TWI237544B - Chip set heat dissipation structure for data processing apparatus - Google Patents

Abstract

A chip set heat dissipation structure for a data processing apparatus is that two sides of a circuit board have a first thermal pad and a second thermal pad respectively. When a chip set on the circuit board operates to generate high heat, heat energy is conducted in two directions to a case through the first thermal pad and the second thermal pad. A heat dissipation area is then expanded to the case entirely so as to provide a better heat dissipation performance without installing any heat dissipation fan. Electric energy in the apparatus can be further saved efficiently to improve the use time of a system substantially.

Description

1237544 V. Description of the invention (l) [Technical field to which the invention belongs] .. It is related to a data processing device, in particular, a chip set of a capital device that provides good heat dissipation performance for electronic components such as discrete chip sets. Thermal structure. 7 [Previous Technology]: The prosperity of the conductor industry, computer equipment has become an important tool in the common life of the general public, Ju Fanzhang —— talks about eight p The 9th f exhibition, through the powerful computing power and data processing of computer equipment, has created: a fast and convenient working mode; and today's network can help people to send messages in real time, and computers The second effect is to bring richer entertainment effects to users. The ear is the development direction of the current Α Α _ band of computer equipment. There are clocks that are light, stomach, short, small and easy to carry. In recent years, the equipment in the industry is too large to carry. T ^ (Note ^ f ^ ^

Mgital Assistant), line :: Digital assistant (PerS〇nal such data processing devices are mainly on the phone (MOM1)), etc. It is portable and consumes no function / 1, because it is relatively small and easy to follow CDmputec P〇 = Desktop personal computer (PerS〇nal is large, but its performance is suitable for i-ίΓ; (Serveriri prepared to Γ is loved by the general public and willing to use it, but it is fine, so this type of handheld Lean materials processing devices such as notebook computers or tablet PCs developed in recent years, etc. With the research of the semiconductor industry 1237544 V. Description of the invention (2) __ ίϊϊ ^ The performance of various electronic components has been significantly improved, which has accompanied it When it was in operation, it radiated an alarmingly high fever, causing the university to propose a number of solutions for the internal components of data processing devices. Some of these technologies have been published and 44ΠΠ9 such as the Republic of China Patent No. 493857 (the following No. 857), No. 0 (referred to as No. 020), No. 46〇108 (Jane's technology. No. 857 disclosed a kind of "assistance notebook type electricity :) the base of the thermally exposed 2, the notebook type electricity When assembled on the base] ^ ^ = fan to achieve the effect of heat dissipation. 丨 08 case revealed one-up ... Among them, two scattered pieces and wind are set in the casing. The IC technology is particularly concentrated on the cooling fins. The structure cover is long and the Udo U is installed in a horizontal way, phase a and the fan thickness is small. Only the traditional assembly method requires the assembly of the fruit to be flat, but the above case can work reasonably. It has the effect of a certain process production, but there are still some defects: (1) The demand for cylindrical column is large, and it is installed in the west office. Yu 1 is equipped with heat sinks, wind turbines, and most of them are electronic components. For the convenience of the building, the volume must be equal to two materials: the cooling fan of the type data processing device, the overall f cannot be overcome; i is bound to increase the thickness of the λ fan farm. When the processing device is carried out, the power source, tolerance, and private pool groups, but the operation of the fan is bound to continue to consume treasure

1237544 V. Description of the invention (3) Expensive electricity, which is also difficult to carry with α (3): such as d. Provide heat dissipation function, but need extra citations / provide additional base to disturb 'neither is a kind of good': square; equipped and increase the user's sleepiness (4) the taste of operation. Standing phase. ', Heat fan to generate heat dissipation • As mentioned above, the conventional technology needs to be installed and used. It will inevitably produce some noise and create it [Content of the invention] There is a clock here, and the heat structure will be celebrated on the 4th The main objective of the invention is to save energy in a chip set of a data processing device, and to provide a heat dissipation structure according to the present invention, which has a chip heat dissipation structure that does not require a cooling fan and saves assembly space required for data processing.

The structure mainly includes a heat dissipation chipset disposed on the right M-type contact shell, and the housing has a storage medium pair, a first thermal pad and a second thermal pad. Among them, the operation place = b can be used to supply circuit boards such as common motherboards, etc. P — U two electronic parts such as the central processor thin W thermal pad is set on the electronics and the capacity is configured on the circuit board. With the top side of the chipset of the chipset, in fact-thermal conductivity. The second guide ^ is provided with a heat dissipation fin to increase the pair of heat conduction positions; the other side is located on the-side of the wafer *, χ for the second: when the carcass sandwich is assembled on the second heat conduction pad, the wafer% Stupid t: ,,,, pads are tightly assembled. When the breeding processing device operates first; the parts will inevitably generate high heat, and at this time, the heat energy of the ...

Page 7 1237544 V. Description of the invention (4) The thermal energy generated by the 2 2 aa chipset can also be guided to the-thermal pad through the circuit board, and cooperate with the housing sandwich to change the 埶 At value # $ v 5 丨 主 弟One ¥ cooling effect. a Bamboo cooked This is passed to the machine, and the main difference between the well-known technology and the conventional technology is good, because the conventional technology usually only transfers heat energy to the back side from one side of the backup heat source. More hunting · From the second part of the electronic parts: the circuit board to the first. Thermal conductivity [re-transmission to = 2 greatly improves the heat dissipation of the overall operating system. Data processing equipment can make more space for two households, resulting in expensive limited electrical energy. More exquisite and "convenient, but also save treasure. In order to make the above and 1 of the present invention easy to understand, the following special Xingling 彳 π & his advantages, special quilts, and advantages can be explained in more detail. The best embodiment, and in accordance with the attached drawings, [Embodiment] Figure "and the heat treatment structure of the chip set Q device-the middle chip set 'Please refer to" No. 1 (taMet P II; for; developed in recent years The tablet computer device is different from the traditional pen two and shell material processing device. This type of data is processed on the ii-p * pen computer, which is characterized by the use of Qu Kegu & ：, The user can record directly, and it is small to carry and use the photo book and must be able to provide long-term use, so for the sake of convenience, it is necessary to dissipate heat = so if you can design-a kind of exempt product has superior :::: : The mechanism of good heat dissipation effect will make; Page 8

I 1237544 V. Description of the invention (5) Guidance: It mainly consists of the housing 10, the circuit board 50, the first coating-, the first, the second thermal-conductive pad 30. Among them, Lei Wei w less film group 60 such as central processing unit electronic parts assembly :, ίί 2 :! :, The body 12 and the lower casing 11 are combined with each other to form an accommodation; 3 and i ΐ = i circuit-board 50. The first thermal pad 20 is made of a highly conductive and electrically insulating deformable material; = side = the side that is tightly bonded to the chipset 'in addition to the first thermal pad 20 and the chipset 6 :: 50 I is equipped with exothermic fins 40 in order to obtain the heat of the chipset 60 = ^ 20 = to provide the effect of heat dissipation. It is also necessary to add = to == = the front side of the board 50, and the back side of the circuit board 50 can be used. The second heat conduction pad 3 is the same as the first heat conduction pad 20, which is electrically insulated by = Made of deformed material ... close to the side of the sandwich 13, the shell sandwich 13 is assembled between the upper shell 12 and the circuit, and is placed between the upper shell 12 and the shell sandwich 13. Display screen, etc. The assembly position of the second thermal pad 30 is located on the circuit board; the board is in the wafer group 60 assembly ...

Please refer to "Figure 2", in which the chipset 60 generates high heat when operating, and is conducted to the first thermal pad 20 through the heat dissipation fins 40, and then guided to the housing 10 to produce a heat dissipation effect. As shown in the "Figure 3", the present invention is heavy, and its technical characteristics are that in addition to the traditional Japanese-Japanese-Japanese film that transfers heat energy on the top side of the chipset 60, and that it is placed on the back of the placement place of the circuit board 50 Side, the thermal energy is guided to the second thermal pad 30 through the rabbit circuit board 50, and then transferred to the shell sandwich 13

1237544 V. Description of the invention (6) The eight limbs 10 'provide heat dissipation effect in the other direction. It should also be added that, because the heat transmitted by the second thermal pad 30 is transmitted by the body sandwich 13, it is arranged in the shell. " You do n’t know the screen, and have a low tolerance for thermal energy. If the temperature is too high, the 30% will be implemented: =: "hunting: adjusting the first-thermal conductivity 20 and the second thermal conductivity of various electronic components Characteristics to achieve the best when high solids: two =: industrial; 50; the thermal energy generated by the operation of the thermal energy phase of the configuration space is measured by 4: set the fins 40, the chipset 60 absorbs and conducts through the circuit board 50 1 g μ to 80% is the back side of the board 50 configuration. It is installed on the chip set 60 and the chip set 60 of the circuit board 50 is transported; the resulting ::: pad 30 can be effectively brought out From the outside, the system dispersion is greatly improved. = The chip set of the data processing device to the housing 10 and the edge of the data processing device. The last name is f. Political heat, the thermal performance of this studio can be increased by 3. 0% lead according to the present invention, which is used in chipset, etc. The electronic zero;: ;;; installed: the chipset heat dissipation effect: in addition to the back side; the cause: the top side is provided The heat dissipation is the body of the overall data processing device. The effective heat dissipation area is expanded without the need for a cooling fan and heat pipe. Performance, and can be made more compact, free. Therefore, the overall data processing device eliminates the need for continuous operation and consumes precious electricity. Page 10 1237544 V. Description of the invention (7) _____ — It also significantly increases the outstanding design of the system. "Using time" is both creative and practical. As mentioned above, the present invention is-rare newness, advancement, and industrial profitability-enter the "innovative products", which has the most important requirements and is based on patent law.咬 The application patent of Wang Fuhe invention patent to protect the rights of the inventor. Examination of commissions is not intended to limit: Ming 2 is only one of the preferred embodiments of the present invention, and the implementation of all of the same; that is, according to the present invention, all patents, temples, crossovers and modifications are required. It is covered by the patent scope of the present invention.

Page 111237544 Brief description of the drawings. Figure 1 is an exploded perspective view of the heat dissipation structure of the chip set of the data processing device of the present invention; Figure 2 is a schematic side heat conduction diagram of the heat dissipation structure of the chip set of the data processing device of the present invention; The figure shows the heat dissipation structure of the chip set of the data processing device of the present invention. No-Side Schematic diagram of heat conduction. [Illustration of Symbols] 10 Case 11 Lower Case 12 Upper Case 13 Shell Interlayer 20 First Thermal Pad 30 Second Thermal Pad 40 Heat Dissipating Fin 50 Circuit Board 60 Chip Set

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Claims (1)

1237544 Case number 92131316 Amendment VI. Patent Application Scope 1. A chipset heat dissipation structure of a data processing device includes: a housing with a receiving space to accommodate a circuit board, and the circuit board is equipped with a chipset; a first The inner side of the first heat conducting pad is used to guide the crystals to operate and conduct the heat conduction respectively. 3. The heat-sink junction of Rushen leads to 4. The heat-sink junction of Rushen, and 5. The patented structure produced by the joints of Shenshen group is closely related to the patented structure, which is closely related to the crystal. Patent structure, which can be tightly assembled with a patented thermal pad, mounted on the front side of the circuit board, and the upper and lower sides are respectively connected to the top side of the chipset and the housing. The heat generated by the operation of the chipset can be passed through the first To the case; and a thermal pad, which is assembled on the back side of the circuit board and is located at the corresponding position of the assembly position, the upper and lower sides of the second thermal pad, the back side of the circuit board and the inside of the case, so that the heat of the chipset The circuit board is passed through the second heat conducting pad body to enhance heat dissipation. In the chip assembly of the data processing device described in the first item of the scope, the case has a shell sandwich for the second conduction, so that the second heat conduction pad conducts heat energy to the first item of the shell range. The chip set of the data processing device further includes a heat dissipation fin, which is assembled between the first guide sheet set to assist the chip set to conduct thermal energy to the heat pad. In the chip set of the data processing device described in the first item of the scope, the first thermal pad is made of a deformable material and is attached to the chip set. The chip set of the data processing device described in item 1 of the scope Page 131237544 _ Case No. 92131316 guang] > Year 〆 / Month 〆 j said amendment_ VI. Patent application thermal structure, in which the second thermal pad is made of deformable material and can be closely attached to The circuit board. 6. The heat dissipation structure of the chip set of the data processing device described in item 1 of the patent application scope, wherein the thermal pad is made of an electrically insulating material. 7. The heat dissipation structure of the chip set of the data processing device according to item 1 of the scope of patent application, wherein the chip set is a central processing unit. Page 14