TWI375863B - - Google Patents
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- Publication number
- TWI375863B TWI375863B TW094130706A TW94130706A TWI375863B TW I375863 B TWI375863 B TW I375863B TW 094130706 A TW094130706 A TW 094130706A TW 94130706 A TW94130706 A TW 94130706A TW I375863 B TWI375863 B TW I375863B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- compound
- resin composition
- acid
- alkali
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004271688A JP4198101B2 (ja) | 2004-09-17 | 2004-09-17 | アルカリ現像性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200625005A TW200625005A (en) | 2006-07-16 |
| TWI375863B true TWI375863B (ja) | 2012-11-01 |
Family
ID=36059885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094130706A TW200625005A (en) | 2004-09-17 | 2005-09-07 | Alkaline developable resin composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4198101B2 (ja) |
| KR (1) | KR101168438B1 (ja) |
| CN (1) | CN100580555C (ja) |
| TW (1) | TW200625005A (ja) |
| WO (1) | WO2006030630A1 (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4916224B2 (ja) * | 2005-06-20 | 2012-04-11 | 株式会社Adeka | アルカリ現像性感光性樹脂組成物 |
| JP4684293B2 (ja) * | 2005-06-20 | 2011-05-18 | 凸版印刷株式会社 | 着色アルカリ現像型感光性樹脂組成物、及び該着色アルカリ現像型感光性樹脂組成物を用いたカラーフィルタ |
| JP5546093B2 (ja) | 2006-12-26 | 2014-07-09 | 株式会社Adeka | 重合性化合物及び重合性組成物 |
| JP5311750B2 (ja) * | 2007-02-28 | 2013-10-09 | 株式会社Adeka | フェノール樹脂、エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物 |
| JP6061449B2 (ja) * | 2011-03-31 | 2017-01-18 | 太陽インキ製造株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| WO2016129195A1 (ja) * | 2015-02-10 | 2016-08-18 | Jsr株式会社 | 感光性樹脂組成物および樹脂組成物、パターン化樹脂膜およびその製造方法、ならびに細胞培養装置 |
| JP7428365B2 (ja) * | 2019-10-16 | 2024-02-06 | 互応化学工業株式会社 | 感光性組成物、透明硬化膜、積層体、及び積層体の製造方法 |
| CN112250836B (zh) * | 2020-12-08 | 2021-03-30 | 北京市银帆涂料有限责任公司 | 一种高分子化合物和包含它的涂料组合物及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3148429B2 (ja) * | 1992-02-04 | 2001-03-19 | 新日本製鐵株式会社 | 光重合性不飽和化合物及びアルカリ現像型感光性樹脂組成物 |
| US6727042B2 (en) * | 2000-01-17 | 2004-04-27 | Showa Highpolymer Co., Ltd. | Photosensitive resin composition |
| WO2002025378A1 (en) * | 2000-09-16 | 2002-03-28 | Goo Chemical Co., Ltd. | Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| US6555592B2 (en) * | 2001-02-27 | 2003-04-29 | Advance Materials Corporation | Photothermosetting composition comprising acrylated epoxy resin |
| JP2003107702A (ja) * | 2001-09-27 | 2003-04-09 | Sumitomo Chem Co Ltd | 樹脂組成物 |
| JP4087650B2 (ja) * | 2002-07-12 | 2008-05-21 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性樹脂組成物及びその硬化物 |
| JP2004061566A (ja) * | 2002-07-25 | 2004-02-26 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板 |
| JP2004137328A (ja) * | 2002-10-16 | 2004-05-13 | Japan U-Pica Co Ltd | 光硬化性化合物及び感光性熱硬化性樹脂組成物並びにその硬化物 |
| CN100386298C (zh) * | 2004-03-25 | 2008-05-07 | 株式会社艾迪科 | 新型酚化合物和可由该酚化合物衍生得到的新型环氧树脂 |
-
2004
- 2004-09-17 JP JP2004271688A patent/JP4198101B2/ja not_active Expired - Lifetime
-
2005
- 2005-08-30 CN CN200580000757A patent/CN100580555C/zh not_active Expired - Lifetime
- 2005-08-30 KR KR1020067000500A patent/KR101168438B1/ko not_active Expired - Lifetime
- 2005-08-30 WO PCT/JP2005/015719 patent/WO2006030630A1/ja not_active Ceased
- 2005-09-07 TW TW094130706A patent/TW200625005A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1860415A (zh) | 2006-11-08 |
| KR101168438B1 (ko) | 2012-07-25 |
| JP2006084985A (ja) | 2006-03-30 |
| KR20070051762A (ko) | 2007-05-18 |
| CN100580555C (zh) | 2010-01-13 |
| WO2006030630A1 (ja) | 2006-03-23 |
| TW200625005A (en) | 2006-07-16 |
| JP4198101B2 (ja) | 2008-12-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |