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TWI371096B - Multi-chip package structure and forming method thereof - Google Patents

Multi-chip package structure and forming method thereof

Info

Publication number
TWI371096B
TWI371096B TW097147901A TW97147901A TWI371096B TW I371096 B TWI371096 B TW I371096B TW 097147901 A TW097147901 A TW 097147901A TW 97147901 A TW97147901 A TW 97147901A TW I371096 B TWI371096 B TW I371096B
Authority
TW
Taiwan
Prior art keywords
forming method
package structure
chip package
chip
forming
Prior art date
Application number
TW097147901A
Other languages
Chinese (zh)
Other versions
TW201023318A (en
Inventor
Chih Wei Wu
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW097147901A priority Critical patent/TWI371096B/en
Publication of TW201023318A publication Critical patent/TW201023318A/en
Application granted granted Critical
Publication of TWI371096B publication Critical patent/TWI371096B/en

Links

Classifications

    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
TW097147901A 2008-12-09 2008-12-09 Multi-chip package structure and forming method thereof TWI371096B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097147901A TWI371096B (en) 2008-12-09 2008-12-09 Multi-chip package structure and forming method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097147901A TWI371096B (en) 2008-12-09 2008-12-09 Multi-chip package structure and forming method thereof

Publications (2)

Publication Number Publication Date
TW201023318A TW201023318A (en) 2010-06-16
TWI371096B true TWI371096B (en) 2012-08-21

Family

ID=44833335

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097147901A TWI371096B (en) 2008-12-09 2008-12-09 Multi-chip package structure and forming method thereof

Country Status (1)

Country Link
TW (1) TWI371096B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9385006B2 (en) 2012-06-21 2016-07-05 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming an embedded SOP fan-out package
KR101672622B1 (en) * 2015-02-09 2016-11-03 앰코 테크놀로지 코리아 주식회사 Semiconductor device and manufacturing method thereof
US10608642B2 (en) * 2018-02-01 2020-03-31 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips comprising non-volatile radom access memory cells

Also Published As

Publication number Publication date
TW201023318A (en) 2010-06-16

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