TW200520938A - Molding apparatus for packaging semiconductor package - Google Patents
Molding apparatus for packaging semiconductor package Download PDFInfo
- Publication number
- TW200520938A TW200520938A TW92137724A TW92137724A TW200520938A TW 200520938 A TW200520938 A TW 200520938A TW 92137724 A TW92137724 A TW 92137724A TW 92137724 A TW92137724 A TW 92137724A TW 200520938 A TW200520938 A TW 200520938A
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- transparent
- flow
- mold chase
- sealant
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000004806 packaging method and process Methods 0.000 title claims description 12
- 238000000465 moulding Methods 0.000 title abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000011521 glass Substances 0.000 claims abstract 2
- 238000005266 casting Methods 0.000 claims 1
- 239000000565 sealant Substances 0.000 description 10
- 239000012812 sealant material Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000003566 sealing material Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
200520938 五、發明說明（1) (一） 、【發明所屬之技術領域】 本發明係有關於一種半導體封裝用之鑄模裝置，特別 是關於一種具有透明模具之鑄模裝置。 (二） 、【先前技術】 隨著微小化以及高運作速度需求的增加，半導體封裝 技術在電子裝置或元件之製造所扮演之角色也愈形重要。 尤其是半導體元件之封膠時，需要求較穩定之模流流速， 使受熱後之液態封膠材能平均的灌注至模具之模穴中，以 確保半導體元件封模後’其外觀能保持較佳之完整性。 一般而言，目前模具裝置之設計（如圖1所示）係包含 一模座（mold chase holder)ll〇、一模具（mold chase)120及一加熱器130(heater)。其中，模座u〇係用 以容置模具120 ’模具120係具有複數個模穴121 (m〇id cavity);加熱|§130係設置於模座11〇中，而模具12〇係藉 由模座110上之加熱器130使其加熱之。由於模具丨2〇上並 無任何量測模流流速之感測器，故只能利用高感度儀器 (如spiral fl〇w tool)在封膠后即時量測模流流速（即封 膠之流動度（f lowability))，所以無法得知封膠於模穴 1 2 1表面上之貝際流動速度。也因此南感度儀器所债測得 知之模流流速資料往往與模穴1 2 1表面上封膠之實際流動 速度有一定之差異，而無法得知實際之模流流速。再者， 只能利用電腦軟體以輔助分析及模擬封膠材於模具中之流 動狀況及模流流速，故需建立大量之資料庫以進行相關之200520938 V. Description of the invention (1) (1) [Technical field to which the invention belongs] The present invention relates to a mold device for semiconductor packaging, and more particularly to a mold device having a transparent mold. (B), [Previous Technology] With the miniaturization and the increase in the demand for high operating speeds, the role of semiconductor packaging technology in the manufacture of electronic devices or components has become increasingly important. In particular, when sealing semiconductor components, a relatively stable mold flow rate is required so that the heated liquid sealing compound can be evenly poured into the cavity of the mold to ensure that the appearance of the semiconductor components after sealing is maintained. Good integrity. Generally speaking, the current design of the mold device (as shown in Fig. 1) includes a mold chase holder 110, a mold chase 120, and a heater 130. Among them, the mold base u〇 is used to accommodate the mold 120 'the mold 120 has a plurality of mold cavities 121 (m〇id cavity); heating | §130 is set in the mold base 11 〇, and the mold 12 〇 by A heater 130 on the mold base 110 heats it. Since there is no sensor for measuring the mold flow velocity on the mold, only high-sensitivity instruments (such as spiral fl0w tool) can be used to measure the mold flow velocity (ie the flow of the sealant) immediately after sealing. F (lowability)), so it is impossible to know the flow velocity of the shellfish on the surface of the mold cavity 1 2 1. Therefore, the measured mold flow velocity data measured by the South Sensitivity Instrument is often different from the actual flow velocity of the sealant on the surface of the mold cavity 1, and the actual mold flow velocity cannot be known. Furthermore, only computer software can be used to assist in analyzing and simulating the flow conditions of the sealant in the mold and the mold flow velocity. Therefore, a large number of databases need to be established for related
200520938200520938
電腦軟體分析與模擬，故不僅較為費時且較不易得知 之分析結果。 °#確 有鑑於此，為得知封膠之實際流動速度及流動狀況r 了解其流動情形，進而得知相關封膠之材料特性，來以 相關封膠材料之改善依據，並提升半導體元件之封震為 能，實為一重要的課題。 (三）、【發明内容】 有鑑於上述課題，本發明之目的係提供一種具 模具之半導體封裝用鑄模裝置，據以配合利用一攝与透 件，而透過該透明模具觀測封膠材之流動狀況及量二^ ΐίί化i得知1關封膠材料之特性並作為相關封膠材ϊ 之改善f據，以進一步確保相關封膠材之品質。何抖 緣疋為了達成上述目的，本發明係提供一種且有 明模具之半導體封裝用鵠模裝置，主要包含一模有ί 明模具及一加熱器。該透明模罝 ^棋座—透 係用以容置該模具。再者，节二办、，、衩八，而該模座 以加熱該模具。值得的==置於模座*，用 用一設置於透明模具上方2該封膠材之流動狀況可利 之，再者更可配合相關運算透明模具來觀測 得知相關封膠材料之特性並g :::模流之流速，來 據，以進-步確保相關封膠封穋材料之改善依 綜上所述，由於本發明传。 具來觀測模流流動狀熊及旦、二1用一攝影元件透過透明模 里》、出模流流速，故可藉此量測Computer software analysis and simulation are not only time consuming but also difficult to know. ° # In view of this, in order to know the actual flow rate and flow condition of the sealant, understand its flow situation, and then know the material characteristics of the relevant sealant, based on the improvement of the relevant sealant material, and improve the semiconductor components. Sealing earthquakes as energy is an important subject. (3) [Content of the invention] In view of the above-mentioned problems, the object of the present invention is to provide a mold device for semiconductor packaging with a mold, so as to cooperate with the use of a photographic and transparent part, and observe the flow of the sealing material through the transparent mold. Condition and quantity ^ ΐίίi knows the characteristics of 1 sealant material and serves as an improvement evidence of the related sealant material to further ensure the quality of the related sealant material. In order to achieve the above object, the present invention provides a die packaging device for semiconductor packaging with a clear mold, which mainly includes a mold with a bright mold and a heater. The transparent mold 棋 chess seat-transparent system is used for accommodating the mold. Furthermore, the second and the third quarters, and eighth, and the mold base to heat the mold. Worth == placed on the mold base *, it is advantageous to use a plastic mold set on top of the transparent mold 2 the flow condition of the sealing material, and can also cooperate with the relevant operation transparent mold to observe the characteristics of the relevant sealing material and g ::: The flow rate of the mold flow is based on this to further ensure that the improvement of the relevant sealant material is as described above, as the invention is passed. It can be used to observe the flow of bears and dies, and use a photographic element to pass through the transparent mold. The flow speed of the mold flow can be measured.
200520938 五、發明說明（3) 得知封膠材於楔^ 關封膠材料之特=面流動時之實際流動速度，以得知相 -步確保相關封飘从作為相關封膠材料之改善依據，而進 軟體輔助分析：‘：：：質。再者可避免為利用電腦 速，需建立大量資模具中之流動狀況及模流流 (四）、【實施方式】 導體二：：2相關圖* ’說明依本發明較佳實施例之半 ¥篮封裝用之鑄模裝置。 舻封m顯示本發明較佳實施例之具有透明模具之半導 梦ηϊί裝置，而圖⑼係本發明較佳實施例中之鑄模 :丰導二ΐ:攝影元件之示意圖。*圖以所示，本發明 ίί二Λ 鑄模裝置主要包含-模座2ι〇、-透明 221、 熱态23〇。透明模具220係具有複數個模穴 且該模八221具有一模穴表面（未表示於圖中）。另 :埶Ϊ3Γ係用以容置該模具220，且該模座210設有-加.，、、器230，用以加熱該模具22〇，使封膠材灌注入置 =體元件之模穴中，進行半導體元件之封膠步驟。值得注 思的是，本發明係利用一攝影元件3〇〇(如CCD)透過該透明 杈具220以觀測封膠材於模具中之實際流動狀況及量測模 流之流速（如圖2B所示）。承上所述，藉由利用一攝影元件 3 0 0經透明模具220來觀測模流流動狀態及量測出模流流 速，可量測得知封膠材於模穴表面流動時之實際流^ ^ 度，得知相關封膠材料之特性，作為相關封膠之改善 第9頁 200520938 五、發明說明（4) 依據，以進一步確保相關封膠材之品質。 於本實施例之詳細說明中所提出之具體的實施例僅為 了易於說明本發明之技術内容，而並非將本發明狹義地限 制於該實施例，因此，在不超出本發明之精神及以下申請 專利範圍之情況，可作種種變化實施。200520938 V. Description of the invention (3) Knowing the actual flow velocity of the sealant in the wedge ^ The sealant material is the surface flow, so as to know the phase-step to ensure that the relevant seal is used as the basis for the improvement of the relevant sealant , And into software-assisted analysis: '::: Quality. Furthermore, in order to use the computer speed, it is necessary to establish the flow conditions and mold flow in a large number of molds (four), [Implementation] Conductor 2 :: 2 Related Figures * 'Explanation of the half of the preferred embodiment of the present invention ¥ Molding device for basket packaging. The seal m shows a semiconducting dream device with a transparent mold according to a preferred embodiment of the present invention, and the figure is a schematic view of a mold: Fengdao II: a photographic element in the preferred embodiment of the present invention. * As shown in the figure, the mold assembly of the present invention mainly includes-mold base 2 ι,-transparent 221, and hot state 23. The transparent mold 220 has a plurality of cavities, and the mold eight 221 has a cavity surface (not shown in the figure). In addition: 埶 Ϊ3Γ is used to accommodate the mold 220, and the mold base 210 is provided with-,,, and 230 to heat the mold 22o, so that the sealing material is poured into the cavity of the body element. In the semiconductor device, a step of sealing the semiconductor device is performed. It is worth noting that the present invention uses a photographic element 300 (such as a CCD) through the transparent branch 220 to observe the actual flow of the sealing material in the mold and measure the flow velocity of the mold flow (as shown in Figure 2B Show). As mentioned above, by using a photographic element 300 to observe the flow state of the mold flow through the transparent mold 220 and measure the mold flow velocity, the actual flow of the sealing material when it flows on the surface of the mold cavity can be measured. ^ Degree, to learn the characteristics of the relevant sealant, as an improvement of the relevant sealant Page 9 200520938 V. Description of the invention (4) basis to further ensure the quality of the relevant sealant. The specific embodiments proposed in the detailed description of this embodiment are only for easy explanation of the technical content of the present invention, and do not limit the present invention to this embodiment in a narrow sense. Therefore, the spirit and the following applications are not exceeded. The scope of patents can be implemented in various ways.
第10頁 200520938 圖式簡單說明 (五）、【圖式之簡單說明】 圖1為一示意圖，顯示習知半導體封裝用之鑄模裝 置。 圖2A為一示意圖，顯示本發明較佳實施例之具有透明 模具之半導體封裝用鑄模裝置。 圖2B為一示意圖，顯示圖2A之具有透明模具之半導體 封裝用鑄模裝置之上方設置有一攝影元件。Page 10 200520938 Brief description of the drawings (5), [Simplified description of the drawings] Fig. 1 is a schematic diagram showing a conventional mold device for semiconductor packaging. Fig. 2A is a schematic view showing a mold device for semiconductor packaging having a transparent mold according to a preferred embodiment of the present invention. FIG. 2B is a schematic view showing a photographic element disposed above the mold device for a semiconductor package with a transparent mold of FIG. 2A.
元件符號說明 1 1 0、2 1 0 模座 1 2 0、2 2 0 模具 1 2 1、2 21 模穴 1 3 0、2 3 0 加熱器 3 00 攝影元件Component symbol description 1 1 0, 2 1 0 Mold base 1 2 0, 2 2 0 Mold 1 2 1, 2 21 Cavity 1 3 0, 2 3 0 Heater 3 00 Photographic element
第11頁Page 11
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92137724A TW200520938A (en) | 2003-12-31 | 2003-12-31 | Molding apparatus for packaging semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92137724A TW200520938A (en) | 2003-12-31 | 2003-12-31 | Molding apparatus for packaging semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200520938A true TW200520938A (en) | 2005-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92137724A TW200520938A (en) | 2003-12-31 | 2003-12-31 | Molding apparatus for packaging semiconductor package |
Country Status (1)
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|---|---|
| TW (1) | TW200520938A (en) |
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2003
- 2003-12-31 TW TW92137724A patent/TW200520938A/en unknown
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