1310709 (1) 九、發明說明 【發明所屬之技術領域】 本發明是有關在印刷配線板等中加工基準孔的開孔裝 置。 【先前技術】 在電子機器中，隨著1C晶片、電阻、電容器等的表 I面安裝用的電子零件的小型化，安裝該等的印刷配線板也 大多被要求高密度化，多層化。多層印刷配線板是以露出 於表背2層的外部的導體層、及數層不露出的内層的導體 層所構成。在各導體層之間插入絕緣性的基板，形成藉由 此基板來接著導體層之構造。 多層印刷配線板是例如預先定位用的至少2個基準孔 會被開鑿於兩面配線板，以此基準孔作爲基準來形成表背 兩面的圖案等。兩面印刷配線板的表背的圖案是平面性地 $互相保持其位置。在如此複數片的兩面配線板使用相同座 標位置的基準孔來形成圖案等。在形成於内層板的兩面印 刷配線板的圖案中，除了單一配線板的圖案以外，還準備 有新設的基準孔用的導件標記及顯示表背識別用的基準孔 的位置的導件標記等，在蝕刻工程中該等的導件標記也會 被形成。 重疊複數片蝕刻完成的内層用兩面印刷配線板，而正 確地使形成於各個配線板的導體部之圖案的位置關係一致 的情況稱爲結層（L a y u p )。爲了進行結層，而準備設有 -5- (2) 1310709 複數個銷的治具板。通常，銷是設置在適合於已設的基準 孔的位置。爲了更正確地使完成的多層配線板的各層圖案 一致’有時設有新結層用的基準孔。 1片触刻完成的兩面配線板會在其基準孔插通治具板 的銷，而放置於治具板上。在其上載置有被開鏊基準孔之 加熱則的基板材料（稱爲預浸料（prepreg))。並且，其 他1片的兩面配線板會在其基準孔插通治具板的銷，而重 疊於治具板上。在此階段， 其間所放置的預浸料的外周 若在結層的2片兩面印 導體材料的銅箔而以熱壓來 兩面配線板間的預浸料會熱 各導體間的接合完了。然後 案的基準孔會被鑿，以此基 導體配線圖案的蝕刻、貫通 鍍工程、防鏽處理工程等， 板，切出成所要的外形形狀 在多層印刷配線板製造 的基準孔、及形成於熱壓工 ，在形成多層印刷配線板的 了單一配線板的圖案以外， 件標記等，在蝕刻工程中該 件標記的座標是設定成保持 係，只要測定該等的導件標 暫時固定2片的兩面配線板及 ，而完成結層。 刷配線板的兩側放置預浸料及 加壓加熱的話，則銅箔或插入 硬化（絕緣）而於基板變化， ，對應於多層配線板的内層圖 準孔作爲基準來進行最外層的 孔的開孔加工等。更，施以電 以機械加工來分割成單一配線 ，而完成多層印刷配線板。 過程中，基準孔爲使用結層用 程後的基準孔等2種。如前述 内層之兩面印刷配線板中，除 還準備有複數個基準孔用的導 導件標記亦被蝕刻。該等的導 單一配線板的圖案與某位置關 記的位置，便可辨明構成電路 -6- (3) 1310709 的圖案的座標。觀測該等的複數個導件標記等。爲了根據 由該觀測値所計算的結果來求取新的基準孔的座標，進行 基準孔的開孔，通常會使用開孔裝置。 就開孔裝置的加工對象而言’第1是結層工程、熱壓 工程終了後，成爲多層印刷配線板者，第2是構成多層印 刷配線板的構件之結層工程前的兩面印刷配線板。亦即， 就基準孔開孔裝置的工件而言，有多層、兩面的印刷配線 板，往後將該兩者總稱爲工件或有時僅記爲印刷配線板。 如上述，以熱壓來加壓加熱的多層印刷配線板的表背 兩外面是以無垢的導體層所覆蓋，不能以肉眼使用可視光 線來明瞭透視形成於内層的導件標記。對應於如此不能以 可視光來觀測時，有各種觀測手段正被硏究，例如不使用 可視光線的超音波等其他的測定法，目前大多是使用X線 (基準孔）開孔機，其係以微弱的X線來透視多層配線板 ，觀測形成於内層的導體層之導件標記。 印刷配線板的加工精度是仰賴基準孔的精度。就提高 印刷配線板的加工精度之技術而言’例如有其次的專利文 獻。 專利文獻1是記載以簡單的構成進行印刷基板的正確 開孔爲目的之技術。專利文獻1的技術是準備一在作業工 作台上的治具板設有複數個孔部之治具板。使用2個攝像 手段來攝取複數個孔部的透過像’求取該等的中心位置與 圖像中心的位置偏移。由於孔部間的間隔爲已知，因此可 算出兩攝像手段的間隔。在此，設定印刷基板’藉由兩攝 (4) 1310709 像手段來攝取兩識別用標記，進行圖像處理來求取該等的 中心位置與圖像中心的位置偏移，而由兩攝像手段間的間 隔來算出識別用標記間的間隔。在此，僅修正識別用標記 間的間隔與應穿孔的孔間的間隔的誤差量，而設定開孔位 置，於此用鑽頭開孔。1310709 (1) Description of the Invention [Technical Field of the Invention] The present invention relates to an opening device for processing a reference hole in a printed wiring board or the like. [Prior Art] In the electronic device, as the electronic components for mounting the surface of the surface of the 1C chip, the resistor, the capacitor, and the like are miniaturized, the printed wiring board on which these are mounted is often required to have a high density and a plurality of layers. The multilayer printed wiring board is composed of a conductor layer exposed to the outside of the front and back layers and a conductor layer of an inner layer which is not exposed to a plurality of layers. An insulating substrate is interposed between the respective conductor layers to form a structure in which the conductor layer is followed by the substrate. In the multilayer printed wiring board, for example, at least two reference holes for pre-positioning are to be cut into the double-sided wiring board, and a pattern of the front and back surfaces is formed on the basis of the reference hole. The pattern of the front and back of the two-sided printed wiring board is flat to maintain its position. A pattern of the same coordinate position is used for the double-sided wiring board of such a plurality of sheets to form a pattern or the like. In the pattern of the double-sided printed wiring board formed on the inner layer board, in addition to the pattern of the single wiring board, a guide mark for a new reference hole and a guide mark for displaying the position of the reference hole for the identification of the front and back are prepared. These guide marks are also formed in the etching process. The double-layer printed wiring board for the inner layer which is formed by laminating a plurality of sheets is etched, and the positional relationship of the patterns of the conductor portions formed in the respective wiring boards is made uniform, which is called a junction layer (L a y u p ). In order to carry out the layering, a jig plate of -5- (2) 1310709 plurality of pins is prepared. Usually, the pin is placed at a position suitable for the set reference hole. In order to more accurately match the pattern of each layer of the completed multilayer wiring board, a reference hole for a new layer is sometimes provided. A two-sided wiring board that has been inscribed by a piece of contact is inserted into the pin of the jig plate at its reference hole and placed on the jig plate. A substrate material (referred to as a prepreg) in which the heated reference holes are heated is placed thereon. Also, the other two-sided wiring board is inserted into the pin of the jig plate at its reference hole and overlaps the jig plate. At this stage, if the outer periphery of the prepreg placed therebetween is printed with copper foil of the conductor material on both sides of the layered layer, the prepreg between the double-sided wiring boards is heated and the bonding between the conductors is completed. Then, the reference hole of the case is cut, and the base conductor wiring pattern is etched, the through plating process, the rustproof process, and the like, and the plate is cut into a reference hole formed in the multilayer printed wiring board and formed in the desired shape. In the hot press, in addition to the pattern of the single wiring board forming the multilayer printed wiring board, the mark of the part is set in the etching process, and the coordinates of the mark are set as the holding system. The two sides of the wiring board and the finish layer. When the prepreg and the pressurization are placed on both sides of the brushed wiring board, the copper foil or the insert is hardened (insulated) and changed on the substrate, and the opening of the outermost layer is performed in accordance with the inner layer of the multilayer wiring board as a reference. Hole processing, etc. Further, the electric power is divided into a single wiring by mechanical processing to complete the multilayer printed wiring board. In the process, the reference hole is two types of reference holes after the use of the layering process. In the two-sided printed wiring board of the inner layer described above, the guide mark for a plurality of reference holes is also etched. The coordinates of the pattern of the single wiring board and the position of the position can be used to identify the coordinates of the pattern constituting the circuit -6-(3) 1310709. Observe the plurality of guide marks and the like. In order to obtain the coordinates of the new reference hole based on the result calculated from the observation ,, and to make the opening of the reference hole, a hole opening device is usually used. In the case of the processing object of the hole opening device, the first is the multilayer printed wiring board after the end of the layering process and the hot pressing process, and the second is the double-sided printed wiring board before the layering process of the member constituting the multilayer printed wiring board. . That is, in the case of the workpiece of the reference hole opening device, there are a plurality of printed wiring boards of both sides, and the latter will be collectively referred to as a workpiece or sometimes only as a printed wiring board. As described above, the front and back surfaces of the multilayer printed wiring board which is heated and pressurized by hot pressing are covered with a non-scale conductor layer, and the visible light rays are not visually recognized to clearly indicate the guide marks formed on the inner layer. In view of the fact that it is impossible to observe with visible light, various observation methods are being investigated. For example, other measurement methods such as ultrasonic waves that do not use visible light are often used, and X-ray (reference hole) opening machines are often used. The multilayer wiring board is seen with a weak X-ray, and the guide marks of the conductor layers formed on the inner layer are observed. The processing accuracy of the printed wiring board is determined by the accuracy of the reference hole. For the technique of improving the processing precision of a printed wiring board, for example, there is a second patent document. Patent Document 1 describes a technique for performing correct opening of a printed circuit board with a simple configuration. The technique of Patent Document 1 is to prepare a jig plate in which a plurality of holes are provided in a jig plate on a work table. The transmission image of the plurality of holes is taken by two imaging means to obtain the positional deviation between the center position and the center of the image. Since the interval between the holes is known, the interval between the two imaging means can be calculated. Here, setting the printed substrate 'takes two identification marks by two cameras (4) 1310709, and performs image processing to obtain the positional deviation between the center position and the image center, and the two imaging means The interval between the identification marks is calculated by the interval between them. Here, only the amount of error in the interval between the identification marks and the interval between the holes to be perforated is corrected, and the opening position is set, and the drill hole is opened here.
又，記載於專利文獻2的技術是在配線板壓緊的中央 部，旋轉軸會被設成與可動工作台的移動方向垂直，設置 藉由可動工作台的移動來迴轉的壓緊滾輪，壓緊滾輪是用 以至加工終了爲止將工件按壓於可動工作台，而來防止位 置偏移。 [專利文獻1]特開平9-8 5 693號公報 [專利文獻2 ]特開2 0 0 1 - 3 1 0 2 0 8號公報 【發明內容】 (發明所欲解決的課題） 以往的開孔裝置是測定攝影機與鑽頭的位置關係，事 先求取兩者中心位置的偏差，作爲校正値（調零（zero set ))。然後，在實際開孔時利用圖像處理來計測表示設 於工件的開孔位置的標記，對其中心座標加上校正値，來 使鑽頭移動，之後藉由鑽頭來開孔。 此方法，未具有確認鑽頭是否正確地移動至應開鑿工 件的孔之處的手段，形成開環（open-loop )控制。鑽頭移 動時所發生的移動誤差，是形成使開孔精度降低的原因。 本發明是有鑑於上述實情而硏發者，其目的是在於消 -8 - (5) 1310709 除開孔手段移動時所發生的移動誤差，使開孔精度提升。 (用以解決課題的手段） 爲了達成上述目的，本發明之第1觀點的開孔方法， 係開孔裝置的開孔方法，該開孔裝置係具備： 工作台，其係載置被開孔的印刷配線板，而於水平方 向移動； 穿孔手段，其係由：鑽頭、及使該鑽頭移動於上下方 向的昇降手段、及固定前述印刷配線板的固定手段所構成 ，在前述印刷配線板中開孔； 至少2個攝像手段，其係測定前述印刷配線板的開孔 位置或基準點的位置； 移動手段，其係保持前述攝像手段與前述穿孔手段的 距離不動，將兩者同時移動於水平方向：及 鑽頭移動手段，其係使前述鑽頭在前述移動手段上對 前述攝像手段移動於水平方向；Further, the technique described in Patent Document 2 is a center portion where the wiring board is pressed, and the rotating shaft is provided to be perpendicular to the moving direction of the movable table, and a pressing roller that is rotated by the movement of the movable table is provided, and the pressing roller is pressed. The tightening roller is used to press the workpiece against the movable table until the end of processing to prevent positional deviation. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 9-8-5693 (Patent Document 2) Japanese Laid-Open Patent Publication No. Hei 2 0 0 1 - 3 1 0 2 0 8 (Problems to be Solved by the Invention) Conventional Openings The device measures the positional relationship between the camera and the drill bit, and determines the deviation between the center positions of the two in advance as a correction zero (zero set). Then, at the time of actual opening, the image processing is used to measure the mark indicating the position of the opening provided in the workpiece, and the center coordinate is added with a correction 値 to move the drill bit, and then the hole is opened by the drill. This method does not have a means of confirming that the drill bit is correctly moved to the hole where the workpiece should be excavated, forming an open-loop control. The movement error that occurs when the drill moves is the cause of the reduced accuracy of the opening. The present invention has been made in view of the above circumstances, and its object is to eliminate the movement error occurring when the opening means is moved, and to improve the opening accuracy. (Means for Solving the Problem) In order to achieve the above object, a method for opening a hole according to a first aspect of the present invention is a method for opening a hole opening device, the hole opening device comprising: a table for mounting an opening The printed wiring board is moved in the horizontal direction; and the punching means is composed of a drill, a lifting means for moving the drill in the vertical direction, and a fixing means for fixing the printed wiring board, and the printed wiring board is included in the printed wiring board. At least two imaging means for measuring the position of the opening of the printed wiring board or the position of the reference point; and the moving means for maintaining the distance between the imaging means and the perforating means, and moving both at the same time a direction and a bit moving means for moving the aforementioned bit to the horizontal direction in the moving means;
I 其特徵爲= 前述開孔裝置係具備治具板，其係具有：供以使用前 述攝像手段來攝取印刷配線板的基準標記之攝像孔、及供 以在該印刷配線板的特定穿孔位置使用前述穿孔手段來開 孔之治具孔者，相等於前述印刷配線板的至少2個特定的 基準標記及特定的穿孔位置的關係，形成2個前述攝像孔 的中心彼此的距離、及對前述2個攝像孔的中心之前述治 具孔的中心， -9 - (6) 1310709 前述開孔方法係具備： 攝像手段位置暫定工程，其係以能夠相等於前述印刷 配線板的2個特定的基準標記的關係之方式，設定前述2 個攝像手段的攝像中心的位置； 鑽頭位置暫定工程，其係以能夠相等於對前述印刷配 線板的2個特定的基準標記之特定的穿孔位置的關係之方 式，對前述2個攝像手段設定前述穿孔手段的位置： 攝像位置調節工程，其係對載置於前述工作台的前述 治具板，以前述2個攝像孔中心及前述2個攝像手段的攝 像中心能夠分別一致之方式，調節前述移動手段及前述工 作台； 誤差測定工程，其係在被載置於前述治具板之穿孔位 置校正用的基板中，藉由前述穿孔手段來開孔之後，使前 述工作台作動，而使藉由前述穿孔手段所被開鑿的孔的位 置移動至前述攝像中心，測定前述治具孔中心與前述穿孔 位置校正用基板中所開鑿的孔的中心位置，測定對前述治 具孔中心之前述開孔位置中心的誤差； 鑽頭定位工程，其係以能夠校正在前述誤差測定工程 所測定之對治具孔中心之開孔位置中心的誤差之方式，使 前述鑽頭移動手段作動，而來設定對前述攝像手段之前述 鑽頭的位置； 基板定位步驟，其係針對被載置於前述工作台之至少 記有2個特定的基準標記之開孔對象的印刷配線板，使前 述工作台作動，而令前述2個特定的基準標記分別一致於 -10- (7) 1310709 前述2個攝像手段的攝像中心的位置；及 開孔工程，其係對被載置於前述工作台之 個特定的基準標記之開孔對象的印刷配線板， 孔手段在該印刷配線板的特定位置開孔。 本發明的第2觀點之開孔裝置係具備： 工作台，其係載置被開孔的印刷配線板， 向移動： _ 穿孔手段，其係由：鑽頭、及使該鑽頭移 向的昇降手段、及固定前述印刷配線板的固定 ’在前述印刷配線板中開孔： 至少2個攝像手段，其係測定前述印刷配 位置或基準點的位置； 移動手段，其係保持前述攝像手段與前述 距離不動，將兩者同時移動於水平方向；及 鑽頭移動手段，其係使前述鑽頭在前述移 |前述攝像手段移動於水平方向； 其特徵係具備： 治具板，其係具有：供以使用前述攝像手 刷配線板的基準標記之攝像孔、及供以在該印 特定穿孔位置使用前述穿孔手段來開孔之治具 前述攝像孔的中心彼此的距離相等於前述印刷 個特定的基準標記的距離，且對前述2個攝像 前述治具孔的中心相等於前述印刷配線板的2 準標記及特定的穿孔位置的關係，形成前述2 至少記有2 藉由前述穿 而於水平方 動於上下方 手段所構成 線板的開孔 穿孔手段的 動手段上對 段來攝取印 刷配線板的 孔者，2個 配線板的2 孔的中心之 個特定的基 個攝像孔及 -11 - (8) 1310709 治具孔； 攝像手段位置暫定手段，其係以能夠相等於前述 配線板的2個特定的基準標記的關係之方式，設定前 個攝像手段的攝像中心的位置； 鑽頭位置暫定手段，其係以能夠相等於對前述印 線板的2個特定的基準標記之特定的穿孔位置的關係 式’對前述2個攝像手段設定前述穿孔手段的位置； 攝像位置調節手段，其係對載置於前述工作台的 治具板’以前述2個攝像孔中心及前述2個攝像手段 像位置中心能夠分別一致之方式，調節前述移動手段 述工作台； 誤差測定手段，其係在被載置於前述治具板之穿 置校正用的基板中，藉由前述穿孔手段來開孔之後， 述工作台作動，而使藉由前述穿孔手段所被開鑿的孔 置移動至前述攝像中心，測定前述治具孔中心與前述 位置校正用基板中所開鑿的孔的中心位置，測定對前 具孔中心之前述開孔位置中心的誤差； 鑽頭定位手段，其係以能夠校正在前述誤差測定 所測定之對治具孔中心之開孔位置中心的誤差之方式 前述鑽頭移動手段作動，而來設定對前述攝像手段之 鑽頭的位置； 基板定位手段，其係針對被載置於前述工作台之 記有2個特定的基準標記之開孔對象的印刷配線板， 述工作台作動，而令前述2個特定的基準標記分別一 印刷 述2 刷配 之方 前述 的攝 及前 孔位 使前 的位 穿孔 述治 手段 ，使 前述 至少 使前 致於 -12- (9) (9)I is characterized in that the hole opening device includes a jig plate having an image pickup hole for picking up a reference mark of a printed wiring board using the image pickup means, and a use for a specific punching position of the printed wiring board. The hole punching hole of the punching means is equivalent to the relationship between at least two specific reference marks of the printed wiring board and a specific punching position, and the distance between the centers of the two image forming holes is formed, and the distance between the two The center of the jig hole in the center of the image hole, -9 - (6) 1310709 The hole opening method includes: a tentative project of the position of the image pickup means, which is equivalent to two specific reference marks of the printed wiring board The relationship between the positions of the imaging centers of the two imaging means is set, and the position of the drill bit is tentatively set so as to be equivalent to the specific perforation position of the two specific reference marks of the printed wiring board. Setting the position of the perforating means for the two imaging means: an imaging position adjustment project for the jig placed on the table The board adjusts the moving means and the table so that the center of the two imaging holes and the imaging centers of the two imaging means are respectively matched; and the error measuring engineering is performed on the perforation placed on the jig plate In the substrate for position correction, after the hole is opened by the punching means, the table is actuated, and the position of the hole to be cut by the piercing means is moved to the imaging center, and the center of the jig hole is measured. The center position of the hole drilled in the substrate for perforating position correction is measured for an error in the center of the opening position of the center of the jig hole; the bit positioning project is capable of correcting the measurement measured by the error measuring project Having the error of the center of the opening position of the center of the hole, the bit moving means is actuated to set the position of the bit to the imaging means; and the substrate positioning step is for at least the recording placed on the table a printed wiring board having two specific reference marks for the opening object, so that the aforementioned table is actuated, and the two The specific reference marks are respectively aligned with the positions of the imaging centers of the two imaging means of -10- (7) 1310709; and the opening works are the opening objects of the specific reference marks placed on the table In the printed wiring board, the hole means opens a hole at a specific position of the printed wiring board. A hole opening device according to a second aspect of the present invention includes: a table on which a printed wiring board having an opening is placed, and a movement: _ a perforating means: a drill bit and a lifting means for moving the bit And fixing the fixing of the printed wiring board. The opening of the printed wiring board is: at least two imaging means for measuring the position of the printing position or the reference point; and the moving means for maintaining the imaging means and the distance Simultaneously moving the two in the horizontal direction at the same time; and the bit moving means for moving the bit in the horizontal direction in the moving direction; the feature is provided with: a jig plate having a An imaging hole of a reference mark of the camera brush wiring board, and a distance between the centers of the imaging holes provided by the jig for opening the hole at the printing specific hole position by the punching means are equal to the distance of the printing specific reference mark And the center of the above-mentioned two image capturing tool holes is equal to the relationship between the two standard marks of the printed wiring board and the specific punching position. In the above 2, at least 2 holes for picking up the printed wiring board by the moving means of the opening perforation means for the wire plate formed by the upper and lower means in the horizontal direction, and 2 holes of the two wiring boards are recorded. a specific base camera hole and a -11 - (8) 1310709 jig hole; a tentative means of position of the image pickup means, which is set in such a manner as to be equivalent to the relationship between the two specific reference marks of the wiring board a position of an imaging center of the previous imaging means; and a bit position provisional means for setting the aforementioned two imaging means with a relational expression "corresponding to a specific perforation position of two specific reference marks of the printing plate" Position of the perforation means; the imaging position adjustment means for adjusting the movement means such that the center of the two imaging holes and the center of the image path of the two imaging means can be aligned with each other in the jig plate placed on the table a table for measuring errors, which is placed in a substrate for placement correction of the jig plate, and is opened by the perforating means. The table is moved, and the hole punched by the punching means is moved to the imaging center, and the center of the hole of the jig and the hole of the hole for the position correction substrate are measured, and the center of the hole is measured. The error of the center of the opening position; the bit positioning means is configured to be capable of correcting the error of the center of the opening position of the center of the jig hole measured by the error measurement, and the bit moving means is set to The position of the drill bit of the image pickup means, and the substrate positioning means for the work piece to be placed on the printed wiring board on which the object is placed on the work surface with two specific reference marks, and the two specific The reference marks are respectively printed and described in the above-mentioned photographing and front hole positions, so that the front bit is perforated, so that the aforementioned at least -12-(9) (9)
1310709 前述2個攝像手段的攝像中心的位置；及 開孔手段，其係對被設定於前述工作台之至少記 個特定的基準標記之開孔對象的印刷配線板，藉由前 孔手段在該印刷配線板的特定位置開孔。 最好前述基板定位手段係由：使前述印刷配線板 於長度方向及寬度方向之XY工作台手段、及使和 XY工作台手段並設的前述印刷配線板移動於寬度方 Y工作台手段所構成。 〔發明的效果〕 若利用本發明的開孔方法，則可在校正鑽頭位置 以能夠在特定的位置進行開孔的方式，使鑽頭的位置 移動調整，一旦調整完成，則鑽頭會原封不動保持其 ，以後不會從該位置作動。 本發明的開孔裝置是在載置印刷配線板的可動工 0上設置治具孔。以此治具孔作爲基準來反魏移動結果 此可一邊査證作動於正確的位置一邊定位。藉由此方 可消除使印刷配線板的開孔位置移動於鑽頭位置時的 〇 由以往的開環控制（open-loop )成爲閉環控 closed-l〇op)，藉此可消除鑽頭的移動誤差，可在更 高的位置進行開孔。 【實施方式】 有2 述穿 移動 前述 向之 時， 實際 位置 作台 ，藉 法， 誤差 制（ 精度 -13- (10) 1310709 參照圖來說明有關本發明的實施形態的開孔裝置1 ° 圖1是本發明的實施形態之開孔裝置1的外觀立體圖 。圖1是透視開孔裝置1的框體2而來顯示内部。並且’ 圖1所記入的機械座標系（原點0、X、Y、Z)是固定於1310709 The position of the imaging center of the two imaging means; and the opening means for the printed wiring board set to the opening target of at least one specific reference mark of the table, by the front hole means A specific position of the printed wiring board is opened. Preferably, the substrate positioning means comprises: XY table means for causing the printed wiring board in the longitudinal direction and the width direction, and the printed wiring board provided in parallel with the XY table means to be moved to the width Y table means . [Effect of the Invention] According to the opening method of the present invention, the position of the drill can be adjusted and adjusted so that the position of the drill can be opened at a specific position, and once the adjustment is completed, the drill will remain intact. Will not be activated from this position in the future. In the aperture device of the present invention, a jig hole is provided in the movable work 0 on which the printed wiring board is placed. Use this jig hole as a benchmark to counter the Wei movement results. This can be verified while positioning at the correct position. By this, it is possible to eliminate the problem of moving the opening position of the printed wiring board to the position of the drill bit by the conventional open-loop control (closed-closed closed-l〇op), thereby eliminating the movement error of the drill bit. , can be opened at a higher position. [Embodiment] When the above-mentioned direction is described, the actual position is used as a table, and the error is made. (Accuracy - 13 - (10) 1310709 Refer to the figure to explain the 1 ° figure of the opening device according to the embodiment of the present invention. 1 is an external perspective view of the aperture device 1 according to the embodiment of the present invention. Fig. 1 is a perspective view showing the inside of the housing 2 of the aperture opening device 1 and the mechanical coordinate system (the origin 0, X, Y, Z) is fixed at
開孔裝置1的不動部分（例如框體2或架台3 )的座標系 ’傳送裝置的各種機械部分的移動方向是形成平行於該座 標軸。另外，圖1的箭頭1 7是作業者的定位置，作業者 朝向箭頭的方向（Y軸的正方向）站立，投入工件的印刷 配線板（未圖示），若加工終了，則自開孔裝置1取出。 工件的供給與取出可藉由搬送裝置來進行。搬送裝置可例 如使用具備藉由空氣來吸附的吸附器之機械手臂所構成。 在開孔裝置1的框體2的内部固定有架台3。左右1 對的X移動架台10是大致形成通道狀，左右形成鏡像關 係的形狀。此X移動架台10是藉由配置於架台3上端的 直線導件l〇a來支承。藉由滾珠螺桿l〇b及卡合的X移動 架台10下面所安裝的球狀螺母（ball nut)(未圖示）， 配合開鑿基準孔的配線板的大小，事先平行移動於X軸， 使X線攝影機6待機於標記60m的觀測可能的位置。另 外’爲了個別驅動X移動架台10，滾珠螺桿l〇b係配置 於各X移動架台10。 在X移動架台10的上部固定有X線發生裝置4，在 下部安裝有直線導件11a。然後，Y移動架台U會被支承 於該直線導件11a。藉由滾珠螺桿lib及卡合的γ移動架 台Π下面所安裝的球狀螺母（未圖示），使Y移動架台 -14- (11) 1310709 11可平行移動於Y軸。Y移動架台11是形成通道狀，在 上部配置有X線防護管5，且與該管並列設置有箝位器9 及使箝位器9上下動的汽缸9a。在下部固定有載置鑽頭7 的鑽頭移動架台7a(參照圖3)及X線攝影機6。 與Y軸平行配置，藉由固定於框體2的中央部分的直 線導件1 2 a及滾珠螺桿1 2b所支承、驅動，而搭載多層印 刷配線板之可動工作台1 2是平行運動於γ軸。可動工作 台1 2是在1 2 A的位置載置工件亦即開鑿基準孔6 〇h的印 刷配線板60 ’沿著Y軸移動而標記測定，引入基準開孔 位置。又，雖圖1未示，但實際可動工作台12是藉由平 行配置於X軸的直線導件及滾珠螺桿來平行運動於X軸 。更’藉由平行配置於Y軸的另一直線導件及滾珠螺桿來 使可動工作台12的一端與滾珠螺桿12b獨立地平行運動 於Y軸，而使可動工作台1 2能以平行於Z軸的軸爲中心 來旋轉運動。 鑽頭7對Y移動架台11而言可移動於X軸及γ軸方 向。鑽頭7對X線攝影機6而言可調節水平方向的位置。 另外，驅動滾珠螺桿10b、lib、12b等，控制X移動 架台10與Y移動架台Η、及可動工作台12的移動之控 制裝置未被圖示。 在此’開孔裝置1的主要構成要素，是以X線發生裝 置4、X線防護管5及X線攝影機6來形成標記6〇m的觀 測裝置、以鑽頭7及箝位器9來形成開孔裝置1、以X移 動架台10、Y移動架台11、可動工作台12及支承驅動該 -15- (12) 1310709 等的直線導件1 0 a、1 1 a、1 2 a、滾珠螺桿1 〇 b、1 1 等來形成驅動裝置。並且，未圖示的控制裝置是按 串的開孔作業程序來進行上述各種裝置的控制。 另外，就圖1而言是在X移動架台10的上部 線發生裝置4，但如圖2所示，亦可將X線發生裝 置於Y移動架台11的上部，而與X線防護管5 — 。圖2是表示本實施形態之開孔裝置的不同構成例 B 2的構成中，由於X線發生裝置4會與Y移動架合 起移動，因此在X線攝影機6所攝取的位置不會 方向的某處。 圖3是Y軸方向所見開孔裝置1内部的立面圖 3中’框體2及架台3會被省略。並且，X移動架芒 略了通道形狀的部分。 左右配置的2個X移動架台10是分別獨立運 方向（在圖3中爲左右方向）。配置於X移動架台 鲁的Y移動架台11是沿著直線導件11a來運動於γ 在圖3中垂直於紙面）。X線攝影機6固定於Y移 11，因此按照X移動架台10及Y移動架台11的 移動。 支承鑽頭7的鑽頭移動架台7a是被固定於Y 台11，可使鑽頭7對Y移動架台11(因此，對線 6)運動於X軸及Y軸方向。並且，鑽頭7是藉由 未圖示）來昇降於Z軸方向。藉由鑽頭7的昇降， 於鑽頭7前端的鑽頭刀7b來對印刷配線板6 0開孔， b、1 2b 照一連 具備X 置4設 體構成 。在圖 '11-限於Y 。在圖 ί 10省 動於X 10上 方向（ 動架台 動作來 移動架 攝影機 汽缸（ 以安裝 -16- (13) 1310709 可動工作台12是與X移動架台10及Y移動架台Η 獨立地運動於X軸及Υ軸方向。並且，如上述，可動工 作台12的一端，例如圖3右端會獨立運動於γ軸方向， 可動工作台12會旋轉於Ζ軸的周圍。 在可動工作台12上安裝有治具板50。在治具板50的 中央設有吸附印刷配線板60等而固定的吸附部5 1。在圖 3中雖被省略，但實際上藉由箝位器9及汽缸9a來固定印 _刷配線板60的開孔位置附近，以鑽頭刀7b來開孔時，印 刷配線板6 0會形成不動。在治具板5 0中，以在印刷配線 板60開孔時，鑽頭7及鑽頭刀7a不會干擾的方式，設有 治具孔53。 控制裝置20是輸入X線攝影機6的攝像，由攝像來 計測孔或標記的位置。控制裝置2 0會驅動X移動架台1 〇 、丫移動架台11、可動工作台12及鑽頭移動架台7a的電 動機（未圖示），使該等的滾珠螺桿旋轉，而令各架台及 鲁工作台移動。並且，控制裝置20是由X移動架台10、Y 移動架台1 1、可動工作台1 2及鑽頭移動架台7a的線性刻 度來輸入各個架台或工作台的位置資訊（及速度資訊）， 進行反餽控制。 圖4是表示控制裝置20的硬體構成之一例的方塊圖 。控制裝置20是如圖4所示，具備控制部2 1、主記憶部 22、外部記憶部23、操作部24、顯示部25及輸出入部26 。主記憶部22、外部記憶部23、操作部24、顯示部25及 輸出入部26皆是經由内部匯流排28來連接至控制部2 1。 -17- (14) 1310709 控制部 21 是由 CPU (Central Processing Unit)等所 構成，按照記憶於外部記憶部23的程式來實行後述開孔 用的處理。 主目己憶部 22 疋由 RAM (Random-Access Memory)等 所構成，載入記億於外部記憶部2 3的程式，作爲控制部 2 1的作業區域使用。 外部記憶部2 3是由快閃記憶體、硬碟、d V D - R A Μ ( • Digital Versatile Disc Random-Access Memory )、DVD-RW ( Digital Versatile Disc Rewritable)等的非揮發性記 憶體所構成，事先記憶用以使前述處理執行於控制部2 1 的程式，且按照控制部2 1的指示，該程式將記憶的資料 供給至控制部2 1，記億由控制部2 1所供給的資料。 操作部24是由鍵盤及滑鼠等的指向裝置、以及將鍵 盤與指向裝置等連接至内部匯流排2 8的介面裝置所構成 。經由操作部2 4來輸入處理的開始或終了的指令等，且 φ供給至控制部2 1。 顯示部 25 是由 CRT (Cathode Ray Tube)或 LCD ( Liquid Crystal Display)等構成、顯示X線攝影機6的攝 像、或X線攝影機6及鑽頭7的位置座標、及計測後的印 刷配線板60的標記60m (參照圖5 )或孔的座標等。 輸出入部 26 是由串聯介面或 LAN ( Local Area Network )介面所構成。經由輸出入部26來輸入由X線攝 影機6所攝像後的圖像信號。並且、輸出驅動X移動架台 10、Y移動架台11、可動工作台12及鑽頭移動架台7a的 -18 - (15) 1310709 電動機之信號。然後，經由輸出入部26，從X移動架台 10、Y移動架台11、可動工作台12及鑽頭移動架台73的 線性刻度來輸入各個架台或工作台的位置資訊（及速度胃 訊）。 另外，在具備上述工件的搬送裝置（未圖示）時，胃 了取得與搬送裝置的動作同步，亦可經由輸出入部26 $ 輸出動作的指令至搬送裝置，從搬送裝置輸入動作的完成 指示。 圖5是表示治具板50的詳細。圖5的（a)是治具板 5〇的平面圖，（b )是使印刷配線板60載置於治具板50 的狀態，（c )是（b )的A-A線剖面圖。 就本實施形態而言，是在印刷配線板60的兩端存在2 個標記60m，以該標記60m爲中心，以某一定的間隔來分 成2個孔的位置，合計開4個孔時爲例來進行説明。The moving direction of the various mechanical portions of the stationary portion of the opening device 1 (e.g., the frame 2 or the gantry 3) is formed parallel to the coordinate axis. In addition, the arrow 17 of FIG. 1 is a fixed position of the operator, and the operator stands in the direction of the arrow (the positive direction of the Y-axis), and the printed wiring board (not shown) of the workpiece is loaded, and if the processing is finished, the self-opening is performed. The device 1 is taken out. The supply and removal of the workpiece can be performed by a transfer device. The conveying device can be constituted, for example, by using a robot arm having an adsorber that is adsorbed by air. A gantry 3 is fixed inside the casing 2 of the boring device 1. The X-moving gantry 10 of the right and left pairs has a substantially channel-like shape and a shape in which the left and right sides form a mirror image relationship. This X moving gantry 10 is supported by a linear guide 10a disposed at the upper end of the gantry 3. The ball nut (not shown) mounted on the lower surface of the X-moving mount 10 by the ball screw l〇b and the engaged X-moving mount 10 is moved in parallel with the X-axis in advance in accordance with the size of the wiring board in which the reference hole is cut. The X-ray camera 6 stands by at an observation possible position of the mark 60m. Further, in order to individually drive the X moving gantry 10, the ball screw l〇b is disposed on each of the X moving gantry 10. The X-ray generating device 4 is fixed to the upper portion of the X moving gantry 10, and the linear guide 11a is attached to the lower portion. Then, the Y moving stage U is supported by the linear guide 11a. The Y moving carriage -14-(11) 1310709 11 can be moved parallel to the Y-axis by the ball screw lib and the ball nut (not shown) attached to the yoke moving table underneath. The Y moving gantry 11 is formed in a channel shape, and an X-ray protection tube 5 is disposed on the upper portion, and a clamper 9 and a cylinder 9a for moving the clamper 9 up and down are provided in parallel with the tube. A drill moving stand 7a (see FIG. 3) on which the drill 7 is placed and a X-ray camera 6 are fixed to the lower portion. Arranged in parallel with the Y-axis, the linear guide 1 2 a and the ball screw 12 b fixed to the central portion of the housing 2 are supported and driven, and the movable table 12 on which the multilayer printed wiring board is mounted is moved in parallel to γ. axis. The movable table 12 is placed at a position of 1 2 A, that is, the printed wiring board 60' which is the reference hole 6 〇h is moved along the Y-axis, and the mark is measured, and the reference opening position is introduced. Further, although not shown in Fig. 1, the actual movable table 12 is moved in parallel to the X-axis by linear guides and ball screws arranged in parallel on the X-axis. Further, one end of the movable table 12 is independently moved parallel to the Y-axis by the ball screw 12b by another linear guide and a ball screw arranged in parallel on the Y-axis, so that the movable table 12 can be parallel to the Z-axis. The axis is centered to rotate. The drill bit 7 is movable in the X-axis and γ-axis directions with respect to the Y moving carriage 11. The drill bit 7 can adjust the position in the horizontal direction for the X-ray camera 6. Further, a control device for driving the ball screws 10b, lib, 12b, and the like to control the movement of the X moving frame 10, the Y moving frame, and the movable table 12 is not shown. Here, the main components of the hole opening device 1 are an observation device in which the X-ray generator 4, the X-ray protection tube 5, and the X-ray camera 6 are formed with a mark 6〇m, and are formed by the drill 7 and the clamper 9. Opening device 1, X moving platform 10, Y moving platform 11, movable table 12, and linear guides supporting driving the -15-(12) 1310709, etc. 1 0 a, 1 1 a, 1 2 a, ball screw 1 〇b, 1 1 , etc. to form the drive unit. Further, the control device (not shown) controls the various devices described above in a series of drilling operation programs. In addition, in FIG. 1, the upper line generating device 4 of the X moving gantry 10 is used. However, as shown in FIG. 2, the X-ray generating device may be disposed on the upper portion of the Y moving gantry 11, and the X-ray protective tube 5 may be provided. . 2 is a view showing a configuration of a different configuration example B 2 of the aperture device according to the present embodiment. Since the X-ray generation device 4 moves in conjunction with the Y moving frame, the position taken by the X-ray camera 6 does not change. somewhere. Fig. 3 is a perspective view showing the inside of the opening device 1 seen in the Y-axis direction. The frame 2 and the frame 3 are omitted. Also, the X moving frame has a portion of the channel shape. The two X-moving gantry 10 disposed on the left and right are independently transported in the left and right directions (in Fig. 3). The Y moving stage 11 disposed on the X moving frame is moved along the linear guide 11a to γ in Fig. 3 perpendicular to the paper surface. The X-ray camera 6 is fixed to the Y-shift 11, so that the movement of the X-moving stand 10 and the Y-moving stand 11 is performed. The drill moving stage 7a supporting the drill 7 is fixed to the Y stage 11, and the drill 7 can move the gantry 11 (and therefore the line 6) to the X-axis and Y-axis directions. Further, the drill 7 is raised and lowered in the Z-axis direction by a not shown. The drill blade 7b at the tip end of the drill bit 7 is used to open the printed wiring board 60 by the raising and lowering of the drill bit 7, and b and 1 2b are integrally provided with the X set 4 housing. In the figure '11 - limited to Y. In Figure 10, the province moves in the X 10 direction (the motion of the gantry moves to move the camera cylinders (to install the -16-(13) 1310709 movable table 12 is to move independently with the X mobile gantry 10 and the Y mobile gantry X The shaft and the x-axis direction. Further, as described above, one end of the movable table 12, for example, the right end of Fig. 3, moves independently in the γ-axis direction, and the movable table 12 rotates around the y-axis. The movable table 12 is mounted on the movable table 12 The jig 50 is provided with an adsorption portion 51 fixed to the center of the jig 50 by suctioning the printed wiring board 60, etc. Although omitted in Fig. 3, it is actually fixed by the clamp 9 and the cylinder 9a. When the hole is opened by the drill blade 7b in the vicinity of the opening position of the stamping board 60, the printed wiring board 60 is not moved. In the jig 50, when the printed wiring board 60 is opened, the drill 7 is used. The jig hole 53 is provided in such a manner that the bit cutter 7a does not interfere. The control device 20 is an image of the input X-ray camera 6, and the position of the hole or the mark is measured by imaging. The control device 20 drives the X moving frame 1 , 丫 mobile gantry 11, movable table 12 and drill moving platform 7a Motivation (not shown) rotates the ball screws to move the gantry and the Lu table. Further, the control device 20 is composed of an X moving gantry 10, a Y moving gantry 1, a movable table 12, and a drill. The positional information (and speed information) of each gantry or table is input to the linear scale of the gantry 7a, and feedback control is performed. Fig. 4 is a block diagram showing an example of the hardware configuration of the control device 20. The control device 20 is as shown in Fig. 4. As shown, the control unit 21, the main memory unit 22, the external memory unit 23, the operation unit 24, the display unit 25, and the input/output unit 26. The main memory unit 22, the external memory unit 23, the operation unit 24, the display unit 25, and the output are provided. The entrance unit 26 is connected to the control unit 21 via the internal bus bar 28. -17- (14) 1310709 The control unit 21 is configured by a CPU (Central Processing Unit) or the like, and is executed in accordance with a program stored in the external storage unit 23. The processing for opening the hole will be described later. The main memory unit 22 is configured by a RAM (Random-Access Memory) or the like, and is loaded into a program of the external memory unit 23, and is used as a work area of the control unit 21. Memory section 2 3 is It consists of non-volatile memory such as flash memory, hard disk, d VD - RA • ( • Digital Versatile Disc Random-Access Memory), DVD-RW (Digital Versatile Disc Rewritable), etc. The program executed in the control unit 2 1 is processed, and in accordance with an instruction from the control unit 21, the program supplies the stored data to the control unit 2 1, and the data supplied by the control unit 21 is recorded. The operation unit 24 is constituted by a pointing device such as a keyboard or a mouse, and an interface device that connects the keyboard and the pointing device to the internal bus bar 28. The command or the like of the start or end of the process is input via the operation unit 24, and φ is supplied to the control unit 21. The display unit 25 is configured by a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display), and displays the image of the X-ray camera 6, the position coordinates of the X-ray camera 6 and the drill 7, and the printed wiring board 60 after measurement. Mark 60m (refer to Figure 5) or the coordinates of the hole, etc. The input/output unit 26 is composed of a serial interface or a LAN (Local Area Network) interface. The image signal imaged by the X-ray camera 6 is input via the input/output unit 26. And, the signals of the -18 - (15) 1310709 motors of the drive X moving gantry 10, the Y moving gantry 11, the movable table 12, and the drill moving gantry 7a are output. Then, the position information (and speed stomach) of each of the gantry or the table is input from the linear scale of the X moving gantry 10, the Y moving gantry 11, the movable table 12, and the drill moving gantry 73 via the input/output portion 26. In addition, when the delivery device (not shown) of the above-described workpiece is provided, the stomach is synchronized with the operation of the transport device, and the operation of the operation and output unit 26$ can be outputted to the transport device, and the completion instruction of the operation can be input from the transport device. FIG. 5 shows the details of the jig plate 50. Fig. 5 (a) is a plan view of the jig plate 5, (b) is a state in which the printed wiring board 60 is placed on the jig plate 50, and (c) is a cross-sectional view taken along line A-A of (b). In the present embodiment, two marks 60m are present at both ends of the printed wiring board 60, and the positions of the two marks are divided into two holes at a certain interval around the mark 60m. To explain.
如圖5 ( a )所示，治具板5 0是在兩端設有供以用X 線攝影機6來攝取印刷配線板60的標記60m之攝像孔52 。而且，以攝像孔52爲中心，分別開鑿分成2處的治具 孔53。攝像孔52的中心及治具孔53的中心是分別對合於 印刷配線板60的標記60m及開鑿基準孔60h的位置來正 確地形成。 在治具板5 0中，如上述，於中央部形成有吸附部5 1 。在吸附部5 1嵌有被開鑿孔5 1 a的板5 1 b (參照圖5 ( c ))，由連接至吸引裝置（未圖示）的吸氣管51c來吸引 空氣，藉此吸附載置於治具板5 0上的工件（印刷配線板 -19- (16) 1310709 ό〇或校正用基板61 )。印刷配線板60是以標記60m 大致位於攝像孔52的中心之方式來載置（參照圖5 )° 圖6是表示可動工作台12的動作。圖6的（a) 動工作台12的平面圖，（b)是可動工作台12旋轉 態平面圖’ （c)是可動工作台12的立面圖。 可動工作台12是以移動於X方向的XI工作台1 U XI工作台12d所支撐。XI工作台12c是藉由滾珠螺 球狀螺母來運動於X軸方向。XI工作台12d是沿著 件12d2來自由作動於X方向^ XI工作台12c及XI 台12d是以框架12g來連結，因此XI工作台12d是 於XI工作台12c的動作。 在XI工作台12c上設有Y1工作台12e。在XI 台12d上設有Y2工作台12PY1工作台12e及Y2 台12f是分別獨立地作動於γ軸方向。框架12g是旋 φ如地安裝於Y1工作台12e及Y2工作台12f。藉由 工作台12e及Υ2工作台12f同時作動於同方向，框架 會平行移動於Y軸方向。例如若保持固定Y1工作台 ，而使Y2工作台I2f作動，貝IJ XI工作台12d會自由 動於X方向，因此框架12g會以Y1工作台12e爲中 轉。 例如圖6 ( b )所示，使框架1 2g旋轉Θ弧度時， 將框架12g的Y1工作台軸與Y2工作台軸的距離設爲 使Y2工作台12f作動Lsine即可。此刻，XI工作台 能夠 (b ) 是可 的狀 2c及 桿及 X導 工作 連動 工作 工作 轉自 t Y1 丨12g 1 2e 地移 心旋 只要 L， 1 2d -20- (17) 1310709 是移動L ( l-cose )。框架12g的位置及角度是藉由觀測 設置於框架12g的2個孔12h、12i來測定。 由於可動工作台1 2不必作動大的角度，因此如Y 1工 作台1 2e或Y2工作台1 2f那樣進行直線動作即可。藉由 實現將可動工作台12的旋轉運動置換成Y2工作台12f( 或Y1工作台12e)的直線動作，可以簡單的機構來取得 精度佳的所望角度變位。 g 其次，參照圖7乃至圖1 〇來説明有關開孔裝置1的 動作。圖7是表示開孔裝置1的動作之一例的流程圖。圖 8是表示使用校正用基板61來校正鑽頭7的位置的狀態圖 。另外，如上述，開孔裝置1的動作是控制部2 1協調主 記憶部2 2、外部記憶部2 3、操作部2 4、輸出入部2 6、X 線攝影機6、X移動架台10、Y移動架台11、可動工作台 12及鑽頭移動架台7a來進行。 事前，2個X線攝影機6的間隔是對合於印刷配線板 φ (以下稱爲基板）60的標記60m的間隔，來決定X移動 架台10的位置。並且，鑽頭7的位置是以能夠形成對標 記6 0m之基準孔60h的位置的方式，對X線攝影機6設 定。亦即’當X線攝影機6位於攝像孔52的中心時，鑽 頭7是位於治具孔5 3。 首先，使治具板5 0的攝像孔5 2的中心正確地對合於 X線攝影機6的攝像中心（步驟s 1 )。此刻，可只使可動 工作台12移動，或使X移動架台及γ移動架台11作 動。但’ X線攝影機6與鑽頭7的相對位置不變。 -21 - (18) 1310709 其次，將校正用基板61載置於治具板5 0上，在使治 具板5 0的攝像孔5 2的中心正確地對合於X線攝影機6的 攝像中心之狀態下，使鑽頭7昇降，而開鏊孔6 1 h (步驟 S2 )。將此刻狀態顯示於圖8的（a )。在X線攝影機6 的攝像中心與攝像孔5 2的中心對合的狀態下，在位於校 正用基板6 1的治具孔5 3的4處開鑿孔6 1 h。 爲了用鑽頭7在校正用基板61中開鑿孔61h，可一個 I 一個地昇降鑽頭7來一個一個地開鑿，或亦可全部同時開 鑿。在後述的印刷配線板60中開鑿基準孔60h時，最好 是同動作。 移動可動工作台12，將開孔位置移動至X線攝影機6 的攝像中心，測定治具孔53與校正用基板6 1中所被開鑿 的孔6 1 h的誤差（步驟S 3 )。圖8的（b )是表示將內側 的開孔位置移動至X線攝影機6的攝像中心時。圖8的（ c )是表示將前側的開孔位置移動至X線攝影機6的攝像 中心時。就本實施形態而言，孔6 1 h的位置爲左右對稱， 因此可左右同時測定。當孔6 1 h的位置非左右對稱時，是 一個一個地對合於X線攝影機6的攝像位置來測定。 圖9是表示治具孔53與孔61h的誤差例。就圖9而 言，對治具孔53的中心而言，孔61h的中心是在X軸方 向偏移Δχ，在Y軸方向偏移Ay。並且，同時X線攝影機 攝像中心與治具孔中心的誤差也測定。X線攝影機攝像中 心與治具孔中心的誤差爲可動工作台1 2的移動誤差。 回到圖7的流程圖，其次，校正鑽頭7 (鑽頭刀7b ) -22- (19) 1310709 的位置（步驟S4 )。孔61 h本來是開於治具孔中心。因 此’以B旨夠打消治具孔中心與孔6 1 h的中心的誤差之方式 ’對X線攝影機6來校正鑽頭7的位置。例如圖9所示， 若誤差爲Δχ及Ay，則將鑽頭7的位置校正-δχ及-的 量。 針對全體的鑽頭7來同様地校正誤差。亦即，若全體 鑽頭7的誤差校正未完成（步驟S5 ; No )，則重複步，驟 _ S 3及步驟S 4。 若全體鑽頭7完成誤差的校正（步驟S5; Yes),貝[j 判斷該等的誤差是否爲容許範圍（步驟S6 )，誤差非容 許範圍時（步驟S6; No)，將新的校正用基板61載置於 治具板50’進行鑽頭位置的校正（重複步驟S2乃至步驟 S6 )。 治具孔5 3的中心與孔6 1 h的中心的容許誤差是例如 決定於X線攝影機6的解像度與鑽頭移動架台7a的分解 鲁能。 在治具孔5 3的中心與孔6 1 h的中心的誤差位於容許 範圍的狀態下（步驟S6 ; Yes) ，X線攝影機6的攝像中 心與鑽頭7的開孔位置的關係應是一致於治具板5〇的攝 像孔中心與治具孔中心（在容許誤差的範圍）。 於是，將在原封不動地保持X線攝影機6與鑽頭7的 位置之下，在印刷配線板60中開鑿基準孔60h。亦即，在 原封不動地使X移動架台10、Y移動架台Π及鑽頭移動 架台7a保持於校正完成的狀態下，將開鑿基準孔60h的 -23- (20) 1310709 印刷配線板60載置於治具板50，調節可動工作台1 2 ’而 使印刷配線板60的標記60m對合於X線攝影機6的攝像 中心（步驟S 7 )。 然後，在原封不動地保持該狀態下，使鑽頭7昇降， 而來開鑿基準孔60h (步驟S 8 )。此刻，如上述’最好是 與在鑽頭位置的校正時於校正用基板61中開鑿孔61h同 動作來開鑿基準孔60h。 圖1 〇是表示將印刷配線板6 0載置於治具板5 〇 ’使標 記6 0m對合於X線攝影機6的攝像中心’而用鑽頭7開 鑿基準孔6Oh之工程。圖1 0的（a )是表示將印刷配線板 60載置於治具板50，而X線攝影機6的攝像中心與標記 6 0m偏移的狀態。圖10的（b)是表示調節可動工作台12 來使印刷配線板60的標記60m對合於X線攝影機6的攝 像中心之狀態。圖1 〇的（c )是在印刷配線板6 0的標記 6〇m對合於X線攝影機6的攝像中心之狀態下’用鑽頭7 來開鑿基準孔60h的狀態。 爲了使印刷配線板60的標記60m對合於X線攝影機 6的攝像中心，而使用圖6所説明的可動工作台1 2的X -Y-Y機能。首先，將可動工作台12平行移動於X軸及Y 軸方向，而例如使左側的標記6 0m對合於一方的X線攝 影機6的攝像中心。其次，藉由圖像計測來測定2個X線 攝影機6與右側的標記60m所成的角度，以能夠形成無角 度誤差的方式來調節圖6的Y2工作台12f。由於標記60m 是非一致於可動工作台1 2的框架1 2 g的支點’因此隨著 -24 * (21) 1310709 Y2工作台1 2f作動’左側的標記60m會偏離χ線攝影機 ό的攝像中心’所以事先計算偏移量來調節X 1工作台1 2 C 及Υ 1工作台1 2e。亦即’以可動工作台1 2的旋轉中心能 夠形成已經對合於X線攝影機6的攝像中心的標記6〇m 的中心之方式來控制可動工作台1 2。 回到圖7的流程圖’在印刷配線板6 〇中開鑿基準孔 60h之後’判定是否有應開鑿基準孔6〇h的印刷配線板6〇 (步驟S9 )。若有應開鑿基準孔6〇h的印刷配線板60 ( 步驟S 9 ; Yes )’則回到步驟S 7來開鑿該印刷配線板6〇 的基準孔6〇h。若無應開孔的印刷配線板60 (步驟S9 ; No)，則終了動作。 如此一來’只要開孔裝置1的條件，例如鑽頭刀7b 的磨耗或温度等的條件不變，藉由一度校正鑽頭7的位置 ’便可針對複數個印刷配線板6 0的一批，正確地開鑿基 準孔60h。 由於本發明的開孔裝置1是對合於治具板50來反餽 控制’因此本發明的開孔裝置1的開孔精度是按照治具板 5〇的精度。只要提高治具板50的攝像孔52與治具孔53 的精度，便可提高印刷配線板60的基準孔60h的精度。 本發明的開孔方法，是在校正鑽頭位置時，以能夠在 特定的位置進行開孔之方式，使鑽頭7的位置實際移動調 整’一旦調整完成，則鑽頭7會原封不動地保持該位置， 以後不會從該位置移動。因此，不會因使鑽頭7移動時的 誤差，而造成基準孔60h的位置偏移。 -25- (22) 1310709 本發明的開孔裝置是在載置印刷配線板6 0的可動工 作台1 2上設置治具孔5 3。以該治具孔5 3作爲基準來反餽 移動結果，藉此可一邊查證作動於正確的位置一邊定位。 藉由此方法，可消除使印刷配線板6 0的開孔位置移動於 鑽頭位置時的誤差。 其他，前述的硬體構成或流程圖乃爲其一例’亦可任 意地變更及修正。就上述實施形態而言，雖是說明有關印 φ刷配線板的標記在兩端爲2個，針對各個的標記以等間隔 來開鑿2處的基準孔時，但本發明並非限於此。例如，標 記的位置亦可爲非左右對稱，或基準孔非等間隔。又，針 對標記，基準孔亦可不是2處，而是1處或3處以上。 【圖式簡單說明】 圖1是表示本發明的實施形態之開孔裝置的構成例。 圖2是表示本發明的實施形態之開孔裝置的不同構成 •例。 圖3是表示本發明的實施形態之開孔裝置的主要内部 構成例 。 圖4是表示本發明的實施形態之控制裝置的硬體構成 之一例的方塊圖。 圖5是表不本發明的實施形態之治具板的詳細圖。 圖6是表示本發明的實施形態之開孔裝置的可動工作 台的動作。 圖7是表示本發明的實施形態之開孔裝置的動作之一 -26- (23) 1310709 例的流程圖。 圖8是表示在本發明的實施形態之開孔裝置中’使用 校正用基板來校正鑽頭的位置之狀態。 圖9是表示治具孔與穿孔的誤差例。 圖1 〇是表示在本發明的實施形態之開孔裝置中，於 印刷配線板開鑿基準孔的工程圖。 【主要元件符號說明】 1 :開孔裝置 2 :框體 3 :架台 4 : X線發生裝置 5 : X線防護管 6 : X線攝影機 7 :鑽頭 7a:鑽頭移動架台 7b :鑽頭刀 9 :箝位器 9a :汽缸 1 0 : X移動架台 1 1 : Y移動架台 1 2 :可動工作台 】〇a、1 la、12a :直線導件（[Μ導件） l〇b、1 lb、12b :滾珠螺桿 -27- (24) 1310709 1 7 :作業者位置（箭頭） 5 0 ·治具板 5 1 :吸附部 52 :攝像孔 5 3 :治具孔 6 0 :印刷配線板 60h :基準孔 6 0 m :標記 61 :校正用基板 6 1 h :孔 -28As shown in Fig. 5 (a), the jig plate 50 is provided with image pickup holes 52 at both ends for receiving the mark 60m of the printed wiring board 60 by the X-ray camera 6. Further, the jig holes 53 divided into two are respectively cut around the imaging hole 52. The center of the imaging hole 52 and the center of the jig hole 53 are formed correctly with respect to the position of the mark 60m and the cutting reference hole 60h of the printed wiring board 60, respectively. In the jig plate 50, as described above, the adsorption portion 5 1 is formed at the center portion. The plate 5 1 b (see FIG. 5( c )) in which the hole 5 1 a is bored is fitted in the adsorption portion 5 1 , and the air is sucked by the intake pipe 51 c connected to the suction device (not shown). A workpiece (printed wiring board 19-(16) 1310709 ό〇 or calibration substrate 61) placed on the jig plate 50. The printed wiring board 60 is placed such that the mark 60m is located substantially at the center of the imaging hole 52 (see FIG. 5). FIG. 6 is a view showing the operation of the movable table 12. 6(a) is a plan view of the movable table 12, (b) is a plan view of the movable table 12 in a rotating state, and (c) is an elevational view of the movable table 12. The movable table 12 is supported by an XI table 1 U XI table 12d that moves in the X direction. The XI table 12c is moved in the X-axis direction by a ball screw nut. The XI table 12d is connected to the X-direction table 12c and the XI table 12d is connected by the frame 12g along the piece 12d2. Therefore, the XI table 12d is operated by the XI table 12c. A Y1 table 12e is provided on the XI table 12c. The Y2 table 12PY1 table 12e and Y2 table 12f are provided on the XI stage 12d to operate independently in the γ-axis direction. The frame 12g is screwed to the Y1 table 12e and the Y2 table 12f. By operating the table 12e and the 工作2 table 12f simultaneously in the same direction, the frame moves in parallel in the Y-axis direction. For example, if the Y1 table is fixed and the Y2 table I2f is actuated, the table IJ XI table 12d is free to move in the X direction, so the frame 12g will be rotated by the Y1 table 12e. For example, as shown in Fig. 6(b), when the frame 1 2g is rotated by an arc, the distance between the Y1 table axis of the frame 12g and the Y2 table axis is set such that the Y2 table 12f is actuated by Lsine. At this moment, the XI workbench can (b) be ok 2c and the rod and X guide work interlocking work from t Y1 丨12g 1 2e to move the heart as long as L, 1 2d -20- (17) 1310709 is moving L ( L-cose ). The position and angle of the frame 12g are measured by observing the two holes 12h, 12i provided in the frame 12g. Since the movable table 12 does not have to be moved at a large angle, a linear motion can be performed as in the Y 1 table 1 2e or the Y2 table 1 2f. By realizing the linear motion of replacing the rotational motion of the movable table 12 with the Y2 table 12f (or the Y1 table 12e), it is possible to obtain an accurate angular displacement with a simple mechanism. g Next, the operation of the hole opening device 1 will be described with reference to Fig. 7 to Fig. 1 . FIG. 7 is a flowchart showing an example of the operation of the hole opening device 1. Fig. 8 is a view showing a state in which the position of the drill 7 is corrected using the correction substrate 61. Further, as described above, the operation of the aperture device 1 is that the control unit 21 coordinates the main memory unit 2, the external memory unit 23, the operation unit 24, the input/output unit 6, the X-ray camera 6, the X mobile station 10, and the Y. The gantry 11, the movable table 12, and the drill moving table 7a are moved. Beforehand, the interval between the two X-ray cameras 6 is the interval between the marks 60m of the printed wiring board φ (hereinafter referred to as the substrate) 60, and the position of the X moving stage 10 is determined. Further, the position of the drill 7 is set to the X-ray camera 6 so that the position of the reference hole 60h of the mark 60m can be formed. That is, when the X-ray camera 6 is located at the center of the imaging hole 52, the drill head 7 is located at the jig hole 53. First, the center of the imaging hole 52 of the jig 50 is correctly aligned with the imaging center of the X-ray camera 6 (step s 1 ). At this time, only the movable table 12 can be moved, or the X moving stage and the gamma moving stage 11 can be operated. However, the relative position of the X-ray camera 6 and the drill bit 7 does not change. -21 - (18) 1310709 Next, the calibration substrate 61 is placed on the jig plate 50, and the center of the imaging hole 52 of the jig plate 50 is correctly aligned with the imaging center of the X-ray camera 6. In this state, the drill bit 7 is raised and lowered, and the boring hole 6 1 h is opened (step S2). This state is shown in (a) of Fig. 8 . In a state where the imaging center of the X-ray camera 6 is aligned with the center of the imaging hole 52, the hole 6 1 h is cut at four places of the jig hole 5 3 of the correction substrate 6 1 . In order to drill the hole 61h in the correction substrate 61 by the drill 7, the drill bit 7 can be lifted one by one to be cut one by one, or all of them can be simultaneously cut. When the reference hole 60h is cut into the printed wiring board 60 to be described later, it is preferable to operate the same. The movable table 12 is moved, and the opening position is moved to the imaging center of the X-ray camera 6, and the error of the hole 6 1 h to be cut in the jig hole 53 and the correction substrate 6 1 is measured (step S3). (b) of Fig. 8 shows a case where the inside opening position is moved to the imaging center of the X-ray camera 6. (c) of Fig. 8 is a view showing when the opening position of the front side is moved to the imaging center of the X-ray camera 6. In the present embodiment, since the position of the hole 6 1 h is bilaterally symmetrical, it can be measured simultaneously. When the position of the hole 6 1 h is not bilaterally symmetrical, it is measured one by one to the imaging position of the X-ray camera 6. Fig. 9 is a view showing an example of an error of the jig hole 53 and the hole 61h. In the center of the jig hole 53, the center of the hole 61h is shifted by Δχ in the X-axis direction and offset by Ay in the Y-axis direction. Moreover, the error of the X-ray camera center and the center of the jig hole was also measured. The error between the X-ray camera camera center and the center of the jig hole is the movement error of the movable table 12. Returning to the flowchart of Fig. 7, second, the position of the drill bit 7 (bit cutter 7b) -22-(19) 1310709 is corrected (step S4). The hole 61 h was originally opened at the center of the jig hole. Therefore, the position of the drill bit 7 is corrected for the X-ray camera 6 in such a manner that B is sufficient to eliminate the error of the center of the hole and the center of the hole 6 1 h. For example, as shown in Fig. 9, if the errors are Δχ and Ay, the position of the drill bit 7 is corrected by the amount of -δχ and -. The error is corrected in the same manner for the entire drill bit 7. That is, if the error correction of the entire drill bit 7 is not completed (step S5; No), the steps, _S3 and step S4 are repeated. When all the drills 7 complete the error correction (step S5; Yes), if the error is judged whether or not the error is an allowable range (step S6), and the error is not within the allowable range (step S6; No), a new correction substrate is to be used. 61 is placed on the jig plate 50' for correction of the bit position (step S2 is repeated to step S6). The tolerance of the center of the jig hole 5 3 and the center of the hole 6 1 h is, for example, determined by the resolution of the X-ray camera 6 and the decomposition of the drill moving frame 7a. In a state where the error of the center of the jig hole 53 and the center of the hole 6 1 h is within the allowable range (step S6; Yes), the relationship between the imaging center of the X-ray camera 6 and the opening position of the drill bit 7 should be identical to The center of the camera hole of the fixture plate and the center of the fixture hole (in the range of tolerance). Then, the reference hole 60h is cut in the printed wiring board 60 under the position where the X-ray camera 6 and the drill 7 are held as they are. In other words, the X-moving gantry 10, the Y-moving gantry, and the drill-moving gantry 7a are held in the state where the correction is completed, and the -23-(20) 1310709 printed wiring board 60 on which the reference hole 60h is cut is placed. The jig 50 adjusts the movable table 1 2 ', and the mark 60m of the printed wiring board 60 is aligned with the imaging center of the X-ray camera 6 (step S7). Then, while the state is maintained as it is, the drill 7 is moved up and down to drill the reference hole 60h (step S8). At this point, as described above, it is preferable to open the reference hole 60h in the same manner as the hole 61h in the correction substrate 61 at the time of correction of the bit position. Fig. 1 is a view showing a process in which the printed wiring board 60 is placed on the jig plate 5 〇 ' so that the mark 60 0 is aligned with the imaging center ' of the X-ray camera 6 and the reference hole 6Oh is drilled by the drill 7. (a) of Fig. 10 shows a state in which the printed wiring board 60 is placed on the jig 50, and the imaging center of the X-ray camera 6 is shifted from the mark 60m. (b) of Fig. 10 shows a state in which the movable table 12 is adjusted to match the mark 60m of the printed wiring board 60 to the image center of the X-ray camera 6. (c) of FIG. 1 is a state in which the reference hole 60h is drilled by the drill bit 7 in a state where the mark 6〇m of the printed wiring board 60 is aligned with the imaging center of the X-ray camera 6. In order to match the mark 60m of the printed wiring board 60 to the imaging center of the X-ray camera 6, the X-Y-Y function of the movable table 12 described with reference to Fig. 6 is used. First, the movable table 12 is moved in parallel in the X-axis and Y-axis directions, and for example, the left mark 60m is aligned with the imaging center of one of the X-ray cameras 6. Next, the angle between the two X-ray cameras 6 and the mark 60m on the right side is measured by image measurement, and the Y2 table 12f of Fig. 6 is adjusted so that the angle error can be formed. Since the mark 60m is non-identical to the fulcrum of the frame 1 2 g of the movable table 1 2, so with the -24 * (21) 1310709 Y2 table 1 2f action 'the mark 60m on the left side will deviate from the camera center of the 摄影 line camera '' Therefore, the offset is calculated in advance to adjust the X 1 table 1 2 C and the Υ 1 table 1 2e. That is, the movable table 12 is controlled such that the center of the mark 6〇m of the imaging center of the X-ray camera 6 can be formed by the center of rotation of the movable table 12. Returning to the flowchart of Fig. 7, 'after the reference hole 60h is cut in the printed wiring board 6', it is determined whether or not there is a printed wiring board 6A to which the reference hole 6?h is to be cut (step S9). If there is a printed wiring board 60 to which the reference hole 6〇h is to be cut (step S9; Yes), the process returns to step S7 to cut the reference hole 6〇h of the printed wiring board 6〇. If there is no printed wiring board 60 to be opened (step S9; No), the operation is terminated. In this way, as long as the conditions of the hole opening device 1, such as the wear or temperature of the drill bit 7b, are not changed, the position of the drill bit 7 can be corrected once, and the batch of the plurality of printed wiring boards 60 can be correct. Ground the reference hole 60h. Since the perforating device 1 of the present invention is in response to the jig plate 50 for feedback control, the opening accuracy of the perforating device 1 of the present invention is in accordance with the accuracy of the jig plate. As long as the accuracy of the imaging hole 52 of the jig 50 and the jig hole 53 are improved, the accuracy of the reference hole 60h of the printed wiring board 60 can be improved. In the hole opening method of the present invention, when the position of the drill bit is corrected, the position of the drill bit 7 is actually moved and adjusted so that the hole 7 can be opened at a specific position. Once the adjustment is completed, the drill bit 7 will maintain the position as it is. It will not move from this location in the future. Therefore, the positional deviation of the reference hole 60h is not caused by the error in moving the drill 7. -25- (22) 1310709 The hole opening device of the present invention is provided with a jig hole 53 in a movable table 12 on which a printed wiring board 60 is placed. The movement result is fed back with the jig hole 5 3 as a reference, whereby the positioning can be performed while verifying that the movement is at the correct position. By this method, the error in moving the opening position of the printed wiring board 60 to the position of the drill bit can be eliminated. Others, the aforementioned hardware configuration or flowchart is an example thereof, and may be arbitrarily changed and corrected. In the above-described embodiment, the number of the marks on the printed wiring board is two at the both ends, and the reference marks of the two marks are cut at equal intervals for each mark. However, the present invention is not limited thereto. For example, the position of the mark may also be non-left-right symmetric, or the reference holes are not equally spaced. Further, in the case of the mark, the reference hole may not be two places but one or more places. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example of the configuration of a hole opening device according to an embodiment of the present invention. Fig. 2 is a view showing an example of a different configuration of the boring device according to the embodiment of the present invention. Fig. 3 is a view showing an example of a main internal configuration of a hole drilling device according to an embodiment of the present invention. Fig. 4 is a block diagram showing an example of a hardware configuration of a control device according to an embodiment of the present invention. Fig. 5 is a detailed view showing a jig plate according to an embodiment of the present invention. Fig. 6 is a view showing the operation of the movable table of the boring device according to the embodiment of the present invention. Fig. 7 is a flow chart showing an example of the operation of the boring device according to the embodiment of the present invention -26-(23) 1310709. Fig. 8 is a view showing a state in which the position of the drill is corrected using the correction substrate in the aperture device according to the embodiment of the present invention. Fig. 9 is a view showing an example of the error of the jig hole and the perforation. Fig. 1 is a view showing the construction of a reference hole in a printed wiring board in the aperture device according to the embodiment of the present invention. [Description of main components] 1 : Opening device 2: Frame 3: Stand 4: X-ray generator 5: X-ray protection tube 6: X-ray camera 7: Drill 7a: Drill moving stand 7b: Drill knife 9: Pliers Positioner 9a: Cylinder 1 0 : X moving stand 1 1 : Y moving stand 1 2 : movable table 〇 a, 1 la, 12a : linear guide ([Μ guide) l〇b, 1 lb, 12b: Ball screw -27- (24) 1310709 1 7 : Operator position (arrow) 5 0 · Fixture plate 5 1 : Adsorption unit 52 : Camera hole 5 3 : Jig hole 6 0 : Printed wiring board 60h : Reference hole 6 0 m : mark 61 : calibration substrate 6 1 h : hole -28