TWI397691B - Probe station device - Google Patents

Description

Probe station device

The present invention relates to a probe assembly for testing a probe station device of a plurality of semiconductor wafer circuits formed on a semiconductor wafer in an electronic device process such as an LSI; in particular, for a circuit terminal arranged on a semiconductor wafer (Electrode pad) A probe station device that contacts a probe in a wafer state for coordinating a probe test for electrically conducting a semiconductor wafer.

With the advancement of semiconductor technology, the integration degree of electronic devices is increased, and the number of circuit terminals (electrode blocks) on each semiconductor wafer is increased, and the area of the electrode blocks is reduced, and the pitch of the electrode blocks is narrowed. The arrangement of the electrode blocks is progressed toward miniaturization.

On the other hand, in the probe card for semiconductor circuit inspection for electrically connecting the electrode block of the semiconductor circuit through the probe group (probe), the number of electrode blocks on the semiconductor wafer is increased, the area of the electrode block is reduced, and A narrow, high-density probe arrangement of electrode block spacing.

In general, the probe card has a standard sparse-pitch land or a through hole in the center of a printed circuit board which is connected to the inspection device as shown in Japanese Laid-Open Patent Publication No. 2003-075503. The probe assembly arranged at a narrow pitch is arranged, and the high-density wiring in the vicinity of the probe assembly is converted into a standard sparse-pitch electrode block or a through hole in the peripheral portion of the common wiring board, and thus the flexible wiring is transmitted through the flexible wiring ( Flexible Flat Cable) for connection.

Further, as shown in Japanese Laid-Open Patent Publication No. 2007-279009, the probe assembly is a resin film adhered with a copper alloy foil, and after etching the copper alloy foil, a probe is formed on the resin film. And a plurality of resin film probes are laminated on the conductive portion of the output terminal portion; and the output terminal portion is formed by dispersing the arrangement positions at a sparse pitch when the resin film probe is laminated. The film can be connected to the printed circuit board at a certain degree of sparse pitch in the vicinity of the probe assembly, thereby contributing to the reduction of the number of printed circuit board layers and simplifying the wiring; however, as disclosed in Japanese Laid-Open Patent Publication No. 2003-075503 As shown in the bulletin, in the wire array connection method in which only one end of the flexible cable is connected, in order to further narrow the pitch, multi-pin or different electrode block arrangement of the semiconductor circuit, the flexible cable is encountered. Congestion is difficult to package, and it is difficult to determine the positional accuracy of the connection.

Further, as shown in Japanese Laid-Open Patent Publication No. 2007-279009, in the connection method of the output terminal of the probe assembly only on the surface layer of the printed circuit board, in order to further narrow the pitch, a multilayer printed circuit board may occur. The problem of large resin film probes.

Patent Document 1 Japanese Patent Laid-Open Publication No. 2003-075503

Patent Document 2, JP-A-2007-279009

In order to solve the above problems, the present invention provides a probe assembly assembled by solving a narrow pitch on a probe station device for a probe assembly developed in response to a narrow pitch of electrode blocks on a semiconductor wafer. And a problem of connection between a printed circuit board that maintains a sparse pitch state or a connection terminal with a terminal connector, to easily perform electrical characteristic inspection of a narrow pitch semiconductor wafer, and to provide an inexpensive probe station device.

The present invention is a probe station device that allows a probe to contact a semiconductor wafer to be inspected and is electrically connected between the inspection devices through the probe, and has an output terminal directly connected to the probe, and the regular arrangement includes the complex probe of the output terminal. a needle group for forming a plurality of integrated probe assemblies, a wiring board on which a wiring is formed on a surface of a non-conductive film, and a pad array formed on one end of the n-th wiring board After contacting the output terminal group of the nth column of the probe assembly, the wiring terminal formed on the other end of the wiring board is connected to the common wiring circuit board or the terminal connector to form an electrically connected semiconductor wafer to be inspected. With inspection device.

Further, the present invention is in contact with a partial wiring board formed on the n+1th layer disposed at the lower end of the n-th wiring board, and an output terminal group including the n+1th column of the probe assembly. The nth layer above the array of pads is arranged to set the opening portion to a non-conductive portion of the upper end wiring circuit board or a portion of the conductive portion from the nth layer so as to allow the output terminal group of the probe assembly It is possible to directly connect the intermediate layer of the wiring board and form a connection with a narrow pitch output terminal.

Further, the present invention constitutes a part or all of each layer of the wiring circuit board by a flexible wiring.

Further, the present invention is a monolithically printed laminated circuit board which constitutes a part or all of each layer of the wiring circuit board.

Further, in the present invention, a conversion circuit board is provided between the wiring terminal of the wiring board and the common wiring board to form a configuration that can cope with the existing common wiring board.

Further, the probe assembly is a resin film adhered to a copper alloy foil, and after etching the copper alloy foil, a conductive portion including a probe and an output terminal portion is formed on the resin film, and the support bar is laminated. Resin film probe is composed of.

When the resin film probe is laminated, the output terminal portion is formed on each resin film so that the arrangement positions are shifted at equal intervals.

The support rod for laminating the resin film probe and the wiring board are in a manner of being restrained by at least the XY plane direction (wafer plane direction) by a support provided on the same support table. Composition.

The thermal expansion coefficient of the above-mentioned support table is formed by a material at least similar to the thermal expansion coefficient of the semiconductor wafer.

According to the probe station device of the present invention, an output terminal having a direct connection probe is provided, and a plurality of probe groups including the output terminal are regularly arranged to form a plurality of integrated probe assemblies and a wiring circuit board. And the pad array group formed on one end of the n-th wiring board is formed in contact with the output terminal group of the n-th column of the probe assembly, and the probe assembly assembled at a narrow pitch is solved. The problem of connection between a printed circuit board that maintains a sparse pitch or a terminal connector terminal is easy to perform electrical characteristic inspection of a narrow pitch semiconductor wafer, and an inexpensive probe station device.

The present invention will be described in detail with reference to the drawings. FIG. 1 is a first embodiment of the present invention, and is a schematic view of a probe station device; FIG. 2 is a probe disposed in FIG. FIG. 3 and FIG. 4 are diagrams showing the configuration of the probe assembly; FIG. 5 is a front view of the central portion of FIG. 1; and FIG. 6 is a common view of the probe assembly and the wiring board. A cross-sectional view of the fixed positional relationship between the boards.

The probe station device shown in Fig. 1 and Fig. 2 is composed of the following components; 1 is a probe assembly; 2 is a signal output LSI electrode block arranged in a test electronic device such as a wafer, and 3 is The wiring board, 4 is a common wiring board, and 10 is a probe; the probe 10 is made of a conductive material, and has a bent portion 13 in the middle to directly connect the output terminal 14; and under the collection of the plurality of probes 10, Each of the cable wires is contacted to form a probe assembly; in this embodiment, the plurality of probes 10 of FIG. 2 have probes 10-1, 10-2, 10-3, 10-4, In Fig. 2, the paper surface is in the vertical direction (depth direction), and is formed by the gap of 10-2 at the rear of the probe 10-1. The following is also shown as 10-3 and 10-4, one by one. The predetermined gap is provided; similarly, on the wiring board 3, the output terminal-specific pads 33-1, 33-2, 33-3, 33 which are in contact with the probes 10-1 to 10-4 are provided. -4; in the probe assembly 1, the plurality of probes 10 are regularly arranged and fixed in such a manner that the electrode blocks 2 are arranged; the wiring board 3 is formed to be horizontal by etching or adhesion. 31 extending to the surface of the non-conductive film, and a copper foil having a metal foil made of a plurality of wires 32 in FIG.

In the film 31 and the wiring pattern 32, n layers are arranged at a predetermined interval in the vertical direction. In the example shown in FIG. 2, the number of layers is 4, and the wiring pattern 32 of each layer is set as the upper layer. After the first layer, the second layer, the third layer, and the fourth layer, the second layer wiring pattern 32-2 extends to the other end than the wiring pattern 32-1 of the first layer; the third layer wiring pattern 32- 3, the extension is extended to the other end than the second layer wiring pattern 32-2. Therefore, when viewed from above, the front end of each layer wiring pattern 32 is exposed; and the wiring patterns of each layer are 32-1, 32. -2, 32-3, 32-4 front end, the output terminal special pads 33-1, 33-2, 33-3, 33-4 are connected; therefore, the output terminal special pads 33-1, ..., 33- 4, each of them is arranged differently from the horizontal direction and the vertical direction of FIG. 2; further, after the predetermined interval is vertically divided on the paper surface of FIG. 2, a plurality of output terminal dedicated weldings are arranged in the whole column. The pad 33-1 is configured to form a pad array group formed on one end of the wiring board 3.

In addition, the output terminal-specific pads 33-2, 33-3, and 33-4 are also disposed on the paper surface of FIG. 2, and are arranged in a plurality of rows at a predetermined interval in the vertical direction to form a wiring circuit. The pads of one end of the board 3 are arranged in groups.

Further, from above the output terminal dedicated pads 33-1, 33-2, 33-3, and 33-4, the output terminals of the probes 10-1, ..., 10-4 are sag and extend; the front ends of these output terminals The front end portion of the output terminal of the probe 10-1 in the portion is aligned to the output terminal dedicated pad 33-1, and the following probes 10-2, 10-3, and 10-4 output terminals are dedicated to the output terminal. When the pads 33-2, 33-3, and 33-4 are aligned, the probes 10-1, ..., 10-4 output the terminal end portions, and the respective output terminal-specific pads 33-1, 33 can be contacted. -2, 33-3, 33-4; in order to realize such probes 10-1, ..., 10-4 output terminals, and output terminal-specific pads 33-1, 33-2, 33-3, 33-4 Contact, while on the probe 10 side, the probe 10-2 extends further to the other end than the probe 10-1 of the probes 10-1, ..., 10-4, and the output terminal extends to the lower side; The needle 10-3 extends further to the other end than the probe 10-2, and is set such that the output terminal extends downward; thereby allowing the structures of the probes 10-1, ..., 10-4 to interact with each other Output terminal special pads 33-1, 33- different from horizontal direction and vertical direction deviation 2, 33-3, 33-4 configuration; further, the probe 10-1 output terminal on the probe assembly 1, on the paper surface of Figure 2, after a predetermined interval in the vertical direction, the entire column is arranged in a plurality of The probe output terminal array group is configured. The output terminals of the probes 10-1, ..., and 10-4 are also arranged on the second sheet surface at a predetermined interval in the vertical direction. To form each probe output terminal array group.

Furthermore, between the layer wiring patterns 32-1, 32-2, 32-3, and 32-4, the grounding members 30-1, 30-2, 30-3, and 30-4 are disposed; the grounding member 30 -1, 30-2, 30-3, 30-4 are used to reduce the crosstalk between the current flowing in each layer wiring pattern 32 or the signal; in other words, to reduce the twist line; further, the above layers The arrangement of the wiring pattern 32 and the output terminal-dedicated pads 33 is for facilitating understanding and explanation of the present invention; if the above-described arrangement is more general, the second layer wiring pattern 32-2 does not need to be more than the first wiring. Figure 32-1 is further extended to the other end. In fact, the first layer wiring diagram 32-1 can also extend to the other end than the second layer wiring diagram 32-2; in this configuration, it is hidden from the top view. In the second layer, the through hole is drilled in the portion (including the film 31 and the ground 30) of the first layer wiring pattern 32-1, and the second layer wiring pattern 32-2 is exposed in a plan view. A second layer wiring pattern 32-2 dedicated output terminal special pad 32-2 is disposed on the exposed portion to contact the probe 10-2 output terminal end portion of the output terminal dedicated pad 33-2; Open Fig. 32-1 of the first layer wiring of the hole has a "broken wire". However, if the wiring width is sufficiently larger than the diameter of the through hole, there is no such doubt; the relationship between the third layer and the fourth layer is the same. Therefore, it is sometimes possible to drill through the through holes of two or more layers by the arrangement of the layers.

In addition, 4 is a common wiring circuit board, and in the periphery, in the inspection apparatus (not shown in the drawing), there is a common bonding pad 42 at a position of a common precision probe (pogo pin) 46 for electrical connection; 41 is provided in the connection wiring. The through hole of the common wiring circuit board 4 at the other end of the circuit board.

3 and 4 are views showing the structure of the probe 10 and the probe assembly 1 used in the present invention; as shown in FIG. 3, the probe 10 is made of a material having high electrical conductivity and high mechanical strength such as beryllium copper. The intermediate portion is provided with a parallelogram spring portion 12, and the probe front end portion 11 is brought into contact with the LSI electrode block 2 by a spring force to obtain electrical conduction between the LSIs; on the other hand, the output terminal 14 of the output portion has The bent portion 13 is a structure that can absorb an external force toward the vertical direction (Z direction), and is pushed to the output terminal dedicated pad 33 of the wiring board to obtain an electrically conductive structure; further, the output position of the plurality of output terminals 14 As shown in FIG. 3, the X-directions of the 3-dimensional orthogonal coordinate system toward XYZ are disposed at positions where only the length Px is sequentially moved. These probes are adhered to the conductive material, for example, on the resin film 15. The resin film probe 10 having the required precision size can be produced by etching.

As shown in FIG. 4, the resin film probes 10 are laminated and fixed by penetrating the support rods 17 on the holes 16 provided in the resin film 15, thereby forming Px pitches in the X direction and in the Y direction. Forming a probe assembly 1 having a Py pitch; a plurality of complex probe groups having a different pitch in the X direction with a continuous Px in the X direction (this figure is exemplified by four probe groups), in order to cope with the narrow pitch The LSI electrode block pitch Py can be formed into a probe assembly 1 that is converted into a sparse pitch Px on the wiring board.

FIG. 5 is a view showing a relationship between the output terminal dedicated pads 33 on the arranged wiring board 3 in response to the arrangement of the output terminals 14 of the probe assembly 1, and 33-1 is a probe assembly 1 The Y-direction of the front end portion of the output terminal is in the first row 14-1, and the pad array group is provided on the first layer wiring board; 33-2 is the Y-direction second column in the leading end portion of the output terminal of the probe assembly 1 14-2, the pad array group provided on the second layer wiring board; 33-3 is provided on the third layer in accordance with the Y-direction third column 14-3 of the front end portion of the output terminal of the probe assembly 1. a pad array group on the wiring board; 33-4 is a pad array group provided on the fourth layer wiring board in accordance with the Y-direction fourth row 14-4 of the front end portion of the output terminal of the probe assembly 1; It is disposed at the lower end of the n-th wiring board and is in contact with the output terminal group of the n+1th column of the probe assembly 1 formed on the n+1th wiring board, and corresponds to the nth above the electrode block group. On a part of the layer wiring board, the output terminal group of the n+1th column of the probe assembly is directly contacted with the n+1th wiring board by providing the opening 34-n. The output terminal of the special pad 33.

The detailed configuration and function of the probe station device of the above-described components will be described below.

The probe assembly 1 having the narrow pitch Py and having the output terminal group 14 having a sparse X-direction pitch Px is precisely fixed to the wiring board in response to the position of the LSI electrode block 2 through the support bar 17 (this figure does not disclose The wiring board 3 is disposed at the lower end of the n-th wiring board 3-n, and is connected to the output terminal group 14 of the n+1th column of the probe assembly 1 formed on the n+1th wiring board. -n contact, and corresponding to a part of the n-th wiring board above the output terminal-dedicated pad group, the output terminal group of the n+1th column of the probe assembly is provided by providing the opening 34-n. It can be fixed to the common wiring circuit board 4 through the support table 51 or the like at the position of the dedicated terminal for the output terminal formed directly on the n+1th wiring board, and on the other hand, the other of the wiring board 3 One end is electrically connected to the wiring pattern 32a protruding from the non-conductive adhesive film 31 by crimping the surface of the through-hole 41 provided on the common wiring board 4 by using the pressing tool 52; The through hole 41 is connected to the periphery by the conductor pattern 45 provided on the surface layer 43 and the intermediate layer 44. Through pad 42; Furthermore, through the common precision probe 46, to allow inspection apparatus accepting the electrical signal.

The wiring board 3 may be a plurality of single-layer flexible wiring lines or a singular or plural multilayer laminated flexible wiring; in addition, between the other end of the wiring circuit board 3 and the through hole 41 of the common wiring circuit board 4. The connection method can also be connected by means of a terminal connector or solder.

6 is a cross-sectional view showing a fixed position between a probe assembly, a wiring board, and a common circuit board; the relationship of each fixed position is described in detail according to the figure; 51 in FIG. 6 is a support table, and 53 is a support table. On the support body A on 51, there is an inner diameter hole 53a which is larger than the outer diameter of the laminated resin film probe support rod 17, and the support rod 17 can be maintained with high precision; on the other hand, 54 is provided on the support table 51. The support body B has an outer diameter which is provided on the wiring board 3 only to be smaller than the inner diameter of the reference hole 35 common to the respective layers, so that the wiring board can be accurately maintained by inserting the support body B into the reference hole 35. In the direction of the XY plane.

The positional relationship between the probe tip end of the resin film probe and the output terminal of the output terminal of the wiring board is maintained with high precision, and at least the thermal expansion coefficient of the support 51 is used to approximate the thermal expansion coefficient of the semiconductor wafer. The material (for example, Fe-36Ni alloy) can be used in the high-temperature environment without being affected by the thermal expansion of the common wiring board 4, and the welding of the probe tip, the output terminal, and the output terminal of the wiring board can be maintained with high precision. The positional relationship between the pads.

Next, a second embodiment of the present invention will be described in detail with reference to the following drawings. Fig. 7 is a perspective view of the probe station apparatus of the present embodiment, Fig. 8 is a cross-sectional view of the central portion, and Fig. 9 is a central portion. The probe station apparatus shown in Figs. 7 and 8 is composed of the following parts; and 6 is a wiring board having a wiring pattern 62 such as a copper foil laminated by the intermediate insulating layer 61.

4 is a common wiring circuit board, and an inspection device (not shown in the drawing) has a common pad 42 corresponding to the position of the common precision probe 46 electrically connected; 47 is common to the through hole 65 for connecting the wiring board. A through hole on the wiring board 4.

FIG. 9 is a view showing a relationship between the output terminal-dedicated pads 63 of the combined wiring board 6 disposed in accordance with the arrangement of the output terminals 14 of the probe assembly 1, and 63-1 is provided at the front end of the output terminal of the probe assembly 1. The portion Y is arranged in the pad array on the first layer wiring board of the first column 14-1; 63-2 is the second layer in the second column 14-2 of the output terminal end portion Y of the probe assembly 1 a pad array group on the wiring board; 63-3 is a pad array group provided on the third layer wiring board of the third column 14-3 corresponding to the output terminal end portion Y of the probe assembly 1; 63- 4 is a pad array group provided on the fourth layer wiring board of the fourth column 14-4 corresponding to the output terminal end portion Y of the probe assembly 1, and is disposed at the lower end of the n-th wiring board, and is formed The output terminal group of the n+1th column of the probe assembly 1 of the n+1th wiring board is in contact with each other, and corresponds to a part of the nth wiring board above the electrode block group, and the opening is provided. 64-n, the output terminal group of the n+1th column of the probe assembly is directly contacted with the output terminal dedicated pad 63 formed on the n+1th wiring board.

The probe assembly 1 having the narrow pitch Py and the output terminal group 14 having the sparse X-direction pitch Px is precisely fixed to the wiring board in response to the position of the LSI electrode block 2 through the fixture 17 (this figure does not disclose The combined wiring board 6 is disposed at the lower end of the nth layer combination wiring board 6-n, and is connected to the output terminal of the n+1th column of the probe assembly 1 formed on the (n+1)th wiring board. Group 14-n contact, equivalent to output In a part of the n-th wiring circuit board above the terminal-dedicated pad group, the output terminal group of the n+1th column of the probe assembly is directly contacted with the n+1 by providing the opening 64-n. The position of the pad for the output terminal formed on the layer wiring board, and the peripheral portion of the combined wiring board 6 are connected to the via hole 65 through the wiring pattern 62 from the output terminal dedicated pad 63.

The via holes 65 for the connection are connected to the through holes 47 provided in the common wiring circuit board 4 to maintain the electrical connection between the common wiring circuit boards 4; the pads can be contacted by the respective via holes (example example) And the terminal connector is connected between the through hole 65 for the transfer and the through hole 47; further, the through hole 47 is connected to the peripheral common pad by the conductor pattern 45 provided on the surface layer 43 and the intermediate layer 44. 42; In addition, the inspection device receives the electrical signal through the common precision probe 46.

3 is a perspective view of the probe station apparatus of the present embodiment; FIG. 11 is a cross-sectional view of the center portion; 2 The integrated wiring board 6 and the common wiring board 4 of the implementation type are integrated with each other; the probe station apparatus shown in FIG. 10 and FIG. 11 is composed of the following parts; A wiring board having a wiring pattern 72 such as a copper foil laminated on the intermediate insulating layer 71; and a common bonding pad 42 for accommodating the position of the common precision probe 46 for electrical connection in the vicinity of the inspection device (not shown in the drawing) .

In the eighth and ninth aspects, the relationship of the output terminal-dedicated pads 73 on the integrated wiring board 7 disposed in accordance with the arrangement of the output terminals 14 of the probe assembly 1 is omitted.

The probe assembly 1 having the narrow pitch Py and having the output terminal group 14 having a sparse X-direction pitch Px is precisely fixed to the LSI electrode block 2 by the fixture 17 The wiring board of the position (not shown in the figure); the integrated wiring board 7 is disposed at the lower end of the n-th integrated wiring board 7-n, and the probe formed on the n+1th wiring board The output terminal group 14-n of the n+1th column of the assembly 1 is in contact with each other, and corresponds to a part of the n-th wiring board above the output terminal dedicated pad group, and the opening portion 74-n is provided to allow the probe On the other hand, the output terminal group of the n+1th column of the needle assembly is fixed to the integrated wiring board 7 at the position of the dedicated pad for the output terminal formed directly on the n+1th wiring board; Through the wiring pattern 72, the output terminal-specific pad is connected to the peripheral common pad 42; further, the inspection device receives the electrical signal by the common precision probe 46.

As described above, the present invention provides an output terminal having a direct connection probe, and a plurality of probe groups including the output terminal are regularly arranged to form a plurality of integrated probe assemblies and wiring boards, and are formed. The pad array group at one end of the n-th wiring board is formed in contact with the output terminal group of the n-th column of the probe assembly, and the probe assembly assembled at a narrow pitch is solved and maintained sparsely. The problem of the connection between the printed circuit board of the pitch or the terminal connector connection terminal facilitates the electrical property inspection of the pitch-pitch semiconductor wafer and the inexpensive probe station device.

The present invention has been described in terms of a preferred embodiment of the present invention, and various changes and modifications can be easily made without departing from the spirit and scope of the invention. Change example.

1‧‧‧ probe assembly

10‧‧‧ probe

10-1, 10-2, 10-3, 10-4‧‧ probes

11‧‧‧ probe front end

13‧‧‧Bend

14‧‧‧Output terminal

14-1‧‧‧Y to column 1

14-2‧‧‧Y to column 2

14-3‧‧‧Y to column 3

14-4‧‧‧Y to column 4

15‧‧‧Resin film

17‧‧‧Support rod

2‧‧‧ LSI electrode block

3‧‧‧Wiring circuit board

3-n, 3-1, 3-2, 3-3, 3-4‧‧‧ wiring boards

30‧‧‧ Grounding

31‧‧‧Non-conductive film

32‧‧‧Wiring diagram

32-1, 32-2, 32-3, 32-4‧‧‧ wiring diagram

33, 33-1, 33-2, 33-3, 33-4‧‧‧ output terminal special pads

34-n, 34-2, 34-3, 34-4‧‧‧ openings

35‧‧‧ reference hole

4‧‧‧Common wiring board

41‧‧‧through hole

42‧‧‧Common solder pads

43‧‧‧ surface layer

44‧‧‧Intermediate

45‧‧‧Conductor pattern

46‧‧‧Common precision probe

47‧‧‧through hole

51‧‧‧Support table

52‧‧‧ Pushing tools

53‧‧‧Support A

53a‧‧‧ inner diameter hole

54‧‧‧Support B

6‧‧‧Combined wiring board

61‧‧‧Intermediate insulation

62‧‧‧Wiring diagram

63, 63-1, 63-2, 63-3, 63-4‧‧‧ solder pad array

64-n, 64-2, 64-3, 64-4‧‧‧ openings

65‧‧‧through hole

7‧‧‧Integrated wiring board

71‧‧‧Intermediate insulation

72‧‧‧Wiring diagram

73, 73-1, 73-2, 73-3, 73-4‧‧‧ output terminal special pads

74-n, 74-2, 74-3, 74-4‧‧‧ openings

Px‧‧‧ spacing

Py‧‧‧ spacing

Fig. 1 is a perspective view showing a first embodiment of the present invention.

Figure 2 is a cross-sectional view of the central portion of Figure 1.

Fig. 3 is a front elevational view showing the configuration of a probe assembly of the first embodiment.

Fig. 4 is a perspective view for explaining the configuration of a probe assembly used in the first embodiment.

Fig. 5 is a plan view showing a central portion of Fig. 1 showing a first embodiment of the present invention.

Figure 6 is a cross-sectional view of the central portion of Figure 1.

Fig. 7 is a perspective view showing a second embodiment of the present invention.

Figure 8 is a cross-sectional view of the central portion of Figure 7.

Fig. 9 is a plan view showing a central portion of Fig. 7 showing a second embodiment.

Fig. 10 is a perspective view showing a third embodiment.

Figure 11 is a cross-sectional view of the central portion of Figure 10.

1. . . Probe assembly

2. . . LSI electrode block

3. . . Wiring board

33. . . Output terminal special pad

4. . . Wiring board

42. . . Common solder pad

45. . . Conductor pattern

46. . . Common precision probe

51. . . Support table

52. . . Pusher

Claims (8)

A probe station device characterized in that a probe terminal device that contacts a semiconductor wafer to be inspected and electrically connected between the inspection devices through the probe has an output terminal directly connected to the probe, and is regularly arranged a plurality of probe groups including the output terminal to form a plurality of integrated probe assemblies, and a wiring board on which a wiring is formed on the surface of the non-conductive film, and which is formed on any layer After the pad array group at one end of the layer wiring board is in contact with the output terminal group of the nth column of the probe assembly, the wiring terminal formed at the other end of the wiring board is connected to the common wiring board or the terminal connector. Electrically connecting the semiconductor wafer to be inspected and the inspection device; the partial wiring circuit board formed on the n+1th layer disposed at the lower end of the n-th wiring circuit board, and including the n+1th column corresponding to the probe assembly The nth layer above the pad array group in which the output terminal groups are in contact with each other is provided with the opening portion provided in the non-conductive portion of the upper end wiring board or a part of the conductive portion from the nth layer. The probe station device according to claim 1, wherein a part or all of each layer of the wiring circuit board is a flexible cable. The probe station device according to claim 1, wherein a part or all of each layer of the wiring circuit board is a multilayer printed laminated circuit board. The probe station device according to claim 1, wherein the conversion circuit board is provided between the wiring board wiring terminal and the common wiring circuit board. The probe station device according to claim 1, wherein the probe assembly is a resin film adhered to a copper alloy foil, and the copper is etched. After the alloy foil, a conductive portion including a probe and an output terminal portion was formed on the resin film, and a plurality of resin film probes were laminated by a support rod. The probe station device according to claim 5, wherein the output terminal portion is formed by disposing each of the arrangement positions at a substantially equal pitch when the resin film probe is laminated. Resin film. The probe station device according to claim 1, wherein the support rod for laminating the resin film probe and the wiring board are disposed on the same support table. The support is constrained by at least the XY plane direction (wafer plane direction). The probe station device according to claim 7, wherein the thermal expansion coefficient of the support table is formed by a material at least similar to a thermal expansion coefficient of the semiconductor wafer.