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TWI310709B - - Google Patents

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Publication number
TWI310709B
TWI310709B TW096101624A TW96101624A TWI310709B TW I310709 B TWI310709 B TW I310709B TW 096101624 A TW096101624 A TW 096101624A TW 96101624 A TW96101624 A TW 96101624A TW I310709 B TWI310709 B TW I310709B
Authority
TW
Taiwan
Prior art keywords
hole
wiring board
printed wiring
imaging
center
Prior art date
Application number
TW096101624A
Other languages
English (en)
Chinese (zh)
Other versions
TW200738379A (en
Inventor
Tsutomu Saito
Masatoshi Araki
Original Assignee
Seiko Precision Kk
Muraki Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Precision Kk, Muraki Ltd filed Critical Seiko Precision Kk
Publication of TW200738379A publication Critical patent/TW200738379A/zh
Application granted granted Critical
Publication of TWI310709B publication Critical patent/TWI310709B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B39/00—General-purpose boring or drilling machines or devices; Sets of boring and/or drilling machines
    • B23B39/04—Co-ordinate boring or drilling machines; Machines for making holes without previous marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B49/00—Measuring or gauging equipment on boring machines for positioning or guiding the drill; Devices for indicating failure of drills during boring; Centering devices for holes to be bored
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/20—Automatic control or regulation of feed movement, cutting velocity or position of tool or work before or after the tool acts upon the workpiece
    • B23Q15/22—Control or regulation of position of tool or workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/32—Use of electronics
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37564—Center of camera vision aligned with axis of drill
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45129—Boring, drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
TW096101624A 2006-01-30 2007-01-16 Boring method and boring device TW200738379A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006020783A JP4542046B2 (ja) 2006-01-30 2006-01-30 穴開け方法及び穴開け装置

Publications (2)

Publication Number Publication Date
TW200738379A TW200738379A (en) 2007-10-16
TWI310709B true TWI310709B (ja) 2009-06-11

Family

ID=38309332

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101624A TW200738379A (en) 2006-01-30 2007-01-16 Boring method and boring device

Country Status (5)

Country Link
JP (1) JP4542046B2 (ja)
KR (1) KR100955449B1 (ja)
CN (1) CN101375648B (ja)
TW (1) TW200738379A (ja)
WO (1) WO2007086555A1 (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101774295A (zh) * 2010-01-21 2010-07-14 昆山雄风彩印有限公司 网印机定位打孔装置
CN101879616B (zh) * 2010-06-25 2011-11-09 天津市中环天佳电子有限公司 用于两端打孔的机械装置
JP2012020357A (ja) 2010-07-13 2012-02-02 Ibiden Co Ltd ドリル及びプリント配線板の製造方法
JP5952053B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
JP5952052B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
JP5908351B2 (ja) * 2012-06-26 2016-04-26 セイコープレシジョン株式会社 穴開け位置決定装置、穴開け位置決定方法、及び、プログラム
CN102773524A (zh) * 2012-08-01 2012-11-14 西北工业大学 一种基于机器视觉找正的制孔方法
CN102922321B (zh) * 2012-10-30 2015-09-16 大族激光科技产业集团股份有限公司 气夹张开防呆方法、系统及气夹控制装置
TW201605315A (zh) * 2014-02-21 2016-02-01 維亞機械股份有限公司 背鑽加工方法以及背鑽加工裝置
TW201542051A (zh) * 2014-04-30 2015-11-01 Tong Tai Machine & Tool Co Ltd Ｐｃｂ板之鑽孔加工方法
KR101629957B1 (ko) * 2014-08-05 2016-06-15 (주)대원실업사 확인창 마대 및 그의 제조 방법
KR102212137B1 (ko) 2016-04-21 2021-02-03 퓨얼 셀 에너지, 인크 이산화탄소 포획을 위해 용융 탄산염 연료 전지 애노드 배기를 후가공처리하는 방법
EP3449523B1 (en) 2016-04-29 2021-10-27 Fuelcell Energy, Inc. Methanation of anode exhaust gas to enhance carbon dioxide capture
CN105979697B (zh) * 2016-06-27 2019-02-19 华为技术有限公司 印刷电路板及通信设备
JP6739259B2 (ja) * 2016-07-06 2020-08-12 セイコータイムシステム株式会社 孔開け装置
JP6252809B1 (ja) * 2016-09-14 2017-12-27 株式会社ムラキ 多層回路基板基準穴明機に応用される自動搬送装置
CN106736789B (zh) * 2016-11-18 2019-05-10 大族激光科技产业集团股份有限公司 一种校准轴间距的方法
CN110338875B (zh) * 2019-04-12 2021-07-02 北京诺亦腾科技有限公司 一种用于非治疗目的的基于虚拟现实技术的打孔控制方法
WO2021181249A1 (en) 2020-03-11 2021-09-16 Fuelcell Energy, Inc. Steam methane reforming unit for carbon capture
DE102020113109B4 (de) 2020-05-14 2023-07-06 Schmoll Maschinen Gmbh Bearbeitungsstation und Verfahren zur Kontrolle oder Identifikation plattenförmiger Werkstücke
CN111774930B (zh) * 2020-07-27 2022-06-07 上海威研精密科技有限公司 一种视觉在机对刀仪及其对刀方法
CN112648946B (zh) * 2020-12-02 2022-04-12 益阳市明正宏电子有限公司 一种孔偏检测装置
CN112847620B (zh) * 2020-12-31 2022-12-06 杭州堃博生物科技有限公司 一种导管横向打孔控制方法、存储介质、终端及打孔装置
FR3124100B1 (fr) * 2021-06-17 2024-01-19 Airbus Operations Sas Procédé d’aide au positionnement d’un foret pour l’alésage d’une pièce

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0657381B2 (ja) * 1989-02-15 1994-08-03 松下電工株式会社 穴加工位置の補正方法
JP2500509B2 (ja) * 1992-03-25 1996-05-29 株式会社精工舎 穿孔装置における画像認識の歪み補正方法
JP2545674B2 (ja) * 1992-07-31 1996-10-23 セイコープレシジョン株式会社 プリント基板の加工方法およびその装置
JP2835496B2 (ja) * 1994-11-09 1998-12-14 株式会社日本製鋼所 基板穴明け方法および基板穴明け装置
JP2873439B2 (ja) * 1995-09-22 1999-03-24 セイコープレシジョン株式会社 プリント基板の穴明け装置及び穴明け方法
JP3550462B2 (ja) * 1996-07-31 2004-08-04 セイコープレシジョン株式会社 板状ワークの穴明け方法及び穴明け装置及び穴位置検出方法及び穴位置検出装置
JP4502454B2 (ja) * 2000-04-28 2010-07-14 株式会社ムラキ 基準穴穴開け機
JP3954474B2 (ja) * 2002-10-16 2007-08-08 株式会社ムラキ 基準穴穴開け機、および、多層プリント配線板のガイドマーク座標値の推定法

Also Published As

Publication number Publication date
JP4542046B2 (ja) 2010-09-08
CN101375648A (zh) 2009-02-25
JP2007201349A (ja) 2007-08-09
KR20080072853A (ko) 2008-08-07
CN101375648B (zh) 2010-09-08
KR100955449B1 (ko) 2010-05-04
TW200738379A (en) 2007-10-16
WO2007086555A1 (ja) 2007-08-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees