12213261221326
(一）、【發明所屬之技術領域】 曰本發明是有關於一種半導體封裝用之鑄模裝置，特別 是有關於一種模穴中設置有一感溫器之鑄模裝置。、(1) [Technical field to which the invention belongs] The present invention relates to a mold device for semiconductor packaging, and more particularly, to a mold device provided with a temperature sensor in a cavity. ,
先前技術】 隨著微小化以及高運作速度需求的增加，半導體封 技術在電子裝置或元件之製造所扮演之角色也愈形重要。 尤其是半導體元件之封膠時，需要求較穩定之模溫控制，Prior Technology] As miniaturization and the need for high operating speeds have increased, the role of semiconductor packaging technology in the manufacture of electronic devices or components has become increasingly important. Especially for the sealing of semiconductor components, more stable mold temperature control is required.
使受熱後之液態膠材能平均的灌注至模具之模穴中，以確 保半導體元件封模後，其外觀能保持較佳之完整性。 請參照圖1，目前之模具裝置之設計，一般係包含一模 座chase h〇lder)ll〇、一模具（m〇ld chase)12〇、一 加熱器 130(heater)及一感溫器 140(therm〇 c〇uple)。其The heated liquid glue material can be evenly poured into the cavity of the mold to ensure that the appearance of the semiconductor component can be kept intact after sealing. Please refer to FIG. 1. The current design of the mold device generally includes a mold holder chalol, 110, a mold chase, 120, a heater, and a temperature sensor. (thermocouple). its
中，模座11 0係用以容置模具1 2 〇，模具1 2 0係具有複數個模 穴121Uold cavity);加熱器130係設置於模座u〇中，而、 感溫器140係設置於加熱器130旁。模具12〇係藉由模座n〇 上之加熱器130使其加熱之，故感溫器14〇所能偵測之溫度 資料係為模座110之溫度，而非模穴121表面之溫度，且由 於感溫器140與加熱器130設置位置過於接近，故當感溫器 140所^測得知之資料往往與模穴丨21表面溫度有一定之差 異，換a之，當感溫器1 4 0測得溫度超過預定設定之溫度標 準時，加熱器1 3 0便會直接自動停止繼續加熱，如此將影響 半導體元件之封裝品質。此外，若於封膠過程中，以人工3 直接開啟模具來量測模穴丨21表面溫度，由於模穴121表面In the mold holder 110, the mold holder 120 is used to accommodate the mold 120, and the mold holder 120 is provided with a plurality of mold cavities 121Uold cavity); the heater 130 is provided in the mold holder u0, and the temperature sensor 140 is provided. Next to the heater 130. The mold 12 is heated by the heater 130 on the mold base n. Therefore, the temperature data that the temperature sensor 14 can detect is the temperature of the mold base 110, not the temperature on the surface of the mold cavity 121. And because the positions of the temperature sensor 140 and the heater 130 are too close, when the information measured by the temperature sensor 140 is often different from the surface temperature of the mold cavity 丨 21, in other words, when the temperature sensor 1 4 When the measured temperature exceeds a predetermined temperature standard, the heater 130 will automatically stop heating directly, which will affect the packaging quality of the semiconductor device. In addition, during the sealing process, the artificial mold 3 is used to directly open the mold to measure the surface temperature of the mold cavity 21, because the surface of the mold cavity 121
1221326 五、發明說明（2) 之溫度會受環境溫片勒 衣兄皿度影響，不僅操作 大0 有鑑於此’為避免前述半導 點，以提升丰導轉分彳生> 4 丌千導體70件之封裝效能， 發明内容】 上述課題，本發明之目的 裝置，其特徵在於鑄模裝 以直接量測注膠之溫度， 為了達成上述目的，本發 模裝置’主要包含一模座 。該模具係具有一模穴及 該模具，且該模座具有一 徵在於該感溫器係設置於 表面之溫度。 述，由於感溫器係設置於 模穴表面之溫度，以藉由 時溫度變化之狀況，以確 (四）、【實施方式】 以下將參照相關圖式 導體封裝用之鑄模裝置。 費時不易且其誤差甚 裝用之鑄模裝置之缺 實為一重要的課題。 有鑑於 裝用之鑄模 感溫器，用 質。 緣是， 封裝用之鑄 及一感溫器 座用以容置 模具。其特 量測該模穴 綜上所 正確量測出 封膠材流動 材品質。 係提供一種半導體封 置之模具中設置有一 而能確保封膠材之品 明係提供一種半導體 模具、一加熱器 至少一感溫器。該模 加熱器，用以加熱該 模具之貫孔中，用以 ，具之貫孔中，故能 ϊ測得知之較正確之 保半導體元件之封膠 說明依本發明較佳實施例之半 1221326 五、發明說明（3) 係繪示本發明較佳實施例 置。本發明之半導體封裝之耨模褒 川、—模具22。、一加熱器2 — 跋置座 226係貫穿模穴表面222 (喑一有^夕貫孔226且貫孔 庙9ΐη於扣 ^ k 併參考圖2及圖2A)。另外，模 工：；置該模具22°，且該模趣設有-加』器 件之該ΐ具220 ’使封膠材灌注入置有半導體元 ί 導體元件之封膠步驟。值得注意的 模穴表面222之、、”。J J貝孔22 6中，用以量測該 度，作為封膠;feT又#匕可藉由準確量測模穴表面222溫 模肋。溫度作為封謬材Λ為進參而考降之低差先則以-二得知之 體元件之封膠材。曾 马上考之差異’而旎確保半導 為一感溫棒。 其中，值侍注意的是，感溫器240可 裝體之突出梢（鑄，裝置中用以頂出冷卻成形之半導體封 中，故吾人之Γ Pln)係設置於模具220之貫孔226 '溫器240置Μ發;月\疋/古原有之部分突出梢取出，而將感 更動，如此不：中 有之鑄模裝置不需做大規模之配置 封膠材品質：：大Γ低成本’更可確保半導體元件之 示於圖中)，而外，亦可於模具22 0中另增設-貫孔(未標 而將感溫器240置於其中。 於本實施例之詳細說明中所提出 了易於說明本發明之技術内容，將；：；： =為 制於該實施例，因此，在不超出本發=:及月：= 1221326 五、發明說明（4) 專利範圍之情況，可作種種變化實施。 1221326 圊式簡單說明 (五）、【圖式之簡單說明】 圖1為一示意圖，顯示習知半導體封裝用之鑄模裝置。 圖2為一示意圖，顯示本發明較佳實施例之半導體封裝 用之鑄模裝置。 圖2A為一示意圖，顯示感溫器設置於模穴之貫孔中。 元件符號說明： 110 、210 模座 120 >220 模具 221 模穴 222 模穴表面 226 貫孔 130 >230 加熱器 140 、240 感溫裔1221326 V. Description of the invention (2) The temperature of the invention will be affected by the temperature of the ambient temperature, not only the operation is large. In view of this, in order to avoid the semiconducting point mentioned above, in order to improve the enrichment of transduced cells> 4 Packaging efficiency of 70 conductors, the content of the invention] The above-mentioned problem and the device of the present invention are characterized in that the mold is equipped with a direct measurement of the temperature of the glue injection. In order to achieve the above-mentioned object, the present mold device 'mainly includes a mold base. The mold system has a cavity and the mold, and the mold base has a temperature at which the temperature sensor is disposed on the surface. Since the temperature sensor is set on the surface of the mold cavity to determine the temperature change condition at time, (4), [Embodiment] The following will refer to the related drawings, the mold device for conductor packaging. The lack of time-consuming and error-prone mold devices is an important issue. In view of the quality of the installed mold temperature sensor. The reason is that the mold for packaging and a temperature sensor base are used to house the mold. It specifically measures the mold cavity. In summary, it accurately measures the quality of the sealant flowing material. A semiconductor packaging mold is provided to provide a product that can ensure the sealing material. A semiconductor mold, a heater, and at least a temperature sensor are provided. The mold heater is used to heat the through holes of the mold, and is used in the through holes of the mold. Therefore, it is possible to detect the more accurate sealing compound for semiconductor components. According to the half of the preferred embodiment of the present invention, 1221326 V. Description of the Invention (3) The preferred embodiment of the present invention is shown. The die of the semiconductor package of the present invention, the die 22. 1. A heater 2 — The pedestal seat 226 penetrates the surface of the mold cavity 222 (there is a through hole 226 and a through hole temple 9ΐη in the buckle ^ k and refer to FIG. 2 and FIG. 2A). In addition, the molder: sets the mold at 22 °, and the mold is provided with the add-on device 220 ′, so that the sealing material is poured into the sealing step where the semiconductor element is placed. It is worth noting that the surface of the cavity 222 ,, ". JJ Bekong 22 6 is used to measure the degree as a sealant; feT ## can accurately measure the mold cavity surface 222 temperature mold rib. The temperature is used as The low difference of Fengmuai Λ for the reference is firstly -2, the sealing material of the body element that was learned. The difference that has been tested immediately is to ensure that the semiconducting device is a temperature-sensitive rod. Yes, the temperature sensor 240 can be equipped with a protruding tip of the body (in the device, which is used to eject the cooled semiconductor seal, so Γ Pln of my person) is set in the through hole 226 of the mold 220. ; Month \ 疋 / The original part of the original is taken out, and the feeling will be changed, so not: there is no need to do large-scale configuration of the molding device. Sealing material quality :: Large Γ low cost can ensure the semiconductor components. (Shown in the figure), in addition, a through hole can be added to the mold 220 (the temperature sensor 240 is placed in the standard without marking.) The detailed description of this embodiment is provided to facilitate the description of the present invention. The technical content will be ::;: = is subject to this embodiment, so, within the limit of this issue =: and month: = 1221326 (4) The scope of the patent can be modified in various ways. 1221326 Simple description of the formula (five), [simple description of the diagram] Figure 1 is a schematic diagram showing a conventional mold packaging device for semiconductor packaging. Figure 2 FIG. 2A is a schematic view showing a temperature sensor disposed in a through hole of a mold cavity. Description of component symbols: 110, 210 mold base 120 > 220 mold 221 cavity 222 cavity surface 226 through hole 130 > 230 heater 140, 240
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