距較小的情況下可遠距離傳熱的魏，來克服單純 金屬實體傳熱的瓶頸，將電子元件上高溫區的熱量快速帶 離並傳導至散熱器的遠距離部位，提高散熱裝置整體性 能。然而’熱管的形狀、其在散熱器上的佈置以及熱管與 散熱器的結合方式’對於散熱震置的性能有很大影響，因 此業界出現很夕適應不同散熱需求的各種結構的熱管散熱 裝置。 【發明内容】 捉供一種散熱效率較好之散熱裴置。 -種散熱農置，包括：依次疊置的底座、第—散 第二散熱部與第三耑勒却蛛墙 … 一政熱。P，該第一散熱部包括間隔排列丨 複數散熱籍片，該策_批批加a丨 茨弟一散熱部包括一基板及基板表面延^ 的複數散熱鰭片，今楚_办為如^ 邊弟二散熱部包括間隔排列的複數 1311459 錄片及至少-熱官將該底座與第二散熱部、第三散熱部 熱傳導性連接，該至少-熱f包括設於底座與第—散熱部 之間的吸熱段，該吸熱段—端彎折延伸形成繞過第一散執 部侧向的連接段，該連接段進―步彎折延伸形成設於第二 散熱部與第二散熱部之間的第—放熱段，該第—放孰段再 變折延伸並垂直穿設第三散熱部上形成的第二放熱段。 上述散熱裝置底座上的一部分熱量直接傳遞至第一散 熱部:另―部分熱量由熱管快速傳送至第二和第三散熱 和經過各散熱部的多數散熱鰭片的較大散熱面積進行散 熱’並且由於該等散熱鰭片之間形成氣流通道，散孰鍵片 上的熱量可經過強職流帶離，從錢散熱裝 散熱性能。 又付r又住 下面參照附圖，結合具體實施例對本發明作 述 【實施方式】 進一步描 本發明熱管散熱裝置係用來安裝於電路板（圖未示） 上以對其上之中央處理器（圖未示）等發熱電子元件進行 散熱。 請參閱則至圖3,本發明一實施例之散熱裝置包括依 二向上疊置的導熱底座1()、第—散熱部2()、第 :三散熱部彻及將上述底㈣與三個散熱部2Q:3〇、4〇 熱傳導性連接的三熱管5〇。 該底座10係較高導熱性的金屬板體，其大致呈矩形。 1311459 S亥底座10四角端緣向外延伸設有固定耳12。該底座1〇具有 用於與電子元件接觸的下表面及其相對的上表面，該上表 面中部位置平行設有數個供熱管50容置的溝槽14，該溝槽 14橫截面呈半圓狀（以下稱半圓形溝槽）。 第 鰭片組22以及位於第 鰭 該第一散熱部20係由 片組22兩侧橫向疊置的第二鰭片組24組成。第一鰭片組 由複數相對底座1〇豎直延伸的第一散熱鰭片22〇橫向疊置 而成。其中，每第一散熱鰭片22〇靠向底座1〇的端緣及其相 對的端緣的中部形成數個半圓形凹口 222，該等端緣均同向 幫折延伸有折邊，從而疊置時由於折邊抵頂而相鄰的第一 散熱鰭片220之間形成-定間距的兩端開口的氣流通道，並 且該等折邊於凹口 222處組合形成供熱管5〇結合之數個溝 槽26(靠向底座10的溝槽的圖未示）。第二鰭片組24由複 數相對底座10豎直延伸的第二散熱鰭片24〇橫向疊置而 成’、中’每第一散熱鳍片240靠向底座1〇的端緣及盆相對 的端緣的中部對應上述第-鰭片組22的溝槽26的位置形成 較大的矩形凹π 242，該凹口 242寬度大於該第—散敎讀片 220的數個凹π 222直徑之和，該等端緣均同向彎折^有 折邊’從而疊置時由於折邊抵頂而相鄰的第二散熱鰭片· 之間形成-定間距的氣流通道’並且該等凹口如組合形成 一凹部28，以便排除組裝熱管5()時的彎曲部位的干涉二亥 第-散熱部20的靠向底座1G的溝槽與底座1()上的溝槽^ 對接’將熱管50一段包容於其中。 該第二散熱部30係鋁擠型散熱器，其具有一基板％及 1311459 基板32上表面延伸間隔排列的複數散熱鰭片34，該基板30 下表面與第一散熱部20接觸並對應第一散熱部20的凹部28 =置設有缺口 36，且該下表面設有與上述第一散熱部20的 靠向第二散熱部30的溝槽24相應的半圓形溝槽38，以便組 合將對應的熱管5〇—段包容於其中。 該第三散熱部4〇係由相對底座10平行的複數散熱鰭片 42縱向疊置而成’每一散熱鰭片仏兩相對的侧端緣同向彎 折延伸有折邊44，疊置時由於折邊44的抵頂而相鄰散熱鰭 片42之間形成具有與折邊44等寬之間距並兩端開口的^ 通道。該第三散熱部40對應第二散熱部3〇的缺口％位置上 開設有供熱管50端部垂直穿入的具有接觸邊的穿孔46，該 接觸邊的寬度與折邊44寬度相同’從而疊置時該等接觸邊 的内表面組合形成與熱管5〇接觸的圓筒狀接觸面。該第三 散熱部4〇的最下層的散熱鰭片42抵靠於上述第二散熱部3〇 的散熱鰭片34頂端，從而第二散熱部3〇的散熱籍片別之間 形成兩端開口的複數氣流通道。該第二散熱部脚第三散 熱部40的氣流通道的開口端方向與第—散熱㈣的相同。 該熱管50大致呈圓管狀，其包括依次彎折形成的吸熱 段51、連接段52、第—放熱段53及第二放熱段54。其中， 吸熱段51 —端實折延伸形成連接段52,而連接段52進一步 向吸熱段51另-端方向彎折延伸形成與吸熱段㈣行的第 二放熱段53，該第一放熱段53延伸端進一步垂直遠離方向 弯折延伸形成第二放熱段54，並且該吸熱段以、第一放熱 段53及第二放熱段54在同一平面上。該連接段㈣用於逹 1311459 接吸熱段51和第一放熱段53，以便熱管5〇繞過第—散熱部 20的側面。該吸熱段51熱傳導性連接（如焊接或導^膠= =等，以下稱連接）於底座1〇的溝槽14和第—散熱;加的 罪向底座10的溝槽24，用來吸收底座10上的熱量並將一部 分熱量傳導給第一散熱部2〇。該第一放熱段53連接於第— 散熱部20的靠向第二散熱部3〇的溝槽24和第二散熱部如的 溝槽38，用來將從吸熱段51吸收的熱量傳導給與其連接的 散熱部進行散熱。該第二放熱段54通過第二散熱部如的缺 口 36伸出並穿設於第三散熱部4〇的對應的圓筒狀接觸面， 從而將吸熱段51吸收的熱量傳導給第三散熱部忉進行散 ，。需要說明的係，本實施例以三個熱管為例進行說明熱 笞50的佈置，如圖2所示，本實施例中三個熱管5〇形狀雖然 相同，但其中一熱管5〇與另二熱管5〇以左右對稱的形式置 於該另二熱管50之間。 本實加例的散熱裝置還包括一風扇6〇，其通過二固定 件70固定於散熱裝置的一側，用來促進散熱鰭片與空氣之 間的熱交換。該固定件70包括一面向風扇6〇的平板72，該 平板72外侧緣向内彎曲形成有扣片74。上述第三散熱部 的靠向風扇60的兩側端部開設有供該固定件7〇的扣片”嵌 入的扣槽48。上述二固定件7〇從第三散熱部4〇的兩側端的 扣槽48上扣挂’而通過螺釘等將風扇6〇固定在該固定件7〇 的平板72上，由於風扇6〇的連接而二固定件7〇不易脫離散 熱裝置。 當然’本發明散熱襄置的熱管數量以及形狀或各散熱 11 1311459 散熱鰭片的分佈等根據需求均可μ 广正。例如，散熱農置只需左右對稱 二 =熱管的吸熱段分佈比較密而第一的:佈、二 熱管的吸熱段和第一放敎放熱部而不能共面於 熱段和筐-姑办 所在的平面，即熱管的第一放 ‘： 一…、段所在的平面與吸熱段和第一放孰 的:面相交於第一放熱段的軸線上;第一散二= 平行設置而第三散熱部的散朗片相對底： 丑叹置p保持第一散熱部的散熱歸片的 熱部的散熱鰭片平面垂直。 /、弟二散 綜上所述，本發明符合發明專利要件，爰依法提出直 利申请。惟，以上該者僅為本發明之較佳實施例，舉凡 悉本案技藝之人士，在爰依本發明精神所作之等效 二 變化，皆應涵蓋於以下之申請專利範圍内。 ， 【圖式簡單說明】 圖1係本發明一實施例散熱裝置的立體分解圖。 圖2係圖1中部分結構的立體分解圖。 圖3係圖1的立體組裝圖。 【主要元件符號說明】 底座 10 固定耳 12 溝槽 14,26,38 第一散熱部 20 第一鰭片組 22 第一散熱鰭片 220 凹口 222,242 第二鰭片組 24 12 1311459 凹部 28 第二散熱部 30 基板 32 散熱鰭片 34,42 缺口 36 第三散熱部 40 折邊 44 穿孔 46 扣槽 48 献管 *、、、 P 50 吸熱段 51 連接段 52 第一放熱段 53 第二放熱段 54 風扇 60 固定件 70 平板 72 扣片 74 131311459 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic component. [Prior Art] At this stage, due to the continuous improvement of the working capacity of electronic components such as the central processing unit (CPU) and the shrinking of the volume, heat sinks with heat pipes are commonly used in the industry to replace the previously pure metal solid heat sinks to meet the emission electronic components. The heat is at a temperature that is working properly. The heat g heat dissipating device mainly utilizes the heat transfer speed of the heat pipe and the long-distance heat transfer in the case where the temperature difference between the two ends is small, to overcome the bottleneck of the simple metal solid heat transfer, and the heat in the high temperature region of the electronic component is fast. The long distances that are carried away and conducted to the heat sink improve the overall performance of the heat sink. However, the shape of the heat pipe, its arrangement on the heat sink, and the way in which the heat pipe and the heat sink are combined have a great influence on the performance of the heat sinking. Therefore, various heat pipe heat dissipating devices of various structures that meet the different heat dissipation requirements are emerging in the industry. SUMMARY OF THE INVENTION A heat dissipation device with better heat dissipation efficiency is provided. - A kind of heat-dissipating farm, including: the bases stacked one after the other, the second-dissipating second heat-dissipating part and the third one but the spider wall... a political heat. P, the first heat dissipating portion includes a plurality of heat dissipating fins arranged at intervals, and the heat dissipating portion includes a substrate and a plurality of heat dissipating fins on the surface of the substrate, and the present invention is as follows: The two-side heat dissipating portion includes a plurality of 1311459 recording sheets arranged at intervals and at least - the heat officer thermally connects the base to the second heat dissipating portion and the third heat dissipating portion, and the at least heat f is disposed on the base and the first heat dissipating portion In the endothermic section, the endothermic section-end bends to form a connecting section laterally around the first dispensing portion, and the connecting section is further bent to extend between the second heat dissipating portion and the second heat dissipating portion. The first heat releasing section, the first releasing section extends and then extends and vertically passes through the second heat releasing section formed on the third heat radiating portion. A part of the heat on the base of the heat sink is directly transmitted to the first heat sink: another part of the heat is quickly transferred by the heat pipe to the second and third heat sinks and the heat dissipation area of the majority of the heat sink fins of each heat sink is used for heat dissipation. Due to the formation of an air flow passage between the fins, the heat on the divergent key sheet can be removed by the strong duty flow, and the heat dissipation performance can be dissipated from the money. Further, the present invention will be described with reference to the accompanying drawings. [Embodiment] The heat pipe heat dissipating device of the present invention is further mounted on a circuit board (not shown) for the central processing unit thereon. Heated electronic components such as (not shown) dissipate heat. Referring to FIG. 3 , a heat dissipating device according to an embodiment of the present invention includes a thermally conductive base 1 ( ), a first heat dissipating portion 2 ( ), a third heat dissipating portion, and a bottom (four) and three Heat dissipating portion 2Q: 3〇, 4〇 three heat pipes 5〇 thermally connected. The base 10 is a metal plate body having a high thermal conductivity and is substantially rectangular. 1311459 S Hai base 10 four-corner end edge extends outward with a fixed ear 12. The base 1 has a lower surface for contacting the electronic component and an upper surface thereof, and a central portion of the upper surface is disposed in parallel with a plurality of grooves 14 for receiving the heat pipe 50, and the groove 14 has a semicircular cross section ( Hereinafter referred to as a semi-circular groove). The first fin group 22 and the first fin portion 20 are composed of a second fin group 24 laterally stacked on both sides of the sheet group 22. The first fin group is formed by laterally stacking a plurality of first heat radiating fins 22 that extend vertically with respect to the base 1 . Each of the first heat dissipation fins 22 is formed by a plurality of semicircular notches 222 formed at an end edge of the base 1 及其 and a middle end of the opposite end edge thereof, and the end edges are equally folded and have a folded edge. Therefore, when the stacking is overlapped, the first heat radiating fins 220 adjacent to each other form a gas flow passage which is open at both ends, and the flanges are combined at the recess 222 to form a heat pipe 5〇. A plurality of grooves 26 (not shown to the groove of the base 10). The second fin group 24 is laterally stacked by a plurality of second heat dissipating fins 24 that extend vertically with respect to the base 10, and the middle end of each of the first fins 240 is opposite to the end edge of the base 1 and the basin. The middle portion of the end edge corresponds to the position of the groove 26 of the first fin group 22 to form a large rectangular recess 242, and the width of the recess 242 is larger than the sum of the diameters of the plurality of concave π 222 of the first-diffusion reading sheet 220. , the end edges are all bent in the same direction, and there is a hemming edge, so that the second heat dissipating fins adjacent to each other due to the hemming of the hemming edge are formed with a constant spacing of the air flow passages and the notches are A recess 28 is formed to eliminate the interference of the bending portion when assembling the heat pipe 5 (). The groove of the heat dissipation portion 20 facing the base 1G is docked with the groove on the base 1 (). Inclusion in it. The second heat dissipating portion 30 is an aluminum extruded heat sink having a substrate % and 1311459. The upper surface of the substrate 32 is spaced apart from the plurality of heat dissipating fins 34. The lower surface of the substrate 30 is in contact with the first heat dissipating portion 20 and corresponds to the first The recessed portion 28 of the heat dissipating portion 20 is provided with a notch 36, and the lower surface is provided with a semicircular groove 38 corresponding to the groove 24 of the first heat dissipating portion 20 facing the second heat dissipating portion 30, so that the combination will be The corresponding heat pipe 5〇 is contained therein. The third heat dissipating portion 4 is formed by vertically stacking a plurality of heat dissipating fins 42 parallel to the base 10. The opposite side edges of each of the fins are bent in the same direction and have a folded edge 44. Due to the abutment of the flange 44, adjacent channels are formed between the adjacent heat dissipation fins 42 and have a width equal to the width of the flange 44 and are open at both ends. The third heat dissipating portion 40 is provided with a through hole 46 having a contact edge perpendicularly penetrating the end portion of the heat pipe 50 corresponding to the notch % of the second heat dissipating portion 3, the width of the contact edge being the same as the width of the flange 44. The inner surfaces of the contact sides are combined to form a cylindrical contact surface that is in contact with the heat pipe 5〇. The lowermost heat dissipation fins 42 of the third heat dissipation portion 4A abut against the top ends of the heat dissipation fins 34 of the second heat dissipation portion 3〇, so that the heat dissipation sheets of the second heat dissipation portion 3〇 form an opening at both ends Multiple airflow channels. The direction of the opening end of the air flow passage of the third heat radiating portion 40 of the second heat radiating portion is the same as that of the first heat radiating (four). The heat pipe 50 is substantially in the shape of a circular tube, and includes a heat absorption section 51, a connecting section 52, a first heat releasing section 53, and a second heat releasing section 54 which are formed by bending in sequence. The end portion of the heat absorption portion 51 is extended to form the connecting portion 52, and the connecting portion 52 is further bent to extend in the other end direction of the heat absorbing portion 51 to form a second heat releasing portion 53 with the heat absorbing portion (four) row, the first heat releasing portion 53 The extension end is further bent perpendicularly away from the direction to form a second heat release section 54, and the heat absorption section is on the same plane as the first heat release section 53 and the second heat release section 54. The connecting section (4) is used for the 吸 1311459 to connect the heat absorbing section 51 and the first heat releasing section 53 so that the heat pipe 5 bypasses the side surface of the first heat radiating portion 20. The heat absorbing section 51 is thermally conductively connected (such as soldering or guiding glue ==, etc., hereinafter referred to as "the connection") to the groove 14 of the base 1 and the first heat dissipation; the sin is applied to the groove 24 of the base 10 for absorbing the base The heat on 10 transfers a portion of the heat to the first heat sink 2〇. The first heat releasing portion 53 is connected to the groove 24 of the first heat radiating portion 20 toward the second heat radiating portion 3 and the groove 38 of the second heat radiating portion, for transferring heat absorbed from the heat absorption portion 51 to The connected heat sink is used for heat dissipation. The second heat releasing portion 54 protrudes through the notch 36 of the second heat dissipating portion, and penetrates through the corresponding cylindrical contact surface of the third heat dissipating portion 4〇, thereby transferring the heat absorbed by the heat absorption portion 51 to the third heat dissipating portion.忉 scatter,. In the embodiment, the heat pipe 50 is illustrated by taking three heat pipes as an example. As shown in FIG. 2, in the present embodiment, the three heat pipes 5 are the same in shape, but one of the heat pipes 5 and the other two. The heat pipe 5 is placed between the other heat pipes 50 in a bilaterally symmetrical manner. The heat sink of the present embodiment further includes a fan 6 固定 which is fixed to one side of the heat sink by two fixing members 70 for promoting heat exchange between the heat radiating fins and the air. The fixing member 70 includes a flat plate 72 facing the fan 6A, and the outer edge of the flat plate 72 is bent inwardly to form a clasp 74. A buckle groove 48 into which the buckle of the fixing member 7 is embedded is disposed at an end of the third heat dissipation portion facing the fan 60. The two fixing members 7 are from the opposite ends of the third heat dissipation portion 4 The buckle groove 48 is fastened and the fan 6〇 is fixed to the flat plate 72 of the fixing member 7〇 by screws or the like. Due to the connection of the fan 6〇, the two fixing members 7〇 are not easily separated from the heat dissipating device. The number of heat pipes and the shape of the heat pipes and the distribution of the heat dissipation fins 13 1311459 can be widely corrected according to the requirements. For example, the heat dissipation of the farm requires only the left and right symmetry 2 = the heat pipe of the heat pipe is densely distributed and the first one: cloth, The heat absorption section of the second heat pipe and the first heat release section are not coplanar with the heat section and the plane where the basket is located, that is, the first discharge of the heat pipe ': a..., the plane where the section is located and the heat absorption section and the first discharge孰: the faces intersect on the axis of the first heat release section; the first scatter 2 = parallel and the third heat sink scatters relative to the bottom: the ugly set p maintains the heat dissipation of the first heat sink The fins are perpendicular to the plane. /, Di Di scattered, the present invention In accordance with the requirements of the invention, the equivalent of the present invention is only for the preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a heat sink according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of a portion of the structure of FIG. 1. FIG. Fig. [Description of main component symbols] Base 10 Fixing ears 12 Grooves 14, 26, 38 First heat sink 20 First fin set 22 First heat sink fin 220 Notch 222, 242 Second fin set 24 12 1311459 Recess 28 Second heat sink 30 substrate 32 heat sink fins 34, 42 notch 36 third heat sink 40 flange 44 perforation 46 buckle groove 48 pipe *, ,, P 50 heat absorption section 51 connection section 52 first heat release section 53 second heat release Segment 54 Fan 60 Fixing member 70 Flat plate 72 Clasp 74 13