TWI471680B - Methof of adjusting degree of parallel and image capturing apparatus - Google Patents

Description

Method for adjusting parallelism and image capturing device

The present invention relates to a method and an optical device for adjusting parallelism, and more particularly to a method and image capturing device for adjusting the parallelism between an image capturing component and a lens module.

With the continuous improvement and low cost of image sensing components and micro-storage media, the consumer market for digital cameras and video equipment has also expanded rapidly, and at the same time, it has driven the purchase of high-priced monocular cameras and high-end video equipment.

In the assembly process of a conventional camera or video equipment, the lens module is a light-transmissive protective plate that bears against the image capturing element. However, the transparent protective plate is not necessarily completely parallel to the working surface of the image capturing component, so when the lens module is supported by the transparent protective plate, the optical plane of the lens module is not easily completed with the working surface of the image capturing component. parallel. This assembly variation can result in poor image quality captured or recorded by conventional cameras or video equipment.

In view of this, the present invention provides a method of adjusting parallelism, which can improve the parallelism between the image capturing component and the lens module.

The present invention provides an image capture device that captures or records high quality images.

An embodiment of the present invention provides a method for adjusting parallelism for adjusting an image capturing component of an image capturing device and a lens of an image capturing device Parallelism between modules. The lens module has an optical axis and an optical plane perpendicular to the optical axis. The method for adjusting the parallelism includes the following steps: providing a motherboard of the image capturing device, the motherboard has an image capturing component; providing a reference plane; making the reference plane parallel to the image capturing component; and assembling the lens module on the reference plane to make the lens The optical plane of the module is parallel to the image capture element. The step of providing a reference plane is to provide a reference component having a reference plane, and the method for adjusting the parallelism further comprises: fixing a reference plane of the motherboard with the image capturing component to the reference component, so that the image capturing component and the image capturing component The reference plane remains parallel.

An embodiment of the present invention provides a method for adjusting the parallelism, which is used to adjust the parallelism between an image capturing component of an image capturing device and a lens module of an image capturing device, and the lens module has a An optical axis and an optical plane perpendicular to the optical axis. The method for adjusting the parallelism comprises: providing a main board of the image capturing device, the main board having an image capturing component; providing a reference plane; making the reference plane parallel to the image capturing component; and assembling the lens module on the reference plane so that the lens module is assembled The optical plane of the lens module is parallel to the image capturing element. The step of providing a reference plane includes: providing a reference component having a pre-reference plane; making the pre-reference plane parallel to the image capturing component; filling a hardenable glue between the main board and the pre-reference plane; and curing hardenable Glue, such that the hardenable glue has a reference plane that is parallel to the pre-reference plane.

The invention provides an image capturing device, which comprises a main board, a reference component and a lens module. The motherboard has an image capture component. The reference element has a reference plane. The reference plane is parallel to the image capture element. The lens module is assembled Reference frame on the reference plane. The main board has a substrate and an image capturing component disposed on the substrate, and the substrate is located between the reference plane of the reference component and the image capturing component.

An embodiment of the present invention provides an image capture device including a motherboard, a reference component, and a lens module. The motherboard has an image capture component. The reference element has a reference plane and the reference plane is parallel to the image capture element. The lens module is assembled on a reference plane of the reference component, wherein the motherboard has a substrate and an image capturing component disposed on the substrate, and a reference plane of the reference component is located between the substrate and the lens module.

In one embodiment of the invention, the method of securing the motherboard having the image capturing component to the reference plane of the reference component comprises the steps of: filling the hardenable glue between the reference plane of the reference component and the motherboard. The hardenable glue is cured such that the reference plane of the reference element remains parallel to the image capture element.

In an embodiment of the invention, the method for assembling the lens module on the reference plane comprises the steps of: supporting the lens module on a reference plane of the reference component such that the optical plane and the reference plane of the lens module Parallel; the relative position of the fixed lens module to the reference component.

In an embodiment of the invention, the method of adjusting parallelism further comprises the step of removing the reference component from the hardenable glue after curing the hardenable glue to expose the reference plane of the hardenable glue.

In an embodiment of the invention, the method for assembling the lens module on the reference plane comprises the steps of: supporting the lens module against the reference plane of the hardenable glue to make the optical plane of the lens module Reference plane Line; the relative position of the fixed lens module to the reference plane.

In an embodiment of the invention, the image capturing device further includes a hardenable glue that connects the reference plane of the reference component with the substrate.

In an embodiment of the invention, the lens module is fixed to a reference plane of the reference component.

In an embodiment of the invention, the lens module includes a support frame and a lens. The support frame has a contact plane. The contact plane is fixed to the reference plane of the reference component. The lens is connected to the support frame. The lens has an optical axis and an optical plane perpendicular to the optical axis. The optical plane is parallel to the pupil plane.

In an embodiment of the invention, the reference element further has a first surface opposite the reference plane. The first surface of the reference component is adhered to the substrate. The lens module bears against the reference plane of the reference component and does not adhere to the reference plane of the reference component.

In an embodiment of the invention, the lens module is fixed to the substrate.

In an embodiment of the invention, the lens module includes a support frame and a lens. The support frame has a contact plane. The contact plane abuts against the reference plane of the reference element. The lens is connected to the support frame. The lens has an optical axis and an optical plane perpendicular to the optical axis. The optical plane is parallel to the pupil plane.

In an embodiment of the invention, the reference element is a hardened hardenable glue.

Based on the above, in the method for adjusting the parallelism according to an embodiment of the present invention, the working surface of the image capturing component is parallel to the reference plane, and then the optical plane of the lens module is parallel to the reference plane, thereby improving image capturing. The parallelism between the component and the lens module. Since the parallelism between the image capturing component and the lens module is improved, the image quality of the imaging device at the peripheral position and the intermediate position of the working surface of the image capturing component can be relatively uniform, thereby causing the image capturing device to capture or record the image. The effect is good.

The above described features and advantages of the present invention will be more apparent from the following description.

First embodiment Method of adjusting parallelism

The method for adjusting the parallelism of the embodiment is for adjusting the parallelism between the image capturing component of the image capturing device and the lens module of the image capturing device. Furthermore, the method for adjusting the parallelism of the embodiment is for adjusting the parallelism between the active surface of the image capturing component and the optical plane of the lens module, wherein the lens module has an optical axis. The optical plane of the lens module refers to a plane perpendicular to the optical axis. In the present embodiment, the image capturing device refers to a device that can capture or record an image, such as a camera or a camera. An image capture component is a component that can receive an optical image to generate an electrical signal or a chemical reaction, such as a charge coupled device (CCD) component, a complementary metal-oxide semiconductor (CMOS) component, or Traditional negatives.

By increasing the parallelism between the image capturing component working surface and the optical plane of the lens module (ie, enabling the image capturing component working surface and the lens module light) The learning planes are parallel to each other, so that the image quality at the peripheral position of the image capturing component working surface and the intermediate position are consistent, thereby improving the effect of the image capturing device on capturing or recording images. The method of adjusting the parallelism of this embodiment will be described in detail below with reference to Figs. 1A to 1C.

1A to 1C are schematic flowcharts of a method for adjusting parallelism according to a first embodiment of the present invention. Referring to FIG. 1A, first, a main board 110 having an image capturing element 112 and a reference plane 120a are provided. Image capture component 112 has a working surface 112a. The main board 110 of the embodiment further has a substrate 114 electrically connected to the image capturing element 112 and a transparent protective sheet 116 covering the image capturing element 112. In the present embodiment, reference plane 120a may be provided using reference element 120 having a reference plane 120a. Reference element 120 refers to an element having at least one plane and being rigid, such as an iron piece, but the invention is not limited thereto.

With continued reference to FIG. 1A, the reference plane 120a is then placed in parallel with the image capturing element 112. Further, the reference plane 120a is substantially parallel to the working surface 112a of the image capturing element 112. In this embodiment, the parallelism between the reference plane 120a and the image capturing component 112 can be adjusted to the specification by using a flatness adjusting device (not shown), that is, the acute angle between the reference plane 120a and the working surface 112a is 0 degree.

Referring to FIG. 1B, next, in a case where the reference plane 120a is substantially parallel to the image capturing component 112, the motherboard 110 having the image capturing component 112 is fixed to the reference plane 120a of the reference component 120 to cause the image to collapse. The component 112 can be kept parallel to the reference plane 120a. In detail, in this embodiment, the reference plane 120a and the motherboard 110 (the substrate 114) may be first. The hardenable glue 130 is filled between. The reference plane 120a is then substantially parallel to the image capture element 112 without the hardenable glue 130 being cured. Next, with the reference plane 120a substantially parallel to the image capture element 112, the hardenable glue 130 is cured such that the reference plane 120a and the image capture element 112 can remain parallel. The hardener 130 of the present embodiment is, for example, a light-curing adhesive or a heat-curing adhesive, but the invention is not limited thereto.

It should be noted that after the above steps are completed, the reference plane 120a is substantially parallel to the working surface 112a of the image capturing component 112, so that other components (such as the lens module) are to be parallel to the working surface 112a of the image capturing component 112. This can be achieved by bearing the other components against the reference plane 120a.

Referring to FIG. 1C, the lens module 140 is assembled on the reference plane 120a such that the optical plane 140a of the lens module 140 is parallel to the image capturing component 112. The lens module 140 of the embodiment includes a Holder 142 and a lens 144 connected to the support frame 142. The support frame 142 has a contact plane 142a. The contact plane 142a is substantially parallel to the optical plane 140a of the lens module 140. In the embodiment, the method for assembling the lens module 140 on the reference plane 120a to make the optical plane 140a parallel to the image capturing component 112 includes the following steps: First, the support frame 142 of the lens module 140 can be made. The meandering contact surface 142a bears against the reference plane 120a of the reference component 120 such that the optical plane 140a of the lens module 140 is parallel to the reference plane 120a. Next, the relative position of the lens module 140 and the reference element 120 is fixed. For example, the lens module 140 can be locked with the reference component 120 by using the lock firmware 150, and the fixed lens module 140 can be fixed. The relative position to the reference element 120.

It should be noted that, before the step shown in FIG. 1C is performed, since the reference plane 120a has been parallel to the working surface 112a of the image capturing element 112, the contact plane 142a parallel to the optical plane 140a bears against the reference plane 120a. In the upper case, the optical plane 140a of the lens module 140 is also parallel to the working surface 112a of the image capturing element 112. Then, the optical plane 140a of the lens module 140 and the working surface 112a of the image capturing component 112 are kept parallel by the relative position of the fixed contact plane 142a and the reference plane 120a, so as to enhance the image capturing device to capture or record the image. The purpose of the effect.

Image capture device

1C is a cross-sectional view of an image capturing device according to a first embodiment of the present invention. 2 is a perspective view of the image capturing device of FIG. 1C. Referring to FIG. 1C and FIG. 2, the image capturing device 100 of the present embodiment includes a main board 110 having an image capturing component 112, a reference component 120 having a reference plane 120a, and a lens module 140 assembled on the reference plane 120a. The reference plane 120 is parallel to the image capturing element 112 (the working surface 112a).

The main board 110 of this embodiment has a substrate 114 and an image capturing element 112 disposed on the substrate 114. The substrate 114 is located between the reference plane 120a of the reference component 120 and the image capture component 112. The substrate 114 is, for example, a circuit board that is electrically connected to the image capturing element 112. The image capturing device 100 of the embodiment further includes a hardenable glue 130. The hardened hardenable glue 130 connects the reference plane 120a of the reference component 120 with the substrate 114.

The lens module 140 of the embodiment is fixed to the reference plane 120a of the reference component 120. In detail, the lens module 140 of the embodiment includes a support frame 142 and a lens 144 connected to the support frame 142. The lens 144 has an optical axis X and an optical plane 140a parallel to the optical axis X.

The support frame 142 has a contact plane 142a. The contact plane 142a is substantially parallel to the optical plane 140a of the lens module 140. The contact plane 142a is fixed to the reference plane 120a of the reference component 120. The image capturing device 100 of the embodiment further includes a locker 150. The contact plane 142a of the support frame 142 is attached to the reference plane 120a of the reference member 120 through the fastener 150.

In the image capturing device 100 of the present embodiment, the reference plane 120a of the reference component 120 is substantially parallel to the working surface 112a of the image capturing component 112, and the contact plane 142a parallel to the optical plane 140a is fixed to the reference. On the plane 120a. Therefore, the optical plane 140a of the lens module 140 can be substantially parallel to the working surface 112a of the image capturing component 112, thereby allowing the image capturing device 100 to have a good effect of capturing or recording images.

Second embodiment Method of adjusting parallelism

The method of adjusting the parallelism of the present embodiment is similar to the method of adjusting the parallelism of the first embodiment, and therefore the same elements are denoted by the same reference numerals. The main difference between the two is that the method of providing the reference plane is different. The following is a description of the difference between the two, the same thing will not be repeated.

3A to 3D are schematic flowcharts of a method for adjusting parallelism according to a second embodiment of the present invention. Referring to FIG. 3A, first, a motherboard 110 having an image capturing component 112 is provided. Referring to FIG. 3B, next, a reference plane 130a is provided. In detail, in the present embodiment, the method of providing the reference plane 130a includes the following steps. As shown in FIG. 3A, first, a reference element K having a pre-reference plane S is provided. Next, as shown in FIG. 3B, a hardenable glue 130 is filled between the main board 110 and the pre-reference plane S and the pre-reference plane S is parallel to the working surface 112a of the image capturing element 112. The distribution area of the hardenable glue 130 can be at least three points that surround the periphery of the image capturing element 112, or an annular area that surrounds the periphery of the image capturing element 112. Next, in a case where the pre-reference plane S and the work surface 112a are kept parallel, the hardenable glue 130 is cured, and the hardenable glue 130 has the reference plane 130a parallel to the pre-reference plane S.

Referring to FIG. 3C, the reference element K is then removed from the hardened hardenable glue 130 to expose the reference plane 130a of the hardenable glue 130. It should be noted that the pre-reference plane S of the reference component K can be surface-treated, so that the pre-reference plane S of the reference component K can be smoothly removed from the hardenable adhesive 130 without harming the reference of the hardened adhesive 130. Plane 130a. As shown in FIG. 3C, after the above steps are completed, the reference plane 130a is substantially parallel to the working surface 112a of the image capturing component 112, so that other components (such as the lens module) and the image capturing component 112 working surface 112a are to be made. Parallel can be achieved by bearing other components against the reference plane 130a.

Referring to FIG. 3D, the lens module 140 is assembled on the reference plane 130a to capture the optical plane 140a of the lens module 140 and the image. The working faces 112a of the elements 112 are parallel. The lens module 140 of the embodiment includes a support frame 142 and a lens 144 coupled to the support frame 142. The support frame 142 has a contact plane 142a. The contact plane 142a is substantially parallel to the optical plane 140a of the lens module 140. In the embodiment, the method for assembling the lens module 140 on the reference plane 130a to make the optical plane 140a parallel to the image capturing component 112 includes the following steps: First, the support frame 142 of the lens module 140 can be made. The meandering contact surface 142a bears against the reference plane 130a of the hardenable glue 130 such that the optical plane 140a of the lens module 140 is parallel to the reference plane 130a. Next, the relative position of the lens module 140 to the reference plane 130a is fixed. For example, the support frame 142 of the lens module 140 and the substrate 114 of the main board 110 can be locked together by the locker 150 to fix the relative position of the lens module 140 and the reference plane 130a.

It should be noted that, before the step shown in FIG. 3D is performed, since the reference plane 130a has been parallel to the working surface 112a of the image capturing element 112, the contact plane 142a parallel to the optical plane 140a bears against the reference plane 130a. In the upper case, the optical plane 140a of the lens module 140 is also parallel to the working surface 112a of the image capturing element 112. Then, the optical plane 140a of the lens module 140 and the working surface 112a of the image capturing component 112 are kept parallel by the relative position of the fixed contact plane 142a and the reference plane 130a, thereby achieving the shooting or recording of the image capturing device 100A. The purpose of the image effect.

It is worth mentioning that in the present embodiment, the reference plane 130a is provided by the low-cost hardenable glue 130 instead of using the reference element 120 of the first embodiment. Therefore, the shadow produced by the method of the embodiment The image capturing device 100A has the advantages of lower cost and light weight than the image capturing device 100 of the first embodiment.

Image capture device

3D is a cross-sectional view of an image capturing device according to a second embodiment of the present invention. 4 is a perspective view of the image capturing device of FIG. 3D. Referring to FIG. 3D and FIG. 4, the image capturing device 100A of the present embodiment is similar to the image capturing device 100 of the first embodiment, and therefore the same elements are denoted by the same reference numerals. The following is a description of the difference between the two, the same thing will not be repeated.

The image capturing device 100A of the present embodiment includes a main board 110 having an image capturing component 112, a reference component having a reference plane 130a, and a lens module 140 assembled on the reference plane 130a, wherein the reference plane 130a and the image capturing component 112 (Working surface 112a) is parallel. In the present embodiment, the reference element is, for example, a hardenable hardenable glue 130.

The main board 110 of this embodiment has a substrate 114 and an image capturing element 112 disposed on the substrate 114. The reference plane 130a of the reference component is located between the substrate 114 and the lens module 140. It is worth noting that the reference element has a first surface S1 opposite the reference plane 130a. The first surface S1 of the reference component is adhered to the substrate 114, and the lens module 140 bears against the reference plane 130a of the reference component without being adhered to the reference plane 130a.

The lens module 140 of the embodiment includes a support frame 142 and a lens 144 coupled to the support frame 142. The support frame 142 has a contact plane 142a. The contact plane 142a is in contact with the reference plane 130a of the reference element. Lens 144 has an optical axis X and an optical plane 140a that is perpendicular to the optical axis X. The optical plane 140a is parallel to the pupil plane 142a. In this embodiment, the lens module 140 is fixed to the substrate 114. In detail, the support frame 142 of the lens module 140 can be fixed to the substrate 114 through the locking member 150.

In the image capturing device 100A of the present embodiment, the reference plane 130a of the reference component is substantially parallel to the working surface 112a of the image capturing component 112, and the contact plane 142a parallel to the optical plane 140a is in contact with the reference plane 130a. on. Therefore, the optical plane 140a of the lens module 140 can be substantially parallel to the working surface 112a of the image capturing component 112, thereby enabling the image capturing device 100A to have a good effect of capturing or recording images.

In summary, in the method for adjusting the parallelism according to an embodiment of the present invention, the working surface of the image capturing component is parallel to the reference plane, and then the optical plane of the lens module is parallel to the reference plane to improve the image. Take the effect of the parallelism between the component and the lens module. Since the parallelism between the image capturing component and the lens module is improved, the image quality of the imaging device at the peripheral position and the intermediate position of the working surface of the image capturing component can be relatively uniform, thereby causing the image capturing device to capture or record the image. The effect is good.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 100A‧‧‧ image capture device

110‧‧‧ motherboard

112‧‧‧Image capture components

112a‧‧‧Working face

114‧‧‧Substrate

116‧‧‧Transparent protective film

120‧‧‧Reference components

120a‧‧‧ reference plane

130‧‧‧hardenable glue

130a‧‧‧ reference plane

140‧‧‧Lens module

140a‧‧‧Optical plane

142‧‧‧Support frame

142a‧‧‧牴Touch plane

144‧‧‧ lens

150‧‧‧Locker

K‧‧‧ reference component

S‧‧‧Pre-reference plane

S1‧‧‧ first surface

X‧‧‧ optical axis

1A to 1C illustrate a method for adjusting parallelism according to a first embodiment of the present invention; Schematic diagram of the process.

2 is a perspective view of the image capturing device of FIG. 1C.

3A to 3D are schematic flowcharts of a method for adjusting parallelism according to a second embodiment of the present invention.

4 is a perspective view of the image capturing device of FIG. 3D.

100‧‧‧Image capture device

110‧‧‧ motherboard

112‧‧‧Image capture components

112a‧‧‧Working face

114‧‧‧Substrate

116‧‧‧Transparent protective film

120‧‧‧Reference components

120a‧‧‧ reference plane

130‧‧‧hardenable glue

140‧‧‧Lens module

140a‧‧‧Optical plane

142‧‧‧Support frame

142a‧‧‧牴Touch plane

144‧‧‧ lens

150‧‧‧Locker

X‧‧‧ optical axis

Claims (14)

A method for adjusting the parallelism for adjusting the parallelism between an image capturing component of an image capturing device and a lens module of the image capturing device, the lens module having an optical axis and the light The method of adjusting the parallelism includes: providing a main board of the image capturing device, the main board having the image capturing component; providing a reference component having the reference plane; The reference plane is parallel to the image capturing component; and the motherboard having the image capturing component is fixed to the reference plane of the reference component such that the image capturing component is parallel to the reference plane; assembling the lens mode And the lens module is mounted on the reference plane of the reference component, so that the optical plane of the lens module is parallel to the image capturing component, wherein the lens module is assembled When the reference plane of the reference component is supported on the motherboard, the lens module and the motherboard are located on the same side of the reference component, and the reference component is referenced by the reference component The surface does not abut against the board image capturing element. The method of adjusting parallelism according to claim 1, wherein the step of fixing the main board having the image capturing element to the reference plane of the reference element comprises: filling a hardenable glue to the reference Between the reference plane of the component and the motherboard; The hardenable glue is cured such that the reference plane of the reference element remains parallel to the image capture element. The method for adjusting the parallelism according to the first aspect of the invention, wherein the step of assembling the lens module on the reference plane comprises: supporting the lens module on the reference plane of the reference component, The optical plane of the lens module is parallel to the reference plane; and the relative position of the lens module to the reference component is fixed. A method for adjusting the parallelism for adjusting the parallelism between an image capturing component of an image capturing device and a lens module of the image capturing device, the lens module having an optical axis and the light The method of adjusting the parallelism includes: providing a main board of the image capturing device, the main board having the image capturing component; providing a reference component having a pre-reference plane; and the pre-reference plane Parallel to the image capturing element; filling a hardenable glue between the main board and the pre-reference plane; and curing the hardenable glue such that the hardenable glue has the reference plane parallel to the pre-reference plane; The lens module is assembled on the reference plane and simultaneously supported on the main board such that the optical plane of the lens module is parallel to the image capturing element, wherein the lens module is assembled to the hardenable glue When the reference plane is simultaneously supported by the main board, the lens module and the image capturing component of the main board are located on the same side of the reference plane of the hardenable glue, and the hardenable glue is It does not abut against the reference plane of the image capturing elements of the motherboard. The method of adjusting parallelism according to claim 4, wherein the step of assembling the lens module on the reference plane comprises: supporting the lens module on the reference plane of the hardenable glue, The optical plane of the lens module is parallel to the reference plane; and the relative position of the lens module to the reference plane is fixed. An image capturing device includes: a main board having an image capturing component; a reference component having a reference plane, the reference plane being parallel to the image capturing component; and a lens module assembled to the reference component The reference plane is simultaneously supported on the main board, the lens module and the main board are located on the same side of the reference component, and the reference plane of the reference component does not abut the image capturing component of the motherboard, wherein the reference plane The main board has a substrate and the image capturing component disposed on the substrate, the substrate being located between the reference plane of the reference component and the image capturing component. The image capturing device of claim 6, further comprising: a hardenable glue, the reference plane connecting the reference component and the substrate. The image capturing device of claim 7, wherein the lens module is fixed to the reference plane of the reference component. The image capture device of claim 7, wherein the lens module comprises: a support frame having a contact plane fixed to the reference plane of the reference component; a lens Connected to the support frame, the lens has an optical axis and The optical axis is perpendicular to an optical plane that is parallel to the contact plane. An image capturing device includes: a main board having an image capturing component; a reference component having a reference plane, the reference plane being parallel to the image capturing component; and a lens module assembled to the reference component The reference plane is mounted on the motherboard, the lens module and the image capturing component of the motherboard are located on the same side of the reference component, and the reference plane of the reference component does not abut the image of the motherboard. The component board has a substrate and the image capturing component disposed on the substrate, the reference plane of the reference component being located between the substrate and the lens module. The image capturing device of claim 10, wherein the reference component further has a first surface opposite to the reference plane, and the first surface of the reference component is adhered to the substrate, the lens module Relying on the reference plane of the reference element and not adhering to the reference plane of the reference element. The image capturing device of claim 10, wherein the lens module is fixed to the substrate. The image capture device of claim 12, wherein the lens module comprises: a support frame having a contact plane that abuts the reference plane of the reference component; and a lens Connected to the support frame, the lens has an optical axis and an optical plane perpendicular to the optical axis, the optical plane being parallel to the contact plane. The image capturing device of claim 10, wherein the reference component is a hardened glue that has been hardened.