TWI368555B - Polishing apparatus - Google Patents
Polishing apparatusInfo
- Publication number
- TWI368555B TWI368555B TW094138057A TW94138057A TWI368555B TW I368555 B TWI368555 B TW I368555B TW 094138057 A TW094138057 A TW 094138057A TW 94138057 A TW94138057 A TW 94138057A TW I368555 B TWI368555 B TW I368555B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing apparatus
- polishing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- H10P52/00—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
- B24B49/183—Wear compensation without the presence of dressing tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004318581A JP4597634B2 (ja) | 2004-11-01 | 2004-11-01 | トップリング、基板の研磨装置及び研磨方法 |
| JP2005079166A JP4817687B2 (ja) | 2005-03-18 | 2005-03-18 | 研磨装置 |
| JP2005145566A JP2006324413A (ja) | 2005-05-18 | 2005-05-18 | 基板保持装置および研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200618939A TW200618939A (en) | 2006-06-16 |
| TWI368555B true TWI368555B (en) | 2012-07-21 |
Family
ID=36319267
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094138057A TWI368555B (en) | 2004-11-01 | 2005-10-31 | Polishing apparatus |
| TW098107806A TWI373393B (en) | 2004-11-01 | 2005-10-31 | Top ring, polishing apparatus and polishing method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098107806A TWI373393B (en) | 2004-11-01 | 2005-10-31 | Top ring, polishing apparatus and polishing method |
Country Status (6)
| Country | Link |
|---|---|
| US (8) | US8083571B2 (zh) |
| EP (6) | EP1807865B1 (zh) |
| KR (5) | KR101011788B1 (zh) |
| CN (4) | CN105904335B (zh) |
| TW (2) | TWI368555B (zh) |
| WO (1) | WO2006049269A1 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9782869B2 (en) | 2012-09-24 | 2017-10-10 | Ebara Corporation | Apparatus for detecting abnormality in polishing of a substrate |
| TWI702111B (zh) * | 2014-08-26 | 2020-08-21 | 日商荏原製作所股份有限公司 | 拋光處理裝置及基板處理裝置 |
| TWI719036B (zh) * | 2015-09-28 | 2021-02-21 | 日商荏原製作所股份有限公司 | 研磨方法及研磨裝置 |
Families Citing this family (124)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6760772B2 (en) * | 2000-12-15 | 2004-07-06 | Qualcomm, Inc. | Generating and implementing a communication protocol and interface for high data rate signal transfer |
| KR101011788B1 (ko) * | 2004-11-01 | 2011-02-07 | 가부시키가이샤 에바라 세이사꾸쇼 | 톱링, 폴리싱장치 및 폴리싱방법 |
| JP4814677B2 (ja) | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
| US7654888B2 (en) | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
| US7575504B2 (en) | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
| US7727055B2 (en) | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
| US7699688B2 (en) | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| US8152594B2 (en) | 2007-01-30 | 2012-04-10 | Ebara Corporation | Polishing apparatus |
| WO2008106221A1 (en) * | 2007-02-28 | 2008-09-04 | Applied Materials, Inc. | Methods and apparatus for cleaning a substrate edge using chemical and mechanical polishing |
| JP2008305875A (ja) * | 2007-06-06 | 2008-12-18 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| JP5464820B2 (ja) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
| JP4658182B2 (ja) * | 2007-11-28 | 2011-03-23 | 株式会社荏原製作所 | 研磨パッドのプロファイル測定方法 |
| JP5199691B2 (ja) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
| US8795032B2 (en) | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
| JP5390807B2 (ja) | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
| JP4682236B2 (ja) * | 2008-08-29 | 2011-05-11 | アプライド マテリアルズ インコーポレイテッド | 軸動作検出機構およびコンディショナーヘッド |
| JP5415735B2 (ja) | 2008-09-26 | 2014-02-12 | 株式会社荏原製作所 | ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置 |
| USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD634719S1 (en) | 2009-08-27 | 2011-03-22 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| TWI381904B (zh) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
| KR101738885B1 (ko) * | 2010-04-20 | 2017-06-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 폴리싱 패드 프로파일들을 위한 폐쇄-루프 제어 |
| CN102059653B (zh) * | 2010-07-20 | 2012-10-31 | 上海交通大学 | 球面数控精密磨削过程自适应控制方法 |
| US20120021671A1 (en) * | 2010-07-26 | 2012-01-26 | Applied Materials, Inc. | Real-time monitoring of retaining ring thickness and lifetime |
| CN101972978B (zh) * | 2010-08-30 | 2012-05-16 | 清华大学 | 一种新型化学机械抛光装置 |
| JP5511600B2 (ja) * | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
| USD711330S1 (en) | 2010-12-28 | 2014-08-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
| KR101104824B1 (ko) * | 2011-01-19 | 2012-01-16 | 김오수 | 캐리어 헤드 및 캐리어 헤드 유닛 |
| JP2012192470A (ja) * | 2011-03-15 | 2012-10-11 | Asahi Glass Co Ltd | 板状体の研磨装置 |
| CN102183198B (zh) * | 2011-03-15 | 2012-08-22 | 清华大学 | 用于测量硅片的膜厚度的测量装置 |
| KR101196652B1 (ko) | 2011-05-31 | 2012-11-02 | 주식회사 케이씨텍 | 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드 |
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| US20130017762A1 (en) * | 2011-07-15 | 2013-01-17 | Infineon Technologies Ag | Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine |
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| JP6842859B2 (ja) | 2016-08-12 | 2021-03-17 | 株式会社荏原製作所 | ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法 |
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| TWI619580B (zh) * | 2016-12-05 | 2018-04-01 | 邱瑛杰 | 平面研磨機及其研磨方法 |
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| CN106625104B (zh) * | 2017-03-22 | 2018-11-30 | 天津盛世舜合自动化技术有限公司 | 一种马桶底部加工装置 |
| JP6917966B2 (ja) * | 2017-10-25 | 2021-08-11 | 株式会社荏原製作所 | 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置 |
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- 2005-10-31 EP EP05800303A patent/EP1807865B1/en not_active Expired - Lifetime
- 2005-10-31 KR KR1020077012298A patent/KR101044739B1/ko not_active Expired - Lifetime
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- 2005-10-31 EP EP16158297.8A patent/EP3043377A1/en not_active Withdrawn
- 2005-10-31 US US11/665,648 patent/US8083571B2/en active Active
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- 2005-10-31 KR KR1020107025443A patent/KR101186239B1/ko not_active Expired - Lifetime
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- 2005-10-31 EP EP13005022.2A patent/EP2690652A3/en not_active Withdrawn
- 2005-10-31 EP EP14177630.2A patent/EP2797109B1/en not_active Expired - Lifetime
- 2005-10-31 EP EP14188224.1A patent/EP2838110B1/en not_active Expired - Lifetime
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2009
- 2009-02-25 US US12/379,597 patent/US20090191797A1/en not_active Abandoned
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9782869B2 (en) | 2012-09-24 | 2017-10-10 | Ebara Corporation | Apparatus for detecting abnormality in polishing of a substrate |
| TWI611871B (zh) * | 2012-09-24 | 2018-01-21 | 荏原製作所股份有限公司 | 基板的研磨異常檢測方法及研磨裝置 |
| US10343252B2 (en) | 2012-09-24 | 2019-07-09 | Ebara Corporation | Polishing apparatus for detecting abnormality in polishing of a substrate |
| TWI702111B (zh) * | 2014-08-26 | 2020-08-21 | 日商荏原製作所股份有限公司 | 拋光處理裝置及基板處理裝置 |
| TWI719036B (zh) * | 2015-09-28 | 2021-02-21 | 日商荏原製作所股份有限公司 | 研磨方法及研磨裝置 |
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