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TWI349993B - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
TWI349993B
TWI349993B TW096127833A TW96127833A TWI349993B TW I349993 B TWI349993 B TW I349993B TW 096127833 A TW096127833 A TW 096127833A TW 96127833 A TW96127833 A TW 96127833A TW I349993 B TWI349993 B TW I349993B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
TW096127833A
Other languages
Chinese (zh)
Other versions
TW200905848A (en
Inventor
Chia Fu Wu
Cheng Yin Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW096127833A priority Critical patent/TWI349993B/en
Publication of TW200905848A publication Critical patent/TW200905848A/en
Application granted granted Critical
Publication of TWI349993B publication Critical patent/TWI349993B/en

Links

Classifications

    • H10W74/142—
    • H10W74/15—
    • H10W90/754—
TW096127833A 2007-07-30 2007-07-30 Semiconductor package TWI349993B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096127833A TWI349993B (en) 2007-07-30 2007-07-30 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096127833A TWI349993B (en) 2007-07-30 2007-07-30 Semiconductor package

Publications (2)

Publication Number Publication Date
TW200905848A TW200905848A (en) 2009-02-01
TWI349993B true TWI349993B (en) 2011-10-01

Family

ID=44722885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127833A TWI349993B (en) 2007-07-30 2007-07-30 Semiconductor package

Country Status (1)

Country Link
TW (1) TWI349993B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474452B (en) * 2011-09-22 2015-02-21 矽品精密工業股份有限公司 Substrate, semiconductor package and method of manufacturing same
CN114388487A (en) * 2020-10-16 2022-04-22 虹晶科技股份有限公司 Packaging structure and preparation method thereof

Also Published As

Publication number Publication date
TW200905848A (en) 2009-02-01

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