|
US7821114B2
(en)
*
|
2008-01-28 |
2010-10-26 |
Fairchild Semiconductor Corporation |
Multiphase synchronous buck converter
|
|
US7696612B2
(en)
*
|
2008-01-28 |
2010-04-13 |
Fairchild Semiconductor Corporation |
Multiphase synchronous buck converter
|
|
US7915721B2
(en)
*
|
2008-03-12 |
2011-03-29 |
Fairchild Semiconductor Corporation |
Semiconductor die package including IC driver and bridge
|
|
US8168490B2
(en)
|
2008-12-23 |
2012-05-01 |
Intersil Americas, Inc. |
Co-packaging approach for power converters based on planar devices, structure and method
|
|
US8023279B2
(en)
*
|
2009-03-12 |
2011-09-20 |
Fairchild Semiconductor Corporation |
FLMP buck converter with a molded capacitor and a method of the same
|
|
JP5443837B2
(ja)
*
|
2009-06-05 |
2014-03-19 |
ルネサスエレクトロニクス株式会社 |
半導体装置
|
|
US8178954B2
(en)
*
|
2009-07-31 |
2012-05-15 |
Alpha & Omega Semiconductor, Inc. |
Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
|
|
US8426950B2
(en)
*
|
2010-01-13 |
2013-04-23 |
Fairchild Semiconductor Corporation |
Die package including multiple dies and lead orientation
|
|
CN103646942B
(zh)
*
|
2010-02-25 |
2016-01-13 |
万国半导体有限公司 |
一种应用于功率切换器电路的半导体封装结构
|
|
TWI426595B
(zh)
*
|
2010-03-01 |
2014-02-11 |
萬國半導體有限公司 |
一種應用於功率切換器電路的半導體封裝結構
|
|
US9728868B1
(en)
|
2010-05-05 |
2017-08-08 |
Cree Fayetteville, Inc. |
Apparatus having self healing liquid phase power connects and method thereof
|
|
US9184117B2
(en)
*
|
2010-06-18 |
2015-11-10 |
Alpha And Omega Semiconductor Incorporated |
Stacked dual-chip packaging structure and preparation method thereof
|
|
TWI453831B
(zh)
|
2010-09-09 |
2014-09-21 |
台灣捷康綜合有限公司 |
半導體封裝結構及其製造方法
|
|
MY166609A
(en)
|
2010-09-15 |
2018-07-17 |
Semiconductor Components Ind Llc |
Connector assembly and method of manufacture
|
|
CN102468292B
(zh)
*
|
2010-10-29 |
2015-02-25 |
万国半导体股份有限公司 |
一种用于直流-直流转换器的封装体结构
|
|
US8674497B2
(en)
|
2011-01-14 |
2014-03-18 |
International Business Machines Corporation |
Stacked half-bridge package with a current carrying layer
|
|
US8426952B2
(en)
*
|
2011-01-14 |
2013-04-23 |
International Rectifier Corporation |
Stacked half-bridge package with a common conductive leadframe
|
|
US8680627B2
(en)
|
2011-01-14 |
2014-03-25 |
International Rectifier Corporation |
Stacked half-bridge package with a common conductive clip
|
|
US20120193772A1
(en)
*
|
2011-01-28 |
2012-08-02 |
Hunt Hang Jiang |
Stacked die packages with flip-chip and wire bonding dies
|
|
US20120200281A1
(en)
*
|
2011-02-07 |
2012-08-09 |
Texas Instruments Incorporated |
Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
|
|
IT1404382B1
(it)
*
|
2011-02-24 |
2013-11-22 |
St Microelectronics Srl |
Dispositivo elettronico per applicazioni ad elevata potenza.
|
|
US8436429B2
(en)
|
2011-05-29 |
2013-05-07 |
Alpha & Omega Semiconductor, Inc. |
Stacked power semiconductor device using dual lead frame and manufacturing method
|
|
US8299588B1
(en)
|
2011-07-07 |
2012-10-30 |
Texas Instruments Incorporated |
Structure and method for uniform current distribution in power supply module
|
|
US9087829B2
(en)
|
2011-08-05 |
2015-07-21 |
Infineon Technologies Ag |
Semiconductor arrangement
|
|
US9524957B2
(en)
|
2011-08-17 |
2016-12-20 |
Intersil Americas LLC |
Back-to-back stacked dies
|
|
US8581416B2
(en)
|
2011-12-15 |
2013-11-12 |
Semiconductor Components Industries, Llc |
Method of forming a semiconductor device and leadframe therefor
|
|
US8524532B1
(en)
*
|
2012-02-27 |
2013-09-03 |
Texas Instruments Incorporated |
Integrated circuit package including an embedded power stage wherein a first field effect transistor (FET) and a second FET are electrically coupled therein
|
|
CN103887292B
(zh)
*
|
2012-12-21 |
2016-08-03 |
万国半导体股份有限公司 |
堆叠式双芯片封装结构及其制备方法
|
|
US9379050B2
(en)
*
|
2013-02-28 |
2016-06-28 |
Infineon Technologies Austria Ag |
Electronic device
|
|
US9082868B2
(en)
|
2013-03-13 |
2015-07-14 |
Semiconductor Components Industries, Llc |
Semiconductor component and method of manufacture
|
|
US9589929B2
(en)
|
2013-03-14 |
2017-03-07 |
Vishay-Siliconix |
Method for fabricating stack die package
|
|
KR101977994B1
(ko)
*
|
2013-06-28 |
2019-08-29 |
매그나칩 반도체 유한회사 |
반도체 패키지
|
|
US9275944B2
(en)
*
|
2013-08-29 |
2016-03-01 |
Infineon Technologies Ag |
Semiconductor package with multi-level die block
|
|
TWI509770B
(zh)
*
|
2013-12-17 |
2015-11-21 |
萬國半導體股份有限公司 |
集成堆疊式多晶片的半導體器件及其制備方法
|
|
TWI571981B
(zh)
*
|
2014-04-11 |
2017-02-21 |
萬國半導體開曼股份有限公司 |
小尺寸貼片印跡面積的功率半導體裝置及製備方法
|
|
US9355942B2
(en)
*
|
2014-05-15 |
2016-05-31 |
Texas Instruments Incorporated |
Gang clips having distributed-function tie bars
|
|
CN107836037B
(zh)
*
|
2015-01-22 |
2020-07-17 |
瑞萨电子株式会社 |
半导体器件及其制造方法
|
|
US9468087B1
(en)
|
2015-07-13 |
2016-10-11 |
Texas Instruments Incorporated |
Power module with improved cooling and method for making
|
|
JP6490027B2
(ja)
*
|
2016-06-10 |
2019-03-27 |
三菱電機株式会社 |
半導体装置
|
|
US10229861B2
(en)
*
|
2017-04-06 |
2019-03-12 |
Sabin Lupan |
Power semiconductor device and package
|
|
US10720380B1
(en)
|
2017-06-13 |
2020-07-21 |
Starlet R. Glover |
Flip-chip wire bondless power device
|
|
US10535579B2
(en)
*
|
2018-04-06 |
2020-01-14 |
Sabin Lupan |
Power semiconductor device and package
|
|
CN108447847A
(zh)
*
|
2018-06-06 |
2018-08-24 |
臻驱科技（上海）有限公司 |
一种功率半导体模块衬底及功率半导体模块
|
|
DE102020214912A1
(de)
*
|
2020-11-27 |
2022-06-02 |
Robert Bosch Gesellschaft mit beschränkter Haftung |
Schaltvorrichtung, elektrischer Energiespeicher, Vorrichtung und Verfahren zum Herstellen einer Schaltvorrichtung
|
|
EP4057341A1
(en)
*
|
2021-03-12 |
2022-09-14 |
Nexperia B.V. |
Packaged half-bridge circuit
|
|
TW202450009A
(zh)
*
|
2022-11-16 |
2024-12-16 |
美商半導體元件工業有限責任公司 |
具有低電感的可擴縮功率半導體裝置封裝
|