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TWI372791B - Etching compositions for copper-containing materials - Google Patents

Etching compositions for copper-containing materials

Info

Publication number
TWI372791B
TWI372791B TW097145188A TW97145188A TWI372791B TW I372791 B TWI372791 B TW I372791B TW 097145188 A TW097145188 A TW 097145188A TW 97145188 A TW97145188 A TW 97145188A TW I372791 B TWI372791 B TW I372791B
Authority
TW
Taiwan
Prior art keywords
copper
containing materials
etching compositions
etching
compositions
Prior art date
Application number
TW097145188A
Other languages
English (en)
Other versions
TW200940747A (en
Inventor
Kimihiko Ikeda
Yusuke Nakamura
Yuji Masamoto
Masakazu Shimosawa
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW200940747A publication Critical patent/TW200940747A/zh
Application granted granted Critical
Publication of TWI372791B publication Critical patent/TWI372791B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW097145188A 2008-01-15 2008-11-21 Etching compositions for copper-containing materials TWI372791B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008005517A JP4916455B2 (ja) 2008-01-15 2008-01-15 銅含有材料用エッチング剤組成物

Publications (2)

Publication Number Publication Date
TW200940747A TW200940747A (en) 2009-10-01
TWI372791B true TWI372791B (en) 2012-09-21

Family

ID=40945269

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145188A TWI372791B (en) 2008-01-15 2008-11-21 Etching compositions for copper-containing materials

Country Status (4)

Country Link
JP (1) JP4916455B2 (zh)
KR (1) KR101191064B1 (zh)
CN (1) CN101498000B (zh)
TW (1) TWI372791B (zh)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471688A (zh) * 2009-08-13 2012-05-23 东友Fine-Chem股份有限公司 用于形成铜互连的蚀刻组合物
EP2537960B1 (en) * 2010-02-15 2015-04-01 Mitsubishi Gas Chemical Company, Inc. ETCHING SOLUTION and etching method FOR MULTILAYER THIN FILM HAVING COPPER LAYER AND MOLYBDENUM LAYER CONTAINED THEREIN
EP2542038A4 (en) 2010-02-22 2014-06-25 Jx Nippon Mining & Metals Corp PROCESS FOR FORMING CIRCUITS ON COATED FLEXIBLE SUBSTRATES
KR101608873B1 (ko) * 2010-03-18 2016-04-05 삼성디스플레이 주식회사 금속 배선 식각액 및 이를 이용한 금속 배선 형성 방법
JP5531708B2 (ja) * 2010-03-26 2014-06-25 メック株式会社 銅のエッチング液および基板の製造方法
EP2640172A1 (en) 2010-11-12 2013-09-18 JX Nippon Mining & Metals Corporation Method for forming circuit on flexible laminate substrate
JP5535060B2 (ja) * 2010-12-28 2014-07-02 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
TW201250059A (en) * 2011-03-08 2012-12-16 Nagase Chemtex Corp Etching liquid
CN102330098B (zh) * 2011-08-31 2014-01-29 东莞市富默克化工有限公司 一种线路板用以快速增加表面粗糙度和去氧化的表面处理剂
JP5933950B2 (ja) * 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 銅または銅合金用エッチング液
CN104160486B (zh) * 2012-03-13 2016-11-02 株式会社Adeka 蚀刻液组合物的应用以及蚀刻方法
JP2014036064A (ja) * 2012-08-08 2014-02-24 Ube Ind Ltd プリント配線板の製造方法
EP2754732B1 (en) * 2013-01-15 2015-03-11 ATOTECH Deutschland GmbH Aqueous composition for etching of copper and copper alloys
JP6078394B2 (ja) * 2013-03-27 2017-02-08 株式会社Adeka エッチング液組成物及びエッチング方法
KR102128061B1 (ko) * 2013-04-05 2020-06-29 해성디에스 주식회사 구리 함유 금속막 식각액 조성물 및 이를 이용한 식각 방법
KR102107476B1 (ko) * 2013-04-10 2020-05-07 해성디에스 주식회사 구리 함유 금속막 식각액 조성물 및 이를 이용한 식각 방법
KR101593110B1 (ko) * 2013-11-21 2016-02-11 주식회사 익스톨 분해방지용 안정화제가 포함된 터치스크린패널용 식각액 조성물
JP6164614B2 (ja) 2013-12-06 2017-07-19 メック株式会社 エッチング液、補給液及び銅配線の形成方法
KR102331036B1 (ko) 2014-10-10 2021-11-26 삼영순화(주) 에칭액 조성물 및 이를 이용하는 다층막의 에칭 방법
KR101571843B1 (ko) * 2015-06-24 2015-11-25 진정복 표면 밀착력 향상을 위한 나노 에칭 조성물
JP6218000B2 (ja) 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
CN111542648A (zh) 2018-01-05 2020-08-14 株式会社Adeka 组合物和蚀刻方法
CN108774747A (zh) * 2018-06-12 2018-11-09 江苏博敏电子有限公司 一种电解蚀刻制备pcb精细线路的电解蚀刻液
WO2020035982A1 (ja) 2018-08-13 2020-02-20 株式会社Adeka 組成物及びエッチング方法
CN109041423A (zh) * 2018-09-21 2018-12-18 郑州云海信息技术有限公司 一种pcb板及一种电子设备
EP3983500A4 (en) * 2019-06-13 2022-11-02 FUJIFILM Electronic Materials U.S.A, Inc. ETCHING COMPOSITIONS
CN111809182B (zh) * 2020-07-08 2025-04-18 江苏和达电子科技有限公司 一种用于铜/钼（铌）/igzo膜层的刻蚀液及其制备方法和应用
JP7507041B2 (ja) * 2020-08-25 2024-06-27 株式会社Adeka 組成物、エッチング方法、及び回路パターン形成方法
CN112239869A (zh) * 2020-10-26 2021-01-19 杭州电子科技大学 一种用于减少蚀刻天线侧蚀的缓蚀剂及其使用方法
JP7274221B2 (ja) * 2020-11-11 2023-05-16 メック株式会社 エッチング剤及び回路基板の製造方法
CN114807944A (zh) * 2021-01-28 2022-07-29 江苏悦锌达新材料有限公司 一种环保型退镀剂及其制备方法和使用方法
CN113026018B (zh) * 2021-03-01 2022-11-22 四川江化微电子材料有限公司 一种铜钼合金的蚀刻液组合物及蚀刻方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181868A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk 銅及び銅合金用のマイクロエッチング剤
JP2001181867A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk マイクロエッチング剤
JP3962239B2 (ja) * 2001-10-30 2007-08-22 株式会社Ａｄｅｋａ エッチング剤組成物及びパターン形成方法
KR100505328B1 (ko) * 2002-12-12 2005-07-29 엘지.필립스 엘시디 주식회사 구리 몰리브덴막에서 몰리브덴 잔사를 제거할 수 있는식각용액 및 그 식각 방법
JP4018559B2 (ja) * 2003-02-27 2007-12-05 メック株式会社 電子基板の製造方法
JP4224436B2 (ja) * 2003-07-25 2009-02-12 メック株式会社 エッチング剤と補給液及びこれを用いた銅配線の製造方法
TWI282377B (en) * 2003-07-25 2007-06-11 Mec Co Ltd Etchant, replenishment solution and method for producing copper wiring using the same
WO2005086551A1 (ja) * 2004-03-03 2005-09-15 Ibiden Co., Ltd. エッチング液、エッチング方法およびプリント配線板
US7456114B2 (en) * 2005-12-21 2008-11-25 Kesheng Feng Microetching composition and method of using the same

Also Published As

Publication number Publication date
CN101498000A (zh) 2009-08-05
JP4916455B2 (ja) 2012-04-11
KR101191064B1 (ko) 2012-10-15
JP2009167459A (ja) 2009-07-30
TW200940747A (en) 2009-10-01
CN101498000B (zh) 2012-07-18
KR20090078736A (ko) 2009-07-20

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