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TWI351089B - Multi-chip face-to-face stack package - Google Patents

Multi-chip face-to-face stack package

Info

Publication number
TWI351089B
TWI351089B TW096105664A TW96105664A TWI351089B TW I351089 B TWI351089 B TW I351089B TW 096105664 A TW096105664 A TW 096105664A TW 96105664 A TW96105664 A TW 96105664A TW I351089 B TWI351089 B TW I351089B
Authority
TW
Taiwan
Prior art keywords
face
stack package
chip
chip face
package
Prior art date
Application number
TW096105664A
Other languages
Chinese (zh)
Other versions
TW200834844A (en
Inventor
Hsiang Ming Huang
An Hong Liu
Yeong Jyh Lin
Yi Chang Lee
Shu Ching Ho
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW096105664A priority Critical patent/TWI351089B/en
Publication of TW200834844A publication Critical patent/TW200834844A/en
Application granted granted Critical
Publication of TWI351089B publication Critical patent/TWI351089B/en

Links

Classifications

    • H10W72/241—
    • H10W72/865—
    • H10W72/874—
    • H10W72/877—
    • H10W72/884—
    • H10W90/724—
    • H10W90/732—
    • H10W90/754—
TW096105664A 2007-02-15 2007-02-15 Multi-chip face-to-face stack package TWI351089B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096105664A TWI351089B (en) 2007-02-15 2007-02-15 Multi-chip face-to-face stack package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096105664A TWI351089B (en) 2007-02-15 2007-02-15 Multi-chip face-to-face stack package

Publications (2)

Publication Number Publication Date
TW200834844A TW200834844A (en) 2008-08-16
TWI351089B true TWI351089B (en) 2011-10-21

Family

ID=44819558

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105664A TWI351089B (en) 2007-02-15 2007-02-15 Multi-chip face-to-face stack package

Country Status (1)

Country Link
TW (1) TWI351089B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10431549B2 (en) 2018-01-10 2019-10-01 Powertech Technology Inc. Semiconductor package and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4170712A3 (en) 2018-03-29 2023-07-12 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Electronic assembly and electronic system with impedance matched interconnect structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10431549B2 (en) 2018-01-10 2019-10-01 Powertech Technology Inc. Semiconductor package and manufacturing method thereof

Also Published As

Publication number Publication date
TW200834844A (en) 2008-08-16

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