1308085 ⑴ 九、發明說明 【發明所屬之技術領域】 本發明是關於對於玻璃基板或半導體晶圓等的基板， 塗佈顯像液’洗淨液，S 0 G溶液，光阻液等之際的塗佈裝 置及塗佈方法。 【先前技術】 在液晶（LCD) 、PDP (電漿顯示器）、半導體元件 等的製造製程中’在基板上形成各種被膜，或是爲了塗佈 洗淨液或顯像液而使用著具備開縫噴嘴的塗佈裝置。 近年來，配合基板尺寸變大型化的趨勢，代替一面旋 轉基板一面塗佈的習知旋轉塗佈，增加一面將寬廣的開縫 噴嘴朝與基板相對性地一方向移動一面進行塗佈的塗佈裝 置。具備此種開縫噴嘴的塗佈裝置，是在大型基板，也可 在其表面形成均勻厚膜之處有利。但是，另一方面也有幾 個課題。 例如，很難適當地調整塗佈時的基板表面與開縫噴嘴 下端之距離的塗佈間隙也是其中的一課題。該理由是，在 寬廣的開縫噴嘴全寬地必須設定相同塗佈間隙，或是受到 塗佈液吐出於基板時的反作用，會使開縫噴嘴上下移動， 而使塗佈間隙成爲不穩定，塗膜起波浪等。 經常，在開縫噴嘴的行走部設置基準工模，而在該基 準工模載置開縫噴嘴來決定開縫噴嘴的水平之後，使用間 隙計經目視來微調開縫噴嘴與基板載置平台之間隙（亦即 -4- (2) 1308085 ，塗佈間隙）。因此，有因人爲要因所致的誤差變大而欠 缺正確性的問題。 爲了解決該問題，在專利文獻1，提案者利用厚度感 測器來測定被塗工材（基板）的厚度，考慮該厚度，成爲 對應於塗料吐出裝置與被塗工材之間隔須形成的塗膜厚度 的間隔的方式，將塗料吐出裝置作成下降的單張塗工方法 及其裝置。 又，在專利文獻2中，揭示著在基板載置台的所定位 置形成具有與台表面（基準面）相同位準的凸狀部，並藉 由隔著凸狀部相對配置進行測定凸狀部與開縫噴嘴前端部 之間隙量的非接觸式的間隙測定感測器，以提高直接通過 該間隙的雷射光的檢測精度的台型雙脈衝器。 專利文獻1:日本特開平8-182953號公報 專利文獻2:日本特開2001-9341號公報 【發明內容】 然而，在專利文獻1中，因基板厚度感測器與開縫噴 是各別地構成，因此成爲必須調整厚度感測器與開縫噴構 件。 又’在專利文獻2中，有開縫噴嘴前端接觸於凸狀部 時有損傷或變形之虞。這時候，在開縫的長度方向成爲很 難成爲均勻塗佈。 鑑於上述點，本發明是提供容易地可決定開縫噴嘴的 平行基準及高度基準，並正確地決定塗佈時的基準表面與 -5- (3) (3)1308085 開縫噴嘴下端可力卩胃白勺胃及塗 佈方法。 本發明的塗佈裝置，屬於對被載置於基板載置部上的 基板，從與該基板以非接觸且相對地可·移動的開縫噴嘴吐 出塗佈液，而在基板上形成塗膜者’其特徵爲：在基板載 置部的塗佈開始側的寬度方向的兩端部’設置有用以決定 開縫噴嘴的水平基準及高度基準的基準工模；基準工模是 具有可昇降的測長子；該測長子是其上面停止在與基板載 置部面同一面高度的方式被控制。 依照本發明的塗佈裝置，基板載置部的塗佈開始側的 寬度方向的兩端部，設置有用以決定開縫噴嘴的水平基準 及高度基準的基準工模；基準工模是具有可昇降的測長子 ;該測長子是其上面停止在與基板載置部面同一面高度的 方式被控制之故，因而實際上在基板上進行塗佈之際，開 縫噴嘴不會損傷或變形，可將開縫噴嘴作成水平，且成爲 可容易地進行開縫噴嘴的高度調整。 本發明的塗佈方法，是在上述塗佈裝置所控制的基板 載置部面同一面高度位置作爲基準來決定開縫噴嘴的待機 位置，以該待機位置作爲基準來決定基板與開縫噴嘴之間 隔，之後開始塗佈。 依照本發明的塗佈方法，在上述塗佈裝置所控制的基 板載置部面同一面高度位置作爲基準來決定開縫噴嘴的待 機位置，以該待機位置作爲基準來決定基板與開縫噴嘴之 間隔，之後開始塗佈之故，因而開縫噴嘴不會損傷或變形 -6 - (4) 1308085 ，可將開縫噴嘴作成水平，且成爲可容易地進行開縫噴嘴 的高度調整。藉由此’均勻塗佈成爲可能。 具體而言，由以下（1)至（5)的程序進行上述塗佈 方法。 (1 )將開縫噴嘴予以下降’並將該開縫噴嘴下端抵 接於位在上昇位置的上述基準工模的測長子。 (2 )仍在表示於（1 )的狀態下’一直到測長子上面 成爲與基板載置部面同一面高度爲止’將上述開縫噴嘴與 上述測長子一起下降’來決定上述開縫噴嘴的水平基準及 高度基準以及距離感測器的基準。 (3)將開縫噴嘴上昇到待機位置。 (4 )使用具備開縫噴嘴的非接觸式的距離測定感測 器來測定基板上面與開縫噴嘴下端的間隔。 (5 )依據在距離測定感測器所測定的測定値’下降 開縫噴嘴成爲一直到基板上面與開縫噴嘴下端之間隔作爲 目的的塗佈開始位置爲止。 又，在上述塗佈方法中，在基板載置部搬入，載置基 板，將上昇到待機位置的開縫噴嘴移動到塗佈位置，藉由 距離測定感測器來測定直到基板表面的距離資料之後’將 該距離資料回饋到開縫噴嘴昇降控制部來進行運算以決定 塗佈間隙，將開縫噴嘴下降到所決定的塗佈間隙位置較佳 〇 依照本發明，對於玻璃基板或半導體晶圓等的基板， 例如塗佈顯像液、洗淨液、SOG溶液、光阻液等的塗佈液 (5) 1308085 之際，容易地可決定開縫噴嘴的平行基準及基準 〇 所以，可正確地進行塗佈時的基板表面與開 端之距離的微調整，且校正塗佈時的開縫噴嘴的 而可成爲防止塗佈不均勻。 因此，可實現高性能且高可靠性的塗佈裝置 勻的塗膜的適當的塗佈方法。 【實施方式】 以下依據所附圖式來說明本發明的實施形態 第1圖是表示本發明的塗佈裝置的一實施形 圖：第2圖是表示第1圖的主要部分的側視圖； 表示第2圖的A方向的箭視圖。 如第1圖所示地，在本實施形態的基板塗佈 在基台1設有一對平行的軌2、2，而用以基板 φ 的基板載置部3被固定在成爲此些軌2、2的中 基台1面的中央。又，橫跨基板載置部3，有門 構4可行走地架設於軌2、2之間，而在該門型 4經由昇降裝置安裝有開縫噴嘴5。 又，在本實施形態中，尤其是在基板載置部 以決定開縫噴嘴5的水平基準及高度基準的基律 6分別安裝於塗佈開始位置側的側面寬度方向。 基準工模6是具有可昇降的測長子8，該測 藉由彈簧等朝上方被彈推，該下降源是測長子8 高度位置 縫噴嘴下 上下移動 及形成均 態的俯視 第3圖是 裝置中， W所載置 間位置的 型移動機 移動機構 3中’用 :工模6、 長子8是 的上面與 -8- (6) (6)1308085 基板載置部3的上面作成成爲同一面高度的位置，並將該 位置作爲高度方向的基準點。 測長子8是被控制成該上面停止在與基板載置部3上 面同一面高度位置。 在將開縫噴嘴5的移動方向作爲基準的前面，左右地 設置有非接觸式的距離測定感測器7。 亦即，玻璃基板W等是各個厚度稍微不相同。欲對 應於此種情形，設置非接觸式的距離測定感測器，必須知 道開縫噴嘴5下端與基板W上面之實際間隔。 藉由此，在厚度不相同的各個玻璃基板W中，成爲 可知道開縫噴嘴5下端與基板W上面之實際間隙。 使用此種構成的塗佈裝置而在基板W進行塗佈時， 將開縫噴嘴5作成由本圖左邊移動到右邊者。 以下，使用第2圖至第7圖來說明表示於第1圖的塗 佈裝置的塗佈方法。 首先，爲了設定開縫噴嘴5的平行基準及高度基準’ 如第2圖及第3圖所示地，從所定位置下降開縫噴嘴5而 將開縫噴嘴5的下端抵接於左右兩件測長子8的上面。 這時候，測長子8是可昇降之故’因而抵接開縫噴嘴 5時的衝擊是被緩和，不會傷及開縫噴嘴5下端。 以下，如第4圖所示地’將開縫噴嘴5與測長子8 — 起推向下方停止在測長子8上面與基板載置部3上面成爲 同一面爲止。 藉由該操作，開縫噴嘴5是可確認是否呈水平’又’ -9- (7) 1308085 可決定開縫噴嘴5下端的基準高度位置° 在本實施形態中，在距離測定感測器7中’將在該決 定時所測定的測定値設定爲0 # m ’而在開縫噴嘴昇降控 制部進行運算處理。 如此地，決定開縫噴嘴5的水平基準及高度基準（基 準高度位置）及距離感測器的基準’將此些資料被記憶在 開縫噴嘴昇降控制部。此些動作是在搭載開縫噴嘴時所進 行。 然後，在基板載置部3搬入，載置基板W之後’如 第5圖所示地，將開縫噴嘴5上昇到待機位置。該待機位 置是任意，惟例如在500〜1000/im左右厚度的基板W進 行塗佈時，則從基板載置部3之面’亦即從假定爲上述0 的基準高度位置作成3000〜5000/zm上方較佳。 又，待機位置與基準高度位置之距離也被記憶在開縫 噴嘴昇降控制部。 之後，如第6圖所示地，沿著軌2、2朝水平方向移 動開縫噴嘴5，令開縫噴嘴5位於基板W的塗佈開始點的 上方。又，在該時機，藉由距離測定感測器7來測定基板 W上面（基板W表面）爲止的距離。 例如待機位置的高度爲3 5 00 // m，而基板W的厚度 爲700#m時，計算上是成爲3500-700 = 2800" m，惟在基 板W有厚度的偏差，惟因受到來自基板W的反射等的影 響之故，因而測定値是成爲比2800/zm稍多或稍少的數 値。 -10- (8) 1308085 在此’進行資料的校正。亦即，若實測値爲如2790 // m時，由該値減掉預定塗佈開始位置（例如3 0 v m )的 數値2 7 6 0 v m，如第7圖所示地，將開縫噴嘴昇降控制部 下降2 7 6 0 m ’將此作爲塗佈間隙。作成如此，在每一基 板W成爲可設定考慮微妙地不同厚度的塗佈間隙的設定 〇 利用以上的方法來決定塗佈間隙，將開縫噴嘴5予以 下降到該塗佈間隙位置（直到作爲目的塗佈開始位置）， 一面維持塗佈間隙一面進行基板W的塗佈。 在此，從塗佈開始到結束之期間，藉由距離測定感測 器7來監視基板上面與開縫噴嘴5的下端之間隔（塗佈間 隙）的變動。又，若塗佈間隙超過容許範圍而變動時，貝IJ 發出警報或亮燈。由此，可成爲塗佈間隙超過容許範圍而 知道變動情形。 依照本實施的形態，在基板載置部搬入，載置基板， 將上昇到待機位置的開縫噴嘴移動到塗佈位置，藉由距離 測定感測器來測定直到基板表面的距離資料之後，將該距 離資料回饋到開縫噴嘴昇降控制部來進行運算以決定塗佈 間隙，將開縫噴嘴下降到所決定的塗佈間隙位置，一面維 持塗佈間隙一面進行基板W的塗佈之故，因而即使在基 板W上進行塗佈，也不會令開縫噴嘴損傷或變形，而可 將開縫噴嘴作成水平，且可容易地進行開縫噴嘴的高度調 整。 在上述的本實施形態中，決定水平基準及高度基準之 -11 - (9) 1308085 際’朝下方推壓開縫噴嘴5來進行調整，惟從比基準點還 低的位置朝上方抬高開縫噴嘴5來調整也可以。 又’本發明是並不被限定於上述實施形態者，而在不 超越本發明的要旨的範圍下可獲得其他各種構成。 本發明的塗佈裝置及塗佈方法，是成爲可容易地進行 依開縫噴嘴所致的大型基板的塗佈之故，因而可適當地利 用對於液晶 '電漿顯示器、半導體元件等的基板上的各種 被膜形成’或對於磁性記錄媒體上的各種被膜形成。 【圖式簡單說明】 第1圖是表示本發明的塗佈裝置的一實施形態的俯視 圖。 第2圖是表示圖示於第1圖的塗佈裝置的主要部分的 側視圖。 第3圖是表示第2圖的A方向箭視圖。 第4圖是表示本發明的塗佈方法的一實施形態的工程 圖（其中1 )。 第5圖是表示本發明的塗佈方法的一實施形態的工程 圖（其中2 )。 第6圖是表示本發明的塗佈方法的一實施形態的工程 圖（其中3 )。 第7圖是表示本發明的塗佈方法的一實施形態的工程 圖（其中4 )。 -12- (10) (10)1308085 【主要元件符號說明】 1 :基板 2 :軌 3 :基板載置部 4 :門型移動機構 5 :開縫噴嘴 6 :基準工模 7 =非接觸式距離測定感測器 8 :測長子 W :玻璃基板1308085 (1) EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to a substrate such as a glass substrate or a semiconductor wafer, which is coated with a developing liquid 'washing liquid, a S 0 G solution, a photoresist liquid, and the like. Coating device and coating method. [Prior Art] In the manufacturing process of liquid crystal (LCD), PDP (plasma display), and semiconductor devices, various types of films are formed on a substrate, or a slit is used for applying a cleaning liquid or a developing solution. Nozzle coating device. In recent years, in accordance with the trend of increasing the size of the substrate, instead of the conventional spin coating applied while rotating the substrate, the coating is applied while the wide slit nozzle is moved in a direction opposite to the substrate. Device. A coating apparatus having such a slit nozzle is advantageous in a large substrate or a uniform thick film formed on the surface thereof. However, there are also several issues on the other hand. For example, it is difficult to appropriately adjust the coating gap of the surface of the substrate at the time of coating and the lower end of the slit nozzle. The reason is that the same coating gap must be set to the full width of the wide slit nozzle, or the reaction of the coating liquid when it is discharged from the substrate causes the slit nozzle to move up and down, and the coating gap becomes unstable. The coating film is waved and the like. Frequently, a reference tool is provided in the running portion of the slotting nozzle, and after the slotting nozzle is placed on the reference tool to determine the level of the slotting nozzle, the slot nozzle and the substrate mounting platform are finely adjusted by visual inspection using a gap gauge. Clearance (ie -4- (2) 1308085, coating gap). Therefore, there is a problem that the error caused by the artificial cause becomes large and the correctness is lacking. In order to solve this problem, in Patent Document 1, the proposer uses a thickness sensor to measure the thickness of the workpiece (substrate), and in consideration of the thickness, it is required to form a coating corresponding to the interval between the paint discharge device and the workpiece. In the manner of the interval of the film thickness, the paint discharge device is formed into a lowered single-sheet coating method and apparatus therefor. Further, Patent Document 2 discloses that a convex portion having the same level as the table surface (reference surface) is formed at a predetermined position of the substrate stage, and the convex portion is measured by the convex portion being disposed opposite to each other. A non-contact type gap measuring sensor that slits the gap between the tip end portions of the nozzles to increase the detection accuracy of the laser light directly passing through the gaps. [Patent Document 1] Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. 2001-9341. SUMMARY OF THE INVENTION However, in Patent Document 1, since the substrate thickness sensor and the slitting spray are separately Since it is constituted, it is necessary to adjust the thickness sensor and the slit spray member. Further, in Patent Document 2, there is a possibility that the tip of the slit nozzle is damaged or deformed when it comes into contact with the convex portion. At this time, it is difficult to form a uniform coating in the longitudinal direction of the slit. In view of the above, the present invention provides a parallel reference and height reference which can easily determine the slit nozzle, and correctly determines the reference surface at the time of coating and the lower end of the -5-(3) (3) 1308085 slit nozzle. Stomach stomach and coating method. The coating apparatus of the present invention belongs to a substrate placed on a substrate mounting portion, and discharges a coating liquid from a slit nozzle that is non-contacting and movable relative to the substrate, thereby forming a coating film on the substrate. The feature is that a reference tool for determining a horizontal reference and a height reference of the slit nozzle is provided at both end portions in the width direction on the application start side of the substrate mounting portion; the reference tool has a liftable shape The elongator; the elongator is controlled such that the upper surface thereof is stopped at the same height as the surface of the substrate mounting portion. According to the coating apparatus of the present invention, the reference mold for determining the horizontal reference and the height reference of the slit nozzle is provided at both end portions in the width direction of the application start side of the substrate mounting portion; the reference mold has a liftable mold The length measuring element is controlled such that the height of the measuring element is stopped on the same surface as the surface of the substrate mounting portion, so that the slit nozzle is not damaged or deformed when actually applied on the substrate. The slit nozzle is made horizontal, and the height of the slit nozzle can be easily adjusted. In the coating method of the present invention, the standby position of the slit nozzle is determined based on the height position of the same surface of the substrate mounting portion controlled by the coating device, and the substrate and the slit nozzle are determined based on the standby position. After the interval, the coating starts. According to the coating method of the present invention, the standby position of the slit nozzle is determined based on the height position of the same surface of the substrate mounting portion controlled by the coating device, and the substrate and the slit nozzle are determined based on the standby position. After the interval, the coating is started, so that the slit nozzle is not damaged or deformed -6 - (4) 1308085, the slit nozzle can be made horizontal, and the height of the slit nozzle can be easily adjusted. By this, uniform coating becomes possible. Specifically, the above coating method is carried out by the following procedures (1) to (5). (1) Lowering the slit nozzle ′ and bringing the lower end of the slit nozzle into contact with the length measuring unit of the above-mentioned reference mold positioned at the rising position. (2) In the state shown in (1), until the upper surface of the measuring arm becomes the same surface height as the surface of the substrate mounting portion, the slit nozzle is lowered together with the length measuring arm to determine the slit nozzle. Horizontal reference and height reference and distance sensor reference. (3) Raise the slotted nozzle to the standby position. (4) The distance between the upper surface of the substrate and the lower end of the slit nozzle was measured using a non-contact distance measuring sensor having a slit nozzle. (5) According to the measurement 値' measured by the distance measuring sensor, the slit nozzle is formed until the interval between the upper surface of the substrate and the lower end of the slit nozzle is the intended application start position. Further, in the above-described coating method, the substrate is placed in the substrate mounting portion, the substrate is placed, and the slit nozzle raised to the standby position is moved to the coating position, and the distance measurement data is measured by the distance measuring sensor. Then, the distance data is fed back to the slit nozzle lifting control unit to perform calculation to determine the coating gap, and the slit nozzle is lowered to the determined coating gap position. Preferably, according to the present invention, for a glass substrate or a semiconductor wafer When a substrate such as a developing solution (5) 1308085 such as a developing solution, a cleaning solution, a SOG solution, or a photoresist is applied, the parallel reference and the reference of the slit nozzle can be easily determined. The fine adjustment of the distance between the surface of the substrate and the opening at the time of coating is performed, and the slit nozzle at the time of coating is corrected to prevent coating unevenness. Therefore, an appropriate coating method of a uniform coating film of a high-performance and highly reliable coating device can be realized. Embodiments of the present invention are described below with reference to the accompanying drawings. Fig. 1 is a side view showing a coating apparatus according to the present invention. Fig. 2 is a side view showing a main part of Fig. 1; Arrow view in the A direction of Figure 2. As shown in Fig. 1, in the substrate of the present embodiment, a pair of parallel rails 2, 2 are provided on the base 1, and the substrate mounting portion 3 for the substrate φ is fixed to the rails 2. The center of one of the two bases of the base. Further, across the substrate mounting portion 3, the door structure 4 is erectably mounted between the rails 2, 2, and the slit type nozzle 5 is attached to the door type 4 via a lifting device. Further, in the present embodiment, in particular, the substrate 6 which determines the horizontal reference and the height reference of the slit nozzle 5 is attached to the side width direction of the application start position side. The reference tool 6 has a length measuring arm 8 that can be raised and lowered. The test is pushed upward by a spring or the like. The descending source is a plan view of the height measuring position of the measuring arm 8 and moving up and down and forming a uniform state. FIG. 3 is a device. In the type moving machine moving mechanism 3 in which the W position is placed, the upper surface of the mold 6 and the elbow 8 is the same as the upper surface of the -8-(6) (6) 1308085 substrate mounting portion 3. The position of the height and use this position as the reference point for the height direction. The length measuring element 8 is controlled such that the upper surface stops at the same height position as the upper surface of the substrate placing portion 3. A non-contact distance measuring sensor 7 is provided on the left and right sides with the moving direction of the slit nozzle 5 as a reference. That is, the glass substrate W and the like are slightly different in thickness. In order to respond to such a situation, a non-contact distance measuring sensor is provided, and the actual distance between the lower end of the slit nozzle 5 and the upper surface of the substrate W must be known. Thereby, in each of the glass substrates W having different thicknesses, the actual gap between the lower end of the slit nozzle 5 and the upper surface of the substrate W can be known. When the substrate W is applied by using the coating device having such a configuration, the slit nozzle 5 is moved from the left side to the right side of the drawing. Hereinafter, a coating method of the coating apparatus shown in Fig. 1 will be described using Figs. 2 to 7 . First, in order to set the parallel reference and height reference of the slit nozzle 5, as shown in Figs. 2 and 3, the slit nozzle 5 is lowered from the predetermined position, and the lower end of the slit nozzle 5 is brought into contact with the left and right parts. The top of the eldest son 8. At this time, the length measuring arm 8 is liftable and lowered. Thus, the impact when the slit nozzle 5 is abutted is moderated, and the lower end of the slit nozzle 5 is not damaged. In the following, as shown in Fig. 4, the slit nozzle 5 is pushed downward and the length measuring element 8 is pushed downward to stop the upper surface of the length measuring unit 8 and the upper surface of the substrate mounting portion 3 so as to be flush with each other. By this operation, the slit nozzle 5 can confirm whether or not it is horizontally 'again' -9- (7) 1308085 The reference height position of the lower end of the slit nozzle 5 can be determined. In the present embodiment, the distance measuring sensor 7 is used. In the middle, the measurement 测定 measured at the time of the determination is set to 0 #m ', and the calculation processing is performed in the slit nozzle lifting control unit. In this manner, the horizontal reference and the height reference (reference height position) of the slit nozzle 5 and the reference of the distance sensor are determined. This data is memorized in the slit nozzle lifting control unit. These actions are performed when the slotted nozzle is mounted. Then, after the substrate mounting portion 3 is carried in and the substrate W is placed, as shown in Fig. 5, the slit nozzle 5 is raised to the standby position. The standby position is arbitrary. For example, when the substrate W having a thickness of about 500 to 1000/im is applied, the surface of the substrate mounting portion 3, that is, the reference height position assumed to be 0 is 3000 to 5000/ The top of zm is better. Further, the distance between the standby position and the reference height position is also stored in the slit nozzle lifting control unit. Thereafter, as shown in Fig. 6, the slit nozzle 5 is moved in the horizontal direction along the rails 2, 2 so that the slit nozzle 5 is positioned above the application start point of the substrate W. At this timing, the distance from the upper surface of the substrate W (the surface of the substrate W) is measured by the distance measuring sensor 7. For example, when the height of the standby position is 3 5 00 // m, and the thickness of the substrate W is 700 #m, it is calculated to be 3500-700 = 2800 " m, but the thickness of the substrate W varies, but the substrate is received from the substrate. The influence of the reflection of W or the like is such that the measurement 値 is a number which is slightly more or less than 2800/zm. -10- (8) 1308085 Here is the correction of the data. That is, if the measured enthalpy is as 2790 // m, the number 値 2 7 6 0 vm of the predetermined coating start position (for example, 30 vm) is subtracted from the 値, as shown in Fig. 7, the slit is opened. The nozzle lift control unit is lowered by 2 7 60 m ' as a coating gap. In this manner, the setting of the coating gap which can be set to a different thickness can be set for each of the substrates W. The coating gap is determined by the above method, and the slit nozzle 5 is lowered to the coating gap position (until the purpose is At the application start position), the application of the substrate W is performed while maintaining the application gap. Here, the distance between the upper surface of the substrate and the lower end of the slit nozzle 5 (coating gap) is monitored by the distance measuring sensor 7 from the start to the end of the coating. Moreover, if the application gap changes beyond the allowable range, the IJ emits an alarm or lights up. Thereby, it is possible to know that the coating gap exceeds the allowable range and the fluctuation is known. According to the embodiment of the present invention, the substrate is placed in the substrate mounting portion, the substrate is placed, and the slit nozzle raised to the standby position is moved to the coating position, and the distance measuring device is used to measure the distance data up to the surface of the substrate. The distance data is fed back to the slit nozzle lifting control unit to calculate the coating gap, and the slit nozzle is lowered to the determined coating gap position, and the coating W is applied while the coating gap is maintained. Even if the coating is performed on the substrate W, the slit nozzle is not damaged or deformed, and the slit nozzle can be made horizontal, and the height of the slit nozzle can be easily adjusted. In the above-described embodiment, the slanting nozzle 5 is pressed downward by -11 - (9) 1308085, which is the horizontal reference and the height reference, and is adjusted upward, but is raised upward from a position lower than the reference point. It is also possible to sew the nozzle 5 to adjust. Further, the present invention is not limited to the above-described embodiments, and various other configurations can be obtained without departing from the gist of the invention. The coating apparatus and the coating method of the present invention are capable of easily applying a large substrate by a slit nozzle, and thus can be suitably used on a substrate such as a liquid crystal 'plasma display, a semiconductor element or the like. Various films are formed 'or formed for various films on a magnetic recording medium. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an embodiment of a coating apparatus according to the present invention. Fig. 2 is a side view showing a main part of the coating apparatus shown in Fig. 1. Fig. 3 is an arrow view in the direction A of Fig. 2; Fig. 4 is a plan view (1) showing an embodiment of the coating method of the present invention. Fig. 5 is a plan view (2) showing an embodiment of the coating method of the present invention. Fig. 6 is a plan view (3) showing an embodiment of the coating method of the present invention. Fig. 7 is a plan view (4) showing an embodiment of the coating method of the present invention. -12- (10) (10)1308085 [Description of main component symbols] 1 : Substrate 2 : Rail 3 : Substrate mounting section 4 : Gate type moving mechanism 5 : Slotting nozzle 6 : Reference tool 7 = Non-contact distance Measuring sensor 8: measuring length W: glass substrate
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