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TWI237351B - Molding apparatus with a molding flowability sensor for packaging semiconductor package - Google Patents

Molding apparatus with a molding flowability sensor for packaging semiconductor package Download PDF

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Publication number
TWI237351B
TWI237351B TW092129689A TW92129689A TWI237351B TW I237351 B TWI237351 B TW I237351B TW 092129689 A TW092129689 A TW 092129689A TW 92129689 A TW92129689 A TW 92129689A TW I237351 B TWI237351 B TW I237351B
Authority
TW
Taiwan
Prior art keywords
mold
flow velocity
cavity
velocity sensor
molding
Prior art date
Application number
TW092129689A
Other languages
English (en)
Other versions
TW200515546A (en
Inventor
Wei-Chih Wang
Kuang-Lin Lo
Yun-Lung Chang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW092129689A priority Critical patent/TWI237351B/zh
Priority to US10/901,039 priority patent/US7144239B2/en
Publication of TW200515546A publication Critical patent/TW200515546A/zh
Application granted granted Critical
Publication of TWI237351B publication Critical patent/TWI237351B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/7646—Measuring, controlling or regulating viscosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76056—Flow rate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76056—Flow rate
    • B29C2945/76063—MFI, MFR
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76254—Mould
    • B29C2945/76257—Mould cavity
    • B29C2945/7626—Mould cavity cavity walls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

1237351 五、發明說明（1) ()、【發明所屬之技術領域】 本兔明係有關於一種半導 是有關於-種於模穴表面之，裝置，特別 導體封裴用鑄模裝置。 α置有—模流流速感測器之半 (二）、【先前技術】 技術==化以及高運作速度需求的增加，帛導體封裝 卢其β:省=置或兀件之製造所扮演之角色也愈形重要。 #二ί ΐ 70件之封膠時，需要求較穩定之模流流速， 吏=^便之液恝膠材能平均的灌注至模具之模穴中，以確 保半導體兀件封模後，其外觀能保持較佳之完整性。 ^ 一般而言，目前模具裝置之設計（如圖1所示）係包含一 杈座（nu^ld chase holder)ll〇、一模具（mold chase)12〇 及 一加熱杰130(heater)。其中，模座no係用以容置模具 120 模具120係具有複數個模穴i21(mold cavity);加熱 為1 3 0係設置於模座1丨〇中，而模具丨2 〇係藉由模座丨丨〇上之 加熱器1 3 0使其加熱之。由於模具上並無任何量測模流流速 之感測？§ ’故只能利用高感度儀器（如s p i r a 1 f丨0 w t ο ο 1) 在封膠后即時量測模流流速（即封膠之流動度 (f lowability))，所以無法得知封膠於模穴1 2 1表面上之 實際流動速度。也因此高感度儀器所偵測得知之模流流速 資料往往與模穴1 2 1表面上封膠之實際流動速度有一定之差 異，而無法得知實際之模流流速。 有鑑於此，為得知封膠之實際流動速度以了解其流動
1237351
五、發明說明（2) 情形’進而得知相關封膠之材料特性，來作為相關封膠材 料之改善依據，並提升半導體元件之封裝效能，實為二重 〔三）、【發明内容】 有鑑於上述課題，本發明之目的係提供一種具有模济 流速感測器之半導體封裝用鑄模裝置，其具有一模流流$ 感測為設置於模具中之模六表面上，用以直接量測封膠於 模八表面之流動速度（f丨〇 w a b丨丨丨t y )，來得知相關封膠材料
之特性並作為相關封膠材料之改善依據，以進一步確保相 關封膠材之品質。 緣是’為了達成上述目的，本發明係提供一種具有模 流流速感測器之半導體封裝用鑄模裝置，主要包含一模 座、二模具、一加熱器及一模流流速感測器。該模具係具 有一模穴’而該模穴具有一模穴表面；該模座係用以容置該 模/、再者°亥加熱器係設置於模座中，用以加熱該模 具。值得^意的是’該模流流速感測器係設置於模穴表面 上，=以里測該模穴表面之模流流速（封膠流動速度）。
&上，述’由於模流流速感測器係設置於模具之模穴 表，’故忐正確量測出模穴表面之模流流速，並藉此以量 測知知^膠材於模穴表面流動時之實際流動速度，以得知 相關封膠材料之特性，蠢作為相關封膠材料之改善依據， 以進一步確保相關封膠材之品質。
1237351 五、發明說明（3) (四）、【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例之半 體封裝用之鑄模裝置。 ’ … 圖2係顯示本發明較佳實施例之具有模流流速感測器之 半to封I用鑄模裝置，而圖2 A及圖2 B係本發明較佳實施例 中之模流流速感測器設置於模穴表面之示意圖。如圖2所 不’本發明之半導體封裝用之鑄模裝置主要包含一模座 2 1 0、一模具2 2 0、一加熱器2 3 〇及一模流流速感測器2 4 〇。模 具2 2 0係具有複數個模穴2 2 1，且該模穴2 2 1具有一模穴表面 2 2 2。另外，模座21〇係用以容置該模具2 2 0，且該模座21〇設 有一加熱器2 3 0，用以加熱該模具2 2 0，使封膠材灌注入置有 半導體元件之模穴221中，進行半導體元件之封膠步驟。值 得注思的是’模流流速感測器2 4 〇係設置於模具2 2 〇之模穴表 面222上，用以量測該模穴表面222之模流流速。如圖2a所 示，該模流流速感測器24〇可為複數個並依螺旋狀之排列方 式設置於模穴表面2 22;而如圖2B所示，該模流流速感測器 240亦可依矩陣狀之排列方式設置於模六表面222。承上所 述，藉由设置於模穴表面2 2 2之模流流速感測器2 4 〇，可準確 量測封，材於模穴表面2 22之流動速度，降低其與先前藉由 高感度量測儀器量測得知之模流流速之差異值。再者，並可 藉此得知相關封膠材料之特性，以作為相關封膠材料之改善 依據’進而確保半導體先件之封膠材品質。 口 0 = :: =之詳細說明中所提出之具體的實施例僅為了 易於s兄月本發明之技術内容’而並非將本發明狹義地限制於
第8頁 1237351
1237351 圖式簡單說明 (五）、【圖式簡單說明】 圖1為一示意圖，顯示習知半導體封裝用之鑄模裝 置。 圖2為一示意圖，顯示本發明較佳實施例之具有模流 流速感測器之半導體封裝用鑄模裝置。 圖2 A為一示意圖，顯示模流流速感測器依螺旋狀之排 列方式設置於模穴表面上。 圖2 B為一示意圖，顯示模流流速感測器依矩陣狀之排 列方式設置於模穴表面上。 ' 120 121 222 226 130 240 模具 模穴 模穴表面 貫孔 加熱器 模流流速感測器 元件符號說明 1 1 0、2 1 Q 模座 220 221 230
第10頁

Claims (1)

1237351 六、申請專利範圍 1. 一種具有模流流速感測器之半導體封裝用鑄模裝置， 包含： 一模具，其係具有至少一模穴，且該模六具有一模穴表 面； 一模座，其係用以容置該模具；以及 至少一模流流速感測器，其係設置於該模穴表面上。 2 · 如申請專利範圍第1項所述之具有模流流速感測器之半 導體封裝用鑄模裝置，更包含一加熱器設置於該模座上用 以加熱該模具。 3. 如申請專利範圍第1項所述之具有模流流速感測器之半 導體封裝用鑄模裝置，其中該模流流速感測器係以一螺旋 狀之排列方式設置於該模穴表上。 4. 如申請專利範圍第1項所述之具有模流流速感測器之半 導體封裝用鑄模裝置，其中該模流流速感測器係以一矩陣 狀之排列方式設置於該模穴表上。
TW092129689A 2003-10-24 2003-10-24 Molding apparatus with a molding flowability sensor for packaging semiconductor package TWI237351B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092129689A TWI237351B (en) 2003-10-24 2003-10-24 Molding apparatus with a molding flowability sensor for packaging semiconductor package
US10/901,039 US7144239B2 (en) 2003-10-24 2004-07-29 Molding apparatus with a molding flowability sensor for packaging semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092129689A TWI237351B (en) 2003-10-24 2003-10-24 Molding apparatus with a molding flowability sensor for packaging semiconductor package

Publications (2)

Publication Number Publication Date
TW200515546A TW200515546A (en) 2005-05-01
TWI237351B true TWI237351B (en) 2005-08-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10046486B2 (en) 2014-12-22 2018-08-14 Hao-Chieh Liao Mold thermal controlling device and hot press system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7618249B2 (en) * 2006-09-22 2009-11-17 Asm Technology Singapore Pte Ltd. Memory card molding apparatus and process

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JPS5497660A (en) * 1978-01-18 1979-08-01 Hitachi Ltd Monitoring of degree of resin cure and its device
JPS5835460B2 (ja) * 1979-09-28 1983-08-02 株式会社日立製作所 トランスフア成形機
JPH02122636A (ja) * 1988-11-01 1990-05-10 Nec Kyushu Ltd 樹脂封止装置
JP2626007B2 (ja) * 1988-12-16 1997-07-02 松下電器産業株式会社 半導体チップのモールドプレス方法
JPH0653263A (ja) * 1992-07-31 1994-02-25 Nec Corp 樹脂封止型半導体の封入製造装置
JPH10256287A (ja) * 1997-03-17 1998-09-25 Mitsubishi Electric Corp 半導体装置およびその樹脂封止方法並びに樹脂封止装置
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JPH11176853A (ja) * 1997-12-15 1999-07-02 Matsushita Electric Works Ltd 半導体封止成形方法及び半導体封止成形金型
JP2002076041A (ja) * 2000-09-01 2002-03-15 Nec Corp 樹脂封入性評価方法並びに評価装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10046486B2 (en) 2014-12-22 2018-08-14 Hao-Chieh Liao Mold thermal controlling device and hot press system

Also Published As

Publication number Publication date
US7144239B2 (en) 2006-12-05
TW200515546A (en) 2005-05-01
US20050089594A1 (en) 2005-04-28

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