JP2004006467A - Panel or board parts mounting equipment - Google Patents

Abstract

A panel or board part mounting apparatus for mounting parts such as a TCP or an IC chip on a liquid crystal panel, an EL panel, or a film substrate, is an apparatus capable of mounting both an IC chip and a TCP or the like having significantly different sizes. Offer.
In the case of a large part, a large part dedicated tray is stacked at a stock position in a plurality of stages, and the outer periphery of the large part dedicated tray located at a lower end thereof is guided by a tray guide rail of a tray transport device. Is transferred to the pickup position by the locking claw 11.
When the parts are IC chips, a plurality of dedicated chip trays 12 each of which has a large number of IC chips arranged in a plane are firmly arranged and stored on the adapter 13 in a planar manner. Is held in position.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a panel or substrate part mounting for connecting an IC chip or TCP (also referred to as a tape carrier package or TAB) by pressure bonding to a connection electrode terminal of a liquid crystal panel, an EL panel, or a film substrate via an anisotropic conductive film. Related to the device.
[0002]
[Prior art]
Conventionally, a liquid crystal panel, an EL panel, and a substrate mounting apparatus are divided into an IC chip having relatively small parts connected thereto and a TCP, which is a driving LSI package mounted on a relatively large film. The trays for storing the sheets in a two-dimensional arrangement and the transport device thereof are completely different. This is based on the fact that the size of TCP is significantly larger than that of an IC chip. As an example, the size of a TCP differs from that of an IC chip by a factor of ten, and the positioning accuracy for picking up parts changes greatly based on the size. There are other reasons that you need to use a lot of.
[0003]
In addition, instead of TCP, there are FPC (flexible printed circuit), COF (chip-on-film), etc., and anisotropic conductive material is provided between the outer leads and the panel electrode group (fine terminal group). Some of them are connected by thermocompression bonding via a membrane, and the present invention also covers these.
The liquid crystal panel and the substrate include a transparent substrate and an opaque substrate. In any case, a marker serving as a reference for mounting components is provided at the edge or the like thereof. In the case of a transparent body, the marker is detected from the lower surface side by a sensor of an alignment optical system, and in the case of an opaque body Detected the position of the marker from the upper surface side. For this reason, the arrangement position of the alignment optical system is different between the case of the transparent substrate and the case of the opaque substrate.
[0004]
[Problems to be solved by the invention]
Conventional liquid crystal panel or substrate mounting apparatuses use different devices depending on the size and type of the parts and whether the substrate is a transparent substrate or an opaque substrate.
Therefore, the panel maker or the board maker often needs to change components, and has to place an order for a mounting device each time. Therefore, a mounting device that can be used in both a case of a relatively large component such as TCP and a case of a small component IC chip, and can be used both when a panel is a transparent substrate and when a panel is an opaque substrate. Was required.
Accordingly, it is an object of the present invention to provide a device that meets such a demand and is more convenient than conventional dedicated mounting devices.
[0005]
[Means for Solving the Problems]
The present invention according to claim 1, wherein an anisotropic conductive film sticking stage (1), a temporary pressure bonding stage (2), and a full pressure bonding stage (3) are sequentially provided along a transport path;
A panel transport device (5) for intermittently transporting a panel (4) or a substrate (including a film substrate) to each stage of the transport path;
A tray transport device (7) for intermittently moving a tray containing a large number of parts arranged in a plane and storing it along the tray transport path (6) at an alignment pitch of the parts;
A part temporary adhering means for adsorbing a part from above the tray at a predetermined position in the tray transport path (6) and holding the part in a temporary adhering machine (8), and for temporarily adhering the part to a panel on a temporary adhering stage (2). (9) and
The tray transport device (7) includes:
The parts are TCP, FPC, COF, etc., which are both large parts compared to IC chips, and both parts are IC chips.
In the case of large parts, a large parts tray (10) for storing the parts is stacked in a plurality of stages at the stock position, and the outer periphery of the large parts tray (10) located at the lower end is the tray transport device ( 7) is configured to be guided by the tray guide rail (43) and transferred to the parts pick-up position by the locking pawl (11) for conveyance.
In the case where the parts are IC chips, a plurality of dedicated chip trays (12) each having a large number of IC chips arranged in a plane are firmly arranged and stored on the adapter (13) in a plane. A panel or board part configured to be transferred to the parts pick-up position in a state in which only the adapter (13) is accurately positioned and held removably and immovably relative to the tray transport device (7). Mounting device.
[0006]
The present invention described in claim 2 is based on claim 1,
A head (14) of the temporary crimping machine (8) holding the parts is located above the panel (4),
A detecting end (16) of an optical system detecting device (15) for alignment is located between the head (14) and the panel (4), and the position of the marker (21) for positioning the part and the position of the panel are determined. This is a panel or board part mounting apparatus configured to detect the position of the marker (22) of (4).
[0007]
According to a third aspect of the present invention, in the first or second aspect,
Panel or board part mounting apparatus formed such that the upper surface position of the large part and the upper surface position of the IC chip coincide with each other on the transport path of the tray transport device (7).
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of the present invention will be described with reference to the drawings. The following description is an example of the present invention, and the present invention is not limited to the example.
FIG. 1 is a schematic plan view of a mounting device that can be used for sharing a large part such as a TCP and an IC chip. FIG. 2 is a schematic front view of an optical system detection device 15 used in the device, and is a view taken along the line II-II of FIG. 1, and FIG. FIG. 4 is a schematic front view of the tray 10, and FIG. 5 is an enlarged cross-sectional view taken along the line VV of FIG. FIG. 6 is a left side view of FIG. FIGS. 1 to 6 show thermocompression bonding of outer leads of TCP (driving LSI package), which is a relatively large part, to an electrode group (fine terminal group) provided at the edge of the liquid crystal panel via an anisotropic conductive film. Are connected by
[0009]
The panel part mounting apparatus has a carry-in conveyor 47, a pre-alignment stage 25, a sticking stage 1, a temporary crimping stage 2, a full crimping stage 3, a carry-out stage 26, and a carry-out conveyor 48 from the upstream side of the transport path of the panel 4. . In addition, it has a supply stocker 17 for supplying parts such as TCP to the temporary crimping machine 8 of the temporary crimping stage 2, a tray conveying device 7, a parts take-out device 19, and a pre-alignment unit 27.
First, the panel 4 is supplied to the carry-in conveyor 47, and is positioned in the X direction by the stopper 47a. Then, it is sucked by the suction cup 20 of the first hand 29a, transported in the Y direction, and supplied to the pre-alignment stage 25. The panel 4 placed on the pre-alignment stage 25 is suction-fixed by negative pressure from the lower surface side, and moves and is positioned along the reciprocating drive line b in the Y direction in that state. At the same time, alignment in the θ direction around the center of the panel 4 on the pre-alignment stage 25 is performed, and the panel 4 is slightly driven to rotate.
[0010]
Next, the panel 4 is transferred from the pre-alignment 25 to the attaching stage 1 via the second hand 29. In the attaching stage 1, the anisotropic conductive film is attached to the electrode group portion of the panel 4 by the AFC attaching device 33a. Next, the panel 4 is transported from the attaching stage 1 to the temporary pressure bonding stage 2 via the third hand 30.
In the temporary pressure bonding stage 2, the TCP is temporarily pressed to the edge of the panel 4 via the anisotropic conductive film by the temporary pressure bonding machine 8.
A large number of the TCPs are stored on the tray 10 for large parts in a planar arrangement. In this example, a large number of trays 10 for large parts are stacked in a supply stocker 17 with the four corners supported by a stacking angle 18. FIGS. 4 and 6 show this state. Then, the tray 10 for large parts located at the lowermost end in the stacked state is transported in the X direction by the tray transport device 7.
[0011]
As shown in FIGS. 4 and 6, the tray driving device 7 rotates the driving screw shaft 24 via the coupling 35 by the rotational driving force of the driving motor 34, and drives the cylinder 37 in the X direction via the screwing portion 46. Things. A piston head 38 is provided on the cylinder 37, a bar material 38a is fixed on the piston head 38, and locking claws 11 are projected from both ends thereof. As shown in FIGS. 3 and 5, the locking claws 11 are removably locked to both sides of the tray 10 for large parts. Further, both sides in the width direction of the large-sized part dedicated tray 10 are mounted on a pair of tray guide rails 43. By driving the drive motor 34, the large parts dedicated tray 10 is moved in the X direction, and the large parts dedicated tray 10 is conveyed from the position indicated by the solid line to the position indicated by the chain line in FIG.
[0012]
As shown in FIGS. 3 and 5, the large parts tray 10 has a large number of recesses arranged at regular intervals in the X and Y directions, and the large parts 44 are stored in the respective recesses as shown in FIG. You. Then, from the large parts 44 arranged at the corners of the large parts dedicated tray 10, they are sequentially sucked by the pickup head 19 a of the parts take-out device 19 and delivered to the temporary crimping machine 8 via the pre-alignment unit 27. . That is, the parts take-out device 19 moves on the reciprocating drive line i in the Y direction, and places the sucked large parts 44 on the pre-alignment unit 27. The large parts 44 on the pre-alignment unit 27 are sucked by the head 14 of the temporary crimping machine 8 and transported to the temporary crimping stage 2.
[0013]
When all the large parts 44 stored in the front row in the X direction in FIG. 3 are sequentially conveyed, the parts take-out device 19 drives the drive motor 34 to move one pitch of the concave portion of the large parts dedicated tray 10 and stops. I do. Then, the large parts 44 existing in the concave portions in the second row in the X direction are sequentially transported. The large part 44 located in the pre-alignment unit 27 is attracted to the pre-alignment unit 27, and the pre-alignment unit 27 itself slightly moves in the X direction and the Y direction to be aligned. Next, the large part 44 on the pre-alignment unit 27 is attracted to the head 14 of the temporary crimping machine 8, moves in the Y direction, and is positioned above the edge of the panel 4.
[0014]
On the edge of the panel 4, the detection end 16 of the optical system detection device 15 is arranged so as to be able to enter and exit in the Y direction. As shown in FIG. 2, the optical system detection device 15 is disposed between the lower end of the head 14 and the upper surface of the panel 4 so as to be able to freely enter and exit. Then, the marker 21 of the large part 44 and the marker 22 of the panel 4 adsorbed on the head 14 are detected, and the temporary crimping stage 2 is finely moved in the X and Y directions in FIG. , The head 14 is rotated about its axis. The large parts 44 are temporarily fixed at predetermined positions of the panel 4 by thermocompression bonding via an anisotropic conductive film.
[0015]
Next, the panel 4 is transported from the temporary crimping stage 2 to the final crimping stage 3 by the fourth hand 31, and the large parts 44 are completely thermocompression-fixed to the panel 4 by the head 28 a of the final crimping machine 28 in the final crimping stage 3. You. Next, the panel 4 is transported to the unloading stage 26 by the fifth hand 32, and is transported onto the unloading conveyor 48 via the sixth hand 32a.
When all of the large parts 44 on the large-parts dedicated tray 10 carried by the tray carrying device 7 are gone, the large-parts dedicated tray 10 is carried to the empty trace stocker 23. Next, at that time, a new large-parts dedicated tray 10 located at the bottom of the supply stocker 17 is supplied from a solid line to a chain line, and the large parts 44 are attached to the panel 4 in the same order as described above.
[0016]
Next, FIGS. 7 to 11 show an embodiment in which the part to be crimped to the panel 4 is an IC chip 45. FIG.
The size of the IC chip 45 is significantly smaller than the large parts 44, and is, for example, 1/10 or less. Such IC chips 45 are arranged in the dedicated chip tray 12 and stored two-dimensionally. The dedicated chip tray 12 has a plurality of fixed sizes, and concave portions are formed therein at regular intervals, and the IC chips 45 are stored in the concave portions. As shown in FIG. 7, a large number of such chip trays 12 are accommodated in the adapter 13 in an aligned manner. The width of the adapter 13 is narrower than that of the tray 10 for large parts, and both sides thereof are separated from the pair of tray guide rails 43 as shown in FIG. Then, the adapter 13 is placed on the upper surface of the leg 42 of the tray transport device 7.
[0017]
At this time, a pin 40 protrudes from the upper end of the leg 42, and the pin 40 fits into the pin hole 41 of the adapter 13 as shown in FIG. As shown in FIG. 7, a pair of such pins 40 are provided at both ends in the X direction to accurately position and fix the adapter 13 on the tray transport device 7. The stopper 39 is for simultaneously positioning and fixing a plurality of dedicated chip trays 12. At this time, the piston head 38 of the cylinder 37 contracts downward, and the locking claw 11 of the bar member 38 a is separated from the lower surface of the adapter 13.
By stopping the movement of the adapter 13 by the drive motor 34 by the storage pitch of the IC chips 45, the IC chips 45 in each row can be transferred to the pickup head 19 a of the parts pick-up device 19 in the same manner as the large parts 44. You can do it.
[0018]
In this example, the thickness and the like of the adapter 13 are adjusted so that the upper surface of the IC chip 45 of the dedicated chip tray 12 is in the same position as the upper surface of the large part 44 in FIG. Thereby, the moving distance of the pickup head 19a in the Z direction (gravity direction) can be matched between the case where the pickup head 19a sucks the large part 44 and the case where the IC chip 45 is sucked. That is, the pickup head 19a moves upward in the Y direction of each part position to suck each part, and the pickup head 19a moves in the Z direction to suck each part at its tip.
[0019]
[Action and Effect of the Invention]
The panel or substrate parts mounting apparatus of the present invention can be used whether the tray transport device 7 that transports a tray in which many parts are arranged in a plane is a large part or a small IC chip.
In the case of a large part, a large parts tray 10 for storing the large part is stacked at a stock position in a plurality of stages, and is sequentially taken out from the lower end side and transferred to the parts pickup position by the tray guide rail 43 and the locking claw 11. Therefore, a large number of large parts can be mounted on the panel.
[0020]
In addition, when the parts are small IC chips compared to the large parts, a plurality of dedicated chip trays 12 in which a large number of IC chips are arranged in a plane are firmly arranged and stored on the adapter 13 in a plane. Then, the adapter 13 is accurately positioned and held in the tray transporting device 7 so as to be relatively immovable and detachable. Therefore, small IC chips can be taken out of the parts pickup position one by one accurately.
[0021]
Further, in the above configuration, the detection end 16 of the optical system detection device 15 for alignment can be located between the panel 4 and the head 14 of the temporary crimping machine 8 located above the panel 4. Then, the part positioning marker 21 and the marker 4 on the panel 4 are detected, and they can be matched. In this case, whether the panel 4 is a transparent body or an opaque body can be used for both purposes.
[0022]
Further, in the above configuration, the upper surface position of the large part and the upper surface position of the IC chip can be formed on the transfer path of the tray transfer device 7 so as to match. In this case, the movement of the parts take-out device 19 in the direction of gravity can be made the same for the case of the IC chip and the case of the large parts, and the control is easy.
[Brief description of the drawings]
FIG. 1 is a block diagram of a panel parts mounting apparatus according to the present invention.
FIG. 2 is a schematic front view of an optical system detection device 15 used in the device.
FIG. 3 is a schematic plan view showing a state in which a tray 10 for large parts is stored in a tray transporting device 7 of the device.
FIG. 4 is a schematic front view of the same.
FIG. 5 is an enlarged cross-sectional view taken along the line VV of FIG. 3;
FIG. 6 is a side view of the tray transport device 7;
FIG. 7 is a plan view showing a state in which a large number of dedicated chip trays 12 are attached to the tray transport device 7 via an adapter 13.
FIG. 8 is an enlarged view of a dedicated chip tray 12 on the adapter 13.
FIG. 9 is an enlarged cross-sectional view along IX-IX in FIG. 8;
FIG. 10 is a front view showing a state in which an adapter 13 is attached to the tray transport device 7;
FIG. 11 is a side view of the same.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Adhering stage 2 Temporary pressure bonding stage 3 Final pressure bonding stage 4 Panel 5 Panel transport device 6 Tray transport path 7 Tray transport device 8 Temporary pressure bonding machine 9 Parts temporary pressure bonding means 10 Large-sized parts dedicated tray 10a Edge 11 Locking claw 12 Special chip tray 13 Adapter 14 Head 15 Optical system detection device 16 Detection end 17 Supply stocker 18 Stacking angle 19 Parts unloading device 19a Pickup head 20 Suction cup 21, 22 Marker 23 Empty trace stocker 24 Driving screw shaft 25 Prealignment stage 26 Unloading stage 27 Prealignment Unit 28 Final crimping machine 28a Head 29 Second hand 29a First hand 30 Third hand 31 Fourth hand 32 Fifth hand 32a Sixth hand 33 Guide rail 33a AFC attaching device 34 Drive mode 35 Coupling 36 Bearing 37 Cylinder 38 Piston head 38a Bar material 39 Stopper 40 Pin 41 Pin hole 42 Leg 43 Tray guide rail 44 Large part 45 IC chip 46 Screw-in part 47 Carry-in conveyor 47a Stopper 48 Carry-out conveyor 48a Stoppers a to j Reciprocate Drive line

Claims (3)

An anisotropic conductive film sticking stage (1), a temporary crimping stage (2), and a final crimping stage (3), which are sequentially provided along the transport path;
A panel transport device (5) for intermittently transporting a panel (4) or a substrate (including a film substrate) to each stage of the transport path;
A tray transport device (7) for intermittently moving a tray containing a large number of parts arranged in a plane and storing it along the tray transport path (6) at an alignment pitch of the parts;
A part temporary adhering means for adsorbing a part from above the tray at a predetermined position in the tray transport path (6) and holding the part in a temporary adhering machine (8), and for temporarily adhering the part to a panel on a temporary adhering stage (2). (9) and
The tray transport device (7) includes:
The parts are TCP, FPC, COF, etc., which are both large parts compared to IC chips, and both parts are IC chips.
In the case of large parts, a large parts tray (10) for storing the parts is stacked in a plurality of stages at the stock position, and the outer periphery of the large parts tray (10) located at the lower end is the tray transport device ( 7) is configured to be guided by the tray guide rail (43) and transferred to the parts pick-up position by the locking pawl (11) for conveyance.
In the case where the parts are IC chips, a plurality of dedicated chip trays (12) each having a large number of IC chips arranged in a plane are firmly arranged and stored on the adapter (13) in a plane. A panel or board part configured to be transferred to the parts pick-up position in a state in which only the adapter (13) is accurately positioned and held removably and immovably relative to the tray transport device (7). Mounting device. In claim 1,
A head (14) of the temporary crimping machine (8) holding the parts is located above the panel (4),
A detecting end (16) of an optical system detecting device (15) for alignment is located between the head (14) and the panel (4), and the position of the marker (21) for positioning the part and the position of the panel are determined. A panel or board parts mounting apparatus configured to detect the position of the marker (22) of (4). In claim 1 or claim 2,
A panel or board part mounting apparatus formed such that the upper surface position of the large part and the upper surface position of the IC chip coincide with each other on the transport path of the tray transport device (7).

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