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TWI368269B - Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape - Google Patents

Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape

Info

Publication number
TWI368269B
TWI368269B TW096142774A TW96142774A TWI368269B TW I368269 B TWI368269 B TW I368269B TW 096142774 A TW096142774 A TW 096142774A TW 96142774 A TW96142774 A TW 96142774A TW I368269 B TWI368269 B TW I368269B
Authority
TW
Taiwan
Prior art keywords
cutting
protective tape
semiconductor wafer
tape
protective
Prior art date
Application number
TW096142774A
Other languages
English (en)
Other versions
TW200834700A (en
Inventor
Yasuji Kaneshima
Takashi Nishinohama
Masayuki Yamamoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200834700A publication Critical patent/TW200834700A/zh
Application granted granted Critical
Publication of TWI368269B publication Critical patent/TWI368269B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
    • H10W99/00—
    • H10P72/0442—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/162—With control means responsive to replaceable or selectable information program
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/162—With control means responsive to replaceable or selectable information program
    • Y10T83/173—Arithmetically determined program
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8776—Constantly urged tool or tool support [e.g., spring biased]

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW096142774A 2006-11-14 2007-11-13 Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape TWI368269B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006307726A JP4642002B2 (ja) 2006-11-14 2006-11-14 半導体ウエハの保護テープ切断方法および保護テープ切断装置

Publications (2)

Publication Number Publication Date
TW200834700A TW200834700A (en) 2008-08-16
TWI368269B true TWI368269B (en) 2012-07-11

Family

ID=39369694

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096142774A TWI368269B (en) 2006-11-14 2007-11-13 Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape

Country Status (5)

Country Link
US (1) US8042441B2 (zh)
JP (1) JP4642002B2 (zh)
KR (1) KR101311567B1 (zh)
CN (1) CN101183641B (zh)
TW (1) TWI368269B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5412260B2 (ja) * 2009-12-10 2014-02-12 日東電工株式会社 粘着テープ貼付け方法およびこれを用いた装置
KR101981639B1 (ko) * 2012-11-13 2019-05-27 삼성디스플레이 주식회사 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법
JP6122311B2 (ja) * 2013-02-28 2017-04-26 日東電工株式会社 粘着テープ切断方法および粘着テープ片切断装置
JP7360812B2 (ja) * 2019-05-17 2023-10-13 リンテック株式会社 シート支持装置およびシート支持方法
JP7273614B2 (ja) * 2019-05-17 2023-05-15 リンテック株式会社 シート支持装置およびシート支持方法
CN116490311B (zh) * 2020-11-17 2025-04-25 星技术株式会社 工件加工装置以及具备该工件加工装置的超声波加工装置
CN112318691A (zh) * 2020-12-04 2021-02-05 禹州市国粹钧窑有限责任公司 一种钧瓷瓶口加工方法及装置
CN114030094B (zh) * 2021-11-18 2022-12-09 江苏纳沛斯半导体有限公司 一种可防止产生崩边的半导体晶圆制备的硅片划片系统
KR20250159232A (ko) * 2023-03-15 2025-11-10 어플라이드 머티어리얼스, 인코포레이티드 다이 전사 기판들용 인터포저 적층 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603609A (en) * 1983-10-21 1986-08-05 Disco Abrasive Systems, Ltd. Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer
US4626320A (en) * 1984-02-22 1986-12-02 Conoco Inc. Method for automated de-coking
JPH01143211A (ja) * 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk ウエハーに対する保護テープの貼付け切り抜き方法および装置
JPH10112492A (ja) * 1996-10-07 1998-04-28 Teikoku Seiki Kk ウェハ保護テープの裁断方法及びその装置
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
JP3919292B2 (ja) * 1997-05-30 2007-05-23 リンテック株式会社 半導体ウェハ保護フィルムの切断方法および装置
JP3983053B2 (ja) * 2002-01-17 2007-09-26 日東電工株式会社 保護テープの切断方法およびそれを用いた保護テープ貼付装置
JP2004025402A (ja) 2002-06-27 2004-01-29 Lintec Corp 半導体ウェハの保護テープの切断方法および切断装置
JP4530638B2 (ja) * 2003-10-07 2010-08-25 日東電工株式会社 半導体ウエハへの保護テープ貼付方法及び貼付装置
JP4472316B2 (ja) 2003-11-28 2010-06-02 日東電工株式会社 粘着テープ切断方法及び粘着テープ切断装置
JP4387879B2 (ja) * 2004-06-17 2009-12-24 株式会社ディスコ 保護テープ装着方法および保護テープ装着装置
JP4450696B2 (ja) * 2004-08-19 2010-04-14 日東電工株式会社 保護テープ貼付け装置

Also Published As

Publication number Publication date
KR101311567B1 (ko) 2013-09-26
CN101183641B (zh) 2011-04-20
JP4642002B2 (ja) 2011-03-02
TW200834700A (en) 2008-08-16
KR20080043718A (ko) 2008-05-19
US8042441B2 (en) 2011-10-25
JP2008124307A (ja) 2008-05-29
US20080113492A1 (en) 2008-05-15
CN101183641A (zh) 2008-05-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees