[go: up one dir, main page]

TWI365518B - Leadless semiconductor package and its assembly for improving heat dissipation - Google Patents

Leadless semiconductor package and its assembly for improving heat dissipation

Info

Publication number
TWI365518B
TWI365518B TW097142946A TW97142946A TWI365518B TW I365518 B TWI365518 B TW I365518B TW 097142946 A TW097142946 A TW 097142946A TW 97142946 A TW97142946 A TW 97142946A TW I365518 B TWI365518 B TW I365518B
Authority
TW
Taiwan
Prior art keywords
assembly
heat dissipation
semiconductor package
improving heat
leadless semiconductor
Prior art date
Application number
TW097142946A
Other languages
Chinese (zh)
Other versions
TW201019426A (en
Inventor
Hwe Zhong Chen
Chi Chung Yu
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW097142946A priority Critical patent/TWI365518B/en
Publication of TW201019426A publication Critical patent/TW201019426A/en
Application granted granted Critical
Publication of TWI365518B publication Critical patent/TWI365518B/en

Links

Classifications

    • H10W72/536—
    • H10W72/5363—
    • H10W72/5473—
    • H10W72/884—
    • H10W74/00—
    • H10W90/732—
    • H10W90/736—
    • H10W90/756—
TW097142946A 2008-11-06 2008-11-06 Leadless semiconductor package and its assembly for improving heat dissipation TWI365518B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097142946A TWI365518B (en) 2008-11-06 2008-11-06 Leadless semiconductor package and its assembly for improving heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097142946A TWI365518B (en) 2008-11-06 2008-11-06 Leadless semiconductor package and its assembly for improving heat dissipation

Publications (2)

Publication Number Publication Date
TW201019426A TW201019426A (en) 2010-05-16
TWI365518B true TWI365518B (en) 2012-06-01

Family

ID=44831732

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097142946A TWI365518B (en) 2008-11-06 2008-11-06 Leadless semiconductor package and its assembly for improving heat dissipation

Country Status (1)

Country Link
TW (1) TWI365518B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9596732B2 (en) 2014-08-22 2017-03-14 Au Optronics Corporation Display module manufacturing method and display module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105097727A (en) * 2015-06-23 2015-11-25 苏州日月新半导体有限公司 Semiconductor packaging structure and packaging method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9596732B2 (en) 2014-08-22 2017-03-14 Au Optronics Corporation Display module manufacturing method and display module
TWI584703B (en) * 2014-08-22 2017-05-21 友達光電股份有限公司 Display module substrate and manufacturing method thereof
US9887215B2 (en) 2014-08-22 2018-02-06 Au Optronics Corporation Display module manufacturing method and display module

Also Published As

Publication number Publication date
TW201019426A (en) 2010-05-16

Similar Documents

Publication Publication Date Title
TWI370530B (en) Semiconductor package having an antenna
TWI341005B (en) Semiconductor die and package structure
TWI366910B (en) Semiconductor package
EP2239773A4 (en) Semiconductor chip package and manufacturing method thereof
TWI369765B (en) Package and semiconductor device
TWI368301B (en) Semiconductor package using an active type heat-spreading element
TWI372476B (en) Circuit structure of package carrier and multi-chip package
SG10201402583TA (en) Resin composition for encapsulating semiconductor and semiconductor device
TWI372450B (en) Semiconductor package
EP2423955B8 (en) Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein
TWI369767B (en) Heat sink structure and semiconductor package as well as method for configuring heat sinks on a semiconductor package
EP2172970A4 (en) Semiconductor package and its manufacturing method
TWI365521B (en) Semiconductor package structure with heat sink
PL2193556T3 (en) Radiation-emitting semiconductor chip
TWI339881B (en) Chip package
GB0822089D0 (en) Integrated circuit package
TWI349357B (en) Emi shielded semiconductor package and method for manufacturing the same
TWI369766B (en) Heat slug and semiconductor chip package
TWI365520B (en) Heat dissipation package for heat generation element
TWI347664B (en) Semiconductor chip package structure
TWI365518B (en) Leadless semiconductor package and its assembly for improving heat dissipation
TWI371096B (en) Multi-chip package structure and forming method thereof
TWI317996B (en) Chip package structure and heat sink for chip package
TWI349993B (en) Semiconductor package
TWM401870U (en) Heat-dissipating semiconductor package

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees