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TWI372791B - Etching compositions for copper-containing materials - Google Patents

Etching compositions for copper-containing materials

Info

Publication number
TWI372791B
TWI372791B TW097145188A TW97145188A TWI372791B TW I372791 B TWI372791 B TW I372791B TW 097145188 A TW097145188 A TW 097145188A TW 97145188 A TW97145188 A TW 97145188A TW I372791 B TWI372791 B TW I372791B
Authority
TW
Taiwan
Prior art keywords
copper
containing materials
etching compositions
etching
compositions
Prior art date
Application number
TW097145188A
Other languages
Chinese (zh)
Other versions
TW200940747A (en
Inventor
Kimihiko Ikeda
Yusuke Nakamura
Yuji Masamoto
Masakazu Shimosawa
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW200940747A publication Critical patent/TW200940747A/en
Application granted granted Critical
Publication of TWI372791B publication Critical patent/TWI372791B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW097145188A 2008-01-15 2008-11-21 Etching compositions for copper-containing materials TWI372791B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008005517A JP4916455B2 (en) 2008-01-15 2008-01-15 Etching composition for copper-containing materials

Publications (2)

Publication Number Publication Date
TW200940747A TW200940747A (en) 2009-10-01
TWI372791B true TWI372791B (en) 2012-09-21

Family

ID=40945269

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145188A TWI372791B (en) 2008-01-15 2008-11-21 Etching compositions for copper-containing materials

Country Status (4)

Country Link
JP (1) JP4916455B2 (en)
KR (1) KR101191064B1 (en)
CN (1) CN101498000B (en)
TW (1) TWI372791B (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471688A (en) * 2009-08-13 2012-05-23 东友Fine-Chem股份有限公司 Etchant composition for forming copper interconnects
EP2537960B1 (en) * 2010-02-15 2015-04-01 Mitsubishi Gas Chemical Company, Inc. ETCHING SOLUTION and etching method FOR MULTILAYER THIN FILM HAVING COPPER LAYER AND MOLYBDENUM LAYER CONTAINED THEREIN
EP2542038A4 (en) 2010-02-22 2014-06-25 Jx Nippon Mining & Metals Corp METHOD FOR FORMING CIRCUITS ON A FLEXIBLE COLAMINATED SUBSTRATE
KR101608873B1 (en) * 2010-03-18 2016-04-05 삼성디스플레이 주식회사 Etchant for metal wire and method for manufacturing metal wire using the same
JP5531708B2 (en) * 2010-03-26 2014-06-25 メック株式会社 Copper etching solution and substrate manufacturing method
EP2640172A1 (en) 2010-11-12 2013-09-18 JX Nippon Mining & Metals Corporation Method for forming circuit on flexible laminate substrate
JP5535060B2 (en) * 2010-12-28 2014-07-02 株式会社Ａｄｅｋａ Etching composition for copper-containing material and method for etching copper-containing material
TW201250059A (en) * 2011-03-08 2012-12-16 Nagase Chemtex Corp Etching liquid
CN102330098B (en) * 2011-08-31 2014-01-29 东莞市富默克化工有限公司 Surface treating agent for rapidly increasing surface roughness and removing oxidation of circuit board
JP5933950B2 (en) * 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Etching solution for copper or copper alloy
CN104160486B (en) * 2012-03-13 2016-11-02 株式会社Adeka Application of etchant composition and etching method
JP2014036064A (en) * 2012-08-08 2014-02-24 Ube Ind Ltd Method of manufacturing printed circuit board
EP2754732B1 (en) * 2013-01-15 2015-03-11 ATOTECH Deutschland GmbH Aqueous composition for etching of copper and copper alloys
JP6078394B2 (en) * 2013-03-27 2017-02-08 株式会社Adeka Etching solution composition and etching method
KR102128061B1 (en) * 2013-04-05 2020-06-29 해성디에스 주식회사 Etchant composition for copper-containing metal film and etching method using the same
KR102107476B1 (en) * 2013-04-10 2020-05-07 해성디에스 주식회사 Etchant composition for copper-containing metal film and etching method using the same
KR101593110B1 (en) * 2013-11-21 2016-02-11 주식회사 익스톨 Etchant composition with stabilizer for touch screen panel
JP6164614B2 (en) 2013-12-06 2017-07-19 メック株式会社 Etching solution, replenisher, and method for forming copper wiring
KR102331036B1 (en) 2014-10-10 2021-11-26 삼영순화(주) Etching solution composition and etching method using the same
KR101571843B1 (en) * 2015-06-24 2015-11-25 진정복 Nano etching composition for improving the surface adhension
JP6218000B2 (en) 2016-02-19 2017-10-25 メック株式会社 Copper microetching agent and method of manufacturing wiring board
CN111542648A (en) 2018-01-05 2020-08-14 株式会社Adeka Composition and Etching Method
CN108774747A (en) * 2018-06-12 2018-11-09 江苏博敏电子有限公司 A kind of electrolytic etching prepares the electrolytic etching liquid of PCB fine-lines
WO2020035982A1 (en) 2018-08-13 2020-02-20 株式会社Adeka Composition and etching method
CN109041423A (en) * 2018-09-21 2018-12-18 郑州云海信息技术有限公司 A kind of pcb board and a kind of electronic equipment
EP3983500A4 (en) * 2019-06-13 2022-11-02 FUJIFILM Electronic Materials U.S.A, Inc. ENGRAVING COMPOSITIONS
CN111809182B (en) * 2020-07-08 2025-04-18 江苏和达电子科技有限公司 An etching solution for copper/molybdenum (niobium)/IGZO film layer and its preparation method and application
JP7507041B2 (en) * 2020-08-25 2024-06-27 株式会社Adeka Composition, etching method, and method for forming circuit pattern
CN112239869A (en) * 2020-10-26 2021-01-19 杭州电子科技大学 Corrosion inhibitor for reducing side etching of etched antenna and use method thereof
JP7274221B2 (en) * 2020-11-11 2023-05-16 メック株式会社 Etching agent and circuit board manufacturing method
CN114807944A (en) * 2021-01-28 2022-07-29 江苏悦锌达新材料有限公司 Environment-friendly deplating agent and preparation method and use method thereof
CN113026018B (en) * 2021-03-01 2022-11-22 四川江化微电子材料有限公司 Etching solution composition of copper-molybdenum alloy and etching method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181868A (en) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk Microetching agents for copper and copper alloys
JP2001181867A (en) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk Micro etching agent
JP3962239B2 (en) * 2001-10-30 2007-08-22 株式会社Ａｄｅｋａ Etching composition and pattern forming method
KR100505328B1 (en) * 2002-12-12 2005-07-29 엘지.필립스 엘시디 주식회사 ETCHING SOLUTIONS AND METHOD TO REMOVE MOLYBDENUM RESIDUE FOR Cu MOLYBDENUM MULTILAYERS
JP4018559B2 (en) * 2003-02-27 2007-12-05 メック株式会社 Manufacturing method of electronic substrate
JP4224436B2 (en) * 2003-07-25 2009-02-12 メック株式会社 Etching agent, replenisher, and copper wiring manufacturing method using the same
TWI282377B (en) * 2003-07-25 2007-06-11 Mec Co Ltd Etchant, replenishment solution and method for producing copper wiring using the same
WO2005086551A1 (en) * 2004-03-03 2005-09-15 Ibiden Co., Ltd. Etching solution, method of etching and printed wiring board
US7456114B2 (en) * 2005-12-21 2008-11-25 Kesheng Feng Microetching composition and method of using the same

Also Published As

Publication number Publication date
CN101498000A (en) 2009-08-05
JP4916455B2 (en) 2012-04-11
KR101191064B1 (en) 2012-10-15
JP2009167459A (en) 2009-07-30
TW200940747A (en) 2009-10-01
CN101498000B (en) 2012-07-18
KR20090078736A (en) 2009-07-20

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