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TWI368466B - Bonding device - Google Patents

Bonding device

Info

Publication number
TWI368466B
TWI368466B TW095119178A TW95119178A TWI368466B TW I368466 B TWI368466 B TW I368466B TW 095119178 A TW095119178 A TW 095119178A TW 95119178 A TW95119178 A TW 95119178A TW I368466 B TWI368466 B TW I368466B
Authority
TW
Taiwan
Prior art keywords
bonding device
bonding
Prior art date
Application number
TW095119178A
Other languages
Chinese (zh)
Other versions
TW200708213A (en
Inventor
Yoshiyuki Arai
Takashi Hare
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200708213A publication Critical patent/TW200708213A/en
Application granted granted Critical
Publication of TWI368466B publication Critical patent/TWI368466B/en

Links

Classifications

    • H10P72/0446—
    • H10W95/00—
    • H10W46/00—
    • H10W46/301—
    • H10W46/601—
    • H10W46/603—
    • H10W72/0711—
    • H10W72/07178—
    • H10W72/07223—
    • H10W72/07236—
TW095119178A 2005-05-31 2006-05-30 Bonding device TWI368466B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005160071 2005-05-31

Publications (2)

Publication Number Publication Date
TW200708213A TW200708213A (en) 2007-02-16
TWI368466B true TWI368466B (en) 2012-07-11

Family

ID=37481476

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119178A TWI368466B (en) 2005-05-31 2006-05-30 Bonding device

Country Status (5)

Country Link
JP (1) JP5065892B2 (en)
KR (1) KR101245995B1 (en)
CN (1) CN100565829C (en)
TW (1) TWI368466B (en)
WO (1) WO2006129547A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822377B (en) * 2022-07-26 2023-11-11 日商山葉發動機股份有限公司 Surface mounting machine and surface mounting method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100933353B1 (en) * 2008-01-25 2009-12-22 주식회사 탑 엔지니어링 Position sensing device of bonding equipment and its manufacturing method
TWI381200B (en) * 2008-11-11 2013-01-01 Au Optronics Suzhou Corp Alignment inspection method and apparatus
CN103367175B (en) * 2013-07-02 2015-08-19 华中科技大学 A kind of multiple degrees of freedom bonding head for flip-chip
KR101510815B1 (en) * 2013-12-26 2015-04-10 세광테크 주식회사 Imaging device and imaging method
JP6724421B2 (en) * 2016-03-02 2020-07-15 Tdk株式会社 Component mounting apparatus and mounting method
CN108511381B (en) * 2017-02-28 2023-05-23 韩美半导体株式会社 Bonding apparatus and control method thereof
KR102430480B1 (en) * 2017-10-19 2022-08-08 세메스 주식회사 Apparatus and method of bonding dies
JP2019102771A (en) 2017-12-08 2019-06-24 アスリートＦａ株式会社 Electronic component mounting device and electronic component mounting method
KR102272618B1 (en) * 2020-01-03 2021-07-05 주식회사 제이스텍 Vertical Alignment and bonding of display panel and COF
CN117182487A (en) * 2023-08-21 2023-12-08 瑞心传动科技(浙江)有限公司 Sucking disc structure and feed mechanism

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3620868B2 (en) * 1994-03-07 2005-02-16 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
US6203082B1 (en) * 1999-07-12 2001-03-20 Rd Automation Mounting apparatus for electronic parts
JP3988878B2 (en) * 2001-03-02 2007-10-10 東レエンジニアリング株式会社 Chip mounting method and apparatus
JP3680785B2 (en) * 2001-11-15 2005-08-10 松下電器産業株式会社 Electronic component bonding apparatus and bonding method
JP2004006467A (en) * 2002-05-31 2004-01-08 Osaki Engineering Co Ltd Panel or board parts mounting equipment
JP2004031868A (en) 2002-06-28 2004-01-29 Toray Eng Co Ltd Mounting method and mounting apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822377B (en) * 2022-07-26 2023-11-11 日商山葉發動機股份有限公司 Surface mounting machine and surface mounting method

Also Published As

Publication number Publication date
TW200708213A (en) 2007-02-16
CN101176197A (en) 2008-05-07
JPWO2006129547A1 (en) 2008-12-25
CN100565829C (en) 2009-12-02
WO2006129547A1 (en) 2006-12-07
KR101245995B1 (en) 2013-03-20
KR20080007349A (en) 2008-01-18
JP5065892B2 (en) 2012-11-07

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