1299179 ^ 九、發明說明： [發明所屬之技術領域】 本發明乃關於一種可因應被測試對象的種類而容易地 進二效旎板的裝脫，而於穩定的狀態下進行被測試對象的 -測導體測試裝置之DUT界面，且關於測試例如液晶 及^漿等顯不面板驅動器之半導體測試裝置之DUT界面。 u【先前技術】 ^ ° 一般而言，半導體測試裝置係構成為，根據對被 籲對象（以下亦稱為DUT(Device Under Test ’待測元件））: • 1^、LSI等賦予測試信號而獲得之DUT的輸出，而進行如τ 是否為良品的判定。與如此的半導體測試裝置相關之 技術的文獻，例如有下列文獻。 則 [專利文獻1]日本特開2000-292500號公報 於採用半導體測試裝置而進行謝是否為良品 定之際，係組合以接觸環為絲之連接具以及效 成DUT界面，並經介扯miT两品二u々丄…曾a 叩構 、、工此DUT界面而將半導體測試褒 於DUT。此外，於έ士人、山α、圭从 且逆接 、、、，°&这些連接具之際，係採用容易進行 DU丁界面之電性連接的彈簧針（Pogo Pin)。 以下採用第2圖來說明以往的半導體測試裝置之 界面。 1 於第2圖中’半導體測試裝置⑽係由探針卡 接月蜀環103、效能板1〇5及測試頭1〇8所構成。 採針卡1 〇 1係、配列有多數條配合別T 2 0 〇的電極部 置的探針’並經由這些探針而電性連接於dut2〇〇的電極 316987 5 J299179 Μ 部0 面及:ΐΓ竭！別設置有藉由彈“將端部彈壓於表 月$早性地X出而形成之複數個彈 之環狀的器具’並經由這些彈簧針102、1Q4,而各自Τ性 連接板針卡1 〇 1及效能板105。 效能板105係連接接觸環1〇3及測試頭1〇8之印刷電 路板。於效能& 1G5 -面上’接觸有接觸環m的彈菁針 =4的端部，於另一面上，接觸有設置於測試頭之彈 黃針106的端部。此外，於效能板i 〇5上，設置有對應 DUT200的種類之測定電路。 測試頭108除了由生成施加於DUT20〇的直流信號等之 弘路，及複數個LCD(Liquid Crystal Display，液晶顯示 态）接腳卡（pin card)所構成之外，亦由複數個接聊電子板 (pin electronics board)l〇7 所構成，而用於進行 DUT200 的評估。其中，於LCD接腳卡中，設置有以高電壓而動作 之LCD用的比較器及A/D轉換器等，並輸入有包含多色階 鲁電壓（multiple gradation voltage :色階表示色彩濃淡深 淺之階度，亦稱灰階gray scale)之信號。此外，於接腳 電子板107中設置有驅動電路及比較電路等。 此外，接腳電子板107係具備因應設定而做為對 DUT200之測試信號輸出系統的功能，以及對DUT200的輸 出信號之測定系統的功能之廣泛應用性。 DUT200 為驅動液晶之 TFT (Thin Fi lm Transistor，薄 膜電晶體）、PDP(Plasma Display Panel ’電漿顯示器）等 6 316987 J299179 、面板驅動器。探測器期系包含贿2〇〇 載台301係設置於彳 、込功此者。乘 接m 心_上’⑽於” _〇〇者。 妾下來5兄月如此的半導體測試裝置的動作。 -般而言’於實際進行測試之際 旋轉半導體測試裝置1〇〇而#乐2圖的狀悲 -測哭300的㈣a Q而使上下颠倒’而測試裝載於探 H _的乘載台301之麵00,於第2圖 _明上的便利，而以盥 T係為了巩 進行說明。上的使用狀悲上下顛倒的狀態下 ㈣置於以輪出系統而設定之測試頭⑽的 驅動電路’所輸出的信號，乃依彈菁、 :請，觸請的彈菁針1〇4、彈菁針1〇2、㈣二 01之順序，而輸入於DUT200。 相對於此，從黯_所輸出的信號，係經由 二ΓΓ1:，彈簧針102、彈簧針一 技針⑽，“人於做為測試頭⑽的測定系統而設定 _電子板Η)7’而進行謝㈣是否為良 【發明内容】 疋 (發明所欲解決之課題） 由於近年來採用行動雷每 之命工“ 動以及㈣型電腦等液晶顯示养 二子機器類的普及，而逐漸開發出驅動這些顯示… 的面板驅動器。如此的面板驅動器 。 同而構造有所不同。 種類的不 因此，於採用半導體測試裝置而進行是否為良品的判 際’有可能必須因面板驅動器種類的不同而進行信號 316987 7 J299179 、放大等處理，為了因應此要求，有需要外接電路之情形。 於效能板105上，係容易確保用以安裝如此的外接電 =之區域。因此於一般的半導體測試裝置1〇〇中，係於= 能板105上安裝對應被測試對象之面板驅動器的種類之>外 接電路，藉由替換此效能板1〇5，而可對應面板驅動 種類之改變。 . 因此，於第2圖所示之連接具的裝設中，係採用玄总 =㈣能板m的替換之彈菁針102、1〇4、1〇6。這= 二針係如上述，以端部藉由彈簧被彈壓而彈性地突出之方 式形成。 4而，近年來隨著面板驅動器的接腳數 用彈箐針102、1〇4、106的枰π π ,^ iUb的N况下，可能因效能板105的 扭曲寻而提高接觸不良的發生率。 著DllH簧針1G2、1G4、1G6的零件成本較高，伴隨 古之門β§ 的增加’而導致DUT界面整體的成本提 P…另立—方面’ 一旦為了可同時降低成本並加強連接具之 間的接觸力，而直接電性連接违, 卸除效能板1〇5之問題。接具’則亦產生難以安裝 -種ΪΓ乃著眼於這些問題而創作者，其目的在於提供 卸r °而£被測4對象的種類而容易地進行效能板的安裝 ::裝態下進行被測試對象的測試之半導體 (月千決§果題之手段） 316987 8 1299179 ，為了達成如此的課題，本發明中之申請專利範圍第工 項所記載的半導體測試裝置之DUT界面，係經由效能板及 電性連接半導體測試裝置及被測試對象，根據從 设置於接腳電子板之驅動電路所輸出之測試信號，而測試 —士述被測試對象，並藉由設置於上述效能板之連接哭，而 連接上述接觸環及上述接腳電子板。 ’裝置==範圍。項所記載的發明為-種半導體測試 邮 界面，係經由效能板及接觸環而電性連接半導 ::試裝置及被測試對象’根據從設置於接腳電子板之驅 :::輸出之測試信號，而測試上述被測試對象，其特 上備:設置於上述接腳電子板之第lziF連接器 Z攻:效能板的下面’並連接於上述第lZiF連接哭之又 於上效能板的印刷電路板，以二面對 器;及設置於上述接:二式下而：向配置之第_ 連接器之第⑽連接/。的下面’並連接於上述第咖 第項所記載的發明係於申請專利範圍 連接器’係經由上X述效能=2ZIF連接器及上述第咖 申請專職互相連結固定。 第2項或第3項所記载^^的發明係於申請專利範圍 多色階電壓之⑽驅動器7 ，上述被測試對象為輸出 申凊專利範圍第5 jg 6 第2項或第3項所^&載的發明係於申請專利範圍 所5己载的發明中，上述第連接器及上 316987 9 1299179 述第4ZIF連接器係具備浮動機構。 第範圍第6項所記載的發明係於申請專利範圍 她載的發明中，又具備固定上述第· 第mF連接器之第1鎖固機構，及固定上述 弟以IF連接器及上述第 -(發明之效果）連接為之弟2鎖固機構。 • 根據本發明，乃具備下列效果。 於採利範圍第1項至第4項所記載的發明中，由 1 效能板連接於接腳電子板及接觸環，因此 二口：：測試對象的種類而容易地進行效能板的安裝卸 矛、，而於It定的狀態下進行被測試對象的測試。 料’於申請專利範圍第3項所記載的發明中，係經 由上述效能板的印刷電路招 器及第連接器，因此T/: 第·· L … 口此可錯由回焊焊接而一次安裝。因 此可細短連結器安裝製程。 h卜斤於申Π月專利軌圍第5項所記載的發明中，第1ZIF t接器及第4ZIF連接器，係具備浮動機構，因此即使產生些 許的位置偏移，亦可順利地進行嵌合。 此外，於申請專利範圍第6項所記載的發明中，係設 置固定ZIF連接器之鎖固機構，因此可確實地將效能板固 疋料導體測試裝置及接觸環，而於穩定的狀態下進行被 測试對象的測試。 [實施方式】 以下參照圖式來說明本發明的實施形態。第i圖係顯 316987 1299179 ^ 示本發明的⑽τ界面的一實施例之構成圖。 於第1圖中，半導體測試裝置400係由探針卡i、 接觸環403、效能板408及測試頭413所構成。 探針卡401係配列有複數條配合DUT2〇〇的電極部之配 置的探針，並電性連接於DUT200的電極部。 接觸環403為於與探針卡4〇1連接的面上，設置有以 如上所述端部藉由彈簧被彈壓而彈性地突出之方式形成之 禝數個彈簧針402，於相反的面上，則經由電纜線4〇4而 設置有ZIF(Zer〇 lnsertion F〇rce，零插技力）連接器 4〇6(母接頭側）之環狀的器具。此Ζί{?連接器4〇6係設定 為，即使產生些許的位置偏移，亦可順利地嵌合之浮動 構。1299179 ^ IX. OBJECTS OF THE INVENTION: [Technical Field] The present invention relates to an object that can be easily inserted into a second effect slab in response to the type of object to be tested, and is subjected to a test object in a stable state - The DUT interface of the conductor test device is tested, and the DUT interface of a semiconductor test device that displays a panel driver such as a liquid crystal or a plasma is tested. u [Prior Art] ^ ° In general, the semiconductor test equipment is configured to give test signals to the target (hereinafter also referred to as DUT (Device Under Test)): • 1^, LSI, etc. The output of the DUT is obtained, and a determination as to whether or not τ is good is performed. Documents of the technology related to such a semiconductor test device are, for example, the following documents. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-292500 discloses a combination of a contact ring as a wire and a DUT interface when a semiconductor test device is used to determine whether or not the product is a good one. Product II u々丄...has a structure, and works on this DUT interface to test the semiconductor to the DUT. In addition, in the case of the gentleman, the mountain, the yue, the reverse, the , the ° & these connectors, the use of a spring pin (Pogo Pin) that is easy to electrically connect the DU interface. The interface of the conventional semiconductor test apparatus will be described below using Fig. 2 . 1 In Fig. 2, the semiconductor test device (10) is composed of a probe card connecting a lunar ring 103, a performance board 1〇5, and a test head 1〇8. The needle card 1 〇1 series is equipped with a plurality of probes disposed on the electrode portions of the other T 2 0 〇, and is electrically connected to the electrodes 316987 5 J299179 Μ part 0 of the dut2〇〇 via these probes: Exhausted! Do not set a ring-shaped device that is formed by a plurality of bullets formed by pressing the end portion to the front of the month, and through each of the spring pins 102 and 1Q4, and each of the elastic connection pins 1 〇1 and performance board 105. The performance board 105 is a printed circuit board that connects the contact ring 1〇3 and the test head 1〇8. On the performance & 1G5-face, the end of the contact with the contact ring m is 4 On the other side, the end of the elastic yellow needle 106 disposed on the test head is contacted. Further, on the performance board i 〇 5, a measuring circuit corresponding to the type of the DUT 200 is provided. The test head 108 is applied by generation In addition to the DC signal of the DUT20〇, and a plurality of LCD (Liquid Crystal Display) pin cards, it is also composed of a plurality of pin electronics boards. 7 is used for evaluation of the DUT 200. Among them, a comparator for an LCD that operates at a high voltage, an A/D converter, and the like are provided in the LCD pin card, and the input includes a multi-color stage. Voltage (multiple gradation voltage: the gradation of color shades, A signal of a gray scale is provided. Further, a driver circuit, a comparison circuit, and the like are provided in the pin electronic board 107. Further, the pin electronic board 107 has a function as a test signal output system for the DUT 200 in response to setting. And the wide-ranging application of the function of the measurement system of the output signal of the DUT 200. The DUT200 is a TFT (Thin Film Transistor), PDP (Plasma Display Panel 'plasma display), etc., 6 316987 J299179, panel Driver. The detector period consists of bribes. The 301 series is set up in the 彳, 込功. This is the connection of m heart _ upper '(10) to _ 〇〇 。. I took down the action of the semiconductor test device of 5 brothers and months. - Generally speaking, when the actual test is performed, the semiconductor test device is rotated 1##################################################################### The face 00 is shown in the second figure _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ (4) The signal output from the drive circuit ' of the test head (10) set by the wheel-out system is based on the elastic crystal, : please, touch the bullet needle 1〇4, the bullet The order of the needles 1〇2, (4) 2, 01 is input to the DUT 200. On the other hand, the signal output from 黯_ is via the ΓΓ1:, the pogo pin 102, the pogo pin, and the technique (10), and "the person sets the _ electronic board 做 7' as the measurement system of the test head (10).谢 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 疋 疋 疋These display... panel drivers. Such a panel driver. The same structure is different. In the case of using a semiconductor test device, it is necessary to perform the signal 316987 7 J299179, amplification, etc., depending on the type of panel driver. In order to meet this requirement, there is a need for an external circuit. . On the performance board 105, it is easy to ensure that such an external power is installed. Therefore, in a general semiconductor test apparatus, an external circuit corresponding to the type of the panel driver of the object to be tested is mounted on the energy board 105, and the panel is driven by replacing the performance board 1〇5. Type change. Therefore, in the installation of the connector shown in Fig. 2, the bullet-shaped needles 102, 1〇4, and 1〇6 which are replaced by the syllabary = (four) energy plate m are used. This = two needles are formed as described above by elastically protruding the ends by being spring-loaded. 4, in recent years, with the number of pins of the panel driver using the 枰π π, ^ iUb of the magazine pins 102, 1〇4, 106, the occurrence of contact failure may be improved due to the distortion of the performance board 105. rate. The cost of the parts of the DllH spring pins 1G2, 1G4, 1G6 is relatively high, and the cost of the DUT interface is increased with the increase of the ancient door β§'. The other is the aspect of the DUT interface. The contact force between the two, and the direct electrical connection is violated, the problem of removing the performance board 1〇5. The connector 'is also difficult to install - the creator is focused on these problems, the purpose is to provide the unloading r ° and the type of 4 objects to be tested and easy to install the performance board: The semiconductor of the test object (the means of the test) 316987 8 1299179, in order to achieve such a problem, the DUT interface of the semiconductor test device described in the application of the scope of the invention is via the performance board. And electrically connecting the semiconductor test device and the object to be tested, and testing the object to be tested according to the test signal outputted from the driving circuit provided on the electronic board of the pin, and crying by the connection provided on the performance board. And connecting the above contact ring and the above-mentioned pin electronic board. 'Device == range. The invention described in the item is a semiconductor test mail interface, which is electrically connected to the semiconductor through the performance board and the contact ring: the test device and the object to be tested 'according to the drive from the electronic board mounted on the pin::: Test the signal, and test the above-mentioned object to be tested, which is specially prepared: set on the lziF connector of the above-mentioned pin electronic board Z attack: below the performance board' and connected to the above-mentioned lZiF connection crying again on the performance board The printed circuit board is connected to the two-faced device; and is disposed under the above-mentioned connection: two: to the (10) connection of the _ connector of the configuration. The invention described below in connection with the above-mentioned Japanese Patent Application Serial No. </ RTI> is attached to the patent application by means of the above-mentioned X=2IF connector and the above-mentioned third application. The invention described in item 2 or item 3 is based on the multi-level voltage (10) driver 7 of the patent application range, and the above-mentioned object to be tested is the output of the patent scope 5 jg 6 item 2 or item 3. The invention of the above-mentioned connector and the fourth ZIF connector of the above-mentioned 316987 9 1299179 are provided with a floating mechanism. The invention according to claim 6 is the first locking mechanism for fixing the first mF connector, and the fixing of the IF connector and the first - ( The effect of the invention is that the connection is the brother 2 locking mechanism. • According to the present invention, the following effects are obtained. In the invention described in the first to fourth aspects of the range, the 1 performance board is connected to the pin electronic board and the contact ring, so the type of the test object is easily used to mount the performance board. Test the object to be tested under the state of It. In the invention described in the third paragraph of the patent application, the printed circuit board and the connector of the above-mentioned performance board are used, so that the T/: the first port can be installed by the reflow soldering once. . Therefore, the connector can be installed in a short connector. In the invention described in the fifth paragraph of the patent track of Shen Haoyue, the first ZIF t-connector and the fourth ZIF connector are provided with a floating mechanism, so that even if a slight positional shift occurs, the embedding can be smoothly performed. Hehe. Further, in the invention described in claim 6, the locking mechanism for fixing the ZIF connector is provided, so that the performance plate fixing conductor test device and the contact ring can be surely performed in a stable state. Test of the object being tested. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure i is a diagram showing the construction of an embodiment of the (10) τ interface of the present invention. In FIG. 1, the semiconductor test device 400 is composed of a probe card i, a contact ring 403, a performance board 408, and a test head 413. The probe card 401 is provided with a plurality of probes arranged to match the electrode portions of the DUT 2 turns, and is electrically connected to the electrode portions of the DUT 200. The contact ring 403 is provided on the surface connected to the probe card 4〇1, and is provided with a plurality of spring pins 402 formed by elastically protruding the end portions as described above by springs, on the opposite faces. Then, a ring-shaped device having a ZIF (Zer〇lnsertion F〇rce) connector 4〇6 (female joint side) is provided via the cable 4〇4. This Ζί{? connector 4〇6 is set so that even if a slight positional shift occurs, the floating structure can be smoothly fitted.
此外，接觸環403係經由彈簧針4〇2、纜線4〇4、ZIF 連接器406 ’而電性連接探針卡4(n、效能板權。此外， 鎖固機構405係使用在從ZIF連接器4〇6安裝 接器m之際。平板416不僅固定ZIF連接器 4為1個單元，並於側邊附近，設置插入有導柱（Guidep〇st) 414之圖中未顯示之孔。固定具417係將平板固定於 接觸環4 0 3。 ' 效能板408係連接接觸環403及測試頭413之印刷電 路板。於效能板408 —面上，設置ZIF連接器4〇7(公接二 4則），方^ S ^ » 、 、 面上，以正向面對於此ZIF連接器407的方式 、、皆向配i ZIF連接器409(公接頭側）。此外，效能板4〇8 的印刷電路板係具備可設置對應DUT200的種類.之功能雷 316987 11 1299179 •路之構造。此外，於效能板408的側邊附近，設置插入有In addition, the contact ring 403 is electrically connected to the probe card 4 via a pogo pin 4 〇 2, a cable 4 〇 4, and a ZIF connector 406 ′. (N., the locking mechanism 405 is used in the slave ZIF. The connector 4〇6 is mounted with the connector m. The flat plate 416 not only fixes the ZIF connector 4 as one unit, but also has a hole (not shown) in which a guide post 414 is inserted in the vicinity of the side. The fixture 417 is used to fix the flat plate to the contact ring 403. The performance board 408 is a printed circuit board that connects the contact ring 403 and the test head 413. On the surface of the performance board 408, a ZIF connector 4 〇 7 is provided. 2, 4), square ^ S ^ », , face, in the forward direction facing the ZIF connector 407, all equipped with i ZIF connector 409 (the male connector side). In addition, the performance board 4〇8 The printed circuit board is provided with a function that can be set to correspond to the type of the DUT 200. The function of the ray 316987 11 1299179 • the road. In addition, near the side of the performance board 408, the insertion is provided.
導柱414之圖中未顯示之孔。此外，ZIF連接器407及ZIF 連接為409，係經由ZIF連接器4〇8的印刷電路板一起連 結固定。 測試頭413除了由生成施加於DUT2〇〇的直流信號等之 電路，及複數個LCD接腳卡所構成之外，亦於平板415裝 ，設有複數個接腳電子板412而構成，而用以進行DUT2〇〇 勺。平估/、中，於LCD接腳卡中，設置有以高電壓而動作 籲之LCD用的比較器及A/D轉換器等，並輸入有包含多色階 私I之L號。此外，於接腳電子板412中設置有驅動電路 及比較電路等。 此外’於此接腳電子板412中，設置ZIF連接器410(母 接頭側）。此ZJF連接器410係設定為，即使產生些許的位 置偏移1亦可順利地進行嵌合之浮動機構。導柱414係設 置於與平板415上的效能板408相對向的面之侧邊附近， 且在連接於Zip連接器4〇8時使用。此外，鎖固機構 係於從ZIF連接器410安裝卸除ZIF連接器409時使用。 此外，接腳電子板412亦具備，因應設定而做為對 DUT2〇〇之測試信號輸出系統的功能，以及對DUT200的輸 出L唬之測定系統的功能之廣泛應用性。 DUT200為面板驅動器。探測器3〇〇係包含如丁2〇〇的 運运功旎者。乘載台3〇1係設置於探測器3〇〇，為用於 載 DUT200 者。 '、 接下來說明如此的半導體測試裝置的動作。 316987 1299179 一般而言’於#際進行測試之際，係從帛（ 匕 ㈣半導體測試農置刪而使之上下顛倒，而測試裝= 楝測器300的乘載台301之DUT200，於第工圖中’铲、 說明上的便利’而在與實際上的使用狀態上下的丁狀^ ΊΓ ^ ^ op . J ^ 從設置於以輸出系統而設定之測試頭413的接腳電子 、板412之驅動電路所輸出的信號，乃依ZIF連接器41^、 效能板408、接觸環4〇3、探針卡4〇1之順序傳送： 於DUT200。 』逐 相對於此，從聰〇〇所輪出的信號，係經由探針卡 40卜接觸環4G3、效能板權、ZIF連接器41◦，而輸入於 做為測試頭413的測定系統而設定之接腳電子板412，而 進行DUT200是否為良品的判定。 y 接下來說明效能板4〇8的安裝卸除動作。 一旦解除鎖固機構411的鎖固，開放ζΐ{?連接器41〇 (士母接翻）的開口冑’而將效能板408裝載於測試頭413 時’由於在效能板4G8側邊附近設置有孔，因此導柱414 插入於此孔’而對準ZiF連接器4〇9衣爪連接器41〇的 位置。 之後知作鎖固機構411而進行鎖固，藉此嵌合zif連 接器409及ZIF連接器41 〇，而將效能板4〇8固定於測試 頭 413 〇 ^接下术刼作鎖定機構4〇5而解除鎖固，以開放ZIF速 A。406(母接碩側）的開口部。之後，—旦將效能板柳 3169S7 1299179 ,嵌合於接觸環403時，固定於效能板408之測試頭413的 導柱414，乃經由設置於效能板的側邊附近的孔，而 插入於設置在平板416的側邊附近的孔，因而對準ZIF連 接器406及ZIF連接器407的位置。 之後操作鎖固機構405而進行鎖固，藉此嵌合ZIF連 -接器406及ZIF連接器407並予以固定。此外，於對接 '(Docking)於探測器3〇〇之際，由於旋轉18〇度，因此除了 鎖固機構405之外，亦具備用以防止脱落之圖中未顯示的 固定機構。 由方、使用者會因測定元件的種類的不同而頻繁更換探 針卡401 13此係採用以往之彈簧針4Q2來做為探針卡術 及接觸環403的連接機構。 如此，由於以設置於效能板彻之⑽ 而連接接觸環403與接腳電子板412,因此可因岸 類而容易地進行效能板的安裝卸除 “的狀恶下進行DUT2〇〇的測試。此外， 408的連接部分未採用彈簧針，因此可降低成本/Λ 向配=二向面對於ZIF連接器，的方式而對 配線長戶—益409 ’亚互相連結而固定’因此可縮短 配、、果長度，亚藉由回焊煜 器安裝製程。 安裝。因此可縮短連結 於本貫施例中， 410來做為連接器， 裝卸除作業的情況下 係採用ZIF連接器4〇6、4〇7、4〇9、 仁疋於幾乎不會發生效能才反408的安 ，亦可將這些ZIF連接器取代為基板 316987 1299179 •對電=接用之連接器。於此情況下更可降低成本。 早，/纟，於本實施例中，係顯示對接於探測器300之例 B〇 rT不僅為板測器3GG，亦可對接於TAB(Tape_Automated 用11 lng ’捲帶式晶粒接合）組裝處理裝置（Handler)而使 用〇 【圖式簡單說明】 弟1圖係顯示本發明的DUT界面之構成圖。 第2圖係顯示習知DUT界面之構成 _【主要元件符號說明】 100 半導體測試裝置 102 、 104 、 106 、 402 103 、 403 接觸環 107 v 412 接腳電子板 200 DUT 301 乘載台 404 電纜線 406 、 407 、 409 、 410 414 導柱 417 固定具 101 ^ 401 探針卡 彈簧針 105 、 408 效能板 108 、 413 測試頭 300 探測器 400 半導體測試裝置 405 、 411 鎖固機構 ZIF連接器 415 、 416 平板 316987A hole not shown in the figure of the guide post 414. Further, the ZIF connector 407 and the ZIF connection are 409, which are connected and fixed together via the printed circuit boards of the ZIF connectors 4A8. The test head 413 is composed of a circuit for generating a DC signal applied to the DUT 2 , and a plurality of LCD pin cards, and is also mounted on the flat plate 415 and is provided with a plurality of pin electronic boards 412 for use. Take the DUT2 spoon. In the LCD pin card, a comparator and an A/D converter for the LCD that operates at a high voltage are provided, and an L number including a multi-color private I is input. Further, a drive circuit, a comparison circuit, and the like are provided in the pin electronic board 412. Further, in this pin electronic board 412, a ZIF connector 410 (female side) is provided. The ZJF connector 410 is set so that the floating mechanism can be smoothly fitted even if a slight positional shift 1 is generated. The guide post 414 is placed adjacent the side of the face opposite the performance plate 408 on the plate 415 and is used when attached to the Zip connector 4〇8. Further, the locking mechanism is used when the ZIF connector 409 is attached and detached from the ZIF connector 410. Further, the pin electronic board 412 is also provided with a wide range of applications as a function of the test signal output system for the DUT 2 and a function of the measurement system for the output of the DUT 200 in response to the setting. The DUT 200 is a panel driver. The detector 3 contains a transporter such as Ding. The carrier 3〇1 is installed in the detector 3〇〇 and is used to carry the DUT200. ', Next, the operation of such a semiconductor test device will be described. 316987 1299179 Generally speaking, at the time of the test, it was reversed from the 帛(四) semiconductor test farm, and the DUT200 of the test station 301 of the test rig 300 was used. In the figure, the shovel, the convenience of the description, and the upper and lower sides of the actual use state are from the pin electronics set to the test head 413 set by the output system, and the board 412 The signal outputted by the driving circuit is transmitted in the order of the ZIF connector 41^, the performance board 408, the contact ring 4〇3, and the probe card 4〇1: in the DUT 200. The signal is input to the pin electronic board 412 which is set as the measurement system of the test head 413 via the probe card 40, the contact ring 4G3, the performance board weight, and the ZIF connector 41◦, and whether the DUT 200 is a good product. y Next, the installation and removal operation of the performance board 4〇8 will be described. Once the locking mechanism 411 is unlocked, the opening ζΐ{? connector 41〇(female connection) opening 胄' When 408 is loaded on test head 413 'Because it is set near the side of performance board 4G8 The hole, so that the guide post 414 is inserted into the hole ', and is aligned with the position of the ZiF connector 4〇9 the claw connector 41. The lock mechanism 411 is then locked and locked, thereby fitting the zif connector 409 and The ZIF connector 41 is fixed, and the performance board 4〇8 is fixed to the test head 413, and the locking mechanism 4〇5 is removed to unlock the opening to open the opening of the ZIF speed A.406 (mother connection side) After that, when the performance board 3169S7 1299179 is fitted to the contact ring 403, the guide post 414 of the test head 413 fixed to the performance board 408 is inserted through a hole provided near the side of the performance board. A hole is provided near the side of the flat plate 416, thereby aligning the position of the ZIF connector 406 and the ZIF connector 407. The lock mechanism 405 is then operated to lock, thereby fitting the ZIF connector 406 and the ZIF connection. The device 407 is fixed and fixed. In addition, when docking at the detector 3, due to the rotation of 18 degrees, in addition to the locking mechanism 405, it is also provided to prevent the falling off. Fixing mechanism. The user and the user will frequently change depending on the type of measuring component. The probe card 401 13 is replaced by a conventional spring pin 4Q2 as a connection mechanism for the probe card and the contact ring 403. Thus, the contact ring 403 and the pin electronic board are connected by being disposed on the performance board (10). 412, so it is easy to carry out the test of the performance board in the installation and removal of the performance board due to the shore type. In addition, the connection part of the 408 does not use the spring pin, so the cost can be reduced. Face-to-face for the ZIF connector, the wiring length of the household - 409 'Asia is connected to each other and fixed 'so can shorten the distribution, the length of the fruit, and the reflow soldering machine installation process. installation. Therefore, the connection can be shortened in the present embodiment, and 410 is used as a connector. In the case of loading and unloading operations, ZIF connectors 4〇6, 4〇7, 4〇9, and 疋 疋 are used for almost no performance. For the anti-408, you can also replace these ZIF connectors with the base plate 316987 1299179. In this case, the cost can be reduced. Early, /, in this embodiment, it is shown that the example B 〇 rT docked to the detector 300 is not only the panel detector 3GG, but also can be docked to the TAB (Tape_Automated with 11 lng 'tape ribbon die bonding) assembly processing Handler is used 〇 [Simple description of the drawing] The first drawing shows the configuration of the DUT interface of the present invention. Figure 2 shows the structure of a conventional DUT interface_[Main component symbol description] 100 semiconductor test device 102, 104, 106, 402 103, 403 contact ring 107 v 412 pin electronic board 200 DUT 301 carrier 404 cable 406, 407, 409, 410 414 Guide post 417 Fixture 101 ^ 401 Probe card spring pin 105, 408 Performance board 108, 413 Test head 300 Detector 400 Semiconductor test set 405, 411 Locking mechanism ZIF connector 415, 416 Flat 316987