1305605 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種用於強化組件間的平行度之小型 取像模組封裝結構，尤指一種能強化一鏡頭模組與一感測 晶片之表面的平行度，並防止該感測晶片之感測區受到雜 散光影響之小型取像模組封裝結構。 【先前技術】 按，提供人們對美好時光加以紀念的方式有許多，而 其中使用頻率最高的實屬相#，因為不論是旅行、聚會、 甚至是一切值得紀念的時刻，都可藉由相機加以記錄，以 供使用者日後之回憶。再者，基於數位相機（digital camera)在使用上具有自行將所攝得之影像資料傳輸至電 子設備（例如電腦）中做修改處理之便利性，再加上其價 格漸降，所以使用數位相機者日漸增多。 ^ 5青參閱第一圖及第二圖所示，其分別為習知小型取像 核組封裝結構之第-貫施例及第二實施例之組合示意圖。 由圖中可知，_之小奸像模組封裝結構係包括：一底 座1 a、—感測晶片2 a及一鏡頭裝置3 a。其中，該感1305605 IX. Description of the Invention: [Technical Field] The present invention relates to a small image capturing module package structure for enhancing parallelism between components, and more particularly to a lens module and a sensing chip The parallelism of the surface and the small image capture module package structure that prevents the sensing area of the sensing wafer from being affected by stray light. [Previous Technology] There are many ways to commemorate good times, and the most frequently used ones are used, because travel, gatherings, and even all memorable moments can be taken by camera. Record for the user's future memories. Moreover, the digital camera uses a digital camera to transmit the captured image data to an electronic device (such as a computer) for modification, and the price is gradually reduced. The number is increasing. ^5青 Refer to the first figure and the second figure, which are respectively a schematic diagram of a combination of the first embodiment and the second embodiment of the conventional small image core package structure. As can be seen from the figure, the image module package structure includes a base 1 a, a sensing wafer 2 a and a lens device 3 a. Among them, the feeling
且該鏡頭裝置3 a係設置於該底座 片 2 a。 ~ (如第一圖所示）或金屬導 電性連接於該底座1 a。此外， 錢1頭模組3 〇 a及一與該鏡頭模 又4 (lens holder) 3 1 a，並 底座1a上並蓋合該感測晶 7 1305605 惟，當該鏡頭裝置3 a蓋合於該感測晶片2 a時，由 於該鏡頭裝置3 a之鏡頭支架3 1 a與該底座1 a之間、 或該感測晶片2 a與該底座1 a之間容易因組裝而產生傾 斜問題’進而導致該鏡頭模組3 〇 a與該感測晶片2 a之 表面發生平行度不佳的情況，而影響到當該鏡頭模組3 〇 a傳送影像到該感測晶片2a時之影像品質；再者，習知需 要使用高精度的設備將該鏡頭裝置3 a組裝於該底座1 a ’因此造成設備成本的增加。 再者’請參第三圖所示，其係為習知小型取像模組封 裝結構之感測晶片受到雜散光影響之示意圖。由圖中可 知，傳統之小型取像模組封裝結構係將一玻璃元件6 a直 接放置於一用於封裝該感測晶片2 a之封裝殼體7 a的上 方’因此當穿透該鏡頭模組3 〇 a的入射光1 〇 〇 a及從 δ玄鏡頭模組3 〇 a之鏡筒内壁3 〇 〇 a所反射出之反射光 2 0 0 a投向該等金屬導線5 a時容易產生雜散光，進而 影響該感測晶片2a之感光區20a的影像感測品質，並 降低該感光區2 0 a對影像之對比效果。 是以，由上可知，目前習知所揭露之小型取像模組封 ^結構尚有「該鏡頭模組3 Q a與該感測晶片2 a之表面 f生平行度不佳」、「需要使用高精度的設備」及「由該雜 =光對該感測晶片2 a之感光區2 0 a所造成之不良影 喜」之缺點，顯然具有不便與缺失存在，而待加以改善者。 緣疋，本發明人有感上述缺失之可改善，且依據多年 來從事此方面之相關經驗’悉心觀察且研究之，並配合學 1305605 理之運用，而提出一種設計合理且有效改善上述缺失之本 發明。 【發明内容】 本發明所要解決的技術問題，在於提供一種用於強化 組件間的平行度之小型取像模組封裝結構，其係以特殊之 凸點設計，而增加一鏡頭模組與一感測晶片之表面的平行 度及穩定性。再者，藉由卡荀之設計，可精準地以人工方 式進行該鏡頭模組之組裝。因此本發明係具有下例優點： 1、 避免鏡頭模組與感測晶片之表面傾斜的問題，進 而提升影像品質。 2、 避免組件封裝時之膠材溢出非封裝區域，而影響 後續模組組裝製程。 3、 不需使用昂貴的精密設備來組裝鏡頭模組，因此 能降低自動化設備之投資成本。 4、 藉由遮蔽凸緣的設計，可防止由鏡頭模組所產生 之入射光及反射光投向金屬導線而對感光晶片之感光區所 造成的影響。 為了解決上述技術問題，根據本發明之其中一種方 案，提供一種用於強化組件間的平行度之小型取像模組封 裝結構，其包括：一基座、一感測晶片、一承載殼體、一 玻璃元件及一鏡頭模組。其中，該感測晶片係設置於該基 座上，並與該基座產生電性連接；該承載殼體係設置於該 基座上，並且該承載殼體係具有複數個與該感測晶片接觸 之第一凸部、一容置槽、及複數個設置於容置槽之第二凸 1305605 部，其中該承載殼體更進一步包括一用於曝露該感測晶片 之感光區及用於遮蔽非直接由該鏡頭模組投向該感光區的 入射光之遮蔽凸緣；該玻璃元件係容置於該容置槽内，並 與該等第二凸部接觸；以及，該鏡頭模組係設置於該承載 殼體上。 為了能更進一步暸解本發明為達成預定目的所採取之 技術、手段及功效，請參閱以下有關本發明之詳細說明與 附圖，相信本發明之目的、特徵與特點，當可由此得一深 入且具體之暸解，然而所附圖式僅提供參考與說明用，並 非用來對本發明加以限制者。 【實施方式】 請參閱第三圖及第四圖所示，其分別為本發明用於強 化組件間的平行度之小型取像模組封裝結構之分解示意圖 及組合示意圖。由圖中可知，本發明之用於強化組件間的 平行度之小型取像模組封裝結構係包括：一基座1、一感 測晶片2、一承載殼體3、一玻璃元件4及一鏡頭模組5。 其中，該感測晶片2係以電性連接的方式設置於該基 座1上，例如：該感測晶片2可透過複數個導電元件（錫 球4 a或金屬導線5 a )以與該基座1產生電性連接。該 基座1係具有複數個定位孔1 0，並且該承載殼體3係具 有複數個與該定位孔1 0相對應之定位銷3 0，並且透過 該等定位孔1 〇與該等定位銷3 0的配合，以使得該承載 殼體3設置於該基座1上。此外，在組裝該基座1與該承 載殼體3時，可填充一黏著劑6於該基座1與該承載殼體 10 1305605And the lens device 3a is disposed on the base piece 2a. ~ (as shown in the first figure) or metal is electrically connected to the base 1 a. In addition, the lens module 3 〇a and one and the lens mold 4 (lens holder) 3 1 a, and the base 1a and covers the sensing crystal 7 1305605, only when the lens device 3 a is covered When the wafer 2a is sensed, the tilting problem between the lens holder 3 1 a of the lens device 3 a and the base 1 a or between the sensing wafer 2 a and the base 1 a is easily caused by assembly. The lens module 3 〇a and the surface of the sensing chip 2 a are not parallel to each other, and affect the image quality when the lens module 3 〇 a transmits images to the sensing chip 2 a; Furthermore, it is conventionally required to assemble the lens device 3a to the base 1a using high-precision equipment, thus causing an increase in equipment cost. Furthermore, please refer to the third figure, which is a schematic diagram of the sensing wafer of the conventional small image capturing module package structure being affected by stray light. As can be seen from the figure, the conventional small image capturing module package structure directly places a glass element 6a on a package housing 7a for packaging the sensing wafer 2a. Therefore, when the lens module is penetrated The incident light 1 〇〇a of the group 3 〇a and the reflected light reflected by the inner wall 3 〇〇a of the lens barrel 3 〇〇a of the δ 玄 lens module 3 〇a are easily generated when the metal wires 5 a are projected. The astigmatism, in turn, affects the image sensing quality of the photosensitive region 20a of the sensing wafer 2a, and reduces the contrast effect of the photosensitive region 20a on the image. Therefore, it can be seen from the above that the structure of the small image capturing module disclosed in the prior art has "the lens module 3 Q a has poor parallelism with the surface of the sensing chip 2 a", The disadvantages of using a high-precision device and the "adverse shadow caused by the photosensitive region 20 a of the sensing wafer 2 a" are obviously inconvenient and missing, and are to be improved. However, the inventor felt that the above-mentioned deficiencies could be improved, and based on years of relevant experience in this field, 'scientific observation and research, and in conjunction with the use of the school 1305605, proposed a reasonable design and effectively improved the above-mentioned defects. this invention. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is to provide a small image capturing module package structure for enhancing the parallelism between components, which is designed with a special bump to increase a lens module and a sense. The parallelism and stability of the surface of the wafer are measured. Furthermore, with the design of the cassette, the assembly of the lens module can be performed manually and accurately. Therefore, the present invention has the following advantages: 1. The problem of tilting the surface of the lens module and the sensing chip is avoided, thereby improving image quality. 2. Avoid the overflow of the non-packaged area when the component is packaged, which affects the subsequent module assembly process. 3. It is not necessary to use expensive precision equipment to assemble the lens module, thus reducing the investment cost of the automation equipment. 4. By designing the shielding flange, the influence of the incident light and the reflected light generated by the lens module on the photosensitive area of the photosensitive wafer can be prevented. In order to solve the above problems, according to one aspect of the present invention, a small image capturing module package structure for reinforcing the parallelism between components includes: a base, a sensing wafer, a bearing housing, A glass component and a lens module. The sensing chip is disposed on the base and electrically connected to the base; the carrier is disposed on the base, and the carrier has a plurality of contacts with the sensing wafer a first protrusion, a receiving groove, and a plurality of second protrusions 1306506 disposed in the receiving groove, wherein the carrying case further comprises a photosensitive area for exposing the sensing chip and is used for shielding indirect a shielding flange of the incident light that is directed to the photosensitive region by the lens module; the glass component is received in the receiving groove and is in contact with the second convex portions; and the lens module is disposed on the lens module On the carrying case. In order to further understand the technology, the means and the effect of the present invention in order to achieve the intended purpose, refer to the following detailed description of the invention and the accompanying drawings. The detailed description is to be understood as illustrative and not restrictive. [Embodiment] Please refer to the third and fourth figures, which are respectively an exploded schematic view and a combined schematic diagram of a small image capturing module package structure for enhancing the parallelism between components. As can be seen from the figure, the small image capturing module package structure for reinforcing the parallelism between components of the present invention comprises: a base 1, a sensing wafer 2, a carrying case 3, a glass component 4 and a Lens module 5. The sensing wafer 2 is electrically connected to the susceptor 1. For example, the sensing wafer 2 can pass through a plurality of conductive elements (the solder balls 4 a or the metal wires 5 a ) to Seat 1 produces an electrical connection. The base 1 has a plurality of positioning holes 10, and the carrier housing 3 has a plurality of positioning pins 30 corresponding to the positioning holes 10, and through the positioning holes 1 and the positioning pins The cooperation of 30 is such that the carrier housing 3 is disposed on the base 1. In addition, when the base 1 and the carrier housing 3 are assembled, an adhesive 6 can be filled on the base 1 and the carrier housing 10 1305605
3之間的間隙g中D 再者，該承載殼體3係設置於該基座1上，並且該承 載殼體3係具有複數個與該感測晶片2接觸之第一凸部3 1、一容置槽3 2、及複數個設置於容置槽3 2之第二凸 部3 3。此外，該感測晶片2之上表面2 〇係具有一第一 水平線2 1，該承載殼體3係具有一與該鏡頭模組$之下 表面5 0接觸之第二水平線3 4，藉由該等第一凸部3工 • 與該感測晶片2的接觸，以使得該第一水平線2丄與該第 =水平線3 4相互平行（亦即使得該感測晶片2與該承载 ' 设體3產生相互平行）。並且，該承載殼體3更進一步包括 -用於遮蔽該等金屬導線5a (亦可為：用於遮蔽非直接 由該鏡頭模組5投向該感光區20的入射光）及用於曝露 該感測晶片2之感光區2 〇 a之遮蔽凸緣3 5，用以防止 從該鏡頭模組5所產生之入射光10 0 a及反射光2 〇 〇 二投向該等導電元件（錫球“或金屬導線5 a )，進而使 # #該制晶片2可在不受《光影響的情況下，而能發揮 該感測晶片2最佳之感測效果。 上外，該破璃元件4係容置於該容置槽3 2内，並與 „亥專第一凸邠3 3接觸，其中該玻璃元件4係可為素 (toe)玻璃、防紅外線（IR)玻璃、防反射（ar)玻璃 或監色（blue)破璃。再者，該玻璃元件4係具有一第三 水平線40，藉由該玻璃元件4與該等第二凸部3 3的接 觸，以使得該第二水平線3 4與該第三水平線40相互平 行（亦即使得該破璃元件4與該承载殼體3產生相互平 11 1305605 行）。並且，可填充一膠材7於該玻璃元件4下表面與該承 載殼體3之間的空隙G中，以強化該玻璃元件4於該承載 殼體3之容置槽3 2内的固持力。 此外，該鏡頭模組5係可以鑲嵌（mount)或任何卡合 的方式設置於該承載殼體3上，以達到使用人工方式即可 完成該鏡頭模組5與該承載殼體3之間的組裝。 再者，該承載殼體3更進一步包括：複數個與該底座 1相鄰之第一切邊3 6及複數個與該鏡頭模組5相鄰之第 二切邊3 7，並且該鏡頭模組5更進一步包括：複數個與 該承載殼體3相鄰之第三切邊5 1。然而，該等切邊之設 置位置並非用於限定本發明，凡可用於容納多餘膠材之切 邊設計，皆為本發明所保護之範疇。 綜上所述，本發明以特殊之凸點設計，而增加該鏡頭 模組5與該感測晶片2之表面的平行度及穩定性。再者， 猎由卡筍之設計5本發明不需要使用昂貴的精密設備’而 可精準地以人工方式進行該鏡頭模組5之組裝，因此能降 低自動化設備之投資成本。 惟，以上所述，僅為本發明最佳之一的具體實施例之 詳細說明與圖式，惟本發明之特徵並不侷限於此，並非用 以限制本發明，本發明之所有範圍應以下述之申請專利範 圍為準，凡合於本發明申請專利範圍之精神與其類似變化 之實施例，皆應包含於本發明之範疇中，任何熟悉該項技 藝者在本發明之領域内，可輕易思及之變化或修飾皆可涵 蓋在以下本案之專利範圍。 12 【圖式簡單說明】 乐—圖係為習知小型取像触 合示意圖； Wq構之第一實施例之組In the gap g between the three, the carrier shell 3 is disposed on the base 1 , and the carrier shell 3 has a plurality of first protrusions 3 1 in contact with the sensing wafer 2 , A receiving groove 3 2 and a plurality of second convex portions 33 are disposed in the receiving groove 32. In addition, the upper surface 2 of the sensing wafer 2 has a first horizontal line 2 1, and the carrying case 3 has a second horizontal line 34 in contact with the lower surface 50 of the lens module $. The first protrusions 3 are in contact with the sensing wafer 2 such that the first horizontal line 2 is parallel to the first horizontal line 34 (that is, the sensing wafer 2 and the carrier ' 3 are produced parallel to each other). Moreover, the carrying case 3 further includes - for shielding the metal wires 5a (may also be used for shielding incident light that is not directly incident on the photosensitive region 20 by the lens module 5) and for exposing the sense The shielding flange 3 5 of the photosensitive region 2 〇a of the wafer 2 is used to prevent the incident light 10 0 a and the reflected light 2 generated from the lens module 5 from being cast to the conductive elements (the solder ball "or The metal wire 5 a ), in turn, enables the wafer 2 to exhibit the best sensing effect of the sensing wafer 2 without being affected by light. Placed in the accommodating groove 3 2 and in contact with the first spurs 3 3 , wherein the glass element 4 can be a toe glass, an infrared (IR) glass, an anti-reflective (ar) glass. Or monitor color (blue) broken glass. Furthermore, the glass element 4 has a third horizontal line 40, and the glass element 4 is in contact with the second convex portions 33 such that the second horizontal line 34 and the third horizontal line 40 are parallel to each other ( That is, the glass frit 4 and the carrying case 3 are mutually flat 11 1305605). Moreover, a glue 7 can be filled in the gap G between the lower surface of the glass member 4 and the carrier housing 3 to strengthen the holding force of the glass member 4 in the receiving groove 3 2 of the carrier housing 3. . In addition, the lens module 5 can be mounted on the carrying case 3 in a manner of mounting or any engaging manner, so that the manual connection between the lens module 5 and the carrying case 3 can be completed. Assembly. Furthermore, the carrying case 3 further includes: a plurality of first trimming edges 36 adjacent to the base 1 and a plurality of second trimming edges 3 7 adjacent to the lens module 5, and the lens module The group 5 further includes a plurality of third trimming edges 51 adjacent to the carrier housing 3. However, the position of the trimming is not intended to limit the invention, and any trimming design that can be used to accommodate excess glue is within the scope of the present invention. In summary, the present invention increases the parallelism and stability of the lens module 5 and the surface of the sensing wafer 2 by a special bump design. Furthermore, the design of the hunting bamboo shoot 5 does not require the use of expensive precision equipment, and the assembly of the lens module 5 can be performed manually and accurately, thereby reducing the investment cost of the automation equipment. However, the above description is only a detailed description of the preferred embodiments of the present invention, and the present invention is not limited thereto, and is not intended to limit the present invention. The scope of the patent application is subject to the scope of the present invention, and any one skilled in the art can easily include it in the field of the present invention. Any changes or modifications considered may be covered by the patents in this case below. 12 [Simple description of the diagram] The music-picture system is a schematic diagram of a conventional small image capture; the group of the first embodiment of the Wq structure
第三H 弟—圖=為習知小型取像模組封t結構之第二實施例之組 合不意圖； 習知小型取像模組封裝結構之感測晶片受到雜 散光影響之示意圖；The third embodiment is a schematic diagram of the second embodiment of the conventional small image capturing module package t structure; a schematic diagram of the sensing chip of the conventional small image capturing module package structure being affected by stray light;
第夕、 四圖係為本發明用於強化組件間的平行度之小型取像模 第五· ’且封裝結構之分解示意圖；以及 乐五圖係為本發明用於強化組件間的平行度之小型取像模 組封裝結構之組合示意圖。 [主要元件符號說明】 [習知]The fourth and fourth figures are the schematic diagram of the fifth image of the small image capturing module for enhancing the parallelism between the components of the present invention and the package structure; and the Le V diagram is used for enhancing the parallelism between the components. A schematic diagram of the combination of the small image capture module package structure. [Main component symbol description] [Practical]
丄a 2 a 感光區 2 0 a 3 a 鏡頭模組 3 0 a 鏡筒内壁 3 0 〇 a 鏡頭支架 3 1a 底座 感須彳晶片 鏡碩裝置 踢球 金屬導線 坡^离元件 封巢殼體 入射光 反射光 4 a 5 a 6 a 7 a 1 0 0 a 2 0 〇 a 13 1305605 [本發明] 基座 感測晶片 承載殼體 12 玻璃元件 鏡頭模組 黏著劑 膠材 間隙 空隙 4 定位孔 10 上表面 20 第一水平線 21 定位銷 3 0 第一凸部 31 容置槽 3 2 第二凸部 33 第二水平線 34 遮蔽凸緣 35 第一切邊 36 第二切邊 3 7 第三水平線 40 下表面 5〇 第三切邊 51丄a 2 a Photosensitive area 2 0 a 3 a Lens module 3 0 a Inner wall of the lens barrel 3 0 〇a Lens holder 3 1a Base sensation 彳 镜 镜 镜 硕 硕 踢 踢 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 元件Reflected light 4 a 5 a 6 a 7 a 1 0 0 a 2 0 〇a 13 1305605 [The present invention] susceptor sensing wafer carrying case 12 glass element lens module adhesive agent gap gap 4 positioning hole 10 upper surface 20 first horizontal line 21 locating pin 3 0 first convex portion 31 accommodating groove 3 2 second convex portion 33 second horizontal line 34 shielding flange 35 first side 36 second trimming edge 3 7 third horizontal line 40 lower surface 5 〇 third trim 51
6 7 g G6 7 g G