200816909 九、發明說明： '【發明所屬之技術領域】 - 本發明涉及一種散熱裝置，尤係指一種用於電子元件 之散熱裝置。 【先前技術】 現階段由於中央處理器（CPU)等電子元件工作能力 的不斷提升及體積的不斷變小，業界普遍使用具有熱管的 散熱裔來代替以前純金屬實體散熱器，來滿足散發電子元 件的熱量，使其處於能夠正常工作的溫度。 ^熱管散熱裝置係主要利用熱管的傳熱速度快以及兩端 溫度差距較小的情況下可遠距離傳熱的功能，來克服單純 金屬實體傳熱的瓶頸，將電子元件上高溫區的熱量快速帶 =並傳‘至散熱器的遠距離部位，提高散熱裝置整體性 气埶熱吕的形狀、其在散熱器上的佈置以及熱管與 1章：結合方式’對於散熱裝置的性能有很大影響，因 裝置現很多適應不同散熱需求的各種結構的熱管散熱 【發明内容】 本發明曰在提供-種散熱效率較好之散敎裝置。 第二以二r次疊置的底座:第-散熱部、 複數散熱鰭片，；第：：敎該弟一散熱部包括間隔排列的 的複數散妖^ 熱部包括—基板及基板表面延伸 *、、、韓片’該第三散熱部包括間隔排列的複數散數 6 200816909 =導=:熱管將該底座與第二散熱部'第三散熱部 =散、、襞置底座上的一部分熱量直接傳遞至第一散 Γ: 分熱量由熱管快速傳送至第二和第-散： :散熱部的多數散熱韓片的較大散：散 熱’並且由於該等散熱轉片之間形成氣流通道，散； =r經過強制氣流帶離，從而使散熱裝置獲；= 下面參照附圖，結合具體實施例對本發明作進 述 【實施方式】 步描 本發明熱管散熱裝置係用來安裝於電路板（圖未示） 上以對其上之中央處理器（®未示）等發熱電子元件進行 散熱。 "明，閱圖1至圖3，本發明一實施例之散熱裝置包括依 广向上宜置的導熱底座1〇、第一散熱部2〇、第二散熱部3〇、 第二散熱部40以及將上述底座1〇與三個散 熱部 20、30、40 熱傳導性連接的三熱管5〇。 一忒底座10係較高導熱性的金屬板體，其大致呈矩形。 該底座10四角端緣向外延伸設有固定耳12。該底座1〇具有 用於與電子元件接觸的下表面及其相對的上表面，該上表 面中部位置平行設有數個供熱管50容置的溝槽14，該溝槽 14橫截面呈半圓狀（以下稱半圓形溝槽）。 200816909 該第-散熱部20係由一第，組22以及位於第一轉 兩側知、向豐置的第二鰭片組24組成。第一鰭片組Μ 由稷數相對底座10豎直延伸的第一散熱趙片22〇橫向疊置 ^。其中’每第—散熱^咖靠向底㈣的端緣及其相 =的端緣的中部形成數個半圓形凹口如，該等端緣均同向 —折延伸有折邊，從而4置時由於折邊抵頂而相鄰的第一 政:、、：片220之間形成一定間距的兩端開口的氣流通道，並 且該等折邊於凹口 222處組合形成供熱管5()結合之數個溝 槽26(靠向底座10的溝槽的圖未示）。第二鰭片組μ由複 數相對底座10豎直延伸的第二散熱鯖片24〇橫向疊置而 成。其中，每第一散熱鰭片24〇靠向底座1〇的端緣及1相對 的端緣的中部對應上述第m22的溝槽％的位置形成 較大的矩形凹口 242 ’該凹口 242寬度大於該第一散熱鰭片 220的數個凹口 222直徑之和，該等端緣均同向彎折延^有 折邊，從而疊置時由於折邊抵頂而相鄰的第二散熱鰭片24〇 之間形成一定間距的氣流通道’並且該等凹口 242組合形成 凹σ卩28，以便排除組裝熱管5〇時的彎曲部位的干涉。該 第一散熱部20的靠向底座1〇的溝槽與底座1〇上的溝槽“相 對接，將熱管50—段包容於其中。 該第二散熱部30係鋁擠型散熱器，其具有一基板32及 基板32上表面延伸間隔排列的複數散熱鰭片34，該基板3〇 下表面與第一散熱部20接觸並對應第一散熱部2〇的凹部Μ 位置设有缺口 36，且該下表面設有與上述第一散熱部2〇的 罪向第二散熱部30的溝槽24相應的半圓形溝槽38，以便組 200816909 合將對應的熱管5〇—段包容於其中。 42縱ΠΓ政熱部4〇係由相對底座1〇平行的複數散熱鰭片 姑ΐ I» t而成’每一散熱韓片42兩相對的側端緣同向彎 斤U有折邊44’疊置時由於折邊44 :之=成具有與折邊44等寬之間距並兩端開 二有散熱部4〇對應第二散熱部3〇的缺口 36位置上 開5又有供熱管50端部垂直穿入的具有接觸邊的穿孔46，兮 ==與折邊44寬度相同，從而疊置時該等㈣ 的内表面組合形成與熱管5〇接觸的圓筒狀接觸面。該第三 散熱部40的最下層的散熱韓片42抵靠於上 一 的散熱韓片34頂端，從而第二散熱部3〇 =〇 :成兩端開口的複數氣流通道。該第二散熱部'上= —Μ0的^流通道的開口端方向與第—散熱部_相同。 ，51該Ϊ:50大致呈圓管狀，其包括依次f折形成的吸熱 又、連接段52、第一放熱段53及第二放熱段^。盆中， 彎折延伸_連接段52’而連接段^進一步 :吸,、.、&51另-端方向幫折延伸形成與吸熱段μ平行的第 ==該第一放熱段53延伸端進一步垂直遠離方向 尸53及第一放熱段54’並且該吸熱段51、第一放熱 在同—平面上。該連接段52係用於連 2_^51和第一放熱段53，以便熱管5〇繞過第一散熱部 。該吸熱段51熱傳導性連接（如焊接或導熱膝枯 L/r下稱連接）於底座1〇的溝槽14和第—散熱部20的 罪向底座10的溝槽24,用來吸收底座1〇上的熱量並將-部 200816909 分熱篁傳導給第一散熱部2〇。該第一放熱段53連接於第一 •散熱部20的靠向第二散熱部30的溝槽24和第二散熱部3〇的 •溝槽38，用來將從吸熱段51吸收的熱量傳導給與其連接的 散熱部進行散熱。該第二放熱段54通過第二散熱部％的缺 口 36伸出並穿設於第三散熱部4〇的對應的圓筒狀接觸面， 從而將吸熱段51吸收的熱量傳導給第三散熱部仞進行散 熱。需要說明的係，本實施例以三個熱管為例進行說明数 管50的佈置，如圖2所示，本實施例中三個熱管％形狀雖然' 相同’但其中一熱管5〇與另二熱管5〇以左右對稱的形式置 於該另二熱管5〇之間。 本實施例的散熱裝置還包括一風扇6〇，其通過二固定 件70固定於散熱裝置的一侧，用來促進散熱縛片與空氣之 間的熱父換。該固定件7〇包括一面向風扇6〇的平板π，該 平f 72外側緣向内彎曲形成有扣片％。上述第三散熱部4〇 的靠向風扇60的兩側端部開設有供該固定件7〇的扣片”嵌 入的扣槽48。上述二固定件7〇從第三散熱部4〇的兩側端的 扣槽48上扣挂，而通過螺釘等將風扇卯固定在該固定件川 的平板72上，由於風扇6〇的連接而二固定件冗不易脫離 熱裝置。 田然，本發明散熱裝置的熱管數量以及形狀或各散熱 P的开/狀以及散熱籍片的分佈等根據需求均可以適當的相 μ調二例如’散熱裝置只需左右對稱設置的二熱管；數 個熱官的吸熱段分佈比較密而第一放熱段的分佈比較散 時，其第二放熱段為了垂直穿過第三散熱部而不能共面於 200816909 .熱管的吸熱段和第-放熱段所在的平面，即熱管的第一放 •熱段和第一放熱段所在的平面與吸熱段和第一放埶段所在 .的平面相交於第一放熱段的轴線上；第一散熱部的散敎絲 片可相對底座平行設置而第三散熱部的散熱韓片相對底座 豎直設置，即保持第一散熱部的散熱鰭片的平面與第三 熱部的散熱鰭片平面垂直。 綜上所述，本發明符合發明專利要件，爰依法提出專 =申明。惟，以上該者僅為本發明之較佳實施例，舉凡熟 =案技藝之人士 ’在爰依本發明精神所作之等效修仰： ，皆應涵蓋於以下之申請專利範圍内。 一 【圖式簡單說明】 圖1係本發明一實施例散熱裝置的立體分解圖。 圖2係圖1 中部分結構的立體分解圖。 圖3係圖1 的立體組装圖 〇 主要元件符號說明】 底座 10 固定耳 12 溝槽 14,26,38 第一散熱部 20 第一鰭片組 22 第一散熱鰭片 220 凹D 222,242 第二縛片組 24 凹部 28 第二散熱部 30 基板 32 散熱鰭片 34,42 缺D 36 第三散熱部 40 折邊 44 穿孔 46 11 200816909 扣槽 48 熱管 50 吸熱段 51 連接段 52 第一放熱段 53 第二放熱段 54 風扇 60 固定件 70 平板 72 扣片 74 12200816909 IX. Description of the invention: '[Technical field to which the invention pertains] - The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic component. [Prior Art] At this stage, due to the continuous improvement of the working capacity of electronic components such as the central processing unit (CPU) and the shrinking of the volume, the heat source of the heat pipe is commonly used in the industry to replace the former pure metal solid heat sink to meet the emission electronic components. The heat is at a temperature that is working properly. ^The heat pipe heat dissipating device mainly utilizes the function of long-distance heat transfer when the heat transfer speed of the heat pipe is fast and the temperature difference between the two ends is small, to overcome the bottleneck of the heat transfer of the simple metal body, and the heat in the high temperature region of the electronic component is fast. With == and pass 'to the long-distance part of the radiator, improve the shape of the heat sink overall heat, its arrangement on the heat sink and the heat pipe and chapter 1: the combination method 'has a great influence on the performance of the heat sink Since the device has many heat pipes for various structures that are adapted to different heat dissipation requirements, the present invention provides a heat sink device with better heat dissipation efficiency. The second and second r-stacked bases: a first heat-dissipating portion, a plurality of heat-dissipating fins, and a first heat-dissipating portion including a plurality of spaced-apart heats; the hot portion includes a substrate and a substrate surface extension* , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Passing to the first divergence: The heat is quickly transferred from the heat pipe to the second and the first:: The majority of the heat sinks of the heat sink are larger: heat dissipation and due to the formation of airflow channels between the heat sinks, =r is forced to flow away, so that the heat sink is obtained; = The following is a description of the present invention with reference to the accompanying drawings. [Embodiment] The heat pipe heat dissipating device of the present invention is used for mounting on a circuit board (Fig. It is not shown) The heat is dissipated from heat-generating electronic components such as the central processing unit (not shown). < Ming, and referring to FIG. 1 to FIG. 3, the heat dissipating device according to an embodiment of the present invention includes a heat conducting base 1〇, a first heat dissipating portion 2〇, a second heat dissipating portion 3〇, and a second heat dissipating portion 40. And a three heat pipe 5〇 that thermally connects the base 1〇 to the three heat radiating portions 20, 30, and 40. The base 10 is a metal plate body having a high thermal conductivity and is substantially rectangular. The fixing ear 12 is extended outwardly from the four-corner end edge of the base 10. The base 1 has a lower surface for contacting the electronic component and an upper surface thereof, and a central portion of the upper surface is disposed in parallel with a plurality of grooves 14 for receiving the heat pipe 50, and the groove 14 has a semicircular cross section ( Hereinafter referred to as a semi-circular groove). 200816909 The first heat dissipating portion 20 is composed of a first group 22 and a second fin group 24 located on both sides of the first turn. The first fin group Μ is laterally overlapped by a first heat-dissipating film 22 that extends vertically relative to the base 10. Wherein each of the first heat-dissipating caffes forms a plurality of semi-circular recesses in the middle of the end edge of the bottom (four) and the end edge of the phase=, such that the end edges are both folded and folded to have a hemming edge, thereby When the hem is abutted against the top, the adjacent first plenum:,: between the sheets 220 form a certain interval of open air flow passages at both ends, and the hem is combined at the recess 222 to form the heat supply tube 5 () A plurality of grooves 26 (not shown to the grooves of the base 10) are combined. The second fin set μ is formed by laterally stacking a plurality of second heat radiating fins 24 that extend vertically with respect to the base 10. Wherein, the position of each of the first heat dissipation fins 24 〇 toward the end of the base 1 及 and the middle of the opposite end edge corresponding to the groove % of the m22th portion form a larger rectangular recess 242 ′ The sum of the diameters of the plurality of notches 222 of the first heat dissipation fins 220 is equal to the same direction, and the second heat dissipation fins are adjacent to each other due to the folding of the edges. A certain spacing of the air flow passages ' is formed between the sheets 24 并且 and the recesses 242 are combined to form a concave σ 卩 28 in order to eliminate interference of the bent portion when assembling the heat pipes 5 。. The groove of the first heat dissipating portion 20 facing the base 1 “ is opposite to the groove on the base 1 ,, and the heat pipe 50 is accommodated therein. The second heat dissipating portion 30 is an aluminum extruded radiator. a plurality of heat dissipation fins 34 having a top surface of the substrate 32 and the upper surface of the substrate 32. The bottom surface of the substrate 3 is in contact with the first heat dissipation portion 20 and is provided with a notch 36 at a position corresponding to the recess portion 第一 of the first heat dissipation portion 2〇, and The lower surface is provided with a semi-circular groove 38 corresponding to the groove 24 of the first heat dissipating portion 2 to the second heat dissipating portion 30, so that the group 200816909 incorporates the corresponding heat pipe 5〇. 42 ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ ΠΓ When stacked, due to the flange 44: it has a width equal to the width of the flange 44 and is open at both ends. There is a heat dissipating portion 4, and the notch 36 corresponding to the second heat dissipating portion 3 is opened at a position 5 and has a heat supply tube 50 end. a perforation 46 having a contact edge that is vertically penetrated, 兮== is the same width as the flange 44, so that the inner surface of the (four) is stacked Forming a cylindrical contact surface in contact with the heat pipe 5〇. The lowermost heat dissipating piece 42 of the third heat dissipating portion 40 abuts against the top end of the last heat dissipating film 34, so that the second heat dissipating portion 3〇=〇: a plurality of air flow passages that are open at both ends. The opening end direction of the flow passage of the second heat dissipating portion '==Μ0 is the same as that of the first heat dissipating portion_. 51: The crucible: 50 is substantially circular and includes f The heat absorption formed by the folding, the connecting section 52, the first heat releasing section 53 and the second heat releasing section ^. In the basin, the bending extension_connecting section 52' is connected to the section further: suction, ., & 51 other end The direction of the gusset extension extends parallel to the endothermic section μ == the extension end of the first heat release section 53 is further vertically away from the directional body 53 and the first heat release section 54' and the heat absorption section 51 and the first heat release are on the same plane. The connecting section 52 is used for connecting the 2_^51 and the first heat releasing section 53 so that the heat pipe 5 bypasses the first heat radiating portion. The heat absorbing section 51 is thermally conductively connected (such as welding or heat conduction knee L/r hereinafter referred to as connection) The groove 14 of the base 1 and the groove 24 of the first heat dissipation portion 20 are used to absorb the heat on the base 1 The first heat dissipation portion 53 is connected to the groove 24 and the second heat dissipation portion 3 of the first heat dissipation portion 20 toward the second heat dissipation portion 30. The groove 38 is configured to conduct heat absorbed from the heat absorption section 51 to the heat dissipating portion connected thereto for heat dissipation. The second heat release section 54 extends through the notch 36 of the second heat dissipation portion and is disposed through the third heat dissipation portion. 4对应 corresponding cylindrical contact surface, so that the heat absorbed by the heat absorption section 51 is transmitted to the third heat dissipating part 仞 for heat dissipation. In the embodiment, the arrangement of the number of tubes 50 is described by taking three heat pipes as an example. As shown in FIG. 2, in the present embodiment, the three heat pipes are in the same shape, but one of the heat pipes 5 〇 and the other heat pipes 5 置于 are disposed in a bilaterally symmetrical manner between the other heat pipes 5 。. The heat dissipating device of this embodiment further includes a fan 6〇 which is fixed to one side of the heat dissipating device by the two fixing members 70 for promoting heat replacement between the heat dissipating tab and the air. The fixing member 7A includes a flat plate π facing the fan 6〇, and the outer edge of the flat f 72 is bent inwardly to form a buckle piece %. The third heat dissipating portion 4A is provided with a buckle groove 48 into which the fastener piece of the fixing member 7 is inserted toward the both end portions of the fan 60. The two fixing members 7 are separated from the third heat dissipating portion 4 The side end of the buckle groove 48 is fastened, and the fan cymbal is fixed on the flat plate 72 of the fixing member by screws or the like. Due to the connection of the fan 6 而, the two fixing members are not easily removed from the heat device. Tian Ran, the heat dissipating device of the present invention The number and shape of the heat pipes and the opening/discharging of the heat dissipation P and the distribution of the heat-dissipating pieces can be adjusted according to the requirements. For example, the heat-dissipating device only needs two heat pipes arranged symmetrically; the heat-absorbing segments of several heat officials When the distribution is relatively dense and the distribution of the first exothermic section is relatively scattered, the second exothermic section cannot be coplanar to the surface of the heat absorption section and the first heat release section of the heat pipe in order to pass through the third heat dissipation portion vertically, that is, the heat pipe. The plane in which the first heat-discharging section and the first heat-dissipating section are located intersects the plane of the heat-absorbing section and the first venting section on the axis of the first heat-dissipating section; the diverging filaments of the first heat-dissipating section may be parallel to the base Set the third heat sink The hot Korean piece is vertically arranged with respect to the base, that is, the plane of the heat radiating fin holding the first heat radiating portion is perpendicular to the plane of the heat radiating fin of the third heat portion. In summary, the present invention conforms to the patent element of the invention, and is legally proposed. The above is only a preferred embodiment of the present invention, and the equivalent of the person skilled in the art of the present invention is to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat dissipating device according to an embodiment of the present invention. Fig. 2 is an exploded perspective view of a portion of the structure of Fig. 1. Fig. 3 is a perspective view of a main assembly of Fig. 1. 】 Base 10 Fixing ears 12 Grooves 14, 26, 38 First heat sink 20 First fin set 22 First heat sink fin 220 Recess D 222, 242 Second tab set 24 Recess 28 Second heat sink 30 Substrate 32 Heat sink fin Sheet 34, 42 missing D 36 third heat sink 40 flange 44 perforation 46 11 200816909 buckle groove 48 heat pipe 50 heat absorption section 51 connection section 52 first heat release section 53 second heat release section 54 fan 60 fixing member 70 flat plate 72 buckle 74 1 2