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TWI368285B - Contact bonding device - Google Patents

Contact bonding device

Info

Publication number
TWI368285B
TWI368285B TW096104695A TW96104695A TWI368285B TW I368285 B TWI368285 B TW I368285B TW 096104695 A TW096104695 A TW 096104695A TW 96104695 A TW96104695 A TW 96104695A TW I368285 B TWI368285 B TW I368285B
Authority
TW
Taiwan
Prior art keywords
bonding device
contact bonding
contact
bonding
Prior art date
Application number
TW096104695A
Other languages
English (en)
Other versions
TW200739772A (en
Inventor
Takashi Matsumura
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200739772A publication Critical patent/TW200739772A/zh
Application granted granted Critical
Publication of TWI368285B publication Critical patent/TWI368285B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/022—Moulds for compacting material in powder, granular of pasta form
    • B30B15/024—Moulds for compacting material in powder, granular of pasta form using elastic mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/073—
    • H10W72/07335—
    • H10W72/07338—
    • H10W72/07339—
    • H10W72/30—
    • H10W72/325—
    • H10W72/351—
    • H10W72/354—
    • H10W74/15—
    • H10W90/22—
    • H10W90/724—
    • H10W90/734—
    • H10W90/735—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Fluid Pressure (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW096104695A 2006-02-10 2007-02-09 Contact bonding device TWI368285B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006033745A JP4996859B2 (ja) 2006-02-10 2006-02-10 圧着装置

Publications (2)

Publication Number Publication Date
TW200739772A TW200739772A (en) 2007-10-16
TWI368285B true TWI368285B (en) 2012-07-11

Family

ID=38345229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104695A TWI368285B (en) 2006-02-10 2007-02-09 Contact bonding device

Country Status (7)

Country Link
US (2) US20090014498A1 (zh)
EP (3) EP1983564A4 (zh)
JP (1) JP4996859B2 (zh)
KR (1) KR101235532B1 (zh)
CN (1) CN101379603B (zh)
TW (1) TWI368285B (zh)
WO (1) WO2007091635A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5164499B2 (ja) * 2007-09-27 2013-03-21 デクセリアルズ株式会社 電子部品の実装方法及び電子部品実装基板
JP2009141269A (ja) * 2007-12-10 2009-06-25 Sony Chemical & Information Device Corp 電気部品の実装方法及び実装装置
JP5614217B2 (ja) * 2010-10-07 2014-10-29 デクセリアルズ株式会社 マルチチップ実装用緩衝フィルム
JP2013033925A (ja) * 2011-07-01 2013-02-14 Tokyo Electron Ltd 洗浄方法、プログラム、コンピュータ記憶媒体、洗浄装置及び剥離システム
CN103200780A (zh) * 2012-01-09 2013-07-10 苏州世鼎电子有限公司 铜箔线路与罩体基板的热压贴合方法
DE102013003527A1 (de) * 2013-03-04 2014-09-04 Danfoss Silicon Power Gmbh Vorrichtung zum Niedertemperatur-Drucksintern, Verfahren zum Niedertemperatur-Drucksintern und leistungselektronische Baugruppe
JP2015046573A (ja) * 2013-07-31 2015-03-12 日東電工株式会社 貼着治具および電子装置の製造方法
US9910646B2 (en) * 2015-12-26 2018-03-06 Intel Corporation Technologies for native code invocation using binary analysis
TWI638160B (zh) * 2017-12-29 2018-10-11 鴻勁精密股份有限公司 Gland module, test device with gland module and test classification device thereof
CN108710225B (zh) * 2018-05-24 2021-01-26 京东方科技集团股份有限公司 一种绑定设备及其控制方法
WO2020095573A1 (ja) * 2018-11-07 2020-05-14 ユニチカ株式会社 浄水カートリッジ
US20210260814A1 (en) * 2020-02-21 2021-08-26 Skate One Corp. Apparatus and method for pressing a workpiece
CN113870704B (zh) * 2021-09-27 2023-06-02 上海天马微电子有限公司 显示装置
CN114103088B (zh) * 2021-11-26 2022-07-08 惠州深科达智能装备有限公司 一种导电膜贴附方法及设备
KR102730348B1 (ko) * 2022-11-28 2024-11-15 (주)미래컴퍼니 전고체전지 제조장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3557446A (en) * 1968-12-16 1971-01-26 Western Electric Co Method of forming printed circuit board through-connections
SE408383B (sv) * 1976-04-08 1979-06-11 Asea Ab Press for formning av platar och dylikt med hjelp av en formdyna, som under formningsskedet er innesluten i en kavitet, som bildas av en ovre och en undre verktygsdel av vilka minst en er rorligt anordnad i ett ...
JP2001501547A (ja) * 1992-06-12 2001-02-06 アルミナム カンパニー オブ アメリカ 非平面を有する多層構造の製造方法
JP2925946B2 (ja) * 1994-09-19 1999-07-28 沖電気工業株式会社 異方導電性フィルムを用いた半導体装置の実装方法及びそのための装置
US5707480A (en) * 1995-09-19 1998-01-13 International Business Machines Corporation Apparatus for forming multiple cavity products
JP3456146B2 (ja) * 1998-06-11 2003-10-14 松下電器産業株式会社 バンプ付電子部品のボンディング装置およびボンディング方法
JP4077982B2 (ja) * 1998-06-26 2008-04-23 日機装株式会社 加圧成形用型
JP4157672B2 (ja) * 1999-09-06 2008-10-01 日機装株式会社 加圧成形装置
JP4513235B2 (ja) 2001-05-31 2010-07-28 ソニー株式会社 フリップチップ実装装置
JP4718734B2 (ja) * 2001-09-12 2011-07-06 日機装株式会社 回路素子の実装方法
WO2003025997A1 (fr) * 2001-09-12 2003-03-27 Nikkiso Co.,Ltd. Procede et presse de montage de circuits
JP4064808B2 (ja) * 2001-12-25 2008-03-19 東芝松下ディスプレイテクノロジー株式会社 熱圧着装置及び熱圧着方法
JP3949072B2 (ja) * 2003-03-26 2007-07-25 日機装株式会社 加圧装置
JP3921459B2 (ja) 2003-07-11 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装方法及び実装装置
JP4925669B2 (ja) * 2006-01-13 2012-05-09 ソニーケミカル＆インフォメーションデバイス株式会社 圧着装置及び実装方法

Also Published As

Publication number Publication date
CN101379603B (zh) 2011-05-25
US20090014498A1 (en) 2009-01-15
US20100186894A1 (en) 2010-07-29
KR20080101895A (ko) 2008-11-21
EP1983564A4 (en) 2012-07-04
KR101235532B1 (ko) 2013-02-21
HK1126315A1 (zh) 2009-08-28
EP2239131A1 (en) 2010-10-13
US8241455B2 (en) 2012-08-14
TW200739772A (en) 2007-10-16
CN101379603A (zh) 2009-03-04
JP2007214434A (ja) 2007-08-23
EP1983564A1 (en) 2008-10-22
JP4996859B2 (ja) 2012-08-08
EP2230073A1 (en) 2010-09-22
WO2007091635A1 (ja) 2007-08-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees