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TWI235401B - A method for making a field emission device - Google Patents

A method for making a field emission device Download PDF

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Publication number
TWI235401B
TWI235401B TW92107710A TW92107710A TWI235401B TW I235401 B TWI235401 B TW I235401B TW 92107710 A TW92107710 A TW 92107710A TW 92107710 A TW92107710 A TW 92107710A TW I235401 B TWI235401 B TW I235401B
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Taiwan
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layer
field emission
emission display
catalyst
insulating
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TW92107710A
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Chinese (zh)
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TW200421407A (en
Inventor
Liang Liu
Shou-Shan Fan
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Hon Hai Prec Ind Co Ltd
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Publication of TWI235401B publication Critical patent/TWI235401B/en

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Abstract

The present invention relates to a method for making a field emission display device. The method includes the following steps: providing a work plate, depositing gate electrodes at relative areas on the work plate according to predetermined display pixels, forming an insulative film covering the gate electrodes and the work plate, depositing a layer of catalyst on the insulative film, forming barriers of insulative materials on the layer of catalyst according to the predetermined display pixels so that defining separated growing spaces, growing arrays of carbon nanotubes on the layer of catalyst within the growing spaces via CVD method, depositing cathode electrode on the arrays of carbon nanotubes, packaging a base plate with the cathode electrode and removing the work plate, etching the relative areas of the insulative film according to the arrays of carbon nanotubes, and packaging a phosphor having an anode cathode so that forming the field emission display device.

Description

五、發明說明(1) 【舍明所屬之技術領域】 於奈場發射顯示裝置,尤其涉及-種基· 人&之%發射顯示器之製作方法。 【先鈿技術】 次發2:以199^::一在電弧放電之產物中首 以。奈米年出版的一以4, 米尺庚夕^ 其良導電性能,完美之晶格結構,奈 在場:射Ϊ::特性而成為極具希望之場發射陰極材料, 應用領域有著廣闊之前景。 大力羊微波為件專 上生::::氣i目沈積…容易地在石夕片 '玻璃等基板 陣之^寸 <、、、向二咼度都確定之奈米碳管陣列,而點 高之制、生二=通過半導體光刻工藝控制催化劑薄膜達到报 :之衣造精度,這使得奈米碳 := 能得到迅速之應用。干π隹十面_不态件中可 美國專利第6, 339, 281號揭露了一箱一幼刑έ士接夫 碳管場發射顯示器之製備方法二了古土種二;級型結構奈米 ΠΛ . ^ ^衣侑万法。该方法包括如下步驟·· f 一基底形成陰極,再在陰極上形成一絕緣声. 口;⑺在絕緣層上形成栅極層’再在柵極層上形成;, -微(孔3);利用拇極層作為掩模’用過刻姓在絕緣層中形成 (4)在基底上形成一層催化劑,利4 、 在基底上生長奈米碳管陣列。 子乳相沈積法 1235401 五、發明說明(2) 然而實際製備過, 場發射之奈米碳管車 予軋相沈積法製備用於 之難題: 陣列有如下缺點及本領域-直難以克服 首先’為達到顯示均勻 石炭管陣列之間距需要在大】ί μ冊極與用於場發射之奈米 而利用化學氣相沈_ $ # $上保持微米量級之均勻性, 均句比較^^ 長工藝要做到奈米碳管高度大面積 ,為ίΐ線= ’必須減低能耗’同 ί::;;盡可能減小。化學氣相= 1工制奈米碳管陣列之生异古疮.^ ^疼…、此夠大體上 要求,難以料楗批別# 1回又’仁其精度目前尚未能滿足 難以精確控制該間距於一理想之範圍。 疋 避免f上:氣相沈積法生長之奈米碳管陣列表面不可 =少量反應剩餘之催化劑顆粒或生成無並 壽:成場發射性能不穩定、不均勻、並降低以:器 〜有鑒於此,提供一種栅極與奈米碳管陣列之 Ϊ;::保持微米量級均勻性之場發射顯示器之製二: 【内容】 本發明之目的係提供一種柵極與奈米碳管陣列 ϋ於大範圍内保持微米量級均勻性之場發射顯示器之‘ ^ 第7頁 1235401 五、發明說明(3) 方法。 本發明之另一目的 均勻、排佈整齊、且不;:^供一種發射端之奈米碳管尺度 之場發射顯示器之製作方法催化劑顆粒或然定性碳等雜質 本發明之又一目的# # 間距可盡量減小,例t供一種柵極與奈米碳管陣列之 作方法。 達到微米量級之場發射顯示器之製 驟:本發明之場發射顯示器之製作方法主要包括如下步 提供一基板; 示點陣於基板表面形成栅極電極; ' 電極表面及基板表面形成一層絕緣介質 在絶緣介質膜表面沈積催化劑層; 2據上述預定之顯示點陣形成絕緣層,使該絕緣 顯示點陣之位置留有一預定空間; 緣 於上述絕緣層之預定空間内,形成奈米碳管陣 於奈米碳管陣列頂端沈積陰極電極; 封裝底板並去除基板; 去除絕緣介質膜以露出奈米碳管; 封裝螢光屏,形成場發射顯示器。 於、纟巴緣介質膜表面沈積催化劑層之前先行於絕 上此積一層矽保護層,且催化劑層沈積於該矽保 (1) (2) (3) 膜; (4) (5) 層相應於 (6) 列; (7) (8) (9) (10) 其中 緣介質膜V. Description of the Invention (1) [Technical Field to which Sheming belongs] The field emission display device in Nai, in particular, relates to a method for manufacturing a% emission display based on a species of human & [Preemptive technology] The second issue of 2: 199 ^ :: one is the first in the product of arc discharge. Published in the year of nanometers, four meters, Gengxi ^ Its good electrical conductivity, perfect lattice structure, Nano is present: Emission :: characteristics and has become a very promising field emission cathode material, the application field has a wide range of prospect. Dali Sheep Microwave is a postgraduate :::: gas deposition ... It is easy to deposit carbon nanotube arrays on the substrates of glass substrates such as glass and glass substrates. The point of the system, the second two = control of the catalyst film through the semiconductor lithography process to achieve the reported precision: This makes nano-carbon: = can be quickly applied. Dry π 隹 10 faces _ Unusable parts US Patent No. 6, 339, 281 discloses a method for preparing a box of a young prisoner to receive a carbon tube field emission display. The ancient soil type II; M ΠΛ. ^ ^ Yi 侑 Wan Fa. The method includes the following steps: f a substrate is formed into a cathode, and then an insulating sound is formed on the cathode. ⑺; a gate layer is formed on the insulating layer, and then formed on the gate layer ;, -micro (hole 3); The thumb pole layer is used as a mask to form (4) an overlying surname in the insulating layer to form a layer of catalyst on the substrate, and to grow a carbon nanotube array on the substrate. Emulsion phase deposition method 1235401 V. Description of the invention (2) However, the field emission nanometer carbon tube car pre-rolled phase deposition method is difficult to prepare: arrays have the following disadvantages and are in the field-it is difficult to overcome first. In order to achieve a uniform display of the distance between the carbon tube arrays, the size of the poles and the nanometers used for field emission are used to maintain the uniformity of the order of microns on the basis of chemical vapor deposition. The process is to achieve a large area of nanometer carbon tube height, for ίΐ line = 'necessary to reduce energy consumption' and ί ::; minimize as much as possible. Chemical vapour phase = 1 heterogeneous ulcer caused by nano carbon tube array of 1 industrial system. ^ ^ Pain ..., this is generally sufficient, it is difficult to predict the batch # 1 回 又 'renqi precision is not yet able to meet the difficult precise control The distance is in a desired range.疋 Avoid f: The surface of the nano-carbon tube array grown by the vapor deposition method cannot be = a small amount of the remaining catalyst particles are reacted or no longevity is generated: the field emission performance is unstable, uneven, and reduced to: To provide a grid and nano-carbon tube array; ::: System 2 for maintaining field-emission uniformity on the order of micrometers: [Content] The object of the present invention is to provide a grid and nano-carbon tube array Field emission display that maintains uniformity on the order of micrometers over a wide range '^ Page 7 1235401 V. Description of the invention (3) Method. Another object of the present invention is uniform, neatly arranged, and not ;: a method for manufacturing a field emission display of nanometer carbon tube scale at the emitting end, catalyst particles, and possibly qualitative carbon and other impurities. Another object of the present invention # # The pitch can be reduced as much as possible. For example, a method for grid and nano carbon tube array is provided. Manufacturing process of field emission display of micron order: The manufacturing method of the field emission display of the present invention mainly includes the following steps: providing a substrate; a dot matrix is formed on the substrate surface to form a gate electrode; 'the electrode surface and the substrate surface form a layer of insulating medium A catalyst layer is deposited on the surface of the insulating dielectric film; 2 An insulating layer is formed according to the predetermined display dot matrix described above, so that a predetermined space is left at the position of the insulating display dot matrix; a nano carbon tube array is formed in the predetermined space of the insulating layer A cathode electrode is deposited on the top of the nano carbon tube array; the bottom plate is packaged and the substrate is removed; the insulating dielectric film is removed to expose the nano carbon tube; the fluorescent screen is packaged to form a field emission display. Before the catalyst layer is deposited on the surface of the dielectric film, the silicon protective layer is deposited on the insulation layer, and the catalyst layer is deposited on the silicon (1) (2) (3) film; (4) (5) layer correspondingly In (6); (7) (8) (9) (10) the edge dielectric film

第8頁 1235401 五、發明說明(4) 護層上。相應的,於 矽保護層與顯示點陣相岸:、、公,質膜步驟之後進-步去除 端沈積陰極電極步驟为。另外,於奈米碳管陣列項. 材料為積陰極電極。該電阻負反饋層的製ΐ. 屬、石二巴ί::臈之f備材料可為玻璃、塗敷絕緣層之金 右的太乎二心基陶瓷或雲# ’要求其能夠耐受700。C左 ίΠί二 度。該絕緣介質膜厚度為1微米〜10 0: 玻^: 5 : 0微米200微米。該絕緣層之製備材料可為 严产為:η 緣層之金屬、矽、氧化矽、陶瓷或雲母,龙 =奈米〜测奈米。催化層厚度為丨,奈米,優= ,利用本發明方法製得之場發射顯示器’其中絕緣入所 膜可用以控制柵極與奈米碳管陣列之間距,從而,可二貝 該距離,進而獲得較低之柵極啟動電壓;奈米管 相沈積法製得,且用作發射電子之發;4 = 未奴s罪近催化劑之一端,因此用於發射電子 f不 可實現大範圍内高度一致均勻性,進而可實 二=衩管 性。而且發射端面不會含有催化劑顆粒或2 性反4雜貝,也不會含有雜亂分佈的奈米碳管,护:疋 性能更穩定、更均勻’ &而延長場發射顯示之:务射 【實施方式】 -心可叩。 請先參㈣-圖’本發明場發射顯示器之製備方法流Page 8 1235401 V. Description of the invention (4) On the protective layer. Correspondingly, the step of depositing the cathode electrode after the silicon protective layer and the display dot matrix:,, and the plasma membrane step is further removed. In addition, the carbon nanotube array item. The material is a cathode electrode. The negative feedback layer of the resistor is made of metal. Shi Erba :: The preparation material can be glass, coated with an insulating layer of gold, or too much two-heart-based ceramics or clouds # 'Requires that it can withstand 700 . C 左 ίΠί 2 degrees. The thickness of the insulating dielectric film is 1 micrometer to 10 0: glass ^: 5: 0 micron and 200 micron. The material of the insulating layer can be strictly produced as: η edge layer of metal, silicon, silicon oxide, ceramic, or mica. Long = nanometer to nanometer. The thickness of the catalytic layer is 丨, nanometer, excellent =, the field emission display produced by the method of the present invention, wherein the insulating film can be used to control the distance between the grid and the carbon nanotube array, so that the distance can be as high as 2 Obtain a lower gate start voltage; made by nano-tube phase deposition method and used as the emission of electrons; 4 = one end of the catalyst is not used, so it cannot be used to emit electrons. Nature, and then can be real two = 衩 ductility. And the emission end face will not contain catalyst particles or amphoteric anti-4 miscellaneous shells, nor will it contain cluttered nano-carbon tubes. The protection: the performance is more stable and more uniform. &Amp; Extended field emission shows: [Embodiment]-Can be heartbroken. Please refer to the figure-the method of preparing the field emission display of the present invention.

第9頁 1235401 五、發明說明(5) -- 程圖’其包括下列步驟: 當可二X基::該基板之表面平整’且基板應 步驟2在V/ 的高溫’並可反復使用。 干點陣彳#沈積栅極電極。根據預先設定之顯 不點積金屬材料形成栅極電極。 膜由::3材料在構拇:上豆形/一層絕緣介質膜。該絕緣介質 可 < 受太^成,’、表面平整度要求在1微米以下,且 了二二未碳管生長時的高溫。 之材料也在絕緣介質膜上沈積催化劑層。該催化劑層 牛知為鐵、鈷、鎳等過渡元素金屬或其合金。 與柵極電桎形门成±絕緣層。該絕緣層係用以絕緣陰極電極 間。电極,同時形成複數空隙以提供奈米碳管之生長空 成夺二形成奈米碳管陣列。通過化學氣相沈積法生 成不=¾管陣列,其高度與絕緣層大致相同即可。生 二驟7,於奈米碳管陣列上沈積陰極電極。 ^驟8,封裝底板並去除基板。 ’去除絕緣介質膜與顯示點陣相對應之部分。 乂驟1 0,與帶有陽極電極的螢光屏封裝。 示器過第二圖至第十四圖介紹本發明製造場發射顯 面可=第二圖,首先,提供一基板10,該基板10之表 102等I#有細微凹槽1〇ι,以便成品脫附容易。先用石喂 102等易於去除之物質塗平,其平整度要求^於以米嘴基 第10頁 1235401 五、發明說明(6) 板1 〇應當可耐受 請參閱第三 採用電子束蒸發 (圖未示),或者 任何金屬,但需 度’且其熱膨脹 護層1 2、絕緣層 請參閱第四 1 1。沈積方法可 絕緣介質膜11在 十圖)間之間距: 緣介質膜11厚度 為10微米〜200微 質膜11應當可光 碳管生長溫度, 屬、石夕、氧化石夕 請參閱第五 12。沈積時用先 在於保護奈米碳 中不被破壞,因 他材料’要求可 幹法刻餘工藝去 射’其厚度在;^ 圍為1Onm〜1 mm。 奈米故管生長時的南溫’並可反復使用。 圖,於基板1 〇上沈積栅極電極1 9。沈積可 、熱蒸發或濺射法,沈積可用鏤空的模板 用光刻工藝。栅極1 9的材料原則上可選用 能夠耐受700。C左右的奈米碳管生長溫 係數能夠與後續形成之絕緣介質膜1 1、保 1 4、底板1 8以及基板1 〇相匹配。 圖,再在柵極電極1 9上沈積一絕緣介質膜 用鍍膜、印刷或直接採用現成的薄板。此 結構中用於控制陰極1 7與柵極1 9 (參見第 ,及後續工藝中印刷、生長用的基板。絕 範圍為1微米〜1 0 0 0微米,優選厚度範圍約 米,平整度要求在1微米以下。此絕緣介 刻加工,並且能夠耐受7 〇 〇。c左右的奈米 其材料可選擇高溫玻璃、塗敷絕緣層的金 或陶瓷、雲母等。 圖,在絕緣介質膜1 1上沈積一層保護層 刻法製作出顯示點陣。此保護層1 2之目的 官在後續工藝中可能採用的濕法刻蝕步驟 此係可選之結構。保護層1 2可採用碎或其 耐受濕法刻蝕,但可用不損傷奈米碳管的 除。沈積方法可採用電子束蒸發或磁控濺 足保護要求的情況下可以儘量薄,厚度範Page 9 1235401 V. Description of the invention (5)-Process diagram 'which includes the following steps: When the substrate is two X-based :: the surface of the substrate is flat' and the substrate should be step 2 at a high temperature of V / and can be used repeatedly. Dry lattice 彳 # deposits the gate electrode. The gate electrode is formed from a predetermined display dot metal material. The film is made of :: 3 material on the thumb: a bean shape / a layer of insulating dielectric film. The insulating medium can be subjected to too much stress, the surface flatness is required to be less than 1 micron, and the high temperature during the growth of the carbon nanotubes is not exceeded. The material also deposits a catalyst layer on the insulating dielectric film. The catalyst layer is known as a transition element metal such as iron, cobalt, nickel, or an alloy thereof. Form an insulation layer with the gate electrical gate. The insulating layer is used to insulate between the cathode electrodes. The electrodes simultaneously form a plurality of voids to provide the growth space of the carbon nanotubes to form a carbon nanotube array. The CVD array is generated by chemical vapor deposition, and its height is about the same as that of the insulating layer. Step 2 was followed by depositing a cathode electrode on the carbon nanotube array. ^ Step 8. Package the substrate and remove the substrate. 'The portion corresponding to the display dot matrix of the insulating dielectric film is removed. Step 10: Package with fluorescent screen with anode electrode. The display shows the second to the fourteenth figures of the present invention. The emission display surface of the manufacturing field of the present invention can be equal to the second figure. First, a substrate 10 is provided. Detachment of finished product is easy. First, use stone feed 102 and other easy-to-remove substances to flatten it. The flatness requirements are as follows: ^ Yi Mizui Page 10 1235401 V. Description of the invention (6) The plate 1 〇 should be tolerable. Please refer to the third using electron beam evaporation ( (Not shown in the figure), or any metal, but it needs to be 'and its thermal expansion protective layer 1 2. For the insulation layer, please refer to the fourth 11. The deposition method can insulate the dielectric film 11 (Figure 10). The marginal dielectric film 11 has a thickness of 10 micrometers to 200 micrometers. The film 11 should be able to grow the temperature of the carbon tube. . When depositing, the first purpose is to protect the nano-carbon from being destroyed, because other materials ’require a dry-cut process to inject, and the thickness is in the range of 1 Onm to 1 mm. The temperature of the nano tube when the tube grows can be used repeatedly. As shown, a gate electrode 19 is deposited on the substrate 10. The deposition can be by thermal evaporation or sputtering, and the deposition can be performed by a hollow template using a photolithography process. The material of the gate 19 can be selected in principle and can withstand 700. The growth temperature coefficient of the carbon nanotubes around C can match the insulating dielectric films 11, 14, 14, and 18 that are formed later. As shown in the figure, an insulating dielectric film is deposited on the gate electrode 19 for coating, printing or directly using a ready-made sheet. This structure is used to control the cathode 17 and grid 19 (see the substrates for printing and growth in subsequent processes. The absolute range is 1 micron to 100 micron, preferably the thickness is about meters, and the flatness is required. Below 1 micron. This insulation is etched and can withstand nanometers of about 700 ° C. Its material can be selected from high temperature glass, gold or ceramic coated with insulation layer, mica, etc. Figure, in the dielectric film 1 A protective layer is etched to produce a display dot matrix. The purpose of this protective layer 1 2 is a wet etching step that may be used in subsequent processes. This is an optional structure. The protective layer 1 2 can be crushed or otherwise Resistance to wet etching, but can be removed without damaging the carbon nanotubes. The deposition method can be as thin as possible under the conditions of electron beam evaporation or magnetron sputtering.

第11頁 1235401 -—-- 五、發明說明(7) 劑圖叙在;;層12上沈積催化劑層13。催化 劑層13的沈積厚度4過渡7^金屬或其合金。催化 ^ ^ 又為卜iOnm,優選3〜5nm。沈積方式採用 包子J洛發:熱蒸發或者賤射法。 π絡=Λ閱第七圖,在催化劑層1 3上形成一絕緣層1 4。該 二* g之目的係絕緣陰極電極1 7與柵極電極1 9,同時形 成空隙1 4 1以提供太本r山从从L ρ … ^ 1、不未奴官的生長空間。製作可採用鍍 1、印刷ί直接採用現成的薄板。此絕緣層1 4厚度範圍為 、U米〜1 〇 *米’根據奈米碳管陣列1 5的生長長度而定,優 選厚度乾圍10微米〜5〇〇微米。若採用現成的薄板則要求單 面平整度1微米以下(面向催化劑一面)。製作時應做出 顯不點陣。此絕緣層丨4的製成材料應當能夠耐受7 〇 〇。c左 右的奈米碳管生長溫度,其材料可選擇高溫玻璃、塗敷絕 緣層的金屬、矽、氧化矽或陶瓷、雲母等。 請茶閱第八圖,在絕緣層丨4之間隙i 4 1中生長奈米碳 管陣列1 5,其高度與絕緣層丨4大致相同即可,高度不均勻 性不會影響到場發射顯示效果。 請參閱第九圖,根據驅動電路之需要,可選擇沈積一 層電阻負反饋層16。其材料可選用合適電阻率的矽、合金 等材料,厚度根據需要的電阻大小決定,該電阻大小由電 路設計和使用時的栅極%壓決定,範圍可能在1千歐姆至 1 00兆歐姆之間。沈積可採用電子束蒸發、熱蒸發或濺射 法’沈積的形狀與陰極電極相同,沈積需要用到鏤空的模 板0Page 11 1235401 ----- V. Description of the invention (7) The agent diagram is shown on; the catalyst layer 13 is deposited on the layer 12. The catalyst layer 13 is deposited to a thickness of 4 to 7 Å metal or an alloy thereof. The catalysis is again iOnm, preferably 3 ~ 5nm. The deposition method is Baozi J Luofa: thermal evaporation or low emission method. π network = Λ see the seventh figure, an insulating layer 14 is formed on the catalyst layer 13. The purpose of the two * gs is to insulate the cathode electrode 17 and the gate electrode 19, and form a void 1 41 at the same time to provide Taiben r mountain from L ρ… ^ 1, a growth space for slaves. Production can be plated 1. Printed directly using ready-made sheets. The thickness of this insulating layer 14 is in the range of Um ~ 10m * m 'according to the growth length of the carbon nanotube array 15, and the thickness is preferably 10m ~ 500m. If ready-made sheets are used, the flatness of one side is required to be less than 1 micron (the side facing the catalyst). Do not display dot matrix when making. The material of this insulating layer 4 should be able to withstand 700. c The growth temperature of the right carbon nanotubes can be selected from high-temperature glass, metal coated with insulating layer, silicon, silicon oxide or ceramic, mica, etc. Please read the eighth figure. Nano carbon tube array 15 is grown in the gap i 4 1 of the insulating layer 丨 4. Its height is about the same as that of the insulating layer 丨 4. The unevenness in height will not affect the field emission display. effect. Referring to the ninth figure, a resistance negative feedback layer 16 may be optionally deposited according to the needs of the driving circuit. The material can be selected from silicon, alloy and other materials with suitable resistivity. The thickness is determined by the required resistance. The resistance is determined by the circuit design and the% gate voltage during use. between. The deposition can be performed by electron beam evaporation, thermal evaporation or sputtering. The shape of the deposition is the same as that of the cathode electrode, and a hollow-out template is required for the deposition.

第12頁 1235401 五、發明說明(8) 請參閱第十圖,在電阻負反饋層丨6上沈積 積方法與沈積電阻負反饋層丨6相同,亦用到相^ ° 。沈 板。陰極17之材料與柵極19相同。 问的沈積模· 請參閱第十一圖,封裝底板18。底板18可 J膝、嶋材料,製作方法可採用印刷1接、融:、 請參閱第十二圖,脫離基板10,翻轉後用適者的工 藝,如濕法刻蝕除去絕緣介質膜丨丨在顯示 & 部分(未標示)。 U陣之對應 請參閱第十三圖,採用適當工藝,如幹法 護層1 2在顯示像素點陣之對應部分(未標示)。如有必=保 可採用雷射轟擊去除剩餘之催化劑層丨3。 ’ 一請2::四圖,最後與螢光屏封裝,即成場 不益,其中赏光屏包括一陽極20,玻璃基板21與螢 ”、 22。所形成之場發射顯示器包括:陰極丨7,陽極^ •1 陰極17與陽極20間之柵極19,用作場發射單元之夺米0 = 陣列15及位於柵極19與陰極17間之絕緣層14,該二米二二 陣列15之一端面通過電阻負反饋層16與陰極17電ς相=官 該奈米碳管陣列〗5之另一端面與絕緣層〗4靠近柵極】9之# 面基本位於同一平面,在絕緣層14與柵極19之間進—牛^ 括一絕緣介質膜11。陰極17通過底板18封裝。 乂匕 本發明方法所得之奈米碳管場發射顯示器,藉由絕 介質膜之厚度控制柵極與奈米碳管陣列之間距,從而莽尸 較低之栅極啟動電壓;用作發射電子之發射端之奈米 第13頁 1235401 五、發明說明(9) 可實現大範圍内高度一致均勻性,進而可實現各像素場發 射效果一致性。 綜上所述,本發明確已符合發明專利之要件,遂依法 提出專利申請。惟,以上所述者僅為本發明之較佳實施 例,自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化,皆 應涵蓋於以下申請專利範圍内。 ·«Page 12 1235401 V. Description of the invention (8) Please refer to the tenth figure. The deposition method on the negative resistance feedback layer 6 is the same as that of the negative resistance feedback layer 6 and the phase ^ ° is also used. Shen board. The material of the cathode 17 is the same as that of the grid 19. Asked about the deposition mode · Please refer to the eleventh figure, the package substrate 18. The base plate 18 can be made of knee and cymbal materials. The production method can be printed and connected: see the twelfth figure, detach the substrate 10, and then use an appropriate process such as wet etching to remove the insulating dielectric film after turning over. Show & section (not labeled). Correspondence of U-array Please refer to the thirteenth figure, adopt appropriate process, such as the dry protective layer 12 in the corresponding part of the display pixel lattice (not labeled). If necessary, you can use laser bombardment to remove the remaining catalyst layer. 'Please ask 2 :: Four pictures, and finally package it with a fluorescent screen, which is not beneficial to the field, where the viewing screen includes an anode 20, glass substrate 21 and fluorescent ", 22. The field emission display formed includes: cathode 丨 7 The anode ^ • 1 The grid 19 between the cathode 17 and the anode 20 is used as a field emission unit for the meter 0 = the array 15 and the insulating layer 14 located between the grid 19 and the cathode 17. One end face is electrically connected to the cathode 17 through the negative resistance feedback layer 16 = the carbon nanotube array. The other end face and the insulation layer are close to the grid. The # face of 9 is basically on the same plane, and the insulation layer 14 Between the grid 19 and the grid 19-an insulating dielectric film 11 is included. The cathode 17 is packaged through the base plate 18. The carbon nanotube field emission display obtained by the method of the present invention controls the grid and the grid by the thickness of the dielectric film. The distance between the carbon nanotube arrays is low, so that the gate start voltage is lower; the nanometer used as the emitting end of the electrons Page 13 12401501 V. Description of the invention (9) High uniformity and uniformity in a wide range can be achieved, In addition, the uniformity of the emission effect of each pixel field can be achieved. It was clear that the requirements of the invention patent had been met, and a patent application was filed in accordance with the law. However, the above is only a preferred embodiment of the present invention and cannot be used to limit the scope of the patent application in this case. Those who are familiar with the skills of this case will rely on this The equivalent modifications or changes made by the spirit of the invention should be covered by the following patent applications.

第14頁 1235401 圖式簡單說明 第一圖係本發明場發射顯示器之製備方法流程圖。 第二圖係製造本發明場發射顯示器所用之具有複數凹 槽之工作板主視圖。 第三圖係於工作板表面沈積柵極電極之示意圖。 第四圖係於第三圖所示之柵極電極上沈積絕緣介質膜 之示意圖。 第五圖係於第四圖所示之絕緣介質膜上沈積保護層之 示意圖。 第六圖係於第五圖所示之保護層上形成催化劑層之示 意圖。 第七圖係於第六圖所示之催化劑層上形成帶有間隙的 絕緣層之示意圖。 第八圖係於第七圖所示之絕緣層之間隙中生長奈米碳 管陣列之示意圖。 第九圖係於第八圖所示之奈米碳管陣列的頂部沈積負 反饋層之示意圖。 第十圖係對第九圖所示之負反饋層上沈積陰極電極之 示意圖。 •i 第十一圖係於除第十圖中的基板後對陰極電極封裝底 板之示意圖。 第十二圖係對第十一圖中的絕緣介質膜進行刻蝕之示 意圖。 第十三圖係對第十二圖中奈米碳管的保護層進行刻蝕 之示意圖。Page 14 1235401 Brief description of the diagram The first diagram is a flowchart of a method for preparing a field emission display of the present invention. The second figure is a front view of a working plate having a plurality of grooves used in manufacturing the field emission display of the present invention. The third figure is a schematic diagram of depositing a gate electrode on the surface of a work plate. The fourth diagram is a schematic diagram of depositing an insulating dielectric film on the gate electrode shown in the third diagram. The fifth diagram is a schematic diagram of depositing a protective layer on the insulating dielectric film shown in the fourth diagram. The sixth diagram is a schematic view of forming a catalyst layer on the protective layer shown in the fifth diagram. The seventh diagram is a schematic diagram of forming an insulating layer with a gap on the catalyst layer shown in the sixth diagram. The eighth figure is a schematic view of growing a carbon nanotube array in the gap between the insulating layers shown in the seventh figure. The ninth figure is a schematic diagram of depositing a negative feedback layer on top of the nano carbon tube array shown in the eighth figure. The tenth figure is a schematic view of the cathode electrode deposited on the negative feedback layer shown in the ninth figure. • i The eleventh figure is a schematic diagram of the cathode electrode package bottom plate after the substrate in the tenth figure. The twelfth figure is a schematic view of etching the insulating dielectric film in the eleventh figure. The thirteenth figure is a schematic view of etching the protective layer of the carbon nanotube in the twelfth figure.

第15頁 1235401 圖式簡單說明 第十四圖係封裝顯示屏後的場發射顯示器之結構示意 圖 主要元件符號說明 基板 10 絕緣介質膜 11 保護層 12 催化劑層 13 絕緣層 14 奈米碳管陣列 15 電阻負反饋層 16 陰極 17 底板 18 桃極 19 陽極 20 玻璃基板 21 螢光層 22 凹槽 101 石躐 102 空隙 141Page 151235401 Brief description of the diagram. The fourteenth diagram is the structure of a field emission display after the display screen is encapsulated. The main components are symbolized. Substrate 10 Insulating dielectric film 11 Protective layer 12 Catalyst layer 13 Insulating layer 14 Nano carbon tube array 15 Resistance Negative feedback layer 16 Cathode 17 Bottom plate 18 Peach pole 19 Anode 20 Glass substrate 21 Fluorescent layer 22 Groove 101 Stone block 102 Gap 141

第16頁Page 16

Claims (1)

1235401 /、申清專利範圍 種器之㈣方法,其包括如下步驟·· 成:極電極; 膜; 极衣向形成一層絕緣介質 ^、、巴、、豪介質膜表面沈積· * ;據上述預定之顯示點陣形。緣声 應於顯示點陣之位置留有一預定空;.“巴緣層 於上述絕緣層之預定空間内,山》 於奈米碳營隍石丨s山 /成不米碳管陣列· 封裝底板==沈積陰極電極; 質膜,以露出奈米碳管; 2.如申請權利第Γ成場十發射顯示器。 法,其中在^ 之場發射顯示器之製備方 絕緣介質膜:m面:積催化劑層之前先行於 該矽保護層上。 且催化剤層沈積於 3 ·如申請權利筋圍楚 法,豆中^ 射顯示器之製備方 4. 如申請權利質膜之厚度為1微米〜_〇微米。 法,tH3項所述之場發射顯示器之製備方 5. 如申請權利介質族之厚度為10微米〜2〇〇微米。 法,直中該么^項所述之場發射顯示器之製備方 層之金屬、之製備材料為玻璃、塗敷絕緣 蜀矽、氧化矽、陶瓷或雲母。 第17頁 12354011235401 / The method of applying the seeding device in the scope of Shenqing Patent, which includes the following steps: forming an electrode; a film; and depositing a electrode coat on the surface of the dielectric film forming a layer of insulating medium ^, 巴, 豪, and 介质 medium; *; according to the above reservation It displays the dot pattern. The marginal sound should have a predetermined space at the position where the dot matrix is displayed; "The marginal layer is in the predetermined space of the above-mentioned insulation layer, the mountain" is in the nano carbon campsite 丨 s mountain / Chengbu meter carbon tube array · package floor == deposited cathode electrode; plasma film to expose nano carbon tube; 2. as claimed in claim Γ into a field ten emission display method, where the field emission display in ^ is prepared with a square dielectric film: m plane: catalyst The silicon protective layer was previously deposited on the silicon protective layer. The catalytic tritium layer was deposited on the 3rd layer. · If you applied for the method of enveloping the right, the manufacturing method of the Douzhong ^ radio display. 4. If you applied for the right, the thickness of the film is 1 micron ~ _0 micron. The method of preparing the field emission display as described in item tH3 5. The thickness of the family of dielectrics for which the right is claimed is 10 μm to 200 μm. The method of preparing the field emission display as described in the item ^ Metal, made of glass, coated with insulating silicon, silicon oxide, ceramic or mica. Page 17 1235401
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