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TWI348754B - Multi-chip zigzag stacked package structure - Google Patents

Multi-chip zigzag stacked package structure

Info

Publication number
TWI348754B
TWI348754B TW096127415A TW96127415A TWI348754B TW I348754 B TWI348754 B TW I348754B TW 096127415 A TW096127415 A TW 096127415A TW 96127415 A TW96127415 A TW 96127415A TW I348754 B TWI348754 B TW I348754B
Authority
TW
Taiwan
Prior art keywords
chip
package structure
stacked package
zigzag stacked
zigzag
Prior art date
Application number
TW096127415A
Other languages
Chinese (zh)
Other versions
TW200905839A (en
Inventor
Yu Ren Chen
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW096127415A priority Critical patent/TWI348754B/en
Publication of TW200905839A publication Critical patent/TW200905839A/en
Application granted granted Critical
Publication of TWI348754B publication Critical patent/TWI348754B/en

Links

Classifications

    • H10W72/884—
    • H10W90/24—
    • H10W90/732—
TW096127415A 2007-07-27 2007-07-27 Multi-chip zigzag stacked package structure TWI348754B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096127415A TWI348754B (en) 2007-07-27 2007-07-27 Multi-chip zigzag stacked package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096127415A TWI348754B (en) 2007-07-27 2007-07-27 Multi-chip zigzag stacked package structure

Publications (2)

Publication Number Publication Date
TW200905839A TW200905839A (en) 2009-02-01
TWI348754B true TWI348754B (en) 2011-09-11

Family

ID=44722883

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127415A TWI348754B (en) 2007-07-27 2007-07-27 Multi-chip zigzag stacked package structure

Country Status (1)

Country Link
TW (1) TWI348754B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI473243B (en) * 2010-09-13 2015-02-11 矽品精密工業股份有限公司 Multi-wafer stacked package structure and process thereof

Also Published As

Publication number Publication date
TW200905839A (en) 2009-02-01

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