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TW200625005A - Alkaline developable resin composition - Google Patents

Alkaline developable resin composition

Info

Publication number
TW200625005A
TW200625005A TW094130706A TW94130706A TW200625005A TW 200625005 A TW200625005 A TW 200625005A TW 094130706 A TW094130706 A TW 094130706A TW 94130706 A TW94130706 A TW 94130706A TW 200625005 A TW200625005 A TW 200625005A
Authority
TW
Taiwan
Prior art keywords
sub
resin composition
alkaline developable
developable resin
alkyl group
Prior art date
Application number
TW094130706A
Other languages
English (en)
Other versions
TWI375863B (zh
Inventor
Mitsuo Akutsu
Masaaki Shimizu
Yoshie Makabe
Naomi Sato
Tomohito Ishiguro
Koichi Kimishima
Naoki Maeda
Original Assignee
Asahi Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Co Ltd filed Critical Asahi Denka Co Ltd
Publication of TW200625005A publication Critical patent/TW200625005A/zh
Application granted granted Critical
Publication of TWI375863B publication Critical patent/TWI375863B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
TW094130706A 2004-09-17 2005-09-07 Alkaline developable resin composition TW200625005A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004271688A JP4198101B2 (ja) 2004-09-17 2004-09-17 アルカリ現像性樹脂組成物

Publications (2)

Publication Number Publication Date
TW200625005A true TW200625005A (en) 2006-07-16
TWI375863B TWI375863B (zh) 2012-11-01

Family

ID=36059885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130706A TW200625005A (en) 2004-09-17 2005-09-07 Alkaline developable resin composition

Country Status (5)

Country Link
JP (1) JP4198101B2 (zh)
KR (1) KR101168438B1 (zh)
CN (1) CN100580555C (zh)
TW (1) TW200625005A (zh)
WO (1) WO2006030630A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916224B2 (ja) * 2005-06-20 2012-04-11 株式会社Ａｄｅｋａ アルカリ現像性感光性樹脂組成物
KR101317223B1 (ko) 2005-06-20 2013-10-15 가부시키가이샤 아데카 착색 알칼리 현상형 감광성 수지 조성물, 및 상기 착색 알칼리 현상형 감광성 수지 조성물을 이용한 컬러필터
JP5546093B2 (ja) * 2006-12-26 2014-07-09 株式会社Ａｄｅｋａ 重合性化合物及び重合性組成物
JP5311750B2 (ja) * 2007-02-28 2013-10-09 株式会社Ａｄｅｋａ フェノール樹脂、エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物
JP6061449B2 (ja) * 2011-03-31 2017-01-18 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
WO2016129195A1 (ja) * 2015-02-10 2016-08-18 Jsr株式会社 感光性樹脂組成物および樹脂組成物、パターン化樹脂膜およびその製造方法、ならびに細胞培養装置
JP7428365B2 (ja) * 2019-10-16 2024-02-06 互応化学工業株式会社 感光性組成物、透明硬化膜、積層体、及び積層体の製造方法
CN112250836B (zh) * 2020-12-08 2021-03-30 北京市银帆涂料有限责任公司 一种高分子化合物和包含它的涂料组合物及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3148429B2 (ja) * 1992-02-04 2001-03-19 新日本製鐵株式会社 光重合性不飽和化合物及びアルカリ現像型感光性樹脂組成物
WO2001053890A1 (fr) * 2000-01-17 2001-07-26 Showa Highpolymer Co., Ltd. Composition de resine photosensible
TW521547B (en) * 2000-09-16 2003-02-21 Goo Chemical Co Ltd Ultraviolet-curable resin composition and photosolder resist ink containing the composition
US6555592B2 (en) * 2001-02-27 2003-04-29 Advance Materials Corporation Photothermosetting composition comprising acrylated epoxy resin
JP2003107702A (ja) 2001-09-27 2003-04-09 Sumitomo Chem Co Ltd 樹脂組成物
JP4087650B2 (ja) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2004061566A (ja) * 2002-07-25 2004-02-26 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板
JP2004137328A (ja) * 2002-10-16 2004-05-13 Japan U-Pica Co Ltd 光硬化性化合物及び感光性熱硬化性樹脂組成物並びにその硬化物
CN100386298C (zh) * 2004-03-25 2008-05-07 株式会社艾迪科 新型酚化合物和可由该酚化合物衍生得到的新型环氧树脂

Also Published As

Publication number Publication date
CN1860415A (zh) 2006-11-08
JP2006084985A (ja) 2006-03-30
KR20070051762A (ko) 2007-05-18
CN100580555C (zh) 2010-01-13
WO2006030630A1 (ja) 2006-03-23
JP4198101B2 (ja) 2008-12-17
TWI375863B (zh) 2012-11-01
KR101168438B1 (ko) 2012-07-25

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Legal Events

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MK4A Expiration of patent term of an invention patent