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TWI354763B - Heat treatment apparatus - Google Patents

Heat treatment apparatus Download PDF

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Publication number
TWI354763B
TWI354763B TW095123564A TW95123564A TWI354763B TW I354763 B TWI354763 B TW I354763B TW 095123564 A TW095123564 A TW 095123564A TW 95123564 A TW95123564 A TW 95123564A TW I354763 B TWI354763 B TW I354763B
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Taiwan
Prior art keywords
gas
period
heat treatment
air
heated
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TW095123564A
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Chinese (zh)
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TW200714857A (en
Inventor
Akira Fukushima
Masao Yasaka
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Espec Corp
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    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/0006Details, accessories not peculiar to any of the following furnaces
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining or circulating atmospheres in heating chambers
    • F27D7/02Supplying steam, vapour, gases or liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining or circulating atmospheres in heating chambers
    • F27D7/06Forming or maintaining special atmospheres or vacuum within heating chambers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Furnace Details (AREA)

Description

1354763 九、發明說明: 【發明所屬之技術領域】 本發明係關於藉由熱風對基板等被加熱物進行熱處理之 熱處理裝置。 【先前技術】 自先則’下述專利文獻1中所揭示之熱處理裝置使用於 如液晶顯示器(LCD : Liquid Crysta丨Display)或電漿顯示器 (PDP : Piasma Display)、有機肌(士价〇 ,電 致發光)顯示器等之平板顯示器(FPD : Flat Panel dispiay) 之製作。熱處理裝置係如下者,即將預先對玻璃板等基板 (被加熱物)塗佈特定之溶液後經加熱乾燥者收容至熱處理 至内,其後將其暴露於導入至熱處理室内之特定溫度之熱 風下進行熱處理(燒成)。 [專利文獻1]曰本專利第2971771號公報 [發明所欲解決之問題] 先前技術之熱處理裝置具有用以取出放入被加熱物之開 口或間隙等’且並非為完全密閉狀態,上述開口或間隙之 附近較易形成低溫。因此,伴隨熱處理,塗佈於基板上之 特定之溶液等汽化後產生之生成氣體’於開口或間隙之附 近冷卻並固化,成為所謂之昇華物。昇華物呈顆粒狀或焦 油狀’存在如下問題,即不僅污染熱處理裝置内並使被加 熱物之品質降低’亦於取出放入被加熱物時洩漏至熱處理 裝置之外部。X ’存在如下問題,即於生成氣體自開口流 出之If形_ ’於熱處理裝置外,生成氣體冷卻後成為所謂 112189.doc “54763 置多數個載置段71。如圖3中箭頭所示,於形成於載置段 71、71之間之間隙中,可水平拔插板體w。此時,板體w 以將由臈狀體9c所覆蓋之表面9b侧朝向上方且使膜狀體“ 不直接接觸載置段71之方式載置。載置架7〇連接於未圖示 之升降裝置,且根據需要,可於熱處理室12内上下運動。1. Technical Field of the Invention The present invention relates to a heat treatment apparatus for heat-treating an object to be heated such as a substrate by hot air. [Prior Art] The heat treatment apparatus disclosed in the following Patent Document 1 is used for, for example, a liquid crystal display (LCD: Liquid Crysta® Display) or a plasma display (PDP: Piasma Display), organic muscle (price, 〇, Electroluminescence) Production of flat panel displays (FPD: Flat Panel dispiay) such as displays. The heat treatment apparatus is a method in which a specific solution is applied to a substrate (heated material) such as a glass plate in advance, and then heat-dried to a heat treatment, and then exposed to a hot air introduced to a specific temperature in the heat treatment chamber. Heat treatment (baking) is performed. [Patent Document 1] Japanese Patent No. 29177711 [Problems to be Solved by the Invention] The heat treatment apparatus of the prior art has an opening or a gap for taking out an object to be heated, and is not completely sealed, and the above-mentioned opening or It is easier to form a low temperature near the gap. Therefore, with the heat treatment, the generated gas generated by vaporization of a specific solution or the like applied on the substrate is cooled and solidified in the vicinity of the opening or the gap, and becomes a so-called sublimate. The sublimate is in the form of particles or tar. There is a problem that not only the inside of the heat treatment apparatus is contaminated but also the quality of the object to be heated is lowered, and it is leaked to the outside of the heat treatment apparatus when it is taken out and placed in the object to be heated. X' has the problem that the generated form of the gas from the opening is formed in the heat treatment device, and the generated gas is cooled to become so-called 112189.doc "54763, a plurality of mounting segments 71. As shown by the arrows in FIG. The plate body w can be horizontally inserted and removed in the gap formed between the placing sections 71, 71. At this time, the plate body w faces the surface 9b side covered by the beak body 9c upward and the film body "no" It is placed in direct contact with the mounting section 71. The mounting frame 7 is connected to a lifting device (not shown) and can be moved up and down in the heat treatment chamber 12 as needed.

如圖1所示,於熱處理室12之背面側,設有保養時所使 用之門7。間壁43固定於與門7對向之位置上,且可於進行 保養等時根據需要而卸除。 管17係藉由從隔熱材料所構成之周壁13a〜13d包圍四方 之空間,且成為用以使自熱處理室12所排出之空氣於上游 側循環之流路之部分。 右更八體地進行說明,則空氣調節部11,如圖丨所示, 大致分為熱風供給機構14(熱源)、管17、以及機器室U。 熱風供給機構14具有加熱空氣等之加熱功能,與將經加熱 工風等送人熱處理室12内之送風功能^管丨7係以由間壁 ,43間隔且包圍熱處理室12之周圍之方坏置之空氣流 :’且形成將自熱處理室12排出之空氣返還至熱風供給機 構14之空氣流路。 *、’、處理至12係形成於以對向之方式配置之2枚間壁 43之間之空間。如圖1或圖4、圖5所示,於熱處理室12之 2側(圖1中載置架7〇之下側,圖4、圖5中之左側)設有換 广,該換裝部6係用以藉由未圖示之機器手臂等移載裝 而取出放入板體W(被加熱物)者。As shown in Fig. 1, on the back side of the heat treatment chamber 12, a door 7 for maintenance is provided. The partition wall 43 is fixed at a position opposed to the door 7, and can be removed as needed during maintenance or the like. The tube 17 surrounds the four spaces by the peripheral walls 13a to 13d formed of the heat insulating material, and is a portion for circulating the air discharged from the heat treatment chamber 12 on the upstream side. The air conditioning unit 11 is roughly divided into a hot air supply mechanism 14 (heat source), a tube 17, and a machine room U as shown in FIG. The hot air supply mechanism 14 has a heating function of heating air or the like, and is connected to the air supply function of the heat treatment chamber 12 by the heated work air or the like so as to be spaced apart by the partition wall 43, and surrounding the periphery of the heat treatment chamber 12 The air flow is set to 'and an air flow path for returning the air discharged from the heat treatment chamber 12 to the hot air supply mechanism 14 is formed. *, ', processing to 12 is formed in the space between the two partition walls 43 arranged in the opposite direction. As shown in FIG. 1 or FIG. 4 and FIG. 5, on the side 2 of the heat treatment chamber 12 (the lower side of the mounting frame 7〇 in FIG. 1, the left side in FIGS. 4 and 5), the replacement portion is provided. 6 is used to take out the board W (the object to be heated) by moving it by a robot arm or the like (not shown).

若更具體地進行說明,則換裂部6係絲出放入板體W H2189.doc •13- 1354763 而权置之部位。m j-a i, i. 於叹置於熱處理室12之正面側之周壁13b 上’形成有7個開口40。開口 4〇,如圖4所*,以排列於上 下方向之方式而形成。於周壁m之開口 4〇上安裝有閉門 1 0 〇 閉門10構成為例如藉由氣虹或馬達等致動器而作動。閘 ’ 1 〇可自上下滑動者或向内側或外側打開者等中適當選 擇。本實施形態之閘門10 ’如圖4中以二點鎖線所示,構 、為可藉由致動器之動力而倒向換裝部6之内側後打開 口 40 ° 於相對於周壁m平行配置之間壁41上,於與周壁⑽之 開口 40對向之位置上設有開口 5〇。因此,可藉由打開閘門 10而對熱處理室12取出放入板體We 如圖4及圖5所示,管17藉由以橋接於周壁咖與間壁“ 之方式固定之隔板47a、47b間而隔為上下。又,如圖"斤 示,隔板47a、47b之兩端部分藉由以與之垂直之方式安裝 之隔板術,所堵塞。藉此,於熱處理裝置!之正面側 上形成有換裝部6 ’該換裝部6自開口 4〇連結於開口 5〇,且 與形成於周壁13b及間壁41之間之管17隔絕。 隔板47a如圖4及圖5所示,係作為各換裝部6之上方側之 間隔而設置者。於隔板47a上設有連通孔53〇因此,可經 由連通孔53a,將存在於換裝部6内之氣體吸人管^側。 即,管Η作為自換裝部6側吸引氣體之氣體吸引機構而起 作用。 又’隔板47b如圖4及圖5所示,於為打開開口⑽而使閘 U2189.doc ]4 1354763 3頃"時w不干涉閘門〗〇之方式成形為段狀。因此, 搞板w於間⑽傾倒時,大部分隱藏於閉⑽之背側, ::成形為段狀之段部54未隱藏於閘門…又,於段部Η上 μ連通孔53b。因此,換裝部6可經由連通孔別,於與 官1 7之間使氣體流通。 相對於換t部6,於鄰接於自熱處理室12 $漏之氣體之 流動方向⑻之箭頭X方向)外側之位置上,設有排氣管 74(氣體吸引機構)與空氣喷嘴7 5(氣流產生機構卜排氣管 74設置於相對於換裝部6之開口 4〇偏上方之位置。排氣管 74係用以吸入並回收自開口 4〇洩漏之氣體者。排氣管Μ含 有用以吸入氣體之進氣口 74a。 办空氣噴嘴75係噴出由如圖6所示之空氣系統⑽斤供給之 空氣者。空氣喷嘴75位於排氣f 74之下方。^氣喷嘴75, 如圖5中箭頭Y所示,可向排氣f74側喷出空氣後形成氣簾 A1。氣簾幻相對設置於排氣管74上之進氣口 %之開口位 置’形成於偏向自熱處理室茂漏之氣體之流動方向(箭頭χ 方向)之下游側之位置。 如上所述,熱處理裝置丨含有7個換裝部6,且於每個換 裝部6上設有空氣喷嘴75。各空氣噴嘴75構成為可由如_ 所示之空氣系統68而供給空氣。空氣系統68係用以自未圖 示之供給源將潔淨之空氣供給至各空氣噴嘴75者。 空氣系統68,如圖6所示,含有連結於空氣之供給源之 主流路8 8。於主流路8 8上設有可以丰#^> 降“上„又頁j以予動進行開閉之元閥 9〇、流量調節用之電磁閥91、以及壓力調節閥92。主流路 U2189.doc •15· 1354763 88於相對壓力調節閥92之空氣之流動方向的下游侧,分為 7個系統之分支流路89(以下’根據需要,將各自稱為分支 流路89a〜89g)。 分支流路89&〜89§對應於以各自排列於上下方向之方式 • 設置之7個換裝部6而設置。分支流路89a〜89g實質上各自 ' $相同之構成。若更具體地進行說明,則分支流路89a〜 89g作為於中間用以調節空氣之流量之流量調節機構為 設有流量調節閥93、94與電磁閥95之構成…至於分支 μ路89a ’其構成為於比流量調節閥%、或電磁閥%更 靠近空氣之流動方向之上游側,設有由數位流量開關等構 • 成=流量檢測褒置1〇〇。分支流路89a〜89g構成為可藉由 • 調節流量調節閥93、94及電磁閥95而調節空氣之流量。 流量調節閥93與電磁闕95串聯配置於空氣之流動方向 上。又,流量調節閥94設於連接於分支流路89a之迂迴路 96上’且與電磁’為並聯関系。即’分支流路叫構成 籲冑如下’即可藉由電磁閥95之開閉而調節於比流量調節閥 94及電磁閥95更下游側流動之空氣之流量,並且可藉由調 節流量調節閥94之開度而對流量進行微調。 於分支流路89a〜89g中,於比流量調節閥94及電磁㈣ 更靠近空氣之流動方向之下游侧,設有用以補充空氣中所 含有之雜質之過濾器97。分支流路89a〜89g構成為可藉由 配置於比過遽器97更下游側之部位上之加熱器98(氣體加 熱機構)而加熱空氣《即,於本實施形態之熱處理裝置^ 中,加熱器98配置於比構成空氣系統68之主流路“與分支 112189.doc -16- 1354763 流路89a〜89g之分支部分T更靠近空氣之流動方向之下游 側。又,作為流量調節機構起作用之流量調節閥93、叫及 電磁閥95係各自配置於比加熱器98更靠近空氣之流動方向 之上游側。 繼而,參照圖式,就本實施形態之熱處理裝置1之動作 詳細加以說明。熱處理裝置i係採用所謂接觸方式者,該 接觸方式係以特定之順序打開排列設置於上下方向之7個 鲁 換裝6(以下,根據需要為換裝部6a〜6g)之閘門1〇,藉由 閘門10已打開之換裝部6,相對於配置於熱處理室12内之 載置架70而拔插板體w。拔插板體貿時,載置架π藉由未 圖示之升降機構而於熱處理室12内升降,且對準應拔插之 - 板體1之載置段71與閘門10之位置。 本實施形態之熱處理裝置〗於拔插板體臂時,自對應於 閘門H)打開之換裝部6a〜6g而設置之空氣喷嘴乃(以;,、 根據需要稱為空氣噴嘴75a〜75g)喷出經加熱之空氣後形 鲁錢簾A1,防止存在於熱處理室咖之氣體或昇華物自熱 處理室〗2之内側向外側洩漏。 若更具體地進行說明,則空氣噴嘴75a〜75g如圖7之時 序圖所示,於換裝部6a〜6g之閘門1〇打開之期間(換裝期 •間自換裝期間C開始之時序僅上溯特定期間之期間(準 備期間P)、以及自換裝期f4C結束之時序經過特定期間(延 長期間D)之3個期間中,使空氣之喷出量增加至特定量為 止並形成氣簾A1。 若更詳細地進行說明,則空氣噴嘴〜〜^於除去上述 H2I89.doc 17 1354763 換裝期間c、準備期間p、以及延長期間d之期間中,以約 1〇.°[升/分]左右之流量喷出空I此時,加熱器98亦作 動。 另一方面,如圖7所示,若成為換裝期間c,則自空氣喷More specifically, the splitting portion 6 is threaded out to the portion where the plate body W H2189.doc • 13 - 1354763 is placed. m j-a i, i. 7 openings 40 are formed on the peripheral wall 13b of the front side of the heat treatment chamber 12. The openings 4, as shown in Fig. 4, are formed in such a manner as to be arranged in the upper and lower directions. A closed door is attached to the opening 4 of the peripheral wall m. The closed door 10 is configured to be actuated by, for example, an actuator such as a gas jet or a motor. The gate ’ 1 〇 can be appropriately selected from the upper and lower sliders or the inner or outer openers. The shutter 10' of the present embodiment is configured as shown by a two-point lock line in Fig. 4, and is configured to be inverted by the power of the actuator to the inner side of the changing portion 6, and the opening port 40 is disposed parallel to the peripheral wall m. An opening 5 is provided in the wall 41 at a position opposite to the opening 40 of the peripheral wall (10). Therefore, the heat treatment chamber 12 can be taken out and placed in the plate body by opening the shutter 10. As shown in Figs. 4 and 5, the tube 17 is fixed by the partitions 47a, 47b which are bridged to the peripheral wall and the partition wall. Further, as shown in the figure, the two ends of the partition plates 47a, 47b are blocked by a partition plate mounted perpendicular thereto, thereby being on the front side of the heat treatment device! The replacement portion 6 is formed on the side. The replacement portion 6 is connected to the opening 5 from the opening 4, and is isolated from the tube 17 formed between the peripheral wall 13b and the partition 41. The partition 47a is as shown in Figs. 4 and 5. As shown in the figure, the space is provided as an interval between the upper sides of the respective changing portions 6. The communication hole 53 is provided in the partition plate 47a, so that the gas existing in the changing portion 6 can be sucked through the communication hole 53a. That is, the tube 起作用 acts as a gas suction mechanism for attracting gas from the side of the replacement unit 6. Further, as shown in Figs. 4 and 5, the partition plate 47b opens the opening (10) to make the gate U2189.doc ] 4 1354763 3 is "when w does not interfere with the gate" 〇 方式 成形 成形 成形 成形 成形 。 。 。 。 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此On the back side of (10), the section 54 formed into a segment shape is not hidden in the gate. Further, the segment communicating hole 53b is formed in the segment portion. Therefore, the replacement portion 6 can be connected to the official body through the communication hole. The gas is circulated. The exhaust pipe 74 (gas suction mechanism) and the air are provided at a position adjacent to the t-portion 6 outside the arrow X direction of the flow direction (8) of the gas leaking from the heat treatment chamber 12 $ The nozzle 7 5 (the airflow generating mechanism) is disposed at a position above the opening 4 of the changing portion 6. The exhaust pipe 74 is for sucking and recovering the gas leaking from the opening 4. The tube port contains an air inlet 74a for sucking in gas. The air nozzle 75 is for ejecting air supplied by the air system (10) as shown in Fig. 6. The air nozzle 75 is located below the exhaust gas f 74. As shown by the arrow Y in FIG. 5, the air curtain A1 can be formed after the air is ejected toward the side of the exhaust gas f74. The opening position of the air inlet port corresponding to the air inlet port on the exhaust pipe 74 is formed in the biasing heat treatment chamber. The position on the downstream side of the flow direction of the leaking gas (arrow χ direction). The heat treatment apparatus 丨 includes seven replacement parts 6, and each of the replacement parts 6 is provided with an air nozzle 75. Each of the air nozzles 75 is configured to be supplied with air by an air system 68 as shown in Fig.. The clean air is supplied to each of the air nozzles 75 from a supply source (not shown). The air system 68 includes a main flow path 8 connected to a supply source of air as shown in Fig. 6. The main flow path 8 8 is provided. There is a feng feng #^> lower "up „ page j to pre-open and close the meta-valve 9 〇, flow regulating solenoid valve 91, and pressure regulating valve 92. Main road U2189.doc •15· 1354763 88 The downstream side of the flow direction of the air in the pressure regulating valve 92 is divided into seven branch passages 89 (hereinafter referred to as branch passages 89a to 89g as needed). The branch flow paths 89 & ~89 § are provided corresponding to the seven detachment portions 6 provided in the vertical direction. The branch flow paths 89a to 89g are substantially identical in configuration of each other. More specifically, the branch flow paths 89a to 89g serve as a flow rate adjusting mechanism for adjusting the flow rate of the air, and are provided with flow regulating valves 93 and 94 and a solenoid valve 95. As for the branch μ road 89a' The flow rate adjustment valve % or the solenoid valve % is disposed closer to the upstream side of the flow direction of the air, and is provided by a digital flow switch or the like. The branch flow paths 89a to 89g are configured to adjust the flow rate of the air by adjusting the flow rate adjusting valves 93 and 94 and the electromagnetic valve 95. The flow rate adjusting valve 93 is disposed in series with the electromagnetic enthalpy 95 in the flow direction of the air. Further, the flow rate adjusting valve 94 is provided on the circuit 96 connected to the branch flow path 89a and is in parallel with the electromagnetic unit. That is, the 'branch flow path is called the following", and the flow rate of the air flowing on the downstream side of the flow rate adjusting valve 94 and the solenoid valve 95 can be adjusted by the opening and closing of the solenoid valve 95, and the flow regulating valve 94 can be adjusted. Fine-tune the flow rate with the opening. In the branch flow paths 89a to 89g, a filter 97 for replenishing impurities contained in the air is provided downstream of the flow rate adjusting valve 94 and the electromagnetic (four) in the flow direction of the air. The branch flow paths 89a to 89g are configured to be heated by the heater 98 (gas heating mechanism) disposed at a portion on the downstream side of the filter 97, that is, in the heat treatment device of the present embodiment. The device 98 is disposed on the downstream side of the flow direction of the air which is closer to the main flow path of the air system 68 than the branch portion T of the branch 112189.doc -16 - 1354763 flow paths 89a to 89g. Further, it functions as a flow rate adjusting mechanism. Each of the flow rate adjusting valve 93 and the electromagnetic valve 95 is disposed on the upstream side of the flow direction of the air closer to the heater 98. Next, the operation of the heat treatment apparatus 1 of the present embodiment will be described in detail with reference to the drawings. i is a so-called contact method in which the gates 1 排列 arranged in the up and down direction are sequentially opened in a predetermined order (hereinafter, the replacement parts 6a to 6g are required as needed), by the gate 10 The opened changeable portion 6 is inserted into the plate body w with respect to the mounting frame 70 disposed in the heat treatment chamber 12. When the insertion plate body is traded, the mounting frame π is opened by a lifting mechanism (not shown). Heat treatment room 12 The inner lifting and lowering are aligned with the position of the mounting section 71 and the shutter 10 of the board 1. The heat treatment apparatus of the present embodiment is adapted to open the corresponding opening of the gate H) when the board arm is inserted or removed. The air nozzles provided in the portions 6a to 6g are (after, as needed, referred to as air nozzles 75a to 75g), and the heated air is sprayed to form a lug curtain A1 to prevent gas or sublimate present in the heat treatment chamber. The inside of the heat treatment chamber 2 is leaked to the outside. When more specifically explained, the air nozzles 75a to 75g are opened during the opening of the gates 1 to 6g as shown in the timing chart of Fig. 7 (replacement period) • The timing of the start of the self-replacement period C is only for the period of the up-to-date period (preparation period P) and the period from the end of the reload period f4C to the specific period (extension period D), so that the air is ejected. When the amount is increased to a specific amount, the air curtain A1 is formed. In more detail, the air nozzles are removed from the H2I89.doc 17 1354763 replacement period c, the preparation period p, and the extension period d. A flow rate of about 1 〇. ° [L / min] I this case, the heater 98 is also actuated. On the other hand, as shown in Figure 7, when the period becomes c facelift, the air jet from

嘴75a〜75g喷出之經加熱 < 空氣之噴出量調節為特定量 α。於本實施形態中,構成A “ 成為如下,即潔淨之空氣自空氣 :嘴一g以約3 —升/分]左右之流量於加熱狀態下 又,自空氣噴嘴…〜、噴出之空氣之動壓(本實 中為卿a])高於流動於熱處理室12内之空氣或 生成氣體之靜壓。 又’若成為換裝期間C前後之準備期,或延長期間D, 則自空氣喷嘴75,喷出之空氣之喷出量為換裝期間C 之約1/2(α/2)。於本實施形態中,構成為如下,即於準備 期間Ρ或延長期間D中,潔淨之空氣自空氣喷嘴…〜、以 約1.5X102[升/分]左右之流量於加熱狀態下喷出。 設置於換裝期間C前後之準備期間p及延長期間D 短,約為換裝期間c之長短βυ/4(β/4)。即,熱處理裝置i 令’於設置於各換裝部6之閘門1〇打開之換裝期間〔前後, 且時間上短於換裝期間c之準備期間p及延長期間D中 空氣喷嘴75a〜75g喷出經加熱之空氣。 如上所述,熱處理裝置1中,依次切換間門10打開之換 裝部―。因此’如圖7所示,根據閉門1〇打開之換褒 部6a〜6g之切換,對於喷出經加熱之空氣之^氣喷嘴乃,、 亦以空氣喷嘴75a—空氣喷嘴75b——空氣喷嘴以之順序 112189.doc 18· 1354763 進行切換。 又,自空氣喷嘴75a〜75g噴出之空氣如圖5中箭頭γ所 示’自排氣管74之下方’向排氣管74喷出。即,若自空氣 噴嘴75 a〜75g喷出空氣,則於比閘門10更靠近自熱處理室 12洩漏之氣體之流動方向X的下游側,產生自下方向上方 之氣流,並形成氣簾A1。又,氣簾A1主要形成於比形成 有排氣管74之進氣口 74a之位置更靠近氣體之流動方向又的 下游側。因此,藉由閘門1 〇打開而自開口 4〇洩漏出之氣 體’如圖5所示,順利地被吸引至進氣口 74a。 本實施形態之熱處理裝置丨中,藉由氣簾A1(氣流)而遮 斷含有自熱處理室12之内側向外側之生成氣體之氣體的流 動其中該乳簾A1(氣流)係藉由於取出放入板體w時自空 氣噴嘴75喷出經加熱之空氣而形成者。又,熱處理裝置j 中,可將藉由氣簾A1阻止來自熱處理室12洩漏出之氣體回 收至管17或排氣管74。因此,熱處理裝置丨可防止伴隨於 熱處理室12内加熱板體W所產生之氣體(生成氣體)或藉由 冷部該氣體而產生之所謂昇華物的洩漏。 又,於本實施形態之熱處理裝置丨中,於取出放入板體 W之時(換裝期間C)與於此前後之準備期間p或延長期間D 中,加熱器98作動,且自空氣喷嘴75喷出經加熱之空氣。 又此時所喷出之空氣係加熱至熱處理室12内之環境溫度 左右者,且加熱至產生昇華物之固化溫度以上。因此,= 處理裝置1可防止伴隨取出放入板體W而自熱處理室12浪 漏之生成氣體冷卻後成為昇華物,且可於生成氣體之狀雜 112l89.doc •19· 1354763 下將其回收至管17或排氣管74中。因此,熱處理裝置1 I ’於回收自熱處理室叫漏之氣體時,可防止昇 著於空氣喷嘴75或管17、排氣管74等。 於此,於構成為藉由加熱器98對空氣進行加埶之 依據加熱器%之加熱能力等,有可能使加熱請作動 後無法立即將加熱至特定溫度之空氣供給至空氣㈣乃 根據該認識,本實施形態之熱處理裝置卜,構成為二 下,即先於換震期間C,使加埶器9 ‘”· 埶 1史加‘,,、副自準備期間P作動並加 …。因此’熱處理裝置1中’可自換裝期間C之開於之 m 特“度之…且可抑制昇華物之產生 又,上述實施形態令,構成為如下,即換裝期 =經過片刻(延長期間D),自空氣喷嘴75喷出經加熱之空 :因此’依據上述構成,可於換裝期Μ結束後 於閘⑽之外側或内側之生成氣體之氣體料並回 收至官1 7或排氣管74中。 再者,上述實施形態中,構成為不僅於換裝期間q, :於以準備期間P或延長期間D為為代表之整個期間中,將 給至各空氣喷嘴75或使加熱器轉動,但本發明並 ^於此’例如亦可於除上述期間c、p、D之外之期間 二亭止自空氣喷嘴75喷出空氣,或停止藉由加熱器咖 之:氣進行加熱。又,可構成為於準備期 二方::Γ之期間t不排出經加…氣,或亦可 為不使加熱器98作動而排出非加熱狀態之空氣。 1 J2189.doc 1354763 ^於此,如上所述,準備期間P主要係以自換裝期間c開始 後’可立即排出加熱至特定溫度之空氣之方式使加熱器98 預先作動者。又,延長期間D係以於換裝期間C結束後’ 回收含有殘存於閘門1〇之附近之生成氣體之氣體為主要目 •者因此準備期間p或延長期間D之長短或於該等期間 P、D中所喷出之加熱空氣之量’為可達成該等目的之程度 即可。 因此’根據該認識’本實施形態中,使準備期間p或延 長期間D之期間之長短相對於換裝期間〔縮短。又,上述 實施形態中,於準備期間P或延長期間D中,單位時間内自 ;氣喷嘴75喷出之空氣之喷出量,少於於㈣期間C中, f位時間内自空氣喷嘴75喷出之氣體之嗔出量。因此,熱 處理裝置1於準備期間P或延長 A ± 飞、長期間乜中,喷出空氣所需之 施量消耗為最小限即可。 如上所述,熱處理裝晋丨播+ 4人, 冓成為3有多個換裝部6,對應 於此,於各換裝部6上設有空 氣赁嘴75。繼而,將空氣供 給至空氣喷嘴75之空氣系統68 ” ” 再珉為如下,即連結於空氣 之供給源之主流路88於中間 日+ »T間刀為7個系統之分支流路89, 且可藉由s亥分支流路89而將空痛 ,.^ . 氣供給至空氣喷嘴75。用以 加熱空虱之加熱器98構成為設置 斟夂八±味Α 勹**又置於各分支流路89上,且針 對各分支流路89而獨立動作。八 „ ^ Θ ^ , 节刀支流路89與主流路88相 比,城:!:杈少,因此配管直經 直厶亦比主流路88小。因此, 構成為將加熱器98設置於主流路 、 *教八配…… 机路88上,且藉此將經加熱之 工氣刀配至各分支流路8 9上 月形相比,加熱器98對空氣 II2189.doc -21- 1354763 之加熱效率高。 =:上所述’工乳糸統68,其作為流量調節機構而起 :用之〜量調_93'94或電則95配置於比加熱器嫩 罪近空氣之錢方向之上游側。因此,熱處理裝置丄中, 經加熱之空氣不流入流量調節間93、94或電磁間&因 此,依據上述構成,流量調節閥93、94或電磁間%不易因 熱之影響而老化。X,依上述構成,無需採用㈣性高之 高價者作為流量調節閥93等,而可相應降低熱處理裝置ι 之製造成本。 再者’若考慮流量調節閥93、94或電磁㈣之老化等, 則較理想的是空氣系統68為如上所述之構成,但本發明並 非限定於此,例如亦可構成為將加熱器98配置於比流量調 郎閥93、94或電磁閥95更靠近空氣之流動方向之上游側, 或構成為將加熱器98配置於主流路88。又,如上述空氣系 統68般,0支流路89進而構成為分為内側分支:路99a 與外側分支流路99b之情形時,亦可將加熱器崎置於該 内側分支流路99a或外側分支流路99b上。 熱處理裝置1中,構成為板體w之表面9b藉由膜狀體% 所包覆’且表面9b側以朝向上方之姿勢相對熱處理室丨2進 行取出放入。因此,若於熱處理裝置丨中進行熱處理(燒 成),則於板體W之表面9b侧產生生成氣體,且分佈不均。 鑒於該現像,本實施形態之熱處理裝置】中,空氣喷嘴75 構成為自於熱處理室12中取出放入之板體w之背面9d側之 方向,向表面9b側之方向產生氣流。因此,本實施形態之 n2189.doc •22· 1354763 熱處理裝置1可順利將生成氣體引導至管17或排氣管74, 且可防止生成氣體或昇華物洩漏、或昇華物附著。 熱處理裝置〗藉由以如上所述之方式構成為將連通孔 53a、53b設於管17,而可有效地回收含有自熱處理室丨2浅 … 漏之生成氣體之氣體,但本發明並非限於此,亦可為不設 .· 置連通孔53a、53b之構成。 上述實施形態中,已例示將排氣管74與空氣噴嘴乃設置 ㈣位於換裝部6之最下游側之閘Η H)之外側鄰接的:置 之構成,但本發明並非限定於此,例如亦可為如下構成, 即將與空氣喷嘴75同樣可喷出空氣者設於與閑⑽之内側 ' 鄰接之位置上,以替代設置空氣喷嘴75 ^ ' ¥更具體地進行說明’則熱處理裝置1亦可例如如圖8或 圖9、圖10所示,構成為如 仏閱門10之内側,即換奘 生:裝部6之段部54之附近設置空氣喷嘴 3 3 (疯ι 〃IL 生機構)。 於此’空氣噴嘴55係如老, w 考其為以與由上述實施形能 所示之空氣噴嘴75同椹之古斗、▲,从 ^ ' 式噴出藉由空氣系統68(氣體 供給系統)所供給之空氣而 ” ^ , i)# ^ ϋ ^ a, 置即,空氣喷嘴55設置 為,將二氣嘴出至換裝 比立更靠近自心 室12之邊界部分,或 .比其更靠迓自熱處理室洩 X所示方向方向(圖9中箭頭 圖9所示,較理想的所谓之氣簾。空氣喷嘴55如 ^ 、疋°又置於比連通孔53a,53b更偏向自 熱處理室洩漏之氣體 更偏向自 一番h 向之下游側的位置。 於設置此種空f喑 ^ 嘴嘴(从下,根據需要稱為空氣噴嘴 U2189.doc •23 · !354763 5 5a〜5 5g)之情形時,自空氣噴嘴55a〜55g噴出之*严 工氣, 如圖9中箭頭Z所示,自隔板47b側向隔板47a側,g |目下方 側向上方側喷出,形成氣簾A2(氣流)。如圖9所; ^ 、,空氣 嘴嘴55之空氤之噴出方向z與自熱處理室12洩漏之氣體 流動方向X交又。即,空氣喷嘴55,如圖9中影線所示。 於遮擋自熱處理室12向熱處理裝置1之外側流動 ° ^ 7 <氣體之 机動的方向上喷出空氣’形成氣簾Α2 〇 如上所述,氣簾Α2主要形成於比設置於隔板47&、47 連通孔53a、53b更靠近氣體之流動方向χ 々几之 μ 卜游側。因 ,/、上述實施形態相同,於換裝期間c或準備期間ρ ' 簾A2 ^等b之期間中’自空氣喷嘴55喷出空氣’且形成氣 =4將經由開口 5〇自熱處理室12浅漏之氣體引導 主隔板47a、47b側。 之右至於設置空氣喷嘴55以替代設置空氣喷嘴-之氣體,含有自熱處理室12茂漏之生成氣體 定於+ 併孔s 74然而,本發明並非限 ;此,亦可為不設置排氣管74之構成。 再者,至於以上述方式設置 成為如ττ B 轧赁嘴55之情形,亦可構 攻馮如下,即不僅於換裝期 長期間D為代表之整個期二亦於以準備期間15或延 55或使# i。。 將空氣供給至各空氣喷嘴 戎使加熱裔98作動。又,至 可於除上述期間c、P、D外之期^述之構成之情形,亦 喷出空氣,式广^ 月間中,停止自空氣喷嘴55 ”或知止藉由加熱器98對空氣& > 4 &The nozzles 75a to 75g are heated by the spray < the air discharge amount is adjusted to a specific amount α. In the present embodiment, the configuration A "behaves as follows, that is, the clean air from the air: the mouth-g is about 3 - liter / minute", and the flow rate is in the heated state, and the air is sprayed from the air nozzle. The pressure (in this case, a) is higher than the static pressure of the air or the generated gas flowing in the heat treatment chamber 12. Further, if it is the preparation period before and after the replacement period C, or the extension period D, the self-air nozzle 75 The discharge amount of the ejected air is about 1/2 (α/2) of the refilling period C. In the present embodiment, the air is cleaned from the air during the preparation period or the extension period D. The air nozzles are discharged in a heated state at a flow rate of about 1.5×102 [liter/min]. The preparation period p and the extension period D before and after the replacement period C are short, which is about the length of the reloading period c. /4 (β / 4). That is, the heat treatment apparatus i causes 'the preparation period p before and after the opening of the gate 1 设置 opened in each of the changing parts 6 [before and after, and the preparation period p and the extension of the time d is shorter than the replacement period c During the period D, the air nozzles 75a to 75g eject the heated air. As described above, the heat treatment apparatus 1 sequentially cuts The changing portion of the door 10 is opened. Therefore, as shown in Fig. 7, according to the switching of the changing portions 6a to 6g which are opened by the closing door 1 , the air nozzle for discharging the heated air is also air. The nozzles 75a-air nozzles 75b-air nozzles are switched in the order 112189.doc 18· 1354763. Further, the air ejected from the air nozzles 75a to 75g is 'under the exhaust pipe 74' as indicated by an arrow γ in FIG. When the air is ejected from the air nozzles 75a to 75g, the downstream side of the flow direction X of the gas leaking from the heat treatment chamber 12 is closer to the upper side than the gate 10. The air flow is formed to form the air curtain A1. Further, the air curtain A1 is mainly formed on the downstream side of the flow direction of the gas more than the position of the air inlet 74a in which the exhaust pipe 74 is formed. Therefore, the opening is opened by the shutter 1 As shown in Fig. 5, the leaked gas is smoothly sucked into the intake port 74a. In the heat treatment apparatus of the present embodiment, the inner side of the heat treatment chamber 12 is blocked by the air curtain A1 (air flow). The flow of gas from the outside of the generated gas The curtain A1 (airflow) is formed by ejecting heated air from the air nozzle 75 when taken out of the plate body w. Further, in the heat treatment device j, the heat treatment chamber 12 can be blocked by the air curtain A1. The leaked gas is recovered to the tube 17 or the exhaust pipe 74. Therefore, the heat treatment apparatus 防止 can prevent the gas (generated gas) generated by heating the plate body W in the heat treatment chamber 12 or the so-called gas generated by the cold portion. Further, in the heat treatment apparatus according to the present embodiment, the heater 98 is actuated when the plate body W is taken out (replacement period C) and during the preparation period p or the extension period D before and after And the heated air is ejected from the air nozzle 75. Further, the air ejected at this time is heated to about the ambient temperature in the heat treatment chamber 12, and is heated to a temperature higher than the solidification temperature at which the sublimate is produced. Therefore, the treatment device 1 can prevent the generated gas which has leaked from the heat treatment chamber 12 as it is taken out and is cooled, and then becomes a sublimate, and can be recovered in the form of a gas generated by the gas 1121 89.doc • 19· 1354763. To the tube 17 or the exhaust pipe 74. Therefore, the heat treatment apparatus 1 I' can be prevented from rising to the air nozzle 75 or the tube 17, the exhaust pipe 74, and the like when recovering the gas leaked from the heat treatment chamber. Here, it is configured such that the heater 98 is used to heat the air according to the heating capacity of the heater, etc., and it is possible to supply the air heated to a specific temperature to the air immediately after the heating is actuated (4). The heat treatment apparatus according to the present embodiment is configured to be two times, that is, before the shock-changing period C, the twister 9'"·埶1", and the sub-preparation period P are actuated and added. In the heat treatment apparatus 1, the "self-replacement period C" can be changed to "the degree" and the generation of the sublimate can be suppressed. The above embodiment is configured as follows, that is, the reloading period = the elapsed period (extended period D) The air nozzle 75 is ejected from the heated air: therefore, according to the above configuration, the gas material which is generated on the outer side or the inner side of the gate (10) after the end of the reloading period can be recovered to the official 1 or the exhaust pipe. 74. Further, in the above-described embodiment, not only the replacement period q but also the air nozzles 75 or the heaters are rotated during the entire period in which the preparation period P or the extension period D is representative, but the present invention is configured. According to the invention, for example, the air may be ejected from the air nozzle 75 during the period other than the above periods c, p, and D, or the heating may be stopped by the heater. Further, it may be configured such that during the preparation period, the period of time: Γ does not discharge the added gas, or the air in the non-heated state may be discharged without causing the heater 98 to operate. 1 J2189.doc 1354763 Here, as described above, the preparation period P mainly causes the heater 98 to be pre-actuated in such a manner that the air heated to a specific temperature can be immediately discharged after the start of the reloading period c. Further, in the extension period D, the gas containing the generated gas remaining in the vicinity of the gate 1〇 is collected as the main target after the end of the replacement period C. Therefore, the length of the preparation period p or the extension period D or the period P is prepared. The amount of heated air ejected in D and D can be such that the purpose can be achieved. Therefore, according to the present embodiment, in the present embodiment, the length of the period of the preparation period p or the extension period D is shortened with respect to the replacement period. Further, in the above-described embodiment, in the preparation period P or the extension period D, the discharge amount of the air ejected from the air nozzle 75 per unit time is less than the (four) period C, the f-time time from the air nozzle 75 The amount of gas ejected from the ejected gas. Therefore, the heat treatment device 1 can minimize the amount of consumption required to eject the air during the preparation period P or the extension A ± fly and long period. As described above, the heat treatment package has a total of four people, and the 冓3 has a plurality of replacement portions 6, and accordingly, the air exchange nozzles 75 are provided in the respective replacement portions 6. Then, the air system 68"" that supplies air to the air nozzles 75" is further described as follows: that is, the main flow path 88 connected to the supply source of air is a branch circuit 89 of seven systems in the middle day + »T. The air pain can be supplied to the air nozzle 75 by the shai branch flow path 89. The heater 98 for heating the air is configured to be placed on each branch flow path 89 and operated independently for each branch flow path 89. Eight „ ^ Θ ^ , compared with the mainstream road 88, the knives branch flow path 89 is less than the main road 88. Therefore, the straight pipe straight is also smaller than the main road 88. Therefore, the heater 98 is arranged on the main road. , * teach eight with ... on the machine 88, and by this heating the air knife to each branch flow path 8 9 compared to the moon shape, the heating efficiency of the heater 98 to the air II2189.doc -21 - 1354763 High: =: The above-mentioned 'Working nipple 68, which acts as a flow regulating mechanism: it is used in the amount _93'94 or the electric 95 is arranged on the upstream side of the direction of the air than the heater Therefore, in the heat treatment apparatus, the heated air does not flow into the flow rate adjustment chambers 93, 94 or the electromagnetic room & therefore, according to the above configuration, the flow rate adjusting valves 93, 94 or the electromagnetic room % are not easily deteriorated by the influence of heat. According to the above configuration, it is not necessary to use the high-priced (4) high-priced person as the flow rate adjusting valve 93, etc., and the manufacturing cost of the heat treatment apparatus ι can be reduced correspondingly. Further, if the flow regulating valves 93, 94 or the electromagnetic (four) are aged, etc., It is desirable that the air system 68 be constructed as described above, but the present invention For example, the heater 98 may be disposed on the upstream side of the flow direction of the air than the flow rate adjusting valves 93 and 94 or the electromagnetic valve 95, or may be configured to arrange the heater 98 on the main flow path 88. Further, in the case of the air system 68, the zero branch flow path 89 is further divided into the inner branch: the path 99a and the outer branch flow path 99b, and the heater may be placed on the inner branch flow path 99a or outside. In the heat treatment device 1, the surface 9b of the plate body w is covered by the film-like body %, and the surface 9b side is taken out and placed in the upward direction with respect to the heat treatment chamber 丨2. When heat treatment (baking) is performed in the heat treatment apparatus crucible, generation gas is generated on the surface 9b side of the plate body W, and the distribution is uneven. In the heat treatment apparatus of the present embodiment, the air nozzle 75 is configured as self-contained. In the heat treatment chamber 12, the direction of the back surface 9d side of the plate body w is taken out, and an air flow is generated in the direction of the surface 9b side. Therefore, the heat treatment device 1 of the present embodiment can smoothly generate the gas. The tube 17 or the exhaust pipe 74 can prevent leakage of the generated gas or sublimate or adhesion of the sublimate. The heat treatment apparatus is configured to provide the communication holes 53a, 53b to the tube 17 as described above. The gas containing the generated gas from the heat treatment chamber 丨2 is easily recovered, but the present invention is not limited thereto, and the communication holes 53a and 53b may not be provided. In the above embodiment, the row is exemplified. The air pipe 74 and the air nozzle are disposed adjacent to each other on the outer side of the gate H) on the most downstream side of the changeover unit 6, but the present invention is not limited thereto. For example, the air pipe 74 may be configured as follows. The nozzle 75 can also be disposed at a position adjacent to the inner side of the free (10), instead of the air nozzle 75 ^ ', more specifically, the heat treatment device 1 can also be, for example, as shown in FIG. 8 or FIG. As shown in Fig. 10, an air nozzle 3 3 (a mad 〃 IL mechanism) is provided in the vicinity of the inner portion of the sill door 10, that is, in the vicinity of the segment portion 54 of the accommodating portion 6. Here, the 'air nozzle 55 is old, w is the same as the air nozzle 75 shown by the above-described embodiment, ▲, and is ejected from the air system 68 (gas supply system) The supplied air is "^, i)# ^ ϋ ^ a, that is, the air nozzle 55 is set to bring the two nozzles out to the boundary portion of the self-ventricle 12, or more迓From the direction of the direction indicated by X in the heat treatment chamber (shown by the arrow in Fig. 9 in Fig. 9, the ideal so-called air curtain. The air nozzles 55, such as ^, 疋°, are placed more inclined than the communication holes 53a, 53b from the heat treatment chamber. The gas is more biased from the position on the downstream side of the h. To set the mouth of the air (from below, as needed, it is called air nozzle U2189.doc •23 · !354763 5 5a~5 5g) In the case of the air nozzles 55a to 55g, as shown by the arrow Z in Fig. 9, the side of the partition plate 47a is ejected from the side of the partition plate 47b toward the upper side of the partition plate 47a, and the air curtain A2 is formed. (air flow), as shown in Fig. 9; ^, the discharge direction z of the air nozzle 55 and the gas flow leaking from the heat treatment chamber 12 The air nozzle 55 is formed as shown by the hatching in Fig. 9. The air curtain is formed in the direction of the maneuvering of the gas from the heat treatment chamber 12 to the outside of the heat treatment device 1 to form the air curtain Α 2 As described above, the air curtain 2 is mainly formed on the side of the flow of the gas which is closer to the flow direction of the gas than the communication holes 53a and 53b provided in the partition plates 47 & 47, and is the same as in the above embodiment. In the period of the loading period c or the preparation period ρ 'curtain A2 ^ or the like b, 'air is ejected from the air nozzle 55' and the formation of the gas = 4 will guide the main partitions 47a, 47b through the opening 5 from the heat-treating chamber 12 The right side of the air nozzle 55 is provided instead of the air nozzle-disposed gas, and the generated gas containing the leak from the heat treatment chamber 12 is set at + and the hole s 74. However, the present invention is not limited thereto; The configuration of the air tube 74. Further, as in the case of being set as the ττ B rolling nozzle 55 in the above manner, it is also possible to construct a rifle as follows, that is, not only during the long period of the reloading period, but also for the entire period 2 Prepare period 15 or extend 55 or make # i. will The gas is supplied to each air nozzle to activate the heating element 98. Further, the air can be ejected in the case of the period other than the above periods c, P, and D, and the air is stopped in the air. Nozzle 55" or knows by heater 98 to air &> 4 &

構成為於準借划了二孔進仃加熱。又,可 、早備期間P及延長期間D 〈任方或雙方之期間 】12189.doc .24· 不排出經加熱之空氣,或亦可構成為不使加熱器98作 動而排出非加熱狀態之空氣。 又’熱處理裝置1亦可構成為以上述之方式設置空氣喷 嘴55或空氣噴嘴75之任一方,但本發明並非限定此,例如 如圖11或圖12所示,亦可構成為設置有空氣喷嘴”及空氣 喷嘴75之雙方。於該構成之情形時,可於取出放入板體w 之換裝期間C、或準備期間p、延長期間D等中,形成氣簾 A1、A2之雙方’且可抑制伴隨取出放入板體w之生成氣體 或昇華物之洩漏或者昇華物之產生。 如上所述,於設置空氣噴嘴55、75之情形,空氣系統^ 亦:構成為於分支部分丁中,按照空氣嘴扣、75之數量 進仃刀支。即’於如上述實施形態般設置空氣噴嘴55a〜 55g、75a〜75g之情形時’亦可構成為於分支部分了中,分 為M㈣統之分支流路。又,若無必須以空氣喷嘴55a〜 、二及:孔喷嘴75a〜75g而使空氣之噴出量或空氣之加埶 -度產生變化之特別之情況,則空氣系統“,如圖 示’亦可構成為如下,卽 7即將各分支流路,〜、於相對加 熱多於空氣之流動方向之下游側,分為連結於空氣嘴 嘴55a〜55g之内側分支流路99a與外側分支流路规、 該構成,則對於並存右介号 並存有空軋噴嘴55a〜55g及空氣喷嘴7 〜75g之構成而言’亦可使空氣系,㈣之構成較為簡單。 上述實施形態中,Μ出4為π 藉由加熱器98對供給至各空氣噴喈 75之工巩進仃加熱,但本發明並非限定於此 成為如下,即例如將槎士 J m 丨將構.成空氣系統68之主流路88或分龙流 iJ2J89.doc •25- 1354763 路89等配管之一部分或全部繞於熱處理室12之内部,且於 忒部位進行熱交換並進行加熱❶於該構成之情形時作為 將加熱器98之消耗能量抑制至最小限,或不設置加熱器% 之構成,可使熱處理裝置丨之構成簡略化。 上述實施形態中,構成為針對換裝期間C或準備期間p、 延長期間D以外之期間而自各空氣噴嘴55、75噴出空氣, 但亦可為於上述各期間c、p、D以外,不自各空氣嗔嘴 55、75喷出空氣之構成。 上述熱處理裝置1係載置架7〇於熱處理室12内可上下運 動之構成,但本發明並非限定於此,熱處理裝置1亦可為 載置架70於熱處理室12内不上下運動之構成。 【圖式簡單說明】 圖1係表示本發明之一實施形態之熱處理裝置之内 造的平面圓。 圖2(a)係表示板體之平面圖,係(“之A — A剖面圖, (c)係(b)之B部放大圖。 圖3係表示圖〗所示之熱處理裝置中所採用之載置架與 體之關係的說明圖。 圖4係將圖i所示之熱處理裝置之要㈣大後之剖面圖。 圖5係圖4之C部放大圖。 圖6係表示圖丨所示之熱處理裝置所具備之空氣系統的配 管系統圖。 圓7係表示圖丨所示之熱處理裝置所具備之空氣喷嘴中之 空氣的噴出量及喷出時序之時序圖。 112189.doc -26 - 1354763 圖8係將圖1所示之熱處理裝置之變形實 u見知形態之要部放 大後之剖面圖。 圖9係圖8之C部放大圖。 圖10係表示自熱處理室側觀察圖6所示之熱處理裝置所 具備之換裝部之狀態的剖面立體圖。 圖11係將圖1所示之熱處理裝置之其他变形實施形態之 要部放大後的剖面圖。 圖12係圖11之C部放大圖。 圖13係表示圖11所示之熱處理裝置所具備之空氣系統之 配管系統圖。 【主要元件符號說明】 1 熱處理裝置 6 換裝部 9a 基板 9b 表面(包覆面) 9c 膜狀體 9d 背面 10 閘門 12 熱處理室 14 熱風供給機構(熱源) 17 管(氣體吸引機構) 40,50 開口 55,75 空氣喷嘴(氣流產生機構) 68 空氣系統(氣體供給系統) 112189.doc -27- 1354763 74 排氣管(氣體吸引機構) 89 分支流路 93,94 流量調節閥(流量調節機構) 95 電磁閱 98 加熱器(氣體加熱機構) W 板體(被加熱物) C 換裝期間 P 準備期間 D 延長期間 1l2189.doc *28-It is configured to heat up the two holes. Further, the early morning period P and the extended period D <period of either or both sides] 12189.doc.24. The heated air is not discharged, or the heater 98 may be operated to discharge the non-heated state. air. Further, the heat treatment device 1 may be configured such that one of the air nozzle 55 or the air nozzle 75 is provided as described above. However, the present invention is not limited thereto. For example, as shown in FIG. 11 or FIG. 12, an air nozzle may be provided. And both of the air nozzles 75. In the case of this configuration, both of the air curtains A1 and A2 can be formed in the refilling period C in which the board w is taken out, or in the preparation period p, the extension period D, and the like. The leakage or the sublimation of the generated gas or sublimate accompanying the removal of the plate body w is suppressed. As described above, in the case where the air nozzles 55, 75 are provided, the air system is also configured to be in the branch portion, according to The number of the air nozzles and the number of the nozzles is 75. When the air nozzles 55a to 55g and 75a to 75g are provided as in the above embodiment, the branching portion may be divided into M (four) points. In addition, if there is no need to change the air discharge amount or the air enthalpy-degree by the air nozzles 55a to 2, and the hole nozzles 75a to 75g, the air system ", as shown in the figure 'can also be configured as Next, the 卽7 is divided into the inner branch flow path 99a and the outer branch flow path which are connected to the air nozzles 55a to 55g, and the inner side flow path is connected to the air nozzles 55a to 55g. In the case where the right-hand side and the air-rolling nozzles 55a to 55g and the air nozzles 7 to 75g are present, the air system can be used, and the configuration of (4) is relatively simple. In the above embodiment, the sputum 4 is π, and the heating device 98 heats the work supplied to each of the air squirts 75. However, the present invention is not limited thereto, and for example, the gentleman J m 丨 will be constructed. One or all of the piping of the air system 68, such as the main road 88 or the sub-long flow iJ2J89.doc • 25-1354763, 89, etc., are partially or completely wound around the inside of the heat treatment chamber 12, and heat exchange is performed at the crucible portion and heating is performed. In the case where the energy consumption of the heater 98 is suppressed to the minimum or the heater % is not provided, the constitution of the heat treatment apparatus can be simplified. In the above-described embodiment, the air is ejected from the air nozzles 55 and 75 for the period other than the refilling period C, the preparation period p, and the extension period D. However, the respective periods c, p, and D may not be used. The air nozzles 55, 75 are configured to eject air. The heat treatment apparatus 1 is configured such that the mounting frame 7 can move up and down in the heat treatment chamber 12. However, the present invention is not limited thereto, and the heat treatment apparatus 1 may be configured such that the mounting frame 70 does not move up and down in the heat treatment chamber 12. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a plane circle built in a heat treatment apparatus according to an embodiment of the present invention. Fig. 2(a) is a plan view showing a plate body ("A-A cross-sectional view, (c) (b) is an enlarged view of a portion B. Fig. 3 is a view showing a heat treatment device shown in Fig. Fig. 4 is a cross-sectional view of the heat treatment device shown in Fig. i, and Fig. 5 is an enlarged view of a portion C of Fig. 4. Fig. 6 is a view showing a portion of Fig. The piping system diagram of the air system provided in the heat treatment apparatus. The circle 7 is a timing chart showing the discharge amount and the discharge timing of the air in the air nozzle provided in the heat treatment apparatus shown in Fig. 112189.doc -26 - 1354763 Fig. 8 is an enlarged cross-sectional view showing a portion of the heat treatment apparatus shown in Fig. 1. Fig. 9 is an enlarged view of a portion C of Fig. 8. Fig. 10 is a view showing Fig. 6 from the side of the heat treatment chamber. Fig. 11 is an enlarged cross-sectional view showing an essential part of another modified embodiment of the heat treatment apparatus shown in Fig. 1. Fig. 12 is an enlarged view of a portion C of Fig. 11 Fig. 13 is a view showing a piping system of an air system provided in the heat treatment apparatus shown in Fig. 11. [Main component symbol description] 1 Heat treatment device 6 Replacement portion 9a Substrate 9b Surface (cover surface) 9c Film body 9d Back surface 10 Gate 12 Heat treatment chamber 14 Hot air supply mechanism (heat source) 17 Tube (gas suction mechanism) 40,50 opening 55,75 air nozzle (air flow generation mechanism) 68 air system (gas supply system) 112189.doc -27- 1354763 74 exhaust pipe (gas suction mechanism) 89 branch flow path 93, 94 flow control valve (flow Adjustment mechanism) 95 Electromagnetic reading 98 Heater (gas heating mechanism) W Plate (heated material) C During the refilling period P Preparation period D Extension period 1l2189.doc *28-

Claims (1)

年月日修(更)正替换頁I第咖23564號專利申請案, 中文申凊專利範圍替換本(1〇〇年8月) 申請專利範圍: 種熱處理裝置,其特徵在於其係加熱藉由加熱會產生 生成氣體之被加熱物者;其中該生成氣體係藉由特定之 固化溫度而固化者, 上述熱處理裝置含有配置被加熱物之熱處理室、使該 熱處理室之室溫上升之熱源、以及用以對上述熱處理室 取出放入被加熱物之換裝部, 且包含:氣流產生機構,其配置於該換裝部與熱處理 至之邊界部分或者比該邊界部分更靠近熱處理室之外側 之位置上,且可產生遮擋自熱處理室之内側向外側之氣 體流動之氣流; 以及氣體吸引機構’其配置於藉由該氣流產生機構所 產生之氣流之下游側,且吸引氣體, 上述氣流產生機構於取出放入被加熱物之換裝期間 中’喷出已加熱至上述固化溫度以上之氣體。 2·如請求項1之熱處理裝置, 其中氣體吸引機構含有用以吸入氣體之進氣口, 精由攸4流產生機構產生之氣流所形成之氣簾形成於 ί於上述進氣口之開口位置,偏向自熱處理室浪漏之 氣體之流動方向之下游側㈣Ρ 3.如請求項1之熱處理裝置, 其中設有多個氣流產生機構, 3有將氣體供給至氣流產生機構之氣體供給系統, 且於氣體供认备处 山 、。系統之中間設有:用以加熱流動於氣體 112189-1000824.doc 1354763 _____ 、8月21修(更)正替換頁 供給系統中之氣體之氣體加熱機構,與用以調節氣體之 流量之流量調節機構, 氣體供給系統於比氣流產生機構及氣體加熱機構更靠 近氣體之流動方向之上游側之處,分為多個分支流路, 相對於該分支流路,於氣體之流動方向之下游側連接 氣流產生機構, 流量調節機構設置於比上述氣體加熱機構更靠近氣體 之流動方向之上游側之處。 4. 如請求項!之熱處理裝置,其中於取出放入被加熱物之 換裝期間,以及自該換裝期間開始之時序僅上溯特定期 門之準備期間及/或自換裝期間結束之時序經過特定期間 之延長期間中,自氣流產生機構噴出經加熱之氣體。 5. 如請求項1至4中任-項之熱處理裝置,其中藉由從氣流 產生機構所產生之自下方向上方之氣流形成氣簾。 6·如請求項…中任一項之熱處理裝置,其中自氣流產生 機構喷出之氣體之動壓高於熱處理室内流動之氣體之靜 壓。 7. 如請求項丨至4中任一項之熱處理裝置, 其中被加熱物之一面係由藉由加熱而產生生成氣體之 膜狀體所包覆之包覆面,且以該包覆面朝向特定方向之 方式配置於熱處理室内, 氣流產生機構係自取出放入於熱處理室之被加熱物之 包覆面之背面側方向向包覆面側之方向產生氣流者。 8. 如請求項丄至4中之任一項之熱處理裝置,纟中於假定取 112189-1000824.doc 1354763 ~~24 ~~~&quot; ~Ί 年月百修使)正替換頁 · 出放入被加熱物之換裝期間,以及自 時序僅上料定期間 、㈣開始之 時序經過特定期間之延長期間之情形, 束之 於上述換裝期間,以·及上述 中,白裔攻太1 &amp; k +侑肩間及/或延長期間 /J,L生機構噴出經加熱之氣體, 9.The year of the month is revised (more) is the replacement of the patent application No. 23564 of the Japanese Patent No. 23564, and the scope of the patent application is replaced by the Chinese patent application (August 1st). The scope of the patent application is characterized in that it is heated by Heating generates a heated object that generates a gas; wherein the generated gas system is cured by a specific curing temperature, the heat treatment device includes a heat treatment chamber in which the object to be heated is disposed, a heat source that raises a room temperature of the heat treatment chamber, and a replacement portion for taking out the heat-treated chamber into the object to be heated, and comprising: an airflow generating mechanism disposed at a boundary portion of the replacement portion and the heat treatment or closer to the outer side of the heat treatment chamber than the boundary portion And a gas flow that blocks the flow of gas from the inside to the outside of the heat treatment chamber; and a gas suction mechanism that is disposed on the downstream side of the gas flow generated by the gas flow generation mechanism and attracts gas, and the gas flow generation mechanism The gas which has been heated to above the above-mentioned curing temperature is ejected during the refilling period in which the object to be heated is taken out. 2. The heat treatment device according to claim 1, wherein the gas suction mechanism includes an air inlet for sucking in the gas, and the air curtain formed by the air flow generated by the flow generation mechanism is formed at an opening position of the air inlet. The downstream side of the flow direction of the gas leaking from the heat treatment chamber (4) Ρ 3. The heat treatment apparatus of claim 1, wherein a plurality of air flow generation mechanisms are provided, 3 a gas supply system for supplying gas to the air flow generation mechanism, and Gas supply is available at the mountain. In the middle of the system, there are: a gas heating mechanism for heating the gas flowing in the gas 112189-1000824.doc 1354763 _____, and a replacement of the gas in the page supply system on August 21, and a flow adjustment for regulating the flow rate of the gas The gas supply system is divided into a plurality of branch flow paths at a position closer to the upstream side of the flow direction of the gas than the gas flow generation mechanism and the gas heating mechanism, and is connected to the downstream side of the flow direction of the gas with respect to the branch flow path. The airflow generating mechanism and the flow rate adjusting mechanism are disposed closer to the upstream side of the flow direction of the gas than the gas heating mechanism. 4. As requested! The heat treatment device, wherein during the reloading period in which the object to be heated is taken out, and the timing from the reloading period is only the period during which the specific period of the gate is prepared and/or the period from the end of the reloading period is extended by the specific period The heated gas is ejected from the airflow generating mechanism. 5. The heat treatment apparatus according to any one of claims 1 to 4, wherein the air curtain is formed by a gas flow from the lower side generated from the air flow generating mechanism. The heat treatment apparatus according to any one of the preceding claims, wherein the dynamic pressure of the gas ejected from the air flow generating means is higher than the static pressure of the gas flowing in the heat treatment chamber. 7. The heat treatment apparatus according to any one of claims 4 to 4, wherein one of the surfaces of the object to be heated is coated by a film-like body which is formed by heating to generate a gas, and the coated surface is oriented The airflow generating means is disposed in the heat treatment chamber in a specific direction, and the airflow generating means generates airflow from the direction of the back side of the coating surface of the object to be heated placed in the heat treatment chamber toward the surface of the coating surface. 8. If the heat treatment device of any one of the items 丄 to 4 is requested, the 假定中中 assumed 112189-1000824.doc 1354763 ~~24 ~~~&quot; ~Ί年月月修修)) Replacement page · Release During the reloading period of the object to be heated, and the period from the time when the timing is only the predetermined period, and the timing of the beginning of (4) is extended for a certain period of time, during the above-mentioned reloading period, and in the above, the white priest is too 1 &amp;; k + 侑 shoulder and / or extended period / J, L health mechanism sprayed heated gas, 9. 且準備期間及/或延長期間短於上述換裝期間。 如請求項1至4中之任—項之埶虛 項之热處理裝置,其十於假定取 出士放入破加熱物之換裝期間,以及自該換裝期間開始之 牯序僅上溯特定期間之準備期間及/或自換裝期間結束之 時序經過特定期間之延長期間之情形, 於上述換裝期間,以及上述準備期間及/或延長期間 中,自氣流產生機構喷出經加熱之氣體, 於準備期間及/或延長期間中,於單位時間内自氣流產 生機構噴出之氣體之嘴出4,少於於上述換裝期間中, 於單位時間内自氣流產生機構噴出之氣體之噴出量。And the preparation period and / or extension period is shorter than the above replacement period. The heat treatment device of the imaginary item of any one of the items 1 to 4, which is assumed to be placed during the reloading period in which the repelling heater is placed, and the sequence from the reloading period is only up to a specific period. During the preparation period and/or the period from the end of the replacement period, the heated gas is ejected from the airflow generating mechanism during the above-mentioned reloading period, and during the preparation period and/or the extension period, During the preparation period and/or the extension period, the mouth of the gas ejected from the airflow generating means per unit time is less than the discharge amount of the gas ejected from the airflow generating means per unit time during the reloading period. 10.如凊求項1至4中之任一項之熱處理裝置,其中設有多個 氣流產生機構, 且各氣流產生機構開始進行氣體喷出之時序係錯開。 11.如請求項丨至4中之任一項之熱處理裝置,其中上述氣流 產生機構係可將氣體噴出量調整為特定量。 112189-1000824.doc10. The heat treatment apparatus according to any one of claims 1 to 4, wherein a plurality of airflow generating means are provided, and the timings at which the respective airflow generating means start gas ejection are staggered. The heat treatment apparatus according to any one of claims 4 to 4, wherein the air flow generation mechanism adjusts the gas discharge amount to a specific amount. 112189-1000824.doc
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