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GB2465592B - Method and device for facilitating separation of sliced wafers - Google Patents

Method and device for facilitating separation of sliced wafers

Info

Publication number
GB2465592B
GB2465592B GB0821358A GB0821358A GB2465592B GB 2465592 B GB2465592 B GB 2465592B GB 0821358 A GB0821358 A GB 0821358A GB 0821358 A GB0821358 A GB 0821358A GB 2465592 B GB2465592 B GB 2465592B
Authority
GB
United Kingdom
Prior art keywords
facilitating separation
sliced wafers
sliced
wafers
facilitating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0821358A
Other versions
GB0821358D0 (en
GB2465592A (en
Inventor
Boaz Nishri
Ariel Hildeshem
Svetlana Brodetski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CoreFlow Ltd
Original Assignee
CoreFlow Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CoreFlow Ltd filed Critical CoreFlow Ltd
Priority to GB0821358A priority Critical patent/GB2465592B/en
Publication of GB0821358D0 publication Critical patent/GB0821358D0/en
Priority to PCT/IL2009/001041 priority patent/WO2010058389A1/en
Priority to KR1020117014314A priority patent/KR20110086764A/en
Publication of GB2465592A publication Critical patent/GB2465592A/en
Application granted granted Critical
Publication of GB2465592B publication Critical patent/GB2465592B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H10P72/0428—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00—De-stacking of articles
    • B65G59/08—De-stacking after preliminary tilting of the stack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H10P72/0416—
    • H10P72/3308—
    • H10P72/7602—
    • H10P72/78—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB0821358A 2008-11-21 2008-11-21 Method and device for facilitating separation of sliced wafers Expired - Fee Related GB2465592B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0821358A GB2465592B (en) 2008-11-21 2008-11-21 Method and device for facilitating separation of sliced wafers
PCT/IL2009/001041 WO2010058389A1 (en) 2008-11-21 2009-11-05 Method and device for facilitating separation of sliced wafers
KR1020117014314A KR20110086764A (en) 2008-11-21 2009-11-05 Method and apparatus for facilitating separation of sliced wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0821358A GB2465592B (en) 2008-11-21 2008-11-21 Method and device for facilitating separation of sliced wafers

Publications (3)

Publication Number Publication Date
GB0821358D0 GB0821358D0 (en) 2008-12-31
GB2465592A GB2465592A (en) 2010-05-26
GB2465592B true GB2465592B (en) 2011-12-07

Family

ID=40230671

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0821358A Expired - Fee Related GB2465592B (en) 2008-11-21 2008-11-21 Method and device for facilitating separation of sliced wafers

Country Status (3)

Country Link
KR (1) KR20110086764A (en)
GB (1) GB2465592B (en)
WO (1) WO2010058389A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109396A (en) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 Wafer peeling device

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112010004025A5 (en) * 2009-10-13 2012-10-04 Egon Hübel METHOD AND DEVICE FOR SUBSTRATE DISCOVERY
NO20093232A1 (en) * 2009-10-28 2011-04-29 Dynatec Engineering As Wafer Handling Device
DE102012221452A1 (en) 2012-07-20 2014-01-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device for separating wafers
KR101964568B1 (en) 2018-11-29 2019-04-01 손귀욱 A method of separating a semiconductor wafer and a method of separating a semiconductor wafer into a sheet
KR101964567B1 (en) 2018-11-29 2019-04-01 손귀욱 Single wafer separator for semiconductor wafers
CN111744796A (en) * 2019-05-14 2020-10-09 北京京东尚科信息技术有限公司 Goods picking system and goods picking method
KR102089225B1 (en) 2019-10-22 2020-05-26 손귀욱 Single wafer separator for semiconductor wafers
CN113753568A (en) * 2021-09-29 2021-12-07 无锡根深地固科技有限公司 Automatic unstacking device for flat cultivation containers
KR102519871B1 (en) 2022-10-28 2023-04-11 손귀욱 Single Wafer Separation System
KR102507055B1 (en) 2022-10-28 2023-03-07 손귀욱 Single wafer separator for semiconductor wafers
KR102507049B1 (en) 2022-10-28 2023-03-07 손귀욱 Single wafer separator for semiconductor wafers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010046435A1 (en) * 2000-05-26 2001-11-29 Automation Technology, Inc. Method and apparatus for separating wafers
EP1286385A2 (en) * 2001-08-21 2003-02-26 Infineon Technologies AG Device for debonding thin wafers
US20080213079A1 (en) * 2006-07-06 2008-09-04 Richard Herter Apparatus and Method for Separating and Transporting Substrates

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4100526A1 (en) * 1991-01-10 1992-07-16 Wacker Chemitronic DEVICE AND METHOD FOR AUTOMATICALLY SEPARATING STACKED DISCS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010046435A1 (en) * 2000-05-26 2001-11-29 Automation Technology, Inc. Method and apparatus for separating wafers
EP1286385A2 (en) * 2001-08-21 2003-02-26 Infineon Technologies AG Device for debonding thin wafers
US20080213079A1 (en) * 2006-07-06 2008-09-04 Richard Herter Apparatus and Method for Separating and Transporting Substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109396A (en) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 Wafer peeling device

Also Published As

Publication number Publication date
KR20110086764A (en) 2011-07-29
WO2010058389A1 (en) 2010-05-27
GB0821358D0 (en) 2008-12-31
GB2465592A (en) 2010-05-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20231121