1321656 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電性檢測系統，尤指針對雙面裸板測試的電性 檢測系統。 【先前技術】 電子組裝測試包括兩種基本類型：裸板測試和加載測試。裸板測 試是在完成線路板生產後進行’主要檢查短路、開路或短路、網 表的導通性。在製程過程中還有許多其他的檢查和驗証方法。加 载測試在組裝製程完成後進行，它比裸板測試複雜。 組裝階段的測試包括：生產缺陷分析(MDA)、線上測試（ICT)和功 月έ測试(使產品在應用環境下工作）及其三者的組合。最近幾年， 鲁組裝測試還增加了自動光學檢測⑽)和自動χ射線檢測。它們可 提供電路板的靜態圖像及不同平面上的χ射線電路板的分層圖 像，從而確定虛焊及焊點橋接缺陷。 .裸板測試：檢 通常的測試有五種類型，它們主要的功能如下：工 生產缺 W析.½已黏著零組件的電路板上焊點的短路和開路或短路1321656 IX. Description of the Invention: [Technical Field] The present invention relates to an electrical detection system, and more particularly to an electrical detection system for double-sided bare board testing. [Prior Art] Electronic assembly testing includes two basic types: bare board testing and loading testing. The bare board test is performed after the completion of the board production. The main check is short circuit, open circuit or short circuit, and the continuity of the net meter. There are many other inspection and verification methods in the process. The load test is performed after the assembly process is completed, which is more complicated than the bare board test. The assembly phase tests include: Production Defect Analysis (MDA), Online Test (ICT), and Power Month Test (which allows the product to work in an application environment) and a combination of the three. In recent years, Lu assembly testing has also added automatic optical inspection (10) and automatic X-ray inspection. They provide a static image of the board and a layered image of the X-ray board on different planes to determine solder joint and solder joint bridging defects. Bare board testing: There are five types of testing in general. Their main functions are as follows: Industrial production is missing. 1⁄2 Short circuit and open or short circuit of solder joints on the board with components attached to the component
認S正電路的功能模組的運作； 查未黏著零崎料雜请舰或鱗和祕缺陷；2. J干丨回+組件的運作；4.功能測試： 5.組合測試：線上測試和功能測試 5 丄以i〇：)b 的組合測試。 βΡ板的雜;職巾，基於已事先得知的電路設計目，在待測 2電路板上找统★上麟是通路_個端點，朗用兩個探 节刀別電性接觸至這兩個端點。這兩個探針中之一為輸出電性訊 號’另-為接收此電性訊號。若接收的探針無法糊接收到上述 電性訊號時，财狀該職細路或鱗。 然而’對於雙面板的紐戦，上述方式將無法顧施行。這是 因^在雙面板令，理論上會通路的兩個端點，有時會分別在印 刷电路板的兩面上’麟原先針對單祕設計的紐測試方法無 法順利被施行。 【發明内容】 本發明之主要目的在提供—種電性檢嶋統，藉著在待測印刷電 路板兩側上分別設置探針、，而檢測雙面板的印刷電路板。 基於上述目的，本發明電性檢_、齡要用來檢測雙面板的印刷 電路板(兩面上分別有彼此電性相通的端點）。本發明系統包含可 電性接觸電路板的制板、可支碰峨與f路板的支撐板、輸 出電性訊制複數個須試探針、、經過電路板與檢測板而可接收到 電性訊號的感·。當該印刷電路板被放置_檢測板上時，將 由複數個測試探針逐一輸出電性訊號並經由檢測板傳遞至印刷電 路板，並基於感測器是否接收到電性訊號，而藉此判斷相對於測 6 试探針的印刷電路板上的端點是否 關於本發明之優點與精神可以藉由 到進一步的暸解。 為開路或短路。 以下的發明詳述及所附圖式得 【實施方式】 月:閱第ΙΑ K：圖’第1A~1C圖為本發明電性檢測系統之示意圖。 如第1A圖所不’本發明電性檢啦統所使關的讀板⑺。如第 B 1C圖所不本發明電性檢測系統所使用到的檢測板别。第比 圖為檢測板2Q的正面2Qa的示意圖，而第1C圖則為檢測板20的 背面20b的示意圖。 月 > 閱第2A 2B圖’第2A~2B圖為本發明電性檢測系統之實施示 意圖。如第2A _示’本發明電性檢測系統中支撐板1Q、檢測板 2〇 π成組5之示思圖。如第2B圖所示’本發明電性檢測系統實際 對電路板32進行測試之示意圖。 本發明電性檢測系統主要包含可電性接觸t路板32(如第 2B圖所 ㈤的檢· 20、可支撐檢測板20與電路板32的支撐板1〇、輸 出電性訊號的複數個測試探針36(如第2A〜2B圖所示）、經過電路 板32與檢測板2〇.而可接收到電性訊號的感測器3〇(如第2B圖所 示）。 簡單來說，如第2JB圖所示，當印刷電路板32被放置到檢測板20 上時，將由複數個測試探針36輸出（可逐一輸出）電性訊號並經由 1321656 印刷電路板32傳遞至檢測板20，間接傳遞至感測器3〇，並美於 感測器30是否接收到此電性訊號，而藉此判斷相對於測試探 的印刷電路板32上的端點34是否為開路或短路。底下，先依據 說明每個元件，再說明如何組裝並進行測試工作。 上述待測印刷電路板34可為覆晶薄膜(Chip 〇n Film，c〇F)、捲 帶自動粘合(Tape Automated Bonding，TAB)、軟式印刷電路板 mexibie Print Circuit’ FPC) ’且在其兩面上分別有彼此電性 • 相通的端點34。 如第2B圖所示，複數侧試探針36中之一逐—所輪出的電性訊 號可經由導線3〇a被傳輸到檢測板20上該些個檢測•點％，進而被 間接傳輸至已組裝完全後的印刷電路板32的每個端點討。 如第1A圖所示，支撐板100(為絕緣材料所構成）具有線孔16，且 線孔16大小足以讓連接至感測器3〇的導線3〇a通過。 如帛me圖所檢測板2〇為絕緣材料所構成並具有金屬的複 數個檢測點26，在位置設置上每_檢_ 26麵於印刷電路板 32背面上的端點34。檢測板2G的雙面上設有彼此導通的該些個 檢測點26。具體來說，檢測板20的正面施上僅能觀察到該些個 檢聰26 ’而從其背面20b則可觀察到，該些個檢測點26被連接 線24所連接，且經由連接線24導通至導線接面四，導線接面跗 可供導線30a作焊接。 在進行組裝時，先利用如第1A圖所示之支撐板1〇的機台固定元 8 件14，將支撐板10固定在測試機台（未描繪)上。然後，如第2A 圖所示，在支撐板10放置檢測板20，並利用如第1A〜1C圖所示之 固定穿孔12、22，使支撐板10、檢測板20彼此緊密結合，同時 使得檢測板20間接被固定在測試機台上。在支樓板1〇、檢測板 20彼此緊密結合時，檢測板20上的導線接面28,可從支樓板1〇〇 的線孔16被觀察到。如此’就可將導線30a焊接至導線接面28， 使得複數個測試探針36的電性訊號得以傳輸至檢測板2〇，並間接 傳輸至印刷電路板32。 如第2B圖所示’由於檢測板20的每一檢測點26在位置設置上均 相對於印刷電路板32背面上的端點34，使得印刷電路板32放置 在檢測板20之上時’在印刷電路板32的端點34將會接觸到檢測 板20的相對檢測點26。同時’複數個測試探針36電性接觸到印 刷電路板32正面上的端點34’而理論上應該可對該些個檢測點輸 出26的電性訊號。如此一來，複數個測試探針36逐一輸出電性 訊號時，就可經由印刷電路板32傳遞至檢測板2〇，間接傳遞至感 測器30 ’並可基於感測器30是否接收到該電性訊號，而藉此判斷 相對於測試探針36的印刷電路板20上的端點34是否為開路或短 路。 藉由以上健具财施狀詳述，歸魏更加錢描述本發明 之特徵與精神’ g非以上述·露的紐频實_來對本發 明之範臂加以限制。相反地’其目的是希望能涵蓋各種改變及具 1321656 相等性的安排於本發明所欲申請之專利範圍的範疇内。 【圖式簡單說明】 第1A〜1C圖為本發明電性檢測系統之示意圖。 第2A〜2B圖為本發明電性檢測系統之實施示意圖。 【主要元件符號說明】 10支撐板 12、22固定穿孔 14機台固定元件 16線孔 20檢測板 20a正面 20b背面 24連接線 26檢測點 28導線接面 30感測器 30a導線 32電路板 34端點 1321656 36測試探針Recognize the operation of the functional modules of the S-positive circuit; check the adhesions of the ship or scales and secrets that are not adhered to the zero-corrugated material; 2. J dry-back + component operation; 4. Functional test: 5. Combination test: online test and Functional test 5 组合 Test with a combination of i〇:)b. Ρ 的 ; ; 职 职 职 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; 职 职 职 职 职 职 职 职 职 职 职 职 职 职 职 职 职 职 职Two endpoints. One of the two probes is an output electrical signal 'other' to receive this electrical signal. If the received probe is unable to receive the above electrical signal, it is the fine path or scale. However, for the double-panel, the above method will not be implemented. This is because in the double-panel, theoretically, the two end points of the path, sometimes on the two sides of the printed circuit board, the original test method for the single secret design of Lin was not successfully implemented. SUMMARY OF THE INVENTION The main object of the present invention is to provide an electrical inspection system for detecting a double-panel printed circuit board by separately providing probes on both sides of a printed circuit board to be tested. Based on the above object, the electrical test of the present invention is used to detect a double-panel printed circuit board (ends of electrical communication with each other on both sides). The system of the invention comprises a board for electrically contacting a circuit board, a support board for supporting the bump and the f-plate, outputting a plurality of test probes for electrical signals, and receiving the electricity through the circuit board and the detecting board The feeling of sex signal. When the printed circuit board is placed on the detecting board, the electrical signals are outputted one by one by a plurality of test probes and transmitted to the printed circuit board via the detecting board, and based on whether the sensor receives the electrical signal, thereby determining Whether or not the endpoints on the printed circuit board of the test probe are related to the advantages and spirit of the present invention can be further understood. Open or short circuit. DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention and the accompanying drawings [Embodiment] Month: Read ΙΑ K: Fig. 1A to 1C are schematic views of the electrical detection system of the present invention. As shown in Fig. 1A, the reading plate (7) of the electrical inspection system of the present invention is turned off. The detection board used in the electrical detection system of the present invention is not shown in FIG. The first comparison diagram is a schematic view of the front surface 2Qa of the detection panel 2Q, and the 1Cth diagram is a schematic diagram of the rear surface 20b of the inspection panel 20. Month > Read 2A 2B Figure '2A-2B is an embodiment of the electrical detection system of the present invention. As shown in Fig. 2A, there is shown a diagram of the support plate 1Q and the detection plate 2 〇 π in the electrical detection system of the present invention. As shown in Fig. 2B, the electrical detection system of the present invention actually tests the circuit board 32. The electrical detection system of the present invention mainly comprises an electrical contact t-plate 32 (such as the inspection of FIG. 2B (5), the support plate of the detection board 20 and the circuit board 32, and a plurality of output electrical signals. The test probe 36 (shown in Figures 2A to 2B) passes through the circuit board 32 and the test board 2 to receive the electrical signal of the sensor 3 (as shown in Fig. 2B). As shown in FIG. 2B, when the printed circuit board 32 is placed on the detecting board 20, the plurality of test probes 36 output (one-by-one output) electrical signals and transmitted to the detecting board 20 via the 1321656 printed circuit board 32. Indirectly transmitted to the sensor 3A, and whether the sensor 30 receives the electrical signal, thereby determining whether the terminal 34 on the printed circuit board 32 relative to the test probe is open or shorted. First, according to the description of each component, how to assemble and carry out the test work. The printed circuit board 34 to be tested may be a chip 〇n film (c〇F), tape auto-bonding (Tape Automated Bonding). TAB), soft printed circuit board mexibie Print Circuit 'FPC) 'and in its Face each other respectively electrically • 34 communicating endpoints. As shown in FIG. 2B, the electrical signals rotated by one of the plurality of side trial probes 36 can be transmitted to the detection board 20 via the wires 3〇a, and then transmitted indirectly. Each end point of the printed circuit board 32 has been assembled. As shown in Fig. 1A, the support plate 100 (consisting of an insulating material) has a wire hole 16 and the wire hole 16 is large enough for the wire 3A connected to the sensor 3A to pass. For example, the board 2 is an insulating material and has a plurality of metal detection points 26, which are disposed at the end points 34 on the back surface of the printed circuit board 32. The detection points 26 are electrically connected to each other on both sides of the detecting plate 2G. Specifically, only the plurality of inspections 26' can be observed on the front side of the detection panel 20, and the detection points 26 are connected by the connection line 24, and the connection lines 24 are connected via the connection line 24 Conducted to the wire junction 4, the wire junction surface can be used for wire 30a welding. At the time of assembly, the support plate 10 is fixed to the test machine (not shown) by using the machine fixing member 8 of the support plate 1 as shown in Fig. 1A. Then, as shown in Fig. 2A, the detecting plate 20 is placed on the support plate 10, and the fixing perforations 12, 22 as shown in Figs. 1A to 1C are used to closely bond the supporting plate 10 and the detecting plate 20 to each other while detecting The plate 20 is indirectly fixed to the test machine. When the slabs 1 and the detecting plates 20 are tightly coupled to each other, the wire joints 28 on the detecting plates 20 can be observed from the wire holes 16 of the slabs 1 。. Thus, the wire 30a can be soldered to the wire junction 28 such that the electrical signals of the plurality of test probes 36 are transmitted to the test panel 2 and indirectly to the printed circuit board 32. As shown in FIG. 2B, 'as each of the detection points 26 of the detection board 20 is positioned relative to the end point 34 on the back side of the printed circuit board 32 such that the printed circuit board 32 is placed over the detection board 20' The end point 34 of the printed circuit board 32 will contact the opposite detection point 26 of the test board 20. At the same time, the plurality of test probes 36 are electrically contacted to the end points 34' on the front side of the printed circuit board 32. Theoretically, the electrical signals of 26 may be outputted to the test points. In this way, when the plurality of test probes 36 output electrical signals one by one, they can be transmitted to the detection board 2 through the printed circuit board 32, indirectly to the sensor 30' and can be based on whether the sensor 30 receives the signal. The electrical signal is thereby used to determine whether the terminal 34 on the printed circuit board 20 relative to the test probe 36 is open or shorted. By the above detailed description of the health care function, it is said that the characteristics and spirit of the present invention are not limited by the above-mentioned. To the contrary, it is intended to cover various modifications and equivalences of 1321656 within the scope of the patent scope of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A to 1C are schematic views of an electrical detection system of the present invention. 2A-2B are schematic views showing the implementation of the electrical detection system of the present invention. [Main component symbol description] 10 support plates 12, 22 fixed perforations 14 machine table fixing components 16 wire holes 20 detection plate 20a front surface 20b back surface 24 connection line 26 detection point 28 wire connection surface 30 sensor 30a wire 32 circuit board 34 end Point 1321656 36 test probe