CN102839411A - Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry - Google Patents
Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry Download PDFInfo
- Publication number
- CN102839411A CN102839411A CN2012103444838A CN201210344483A CN102839411A CN 102839411 A CN102839411 A CN 102839411A CN 2012103444838 A CN2012103444838 A CN 2012103444838A CN 201210344483 A CN201210344483 A CN 201210344483A CN 102839411 A CN102839411 A CN 102839411A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- vertical line
- ultra
- wing plate
- electroplated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title abstract description 20
- 239000004020 conductor Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to an ultrathin sheet electroplating hanger for electroplating a vertical line in the PCB (Printed Circuit Board) industry, which is specifically used for fixing a PCB for electroplating and belongs to the technical field of electroplating. The ultrathin sheet electroplating hanger comprises fixed wing plates, movable wing plates and clasps, wherein a plurality of fixed wing plates are fixed on the back side of a frame respectively, and are provided with a plurality of through holes; the front side of the frame is rotationally connected with a plurality of movable wing plates respectively; the movable wing plates are provided with a plurality of through holes; the left and right sides of the frame are rotationally connected with a plurality of clasps respectively; a plurality of clasps on each side are distributed in sequence from top to bottom; and a fixed wing plate and a movable wing plate are clamped together by using each clasp. The ultrathin sheet electroplating hanger is simple, compact and reasonable in structure, can be applied to electroplating production of ultrathin soft plates and thick hard plates with flat plate surfaces simultaneously, contributes to increasing the capacity and economic efficiency and reducing the production cost, and is convenient and rapid for using; and due to the formation of the through holes, the impact force on the workpiece in an electroplating groove is lowered, and the flatness and stability of sheets are ensured.
Description
Technical field
The present invention relates to a kind of PCB industry vertical line and electroplate, specifically be used for fixing printed substrate and carry out galvanizedly, belong to the electroplating technology field with ultra-thin plate Electropolating hangers.
Background technology
Present electronic product is just towards compact trend development.Ultra-thin soft board in the printed substrate (Printed circuit board), the demand of Rigid Flex is increasing, along with the thickness of ultra-thin soft board more and more thinner (the thinnest arrived 25um).Electroplating is the one common operation in present PCB field, and when carrying out electroplating technology, pcb board can be fixed on the Electropolating hangers, and making current is electroplated.Electropolating hangers has played fixing and two effects of conducting, is the key part of electroplating technology.At present carry out ultra-thin soft board electro-coppering with vertical line electroplating device and Electropolating hangers, the ultra-thin soft board after be difficult to guarantee electroplating is smooth, has only to turn off waving of whole piece upright plating line to guarantee that ultra-thin soft board is smooth.But can not produce thicker hardboard simultaneously after turning off the waving of upright plating line, badly influence production capacity.Therefore, need a kind of better Electropolating hangers can produce ultra-thin soft board and thicker hardboard simultaneously, improve production capacity.
Summary of the invention
The objective of the invention is to overcome above-mentioned weak point, thereby provide a kind of PCB industry vertical line to electroplate, can be used for the Electroplating Production of ultra-thin soft board and thicker hardboard simultaneously, improved production capacity and economic benefit with ultra-thin plate Electropolating hangers.
According to technical scheme provided by the invention; A kind of PCB industry vertical line is electroplated and is comprised framework and copper conductor with ultra-thin plate Electropolating hangers; The framework both sides are respectively equipped with a copper conductor; It is characterized in that: also comprise fixedly wing plate, movable wing plate and clip, the fixing respectively a plurality of fixedly wing plates of said framework rear side, fixedly wing plate is provided with a plurality of through holes.Said framework front side a plurality of movable wing plates that are rotationally connected respectively, movable wing plate is provided with a plurality of through holes.The left and right sides of framework a plurality of clips that are rotationally connected respectively, a plurality of clips of every side distribute up and down successively.Fixedly wing plate and a movable wing plate holder are held in together said each clip with one.
Said framework comprises two mobile jibs and two poles, connects two poles between two mobile jibs, and mobile jib and pole are orthogonal.
Said two mobile jibs are parallel to each other.
Said two poles are parallel to each other.
Said mobile jib upper end is provided with hook.
Said fixedly wing plate adopts the PVC material.
Said movable wing plate adopts the PVC material.
Said fixedly wing plate has four.
Said movable wing plate has four.
Said clip has four.
Compared with present technology the present invention has the following advantages:
The present invention is simple, compact and reasonable for structure; Can be used for the Electroplating Production of ultra-thin soft board and thicker hardboard simultaneously, the plate face is smooth; Production capacity and economic benefit have been improved; Lower production cost; Easy to use, quick; Through hole has reduced the surging force that workpiece receives in coating bath, guaranteed the planarization and the stability of thin plate.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Description of reference numerals: 1-framework, 2-be wing plate, the movable wing plate of 3-, 4-clip, 5-copper conductor, 6-mobile jib, 7-pole, 8-hook fixedly.
Embodiment
Following the present invention will combine the embodiment in the accompanying drawing to further describe:
As shown in Figure 1, the present invention mainly comprises framework 1, fixedly wing plate 2, movable wing plate 3, clip 4 and copper conductor 5.
Framework 1 comprises two mobile jibs 6 and 6 settings parallel to each other of 7, two mobile jibs of two poles, and it is parallel to each other to connect 7, two poles 7 of two poles between two mobile jibs 6.Said mobile jib 6 is orthogonal with pole 7.Said mobile jib 6 upper ends are provided with hook 8.
Said framework 1 rear side is fixed four fixedly wing plates 2 respectively, and fixedly wing plate 2 is provided with a plurality of through holes, and through hole has reduced the surging force that workpiece receives in coating bath, guaranteed the planarization and the stability of thin plate.Said framework 1 front side four the movable wing plates 3 that are rotationally connected respectively, movable wing plate 3 is provided with a plurality of through holes.
The left and right sides of framework 1 two clips 4 that are rotationally connected respectively, two clips 4 of every side distribute up and down successively.Fixedly wing plate 2 and a movable wing plate 3 are clamped together said each clip 4 with one.
Said framework 1 both sides are respectively equipped with a copper conductor 5.
Said fixedly wing plate 2 adopts the PVC material with movable wing plate 3.
The present invention need galvanized workpiece be placed on four fixedly in the wing plate 2 in use, and rotation activity wing plate 3 is lived piece-holder, through stir clip 4 fixedly wing plate 2 fix with movable wing plate 3.Through link up with 8 hang over plating line fly carry out normal electroplating activity on the target.The present invention is simple, compact and reasonable for structure, can be used for the Electroplating Production of ultra-thin soft board and thicker hardboard simultaneously, and the plate face of production is smooth, has improved production capacity and economic benefit, lower production cost.It is easy to use, quick.
Claims (10)
1. a PCB industry vertical line is electroplated with ultra-thin plate Electropolating hangers; Comprise framework (1) and copper conductor (5); Framework (1) both sides are respectively equipped with a copper conductor (5); It is characterized in that: also comprise fixedly wing plate (2), movable wing plate (3) and clip (4), the fixing respectively a plurality of fixedly wing plates (2) of said framework (1) rear side, fixedly wing plate (2) is provided with a plurality of through holes; Said framework (1) the front side a plurality of movable wing plates (3) that are rotationally connected respectively, movable wing plate (3) is provided with a plurality of through holes; The left and right sides of framework (1) a plurality of clips (4) that are rotationally connected respectively, a plurality of clips (4) of every side distribute up and down successively; Fixedly wing plate (2) and a movable wing plate (3) are clamped together said each clip (4) with one.
2. a kind of PCB industry vertical line as claimed in claim 1 is electroplated with ultra-thin plate Electropolating hangers; It is characterized in that: said framework (1) comprises two mobile jibs (6) and two poles (7); Connect two poles (7) between two mobile jibs (6), mobile jib (6) and pole (7) are orthogonal.
3. a kind of PCB industry vertical line as claimed in claim 2 is electroplated with ultra-thin plate Electropolating hangers, and it is characterized in that: said two mobile jibs (6) are parallel to each other.
4. a kind of PCB industry vertical line as claimed in claim 2 is electroplated with ultra-thin plate Electropolating hangers, and it is characterized in that: said two poles (7) are parallel to each other.
5. a kind of PCB industry vertical line as claimed in claim 2 is electroplated with ultra-thin plate Electropolating hangers, it is characterized in that: said mobile jib (6) upper end is provided with hook (8).
6. a kind of PCB industry vertical line as claimed in claim 1 is electroplated with ultra-thin plate Electropolating hangers, it is characterized in that: said fixedly wing plate (2) adopts the PVC material.
7. a kind of PCB industry vertical line as claimed in claim 1 is electroplated with ultra-thin plate Electropolating hangers, it is characterized in that: said movable wing plate (3) adopts the PVC material.
8. a kind of PCB industry vertical line as claimed in claim 1 is electroplated with ultra-thin plate Electropolating hangers, and it is characterized in that: said fixedly wing plate (2) has four.
9. a kind of PCB industry vertical line as claimed in claim 1 is electroplated with ultra-thin plate Electropolating hangers, and it is characterized in that: said movable wing plate (3) has four.
10. a kind of PCB industry vertical line as claimed in claim 1 is electroplated with ultra-thin plate Electropolating hangers, and it is characterized in that: said clip (4) has four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103444838A CN102839411A (en) | 2012-09-17 | 2012-09-17 | Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103444838A CN102839411A (en) | 2012-09-17 | 2012-09-17 | Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102839411A true CN102839411A (en) | 2012-12-26 |
Family
ID=47367120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103444838A Pending CN102839411A (en) | 2012-09-17 | 2012-09-17 | Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102839411A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152976A (en) * | 2014-08-21 | 2014-11-19 | 宁波赛特信息科技发展有限公司 | Composite hanger for electroplating of flexible circuit board |
| CN104333977A (en) * | 2014-10-17 | 2015-02-04 | 中山市惠亚线路版有限公司 | Clamp for small circuit board passing across production line and production line passing method |
| CN107988625A (en) * | 2017-12-29 | 2018-05-04 | 合肥矽迈微电子科技有限公司 | A kind of new multiwindow PCB Electropolating hangers |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002054000A (en) * | 2000-08-02 | 2002-02-19 | Nitto Denko Corp | Electroplating method for substrate |
| JP2002161398A (en) * | 2000-11-22 | 2002-06-04 | Puraimu:Kk | Substrate holder with shielding plate |
| CN2670382Y (en) * | 2003-11-04 | 2005-01-12 | 黄志铭 | Thin plate electroplating hanger |
| CN1847465A (en) * | 2005-04-14 | 2006-10-18 | 日本梅克特隆株式会社 | Plating method for printing circuit board |
| CN201686762U (en) * | 2010-02-03 | 2010-12-29 | 深南电路有限公司 | PCB electroplated auxiliary clamp and combination of PCB and same |
| CN102560609A (en) * | 2010-12-24 | 2012-07-11 | 北大方正集团有限公司 | Electroplating hanging tool and manufacturing method thereof |
| CN202830210U (en) * | 2012-09-17 | 2013-03-27 | 高德（无锡）电子有限公司 | Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry |
-
2012
- 2012-09-17 CN CN2012103444838A patent/CN102839411A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002054000A (en) * | 2000-08-02 | 2002-02-19 | Nitto Denko Corp | Electroplating method for substrate |
| JP2002161398A (en) * | 2000-11-22 | 2002-06-04 | Puraimu:Kk | Substrate holder with shielding plate |
| CN2670382Y (en) * | 2003-11-04 | 2005-01-12 | 黄志铭 | Thin plate electroplating hanger |
| CN1847465A (en) * | 2005-04-14 | 2006-10-18 | 日本梅克特隆株式会社 | Plating method for printing circuit board |
| CN201686762U (en) * | 2010-02-03 | 2010-12-29 | 深南电路有限公司 | PCB electroplated auxiliary clamp and combination of PCB and same |
| CN102560609A (en) * | 2010-12-24 | 2012-07-11 | 北大方正集团有限公司 | Electroplating hanging tool and manufacturing method thereof |
| CN202830210U (en) * | 2012-09-17 | 2013-03-27 | 高德（无锡）电子有限公司 | Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152976A (en) * | 2014-08-21 | 2014-11-19 | 宁波赛特信息科技发展有限公司 | Composite hanger for electroplating of flexible circuit board |
| CN104152976B (en) * | 2014-08-21 | 2017-02-08 | 慈溪中浩投资咨询有限公司 | Composite hanger for electroplating of flexible circuit board |
| CN104333977A (en) * | 2014-10-17 | 2015-02-04 | 中山市惠亚线路版有限公司 | Clamp for small circuit board passing across production line and production line passing method |
| CN104333977B (en) * | 2014-10-17 | 2018-07-13 | 皆利士多层线路版(中山)有限公司 | A kind of small size wiring board crosses production line fixture and crosses product line method |
| CN107988625A (en) * | 2017-12-29 | 2018-05-04 | 合肥矽迈微电子科技有限公司 | A kind of new multiwindow PCB Electropolating hangers |
| CN107988625B (en) * | 2017-12-29 | 2024-07-23 | 合肥矽迈微电子科技有限公司 | Novel multi-window PCB electroplating hanger |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205347614U (en) | Electricity plate wire PCB sheet metal is electroplated and is assisted utensil | |
| CN102839411A (en) | Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry | |
| CN202671691U (en) | Thin plate electroplating splint clamp | |
| CN202830210U (en) | Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry | |
| CN102383169B (en) | Auxiliary slat for vertical electroplating line and method for vertical electroplating PCB board | |
| CN201901717U (en) | Electroplating copper hanger of double-surface flexible circuit board | |
| CN203846132U (en) | Circuit board fixture for electroplating | |
| CN201933182U (en) | Novel clamp capable of improving efficiency for electroplating printed circuit board | |
| CN105297096B (en) | A kind of electroplanting device and electro-plating method of two-sided electro-deposition xenogenesis coating | |
| CN203613296U (en) | Electroplating device and auxiliary strake thereof for PCB (printed circuit board) | |
| CN201598342U (en) | Circuit board plating hanger | |
| CN204455338U (en) | For the electroplating clamp of printed circuit board (PCB) | |
| CN202730284U (en) | Printed circuit board hanger for electroplating | |
| CN206553645U (en) | A kind of PCB Electropolating hangers | |
| CN205152363U (en) | Electroplating device of two -sided electro -deposition xenogenesis cladding material | |
| CN109913934A (en) | A kind of Electroplating Rack that can carry out two one-side electroplatings simultaneously | |
| CN204251743U (en) | The sub-basket of a kind of thin PCB | |
| CN210001955U (en) | electroplating racks capable of simultaneously electroplating two single sides | |
| CN202658254U (en) | Cathode auxiliary device for vertical plating line | |
| CN202482472U (en) | Electroplating suspending rack for flexible circuit board | |
| CN200955075Y (en) | Shallow-tank hange of printed circuit board | |
| CN209731729U (en) | A kind of FPC plate hanger for copper electroplating | |
| CN204039538U (en) | The composite electroplated hanger of a kind of flex circuit application | |
| CN207016872U (en) | A kind of noble metal continuously plates parcel plating device | |
| CN202558954U (en) | High height plate electroplating manual hanging tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121226 |