TWI294351B - Laminate containing 4-methyl-1-pentene based polymer and release film comprising the same - Google Patents

Description

1294351 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a laminate comprising a 4-methyl fluorene-pentene polymer and a release film thereof. More specifically, the laminated body for a release film which is used for the film or sheet laminate and the pressure molding, in particular, when used in the manufacture of a flexible printed circuit board, is used as Protection 2: The cover layer (cover ay) film of the (copper 'self') surface, which is heated and pressurized by an adhesive, and then the release film used, and has a suitable degree A release film having a cushioning property and a superior release property, and a release film for producing a flexible printed circuit board obtained by the laminate. [Prior Art] In the case of manufacturing a flexible printed circuit board (hereinafter referred to as "rFpc"), it is generally known to provide a cover layer on a substrate on which a circuit is formed. In the case where the printed circuit is formed on only one side of the substrate, the heat-curing type adhesive is used for heating and pressurization on only one side, and the ruthenium layer is followed by 'on both sides of the substrate. In the case where a printed circuit is provided on each other in a plurality of layers, heat and pressure are applied to both surfaces using a heat-curable adhesive, and the cover layer is subsequently attached. The substrate and the cover layer on which the circuit is formed are subsequently heated and pressed by sandwiching the circuit-formed substrate and the cover layer with a thermosetting type bonding agent, but in order to avoid heating And a state in which the coating layer and the metal sheet are followed by the pressurization, and a fluorine-based film or a polydecylpentene film of polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, and polyvinyl fluoride is used in the middle thereof. Wait for the release film. 312XP/Inventive Manual (Supplement)/95-09/95116834 5 8 1294351 八In the other 'FPC, the terminal part $ for electrical connection with other parts is not covered with a cover layer, and the circuit of the connection part When the exposed layer is covered with a coating layer other than the exposed portion, the adhesive applied to the coating layer is melted by heating and pressurization when the seed layer is formed on the substrate on which the circuit is formed. However, it is often discharged to the exposed portion = the surface of the road, so that the surface of the circuit is covered by the layer of the adhesive, and the electrical connection is poor.曰/ In order to solve this problem, the release film used in the manufacture of FPC is intended to have good release properties, and to prevent the adhesive from flowing out from the end face of the cover layer by following the irregularities of the cover layer or the surface of the Fpc. On the circuit, the cushioning. Juice 0. Patent Document 1 discloses a release enthalpy in which a soft polyolefin layer is used as an intermediate layer to form a crystalline polymethylpentene layer on both inner and outer surfaces thereof. a, in addition, in Patent Document 2, it is disclosed that the surface layer belongs to poly-4-indolyl-1-pentene, and polyethylene, poly(ethylene oxide), ethylene acrylate copolymer, ethylene, and the like are provided via an adhesive layer of ethylene/propylene rubber. A layered film is formed by a resin such as a mercapto acrylate copolymer or an ethylene-vinyl acetate copolymer. However, such a release film and a multilayer film have a low melting point of polyethylene and polypropylene which are soft polyolefin layers, and are used as a release type in the production of FPC, and are superposed on the cover layer for heating and pressurization. Polyethylene and polypropylene, which are soft polyolefin layers, will extend from the ends of the release film and the multilayer film to the surface of the substrate on which the circuit is formed and the metal plate used for heating and pressurization, and are manufactured by FPC. The problem of reduced yield and reduced work efficiency. In addition, the release film of the patent document 1 is more likely to be used in the patent document 2 because it does not have an adhesive layer, so it is easier to send the 312XP/inventive specification (supplement)/95-09/95116834 6 1294351. In the adhesive layer of the acetamidine-propene rubber, since the melt viscosity is higher than that of the surface layer of polymethyl 4-methyl-1-decene, there is a problem that the thickness and thickness of the multilayer film are inferior and the productivity is lowered. Further, Patent Document 3 discloses a release film in which a 3-layer film of a polyfluorenyl 4-pentene resin layer, an adhesive resin layer, and a heat resistant resin layer is sequentially laminated from the surface side, or The heat resistant resin layer is centered, and a five-layer film of an adhesive resin layer and a poly-4-methyl-p-pentene resin layer is laminated on both sides. However, in this release film, since the resin used for the heat resistant resin layer belongs to a heat distortion temperature measured at a load of 4.6 (kg/cm 2 ) of 13 〇 t: or more, and a stress at a temperature of 140 ° C It is a high-hardness resin which is extremely hard to be thermally deformed at a temperature of 1 〇〇 (kg/cm 2 ) or more. Therefore, when FPC is manufactured, when a circuit-formed substrate, a cover film, and a release film are stacked in this order, and heated and pressurized, The release film will not follow the irregularities of the substrate on which the circuit is formed, and there is a problem that the adhesive between the substrate on which the circuit is formed and the cover film flow out onto the Fpc circuit surface.

The methyl 1 pentene fluorene polymer resin is coated. In addition, Patent Document 4 discloses a method for producing a printed circuit board, wherein the outer layer of the film is a 4H pentene polymer resin, and the inner layer is a poly olefin (4). Resin, and the multilayer resin having the outer layer above and below the inner layer = in order not to make the inner layer beyond 'the inner layer is surrounded by the outer layer - the degree varies depending on the type of FPC, and therefore, by cutting the laminated body Two-two-degree release film' However, in reality, it is difficult to match various private views and the outer layer is covered with the inner layer, and the steps will become complicated.

In general, the FPC 312ΧΡ/Flip instructions (supplement)/95-09/95116834 7 1294351 are significantly less productive. In addition, although the blow molding method is proposed as the manufacturing method, it is necessary to change the size of the round mold and the swell ratio by the width of the release film, and it is difficult to make the thickness of each layer uniform, so when manufacturing the FPC =When heat and pressure, wrinkles will occur on the surface of the release film. In the case of wrinkles, the blade release film will not be able to fully follow the irregularities of the surface of the substrate on which the circuit is formed, resulting in empty yang: or wrinkle transfer. i FPC ±, so there is no way to get an FPC with a fully compliant appearance. Further, Patent Document 5 discloses a laminate in which a resin layer composed of a 4-mercapto-p-pentene polymer, an adhesive layer, and a 4-mercapto-p-pentene polymer are used. It consists of a thermoplastic resin. However, the thermoplastic resin other than the 4-mercapto-1-pentene polymer used is an oxygen-containing thermoplastic resin such as polyester or polyamide, and polyethylene, polypropylene, and polybutene. In the case of the olefin-based resin, in the case of the oxygen-containing thermoplastic resin, as in Patent Document 3, the laminate does not sufficiently follow the unevenness of the substrate on which the circuit is formed, and the substrate between the substrates is formed. The problem of the agent flowing out to the Fpc circuit surface. On the other hand, in the case of an olefin-based polymer resin, as in the case of Patent Document 2, in the case of a release film, the 'ene (tetra) polymer is attached to the FPC or the hot plate for pressurization from the end of the laminate. On, there is still a problem of lower Fpc rate and lower work efficiency. Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Patent Publication No. 2000-263724, No. 2000-263724/Inventor's Specification (Supplement)/95-09/95116834 8 1294351 Document 5 · Japanese Patent Laid-Open Publication No. 2002-179863 (Summary of the Invention) Zhang (Problem to be Solved by the Invention) The present invention Providing a layer which is heated and pressurized in a release type by using a thermosetting type adhesive, in a process of forming an EPC substrate, a cover layer, and a release film. The escaping of the resin, which is a buffer of the intermediate layer of the release film, and the release film formed by the substrate and the cover layer of the circuit layer by following the adhesive between the surface film of the substrate on which the circuit is formed The laminated body of the punctuality, the release film for the manufacture of the flexible printed circuit board (the means of solving the problem) = Ming = et al., and the research on the above problems, and found that the hunting 乂 有 § has 4 _methyl specific followed by (B) and a layer H having a specific adhesive layer between the surface layer (A), (C), the buffer layer of the specific resin and the soft resin, and the buffer layer (c), The present invention can be solved by the above problems. That is, the present invention is as follows. The surface layer (1), the subsequent layer (8), and the buffer layer (c) are provided with an adhesive layer A. The i layer (1) contains a 4- to pentene 5-body having a mass of 80 to 100 Å, and the buffer layer (C) contains a melting point i9 (heat resistant tree wax (c) above rc) and a turmeric τ", (2) The laminated layer of the T-soft resin (10) described in the above (1). The layer of the layer (8) contains the 312XP/inventive specification (supplement... 孓(4) state stripping 9 1294351 20 to 50% by mass of 4-1丄, , χ / 4 基 1 - terpene polymer (bl) and 50 to 80 mass two tt atom number. 2 to 4 olefin polymer (10), and measured by load g 'span 230 C Melt flow rate 丨;) not, 茜.. (4) minutes '. buffer layer (c) contains ... 70 swim, 丄ί ) and 5 〇 ~ 9 〇 mass % of the melting point H70C soft resin (c2) ' And with a load of 2, temperature C The melt flow rate set ⑽. For G 4~iGg/iG minutes. The ruthenium ethylene/butene copolymer α2_υ: two: (b), :: 丁烯 butene polymer (b2-2). Berry/. [1] The laminate according to the above [1H3], wherein the thermal resin (8) is selected from the group consisting of 4-methyl + pentane polyester to "species" soft resin (10) selected from low density and low density. Polyethylene, high density polyethylene, propylene partial linear propylene copolymer, ethylene propylene/butene copolymer, π ethylene · complex, ethylene · butylene copolymer, propylene / butene copolymer maleic anhydride The laminate of the above-mentioned [1] to [4], wherein the laminate has a 4-mercapto-1-pentene homopolymer or a 4-layer The copolymer of the olefin having a carbon number of 2 to 20 other than the group -1-pentene and the olefin of 2 to 20, and the layered body described in the above [1] to [5], wherein , the outer layer is the surface layer (Α), the surface layer (Α) of the thick sound of the two bodies is at least 5 to 50% - the thickness of the layer is 312 ΧΡ / hair invention instructions ( (Replacement) /95_〇9/95116834 1〇1294351 =] The laminate according to the above [1] to [6], wherein the surface layer (A) and the buffer layer of the laminate before heat and pressure treatment ( c) between JIS K68 The laminate according to the above [1] to [7], wherein at least one outermost layer of the laminate is a surface layer (Α), the surface The surface roughness Ry of the layer (human) is 2 〇 / / m 〇 [9] The laminate according to the above [1] to [8], wherein each layer is formed by a method. [10] The release film of the release type and the flexible printed circuit board is composed of the laminate of any one of the above [1] to [9].

The laminate of the present invention is excellent in heat resistance and release property by containing a 4-methyl-I-pentene polymer in the surface layer (A). In addition, the buffer layer (C) has excellent flexibility when it is heated and pressurized in the production of PC. Therefore, it can be deformed well in accordance with the shape of the surface of the substrate on which the circuit is formed, and can prevent the substrate surface of the circuit from being replaced. The outflow of the adhesive between the cover layers. Further, the 2 = enamel layer (8) and the buffer layer (c) having the composition of the heat-resistant resin (cl) and the soft resin (10) are excessively heated and pressurized: adhered to the buffer layer (c) The yield of FPC products caused by the surface of the substrate on which the circuit is formed or = and the pressure of the metal plate is reduced. The film 〃 + low phase problem can be suitably used as the FPC for the production of the type 5116834 n 1294351. [Embodiment] Hereinafter, the present invention will be described in detail. The present invention is a laminate comprising at least a surface layer a), '(8) and a buffer layer (6), and between the surface layer (A) and the buffer layer (6) and then the layer (B) is characterized by The surface layer (A) contains ~(10) proton%, a 4-methyl pentaerythrine polymer, and the buffer layer (c) contains a heat-resistant resin (8) and a melting point of 17 Gt: the following soft resin That is, the layered system of the present invention basically has a surface layer (?), an adhesive layer (B), and a buffer layer (C) which are sequentially formed of a 4 methyl-1-pentene polymer from the surface side. At least three layers of construction. For example, the surface layer (A), the subsequent layer (B), the buffer layer (c), and the subsequent layer (B) composed of a 4-methyl-nonane-pentene polymer are sequentially laminated from the surface side. The laminate of the surface layer (A) of the monomethyl 1-pentene polymer and the integrated structure of the 5 reed structure can be suitably used as a release film, in particular, a FPC system and a release liner film. Throwing '[Surface layer (A)] ^ The surface layer (A) of the present invention may contain, as long as it contains 80 to 100% by mass of a 4-fluorenyl-p-pentene-based polymer, except for 4-mercapto-1-lan The olefinic polymer may be a fluorine-based resin such as tetrafluoroethylene or the like, polyphenylene sulfide or polyester vinegar. a 4-mercapto-1 -pentene-based polymer used in the surface layer of the present invention, a homopolymer of 4-mercapto-1-pentene, or a 4-mercapto-p-pentene and a ruthenium Illustrator of the olefin or chain dimer having 2 to 20 carbon atoms other than keto-pentene/inventive specification (supplement)/95-09/95116834 12 1294351 total: the composite has good rigidity and elastic modulus, Therefore, compared with: the thin smoke of 匕 can be cited, for example, women, women, and women! As a carbon source: number eighteen: 1 ene, 1 ~ twelve rare, fourteen thin, twenty L: ', good. In particular, the diorite has a low rigidity and a good elastic modulus; therefore: In addition, as such a 4-methyl- 1 -, a constituent unit derived from 4-methyl-p-pentene is preferred to contain two = The number of carbon atoms is 2, and the olefins have two 0<1.1 〇; ^ 1~5 质 m 社 % % % % 特 ( ( ( ( ( 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 The modulus of elasticity is increased, so it is preferred. In the early position, the 4-methyl+pentene polymer can be known by known methods: the two polymerization catalysts and the polymerization method are not particularly limited to Ziegler type catalysts (according to Carrier or unsupported dentate II: 组合 ΐ compound combination), Phillips type catalyst (according to carrier oxidation:), Kaminsky type catalyst (based on carrier or unloaded) Holding a metallocene type compound and an organic compound, especially a combination with a sulphonic acid (alUm〇Xane) and the like. The polymerization method is a polymer polymerization method, a gas phase fluidized bed polymerization method, a solution polymerization method in the presence of such a catalyst, or a high pressure overall (secret) polymerization method having a pressure of 20 MPa or more and a polymerization temperature of 1 Torr or more. method. Specifically, the catalyst is as described in Japanese Patent Laid-Open Publication No. SHO 611-1136-4, No. 312XP/Inventive Specification (Supplement), 95-09/95116834, 13 1294351, and No. 2003-1 05022. In the presence of 4-mercapto-1-pentene alone or 4-methyl-monopentene and other olefins having 2 to 20 carbon atoms, a 4-mercapto group can be obtained. - a quinone-based polymer. The 4-methyl-1-pentene polymer is based on aSTM D1238 and has a value of a melt flow rate (MFR) of 5.0 kg and a temperature of 26 (TC conditions, preferably 〇·5~). 2 〇〇 g / 1 〇 minutes, preferably minutes, more preferably 10 ~ l 〇〇 g / 1 〇 minutes. If MFR2 is 〇. 5g / l 〇 minutes ~ 2 〇〇 g / l 〇 minutes In the range of the above, a good moldability and a sufficient mechanical strength can be obtained. The value of MFR2, that is, the molecular weight of the polymer, is a known method such as setting of the amount of hydrogen or the polymerization temperature which can be supplied to the polymerization system. Further, the 4-methyl-1-pentene polymer can be blended with a heat-resistant stabilizer, a weather-resistant stabilizer, a rust preventive, and a copper-resistant stabilizer without damaging the object of the present invention. a compound, an antistatic agent, or the like, which is blended with various additives known per se in the polyolefin. ^ " Further, the above 4-mercapto-1-pentene polymer is preferably 80 to 100 by mass of the surface layer (a). %, preferably 9〇~1〇〇% by mass, more preferably ι〇〇% by mass. [, Next layer B] The adhesive layer (B) of the present invention Resin composition having 20 to 50% by mass of a 4-mercapto-quinone pentene polymer (bl) and 50 to 80% by mass of a polymer (b2) having a carbon number & 2 to 4 olefin Preferably, it contains 3〇~5〇% by mass. 14 312XP/Inventive Manual (supplement)/95-09/95116834

A 4-mercapto-p-pentene-based polymer (b1) of 1294351 and a resin composition containing 5 to 4% by mass of the olefin-based polymer (b2) having 5 to 7 % by mass. . Further, based on ASTM D1238, the value of the melt flow rate (MFR1) of the adhesive layer (B) measured at a load of 21.6 kg and a temperature of 23 〇C is less than 0.4 g/l of trowels, preferably 〇· 〇1~〇·3g/i〇 minutes, more preferably 〇·〇5~0.3g/10 minutes. The value of MFR1 at a temperature of 230 ° C which is closer to the temperature at the time of heating and pressurization at the time of Fpc production, if it is within the above range, the buffer layer can be reduced during pressurization and heating at the time of FPC production. Exceeded. Further, by using such a specific adhesive layer, the surface layer (A) of a 4-mercapto+pentane-based polymer which is generally weak in adhesion to other resins can be sufficiently obtained. The adhesion strength of the buffer layer (c). Further, in the adhesive layer of the present invention, it is preferable that the fluorene-containing polymer (b) is a olefin-based polymer having a carbon number of 2 to 4 as a carbon atom having 2 to 4 carbon atoms. B2) ethylene/butene copolymer (btDpw mass%^ 1-butene polymer (b2-2) 30 to 60% by mass of resin composition', more preferably contains 4-methyl-1-pentyl The olefin polymer (bl) is 3 〇 to 5 〇% by mass, the ethylene·• butene copolymer (b2_1) is 10 to 30% by mass, and the butene-based polymer (b2-2) is 40 to 60% by mass. Resin composition. Further, other thermoplastic resins other than the above, (bl), (b2-1), and (b2-2) may be contained in the range of the present invention without impairing the characteristics of the present invention. In B), the total amount of (bl), (b2-1), and (b2-2) is 80 to 100 with respect to the total amount of other thermoplastic resins, (bl), (b2〇, and (b2-2). % by mass, more preferably 90~1〇〇% by mass. °里..., 312XP/Inventive Manual (supplement)/95-09/95116834 15 1294351 Copper:: 2: It can contain heat-resistant stabilizer, weathering stabilizer, Rust inhibitor, anti-agent, antistatic agent, etc. Mixing method of the additive of the n-additive 'the grease and the stabilizer, etc. in the polyolefin. α + such as dry blending or refining blending using an extruder, etc. The layer (8) obtained by laminating the layer (8) and the surface layer (Α) and the buffer layer (c) before the pressure treatment can be measured, for example, by the following method: from the use of 3 layers (6) ^ A laminate consisting of five layers of the surface layer (A) / the subsequent layer (8) / the buffer layer (8) / the surface layer (1) obtained by the pulling device, and the sample of the cut width = ^50 with a width of 15 mm 'according to JIS_4, sample = degree One end of the direction causes the surface layer (1) on one side to be slightly peeled off, and the adjacent layer of the surface layer (Α) of the neighboring 八八丨2 u) (4) is left: the knife is sandwiched by the jig at a temperature of 23t, The peeling angle (10) degree, the peeling speed of 300_/min, and the peeling width of the 15th position were subjected to the τ-type peeling test. The strength between the surface layer (1) and the buffer layer (c) before the heating and dusting treatment was 20N/15mm, preferably H0N/15, more preferably 2~coffee_, especially good 4~8N/15mm, surface layer of laminated body (1) When the bonding strength between the layers (c) is within the above range, the buffer layer ((:) is excessively reduced during pressurization and heating at the time of Fpc production. Further, the laminate of the present invention is used close to The heating and pressurization treatment conditions in the case of the release film at the time of Fpc production are, for example, a temperature of 18 〇, and a pressure of 5 MPa. After heating and pressurizing for 30 minutes, the heating is performed by cooling.

312XP/Inventive Manual (Supplement)/95-09/95116834 16 1294351 and the pressure-treated laminate, the surface layer (A) and the buffer layer (c) have the best adhesion strength according to Jis K6854. It is 1/N5 mm, preferably 1 to 5 N/15_, more preferably 2 to 4 Å/15_. #热热 The pressure between the surface layer (Α) and the buffer layer (C) is within the above range, after the subsequent treatment with the coating layer by heating and room cleaning, the coating is covered. When the layer is peeled off, it is possible to prevent the coating layer from being left on the surface such as cracking of the film. (4-methyl-1-pentene polymer (bl)) 4-methyl+anthracene used in the second layer (8): the same as: used and used in the surface layer (1) Polymerization (polymer (b2) containing an olefin having 2 to 4 carbon atoms) = polymer (b2) used in the subsequent layer (8) of the invention, if it is a sulfonium 7 a double & 4 < It can be the average of the women; the two-body can be a polymer of 2 to 4 olefins (b2 ς = polymer (b2A and butadiene polymer (10) butadiene (ethylene/butene copolymer (b2) -l)) Following the present invention> ((4), preferably, random copolymerization of ethylene-butene copolymer mass% by weight: 3 mass (four) is 15, = r.t1, 'Isobutyl...Alkene, Middle:Diene oxime Butene is preferred. These butenes can be used as '#, two or more. Use one type alone, or a combination of 312 clear instructions (small parts) /95116834 17 1294351 The above composition of the ethylene/butene copolymer "Bu" is measured by the 13c-nmr. In addition, B. Ding, p #, ,, 成,力措田

Π1〇,, 朴烯烯/, polymer (b2-l) according to ASTM car r, more than two: Η '10 minutes, preferably 1, /10, better known as Bu 1〇g/10 minute. The ethylene-butadiene copolymerization method is obtained by polymerizing each unit body, and the value of the unit, that is, the p-body: molecular weight, is a known method such as supply to polymerization: polymerization temperature, etc. And to control. In addition, it is easy to obtain, for example, the trade name of "Mitsui Chemical Co., Ltd." (8), and the product name of "Shinjuku Chemical Co., Ltd.", "ΕβΜ". The mixing property of the 1-buty-thick polymer (b2-2) is better, and the second layer: the surface layer (A) and the buffer layer (6) have high adhesion properties (4) for (1-butene-based polymer ( B2_2)) θ (B). The butene-based polymer used in the layer (8) (called 1', 丁八有! 6〇, °% by mass, preferably δο, 〇 mass of the copolymer 1 or bubutene and pudding In addition to the diuretic co-polymerization of the diuretic co-polymerization of the woman other than the woman, the bismuth other than the m-dilute co-polymerization: dilute, di-diluted, di-n-dish, diterpene, b::, for example, octadecene, etc. , 3 and 5 to 20 olefins, etc.: = preferred. These olefins can be used alone; can be grouped: B 2 312XP / issued instructions for bribes / 95 · 〇 9 / 95 i} coffee 4 18 1294351 i: The above composition of the wire combination can be obtained by _, and: the olefin polymer (b2~2) according to ASTM D1238, the melt flow measured by -: Γ Γ temperature Rate (10). The value is 0. 5 Gg / 1 () minutes, preferably minutes, more preferably 2. 2 g / l 〇 minutes. Such a dibutyl polymer can be obtained by polymerizing a long-term body according to a known method, that is, a value of a polymer, a chlorine amount or a polymerization temperature to be supplied to a polymerization system, etc.: Control it. Moreover, it can be easily obtained by the market, and the yak is listed as the trade name "TAFMER BL" manufactured by Mitsui Chemicals Co., Ltd. / by using a resin composition and a value of MFR1 of ±, a mixture of a polymer (: 2), a betyl methyl group + a pentene polymer (10), and a mixture of a B and a butylene fine copolymer (b2-l) If the property is improved, it is possible to obtain a high adhesion property to the top layer (A) and the buffer layer (6). [Buffer layer (C)] The buffer layer (C) of the present invention contains a bright point 19 (rc or more). The sturdy resin ((1) and the soft resin (c2) under the refractory point 170t) may contain a thermoplastic resin having a melting point of more than 17 generations of 19 (TC) within a range not detracting from the object of the present invention. And additives such as heat-resistant stabilizers, weather-resistant stabilizers, rust inhibitors, copper-resistant stabilizers, and antistatic agents, etc., which are well-known in the month of polysulfide. The mixing method may, for example, be a known method such as blending by means or melt blending using an extruder. The buffer layer (c) of the invention is preferably 10 to 50% by mass, preferably 1 (M5 Berry i The ratio of Y soil is 15 to 40% by mass, and the melting point is 19 〇. The above 312XP/inventive specification (supplement)/95-〇9/95 j]6834 19 1294351: Resin (cl). Further, by preferably 50~90 mass%, preferably 55~90% by mass, more preferably in a range of 60~85% by mass having a melting point of 170 ° C or less soft resin (c 2).

Further, according to ASTM D1238, the value of the melt flow rate (MFRi) of the buffer layer (C) measured at a load of 2·16 kg and a temperature of 230 ° C is 0·4 〜 l 〇 g / i 〇 minutes, preferably 〇 4 to 9 g / 1 () minutes, more preferably 0 · 4 ~ 5g / l 〇 minutes, more preferably 〇. 5 ~ 4g / 1 〇 minutes, particularly good 〇 · 5 ~ 3g / l 〇 minutes. By using the above-mentioned composition range, the heat-resistant resin (cl) having a specific melting point range and the soft resin (c2) and having the buffer layer (c) belonging to the above-mentioned MFR1 range are used as the release type at the time of FPC production. The film provides good cushioning and prevents the adhesive from exceeding, while preventing the buffer layer itself from exceeding. (Heat-Resistant Resin (cl)) The heat-resistant resin (cl) having a melting point of 19 (rc or more) used in the buffer layer (c) of the present invention preferably has a melting point of 19 (rc or more, preferably 19 Å to 25 Å). t:, ^ is preferably a resin of 200 to 250 ° C. If the melting point is 19 (rc or more, Fpc = resin does not melt when heated and pressurized, but can reduce the buffer layer, and the right melting point When it is 2501 or less, it melts this by an extruder, and it can obtain the composition of the heat-resistant resin (cl) and the soft resin (c2) below the melting point of the soft resin (c2). Moreover, heat-resistant resin ( Cl) according to ASTM D1238, with a load of 5 kg and a temperature of 26 (the buffer layer ((:) melt flow rate (mfr2) measured by TC is 0.5 to 200 g/l min, preferably 15 g/l 〇 、 、 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 312 Layer 1-A pentene polymer (P), polyethylene terephthalate (PET), polybutylene terephthalate (ρΒΤ) Poly-esters; polyamines such as polyamido-6, polyamido-6,6, polydecylamine 11, polydecylamine 12, etc. These resins are readily available from the market, such as Mitsubishi Engineering Plastics Co., Ltd. The product name "Novamid", the product name of Toray (share), "Amilan", etc. These resins having a melting point of 190t or more can be used alone or in combination of two or more. From the viewpoint of the good adhesion strength of the obtained layer: B), a 4-methyl+pentene polymer and a polyamine are preferable, and in particular, 4-methyl-1 which is used for the surface layer (1) can be suitably used. - The pentene-based polymer is the same. (Soft resin (c2)) The softening resin (C2) having a melting point of 17 (rc or less) used in the buffer layer (c) of the present invention preferably has a melting point of 17 (rc or less). Preferably, it is a resin of 7〇~17, _f=8〇~(10), and a special 90~. This resin is melted 'read low' and is easily deformed when heated by FPC and will be followed by Shape, the unevenness of the surface of the substrate of the circuit prevents the adhesive between the substrate on which the circuit is formed and the film of the cover film from flowing out onto the circuit surface of the Fpc, that is, The function of the buffering function is as follows: if the soft resin (c2) has a bright point of 17_, it is easily deformed during heating and pressurization during FPC production, and can follow the unevenness of the surface of the substrate on which the circuit is formed. 7 〇 above, the resin does not flow out a lot when heated and pressurized, can reduce the buffer layer (c) super 312XP / invention manual (supplement) / 95.09/95116834 21 8 1294351 In addition, the soft resin (C2) according to ASTM D1238, The value of the melt flow rate (MFR1) measured at a load of 2 16 kg and a temperature of 230 ° C is 0.8 to 25 g/10 min, preferably 20 g/10 min, more preferably W 5 g/i' min. • As the soft resin (c2) satisfying the above conditions, specifically, low density polyethylene, linear low density polyethylene, high density polyethylene, propylene homopolymer, ethylene propylene copolymer, ethylene propylene/butene In order to make the adhesion to the heat-resistant resin (c 1) having a melting point of 19 〇C or more, the copolymerization of the homopolymer, the ethylene/butene copolymer, and the propylene/butylene copolymer are further improved. It is also possible to blend these resins by graft modification with unsaturated acids and/or derivatives thereof. In addition, examples thereof include an ethylene X·acrylate copolymer, an ethylene/methacrylate copolymer, an ethylene/vinyl acetate copolymer, an ethylene/acrylic acid copolymer, an ethylene/methacrylic acid copolymer, and A resin such as a copolymer or the like selected from a part of the ion-exchanged U-linked product. Such resins are readily available from the market, such as the trade name "EVAFLEX" manufactured by Mitsui DuPont Polychemicals Co., Ltd., and the trade name "NUCREL"; the commercial reputation of Sumitomo Chemical Co., Ltd. f: Eve Age, and the product name (4) and also". In addition, the resin may be used alone or in combination of two or more kinds. Among these, it is preferably low-density polyethylene or linear low-density polyethylene (ethylene content of 8% by mass or more of ethylene and carbon atoms 3). a copolymer of ~1 α of α-olefins, a homopolymer of propylene, a propylene/butene copolymer, and a polyethylene modified by grafting with a disaccharide. 312ΧΡ/发发明说明(补件)/95-09/95116834 22 1294351 [Laminated body] ::: The monthly laminated system contains at least the surface layer (1), the subsequent layer (8) and the buffer layer (C)' subsurface layer ( A) having a contiguous sound = laminated body between the buffer layer (c) and having a centroid at least one outermost layer of the laminated body: the second layer may have a surface layer (1), an adhesive layer (8), and a buffer layer (c) Preferably, for example, a laminated body having a three-layer structure of (A)/(8)/(c) and a laminated body (A)/(B) having a four-layer structure of (V(B)/(C)/(D) /(C)/(B)/(A) A layered structure of a 5-layer structure, etc. Among these, the "extraordinary system" is used as a release film, and the outermost layer on both sides has a surface layer ( A) a layered structure having a five-layer structure. Further, as the resin of the layer (9) which can be used for the laminate of the four-layer structure, a thermoplastic resin having high heat resistance is preferable, and for example, polyethylene terephthalate is exemplified.酉匕 (_, polybutylene terephthalate (pBT) and other polyester; polyamine -6 曰, polyamine-6, 6, polyamine U, polyamide 12, etc. Amine; and polymethyl pentene, these resins can be easily obtained from the market, for example The product name "Novamid" manufactured by Mitsubishi Engineering Plastics Co., Ltd., the product name "Amilan" manufactured by Toray Industries Co., Ltd., and the product name "τρχ" manufactured by Mitsui Chemicals Co., Ltd., etc. These resins can be used alone. In addition, in the laminated body of the present invention, the thicknesses of the surface layer (Α), the adhesive layer (β), and the buffer layer (C) vary depending on the use of the laminate, but are used as That is, in the case of manufacturing a release film, the thickness of the laminate is 1 〇 1 〇〇〇 # claw, preferably +20 to 500 / zm, more preferably 3 〇 to 4 〇〇 / / m, and even more When the thickness is within this range, the handleability when used as a rolled material is good, and if it is 10/zm or more, a laminate 312XP having a good thickness and thickness can be obtained. Piece) /95-09/95116834 23 1294351 Γηι又^^ The thickness of the surface layer (1) is preferably 5~sub ", preferably 5~50 1 1 ^^^ 5~4〇#m. In addition, The thickness of the layer (B) is preferably 〇_, preferably 5Mm, more preferably 14〇. The thickness of the buffer layer (c) is preferably 10~6〇〇, 20~200" | 'Or better ", as 1〇~300 Further, at least part of the laminate - 5~5G% of the overall thickness of the outermost surface layer ⑴ laminate, preferably 5~45%, more preferably

',: 3〇%, more preferably 5~25%, especially preferably 10~25%, then FPC dreams: when heating and pressurizing, the buffer layer (the amount of 〇 is less, and for the shape ' The follow-up of the unevenness on the surface of the substrate of the circuit is good, and the flow of the adhesive between the substrate forming the path and the cover film can be prevented.

Further, 'the surface layer (1) which is at least one outermost layer of the laminated body, the surface roughness Ry丨ub 2G" measured according to JIS B_1, preferably 〇.1~=//111, more preferably 0.1~5/ /111. When the thickness of the surface layer is within the above range, the release property when peeling off the release film after heating and pressurization at the time of FPC production is good. The method for producing the laminate having such a surface roughness is not particularly limited. It can be produced by a known method, and in the extrusion molding method using the τ-mold device, the surface of the cold roller, that is, the surface of the cooling roller is changed by matting treatment, and the surface of the cold light is transferred to (10) After melting the resin, it can be easily cooled, and the thickness of the above range can be easily obtained. Further, after the laminated body having a smooth surface is produced, the laminated body is heated and softened again, and heated and pressurized by an embossing roll. The processing method is to make the surface of the laminated body uniform and rough, and the surface roughness of the object can be obtained. Further, the method for producing the laminated body of the present invention is not particularly limited, and the invention can be borrowed from the 312XP/inventive specification (supplement)/95·〇9 /95116834 24 1294351 2 Using a die-die apparatus extrusion molding method, heating each other by a heating method or a solvent 2 method, a layer is formed by laminating a layer, and heating is performed by a known method. Squeezing of the device The forming method is excellent because it can make the film thickness of each layer be hooked and widened, and further, after manufacturing a wide laminated body, since it can be easily cut into a width corresponding to various FPC widths, It is suitable as a release film for Fpc manufacture. The buffer layer (c) of the laminate of the present invention has an excess amount of & 2.5 or less, preferably 0·1 to 2 mm, more preferably 〇·5~ 2_.

When the excess amount of the buffer layer (C) is within the above range, when the laminated body of the present invention is used as a release film for FPC production, when the heating and the addition are performed (3), the buffer layer (c) has a small excess amount. It is possible to prevent problems such as a decrease in the yield of the FPC product and a decrease in work efficiency due to the excess of the buffer layer (c) attached to the substrate on which the circuit is formed or the metal plate on which the ink is applied during heating and refilling. Further, the excess amount of the buffer layer (C) is produced by, for example, using three kinds of 5-layer τ-die devices, which are manufactured by a surface layer (Α) / an adhesive layer (Β) / a buffer layer (c) / an adhesive layer (B) / surface A layer of 4 mm wide layer composed of 5 layers of layer (A), a total of 4 samples [D2] of 10 cm x 10 cm were cut out from any position, and then [A] stainless steel plate (32 cm x 32 cm x 5 mm thick), [B As a cushioning material, the newspaper 1 sheet (30cmx30cm), [C] aluminum sheet (30cmx30cmx thick 〇·1_), [D2] the above sample 4 grazing, by the bottom [A] / [B] / [C] / [D2 The order of ]/[C]/[B]/[A] overlaps. Here, four [D2] samples superposed on the [C] aluminum plate were arranged so as not to overlap each other, and then the temperature of the heating and pressurization treatment conditions when using the release film for FPC production was as follows. (In the ambient gas of rc, heat and pressurize at a pressure of 8 MPa for 1 minute, then press

312XP/Inventive Manual (supplement)/95-09/95116834 25 1294351 Force 5MPa for holding pressure, 3 minutes cold = for the 4th grain sample taken out, measured from the end of the surface layer 2 super = buffer layer (C) The length of the obtained value can be obtained. The buffering capacity of the layer of 350 to the outer layer of the layer is 3° 〇..., preferably 350 to = () () (four), more preferably. 9 is called m, especially good is * (four) is called ^ 绫 里The right is within the above range, then the invention will be used in the case of heating (4) in the case of manufacturing a (four) type film, because

(C) has excellent visibility, so it will be well deformed following the shape of the surface of the substrate on which the circuit is formed. 'The flow of the adhesive between the substrate surface and the cover layer on which the circuit is formed can be prevented, and the circuit surface can be prevented from being The problem of the electrical connection caused by the subsequent coverage of the agent.

Further, the buffer amount of the laminate is, for example, a width of 4 layers of the surface layer (A) / the adhesion layer (B) eight buffer layer (c) / the surface layer 5 layers, using three kinds of 5-layer T-die devices. For the layered body of 〇〇_, a total of 4 samples [D3] of lOcmxlOcm are cut out from any position, and then [A] stainless steel plate (32 (: 1^32 (: 1 >< thick 5_), [B As a cushioning material, the newspaper 1 sheet (30cmx30cm), [C] aluminum sheet (3〇cmx3〇cmx thick 〇·imm), [E] 4 sheets of aluminum plate with 5mm through holes of 1mm0 (75mmx75mmx thickness 1mm), [ D3] The above sample 4 is grazing, and overlaps in the order of [A]/[B]/[C]/[E]/[D3]/[C]/[B]/[A] [E] The aluminum plate having the through hole of 1_0 at [C] on the aluminum plate is arranged so as not to overlap, and the [D 3 ] sample is placed on the aluminum plate having the through hole [E] One animal and one land overlap each other.) Secondly, in the ambient gas at a temperature of 170 ° C, no pressure (only stainless 312XP / invention manual (supplement) / 95-09/95116834 26 1294351 = special weight 1) After 5 minutes, the ambient pressure at the temperature of 17 generations: 2 chest pressure 2 sec seconds, heating and adding After the treatment, the mixture was cooled to room temperature with m, m, and m, and the sample was taken out. Each of the through holes of the nameplate with the through holes (the total length of the sample of 2G totals was calculated, and the average value was calculated to obtain the buffer. [Separation film] / The laminate of the present invention, since the surface layer (A) contains a 4-methyl-I-pentene polymer, it is excellent in heat resistance and release property, and can be used as a release film. Specifically, for example, a release film for producing a flexible printed circuit board, a release film for ACM materials used in aeronautical machine parts, and a semiconductor printed circuit board for a hard printed circuit board, such as a 3L epoxy or a phenol system. For the release film, the release film for forming, the release film for the rubber sheet for sheeting, and the special adhesive tape, the circuit-formed substrate and the cover layer are sandwiched by a thermosetting adhesive. In the case of heating and pressurizing the metal plate, in order to avoid the situation in which the coating layer and the metal plate are in contact with each other during heating and pressurization, a release film for FPC production which is used as a sandwich between them can be suitably used. Laminated body due to surface layer (A) containing 4-methyl -Bupentene is a kind of t & 脰, so it is excellent in heat resistance and release property. Moreover, when the buffer layer (C) is heated and pressurized in the manufacture of pc, it has excellent flexibility, so it will follow the circuit. The shape of the surface of the substrate is well deformed, and the outflow of the adhesive between the substrate surface on which the circuit is formed and the cover layer can be prevented. Further, the specific adhesive layer (B) and the heat resistant resin (cl) and the soft resin ( The buffer layer (C) of the specific composition of c2) is less excessively heated and pressurized, and is not caused by the invention (supplement)/95-09/95116834 27 1294351, because the buffer layer (6) adheres to the formation. The problem of the yield reduction of the FPC product and the operation of the FPC product caused by the circuit board or the metal plate for heating and adding the 'furrow' is easy to make the surface roughness due to the extrusion of the material by the τ_mold. A wide film with good thickness and precision is suitable for use as a release film for FPC manufacturing. (Embodiment) Hereinafter, the present invention will be described more specifically by way of examples, but the present invention is not limited thereto. The evaluation methods of the physical properties in the examples and comparative examples are as follows. U) Melt flow rate (MFR1) Measured according to ASTM D1238 with a load of 2.16 kg and a temperature of 23 (rc). (2) Melt flow rate (mfr2) According to ASTM D1238, load: 5 kg, temperature: 260° The conditions of C were measured. ' (3) Melting point (Tm) ^ Using a differential scanning calorimeter (manufactured by DSCXPerkinElmer, PYRIS-1 type), 5 mg of the sample was heated under a nitrogen atmosphere of 28 (rc heating 5 • knife knowing ' After smelting, it was cooled to room temperature at a cooling rate of 2 〇.〇/min, crystallization was allowed, and it was kept at room temperature for 10 minutes, and then heated at a heating rate of 1{rc/min'. The endothermic curve of the sample indicates the melting point at its peak temperature. (4) The strength before the heating and pressure treatment is performed using three 5-layer T-die devices, and the set temperature of the extruder and the τ-312XP/inventive specification ( Replenishment) / 95-09/95116834 28 10 1294351 The set temperature of the mold is set to 29 (TC, manufactured by co-extrusion from the surface layer (A) / subsequent layer (BV buffer layer (〇 / adhesion layer (B) / surface Layer (a width of 400 mm formed by 5 ^ 〇. ' Second, according to JIS K6854, cut from the layer A sample having a length of 150 mm and a width of i5 mm is slightly peeled off from the one end side of the sample, and the surface layer (A) on one side is peeled off, and the surface layer (A) which is peeled off and the layered body other than the peeled surface layer (A) are laminated. The remaining part was clamped by a clamp, and the surface layer was measured by a temperature Μ, . . . peeling angle of 18 、, peeling speed of 300 with / minute, peeling width " degree 15 mm punching condition, T-type peeling test a) the bonding strength between the buffer layer (匸), and the third layer of the surface layer (A)/buffer layer (C)/surface layer (A) in Comparative Example 6 and Comparative Example 7 The laminated body thus formed was evaluated in the same manner as in the case of the laminated body of five layers. 9. (5) Adhesive strength after heating and pressure treatment [heating and pressurization treatment] Three kinds of five-layer T-die devices were used. The set temperature of the extruder and the set temperature of the τ--mold are set to 290 ° C, and the surface layer (A) / - the subsequent layer (B) / the buffer layer (C) / the subsequent layer are manufactured by co-extrusion ( B) / The width of 4 layers of the surface layer (A) is 4 mm thick, and the thickness of the laminate is 2 〇 cm, x 30 cm in any direction. Sample [D1]., -People's [A] stainless steel plate (32cmx32cmx thickness 5mm), [B] as a cushioning material newspaper 10 sheets (3〇cmx30cm), [C] aluminum plate (30cmx30cmx thickness 0.1mm), [ D1] The above sample 4 is grazing, and is superimposed in the order of U]/[b]/[c]/[d1]/[c]/[b]/[a] at the temperature ι8〇29 312XP/ (Supply) / 95 · _5 ι 聪 4 1294351 °c of the ambient gas, pressurization plus 5 minutes at a pressure of 5 MPa, and heating and pressure treatment. After the connection, 丨v, the pressure is maintained at a pressure of 5 MPa, and after cooling to room temperature at 3 minutes, the sample is taken out. [Measurement of Strength Next] 'The end portion lem of the sample obtained by heating and pressurizing treatment was removed, and a sample having a length of l50 mm and a width of 15 coffee was cut out in any direction, and the bonding strength before the above (4) twisting and pressurization treatment was performed. The measurement was carried out in the same manner, and the adhesion between the surface layer (4) and the buffer layer (6) was measured. 7: The amount of excess from the ° boxing (6) & The setting of the extruder was carried out using three 5-layer T-die devices. Temperature and τ, the set temperature is set to 29〇t:, by coextrusion manufacturing by surface layer (1) / subsequent layer (β) / buffer layer (C) / subsequent layer (B) / surface layer (A) The five layers are formed with a width of 400 and a sample which is cut out from any position. A total of 4 grazing samples [D2] were obtained in the same manner. Next, [A] stainless steel plate (32cmx32cmx thickness 5mm), [B] as a cushioning material newspaper 10 sheets (30cmx30cm), [c] nameplate (10) cmx3〇cmx thick climbing. 1 coffee), [D2] above sample 4 animal husbandry , overlapping by the order of the next. Here, the [D2] sample 4 on the [C] aluminum plate was superimposed and arranged in a non-overlapping manner, and then subjected to pressure at a pressure of 8 MPa for 10 minutes in an ambient gas at a temperature of 8 8 rc. After the heating and pressure treatment, the pressure was maintained at a pressure of 5 MPa. The mixture was cooled to room temperature in 3 minutes and the sample was taken out. The excess amount is determined from the surface layer of the removed 4 samples (the length of the buffer layer (C) beyond the end of the crucible, and the maximum value thereof is used as the excess amount. 312XP/Inventive Manual (Supplement)/95-09/ 95116834 30

1294351 (The amount of buffer is three layers of Τ-die device, and the set temperature of the extruder and the set temperature of the τ-die are set to 290 ° C, and the surface layer (Α)/ subsequent layer is produced by co-extrusion ( Β) / buffer layer (C) / adhesion layer (Β) / surface layer (a) of the five layers of the formation of a width of 400mm laminate, and cut from any position 1〇cmxl〇cm sample. A total of 4 grazing samples [D3] were obtained. Next, [A] stainless steel plate (32 cm x 32 cm x 5 mm thick), [B] was used as a slow-cut sheet (30 cm x 30 cm), [C] aluminum plate (30 cm x 30 cm x thick 〇 〇 1 mm ), [E] 4 pieces of aluminum plate with 5 to 1 through holes of 1_0 (75_χ 75mm X thickness 1mm), [D3] above sample 4, by U]/[B]/[C]/[E]/ The order of [D3]/[C]/[B]/[A] overlaps. Here, the [E] has an aluminum plate with 1 through-holes of 5 holes on the [C] aluminum plate, respectively Arranged in an overlapping manner, and in [E] aluminum plate with through-holes, '[D 3 ] sample 4 grazing, grazing, grazing, and grazing. Second, at temperature 17 (TC ambient gas, no pressure (only There is a weight of stainless steel, etc.) and after preheating for 5 minutes, at a temperature of 17 (rC2 ambient gas _ body After pressurizing at a pressure of 5 MPa for 20 seconds, after heating and pressurizing treatment, the pressure was maintained at a pressure of 5 MPa, and the sample was taken out by cooling to room temperature for 3 minutes. The buffer amount was measured in each through hole of the aluminum plate having the through hole. (Total 2 〇-pieces) The maximum length of the sample to be dropped, and the average value is taken as the buffer amount. (8) The surface roughness is measured in a sample having a thickness of 100 cm/m cut to a thickness of 100 cm/cm. 5cm in any direction as the reference length, in accordance with the method of JIS B0601, for the surface layer of the outermost layer of the laminated body, 312XP / invention manual (supplement) / 95-09/95116834 31 1294351 Surface roughness Ry [Example 1] <Surface layer (A)> Using 4-mercapto- 1-pentene copolymer [1-decene content: 6 mass

• %' melting point · · 228 ° C, MFR 2 · · 26 g / 10 min, density · · 835 kg / m3 (ASTM D1505)]. <Next layer (B)&gt; (b1) —a ·· 4-mercapto-1-pentene-based copolymer [1-ceene content: 3% by mass, MFR2 ··5g/l〇 minutes] 35 quality%. (b2-1) Ethylene-butene random copolymer [EBR, butene-containing ® : 15% by mass, MFR1: 7 g/l 〇 minute] 15% by mass. (b2-2) 1-butene/ethylene random copolymer [PB-1, ethylene content: W mass %, MFR1 : 〇·4g/l 〇 minute] 5 〇 mass %.肆[methylene-3-(3,5-di-t-butyl-4) is further added to 100 parts by mass of the above-mentioned (bl)-a, (b2-1) and (b2-2). -Hydroxyphenyl) propyl hydrazine 曰 甲 甲 ( ( ( Chi Chi Chi Chi Chi Chi Chi Chi Chi Chi Chi Chi 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 The product name is calcium stearate) 〇· 〇 3 parts by mass as a stabilizer, and the •= Hanschel mixer is dry blended. Next, the obtained mixture was melt-kneaded by a twin-screw extruder having a 'f of 28 Å, which was a must-have, and a resin composition was prepared. <Cushion layer (C) &gt; (cl)-a: As a heat-resistant resin having a melting point of 19 or more, a 4-methylpentene-based copolymer having the same surface layer (A) is used in an amount of 2% by mass. 312XP/ Invention specification (supplement) / 95-09/95116834 32 1294351 , (10)-a: as a soft resin with a point of 17 〇μ, using a low density of 4 ethylene [melting point: 11 (TC, MFRi: 2 〇) g/1 minute, density: 920 kg/m3 (ASTM D1 505)] 80% by mass. Next, the above (cl)-a and (c2)-a were subjected to dry blending using a Hanschel mixer. Manufacture of the body>, four use the extrusion 胄 with three kinds of 5-layer T-die, set the degree of the extruder and the set temperature of the T-cooker to 290 °C, by co-extrusion manufacturing The face punch layer (A) / the subsequent layer (b) / the buffer layer (c) / the layer of the layer (A) of the layer of the layer of the layer of the layer of the surface layer (A) The evaluation results of the respective physical property values are shown in Table 1. In addition, the single layer film of the adhesive layer was opened to open y using only the extruder of the adhesive layer (B), and the load of the obtained film was measured to be 2·16 kg, and the temperature was measured. Melt flow rate, and The MFR1 of the adhesive layer (...) was similarly used. The single layer film of the buffer layer (c) was formed by extrusion using only the buffer layer (c), and the load of the obtained film was measured to be 2·16 kg and the temperature was 23 (rc). The melt flow rate was measured, and the buffer layer (MFR1 of 〇 was measured. The results are shown in Table pi. • [Example 2] <Surface layer (A)> The same 4-mercapto-1 as in Example 1 was used. - pentene-based copolymer. _ <Next layer (B)&gt; The composition of the conjugated tree with the implementer is used. <Buffer layer (C)&gt; (cl)-a · As:): For a heat-resistant resin having a temperature of 19 〇〇c or more, the same 4-methyl-1-pentene copolymer as in Example 1 of the invention (Supplement) / 95·〇9/95! 16834 1294351 (c2)-a - As a soft resin having a melting point of 170 ° C or less, 70% by mass of the low-density polyethylene similar to that of Example 1 is used. /', • Next, the above (cl) a and (c2)—a uses a Hanschel mixer • Dry blending. <Manufacturing of laminated body> Using three 5-layer T-die devices, the set temperature of the extruder and the set temperature of the mold are set to 290. ,borrow Broadcasting and manufacturing a wide-weight laminated body composed of five layers of the surface layer (A), the back layer (Β)/the buffer layer (C)/the back layer (8)/the surface layer (1). The thickness of the obtained laminate is (4) The evaluation results of the physical property values and the respective physical property values are shown in Table 1-1. In the same manner as in Example 1, the single layer films of the adhesive layer (8) and the buffer layer (6) were each molded, and MFR1 was measured. The results are shown in the table. [Example 3] <Surface layer (A)&gt; The same 4_mercapto-p-pentene-based copolymer as in Example 1 was used. _ &lt;Next layer (B)&gt;&quot; The same adhesive resin composition as in Example 1 was used. <Resin composition of buffer layer (C)>~(cl)_a: As a heat-resistant resin having a melting point of 19 (TC or more, fish, the same 4-methyl-1-pentene copolymer of the same example 1 was used. 40% by mass, and (c2)-am, the soft resin of 17 or less generations, the same low density polyethylene as in Example 1 was used in an amount of 6% by mass. The same as the above-mentioned (cl)-a and (.2) ) a a Hansler mixer for 34 312XP / hair invented the book (supplement) / 95-09/95116834

1294351 Dry sowing. <Manufacturing of laminated body> Using three kinds of five-layer T-die devices, the set temperature of the extruder and the set temperature of the Τ-mold were set to 290C'. By co-extrusion, the surface layer (a) / the subsequent layer (B) / 400 layers of a buffer layer (C) / 5 layers of the layer (B) / surface layer (A). The thickness constitution of the obtained laminate and the evaluation results of the respective physical properties are shown in Table 1-1. Further, in the same manner as in the first embodiment, the single layer films of the adhesive layer (B) and the buffer layer (c) were separately molded, and MFR1 was measured. The results are shown in Table i. [Example 4] <Surface layer (A)&gt; The same 4-mercapto-1-pentene copolymer was used as in Example 1. <Adhesion layer (B)&gt; The same adhesive resin composition as in Example 1 was used. <Cushion layer (C)&gt; (cl)-b · As a heat-resistant resin having a melting point of 19 〇 ° or more, it is made of polyfluorene-amine 6 [Mitsubishi Engineering Plastics Co., Ltd., trade name "N〇vamidl020C", melting • Point: 218 ° C, MFR 2 : 35 g / 10 min] 20 mass 〇 / 〇. (c2) - a : As a soft resin having a melting point of 170 ° C or less, 60% by mass of the same low-density polyethylene as in Example 1 was used. ~ (c2)-b : using maleic acid modified low density polyethylene [hepatic acid content (modified rate) 〇 · 2% by weight, melting point: l〇9 ° C, MFR1 : 2 · 6g/10 minutes, density: 920kg/m3 (ASTM D1505)] 20 mass 0/〇. Next, the above (cl)-b, (c2)-a and (c2)-b were dry blended using Hanschel Blend 312XP/Inventive Manual (Supplement)/95-09/95116834 35 1294351. <Manufacturing of laminated body> Using three kinds of five-layer T-die devices, the set temperature of the extruder and the set temperature of the τ-mold were set to 290 °C, and the surface layer (A)/layer was produced by co-extrusion. (B) / Buffer layer (C) / Adhesion layer (B) / Surface layer (A) 5 layers of a wide 400mm laminate. The thickness constitution of the obtained laminate and the evaluation results of the respective physical properties are shown in Table 1-1. Further, in the same manner as in Example 1, the single-layer film of the adhesive layer (B) and the buffer layer (C) was separately molded, and MFR1 was measured. The results are shown in Table 1-1. [Example 5] <Surface layer (A)&gt; The same 4-mercapto-1-pentene copolymer was used as in Example 1. <Adhesion layer (B)&gt; The same adhesive resin composition as in Example 1 was used. <buffer layer (C)&gt;

(cl)-c : As a heat-resistant resin having a melting point of 19 (rc or more, polyamine 6 [Mitsubishi Engineering Plastics Co., Ltd., trade name rN〇vamidl〇ucH5", Hyun: 219 C, MFR2: 170 g/ 10 minutes] 2% by mass. (c2)-a - As a soft resin having a melting point of 170 ° C or less, 60% by mass of the low-density polyethylene similar to that of Example 1 was used. Belle (c2)-b: using cis-butyl The enedionic acid is changed to f polyethylene [the yield of the cis- enedenedioic acid (modification rate) 0.2% by weight, the melting point: 1〇9. 〇, MFR1: 2 6g/i 〇 followed by the above (Cl)-C, ( C2)-a and (C2)-b use Hanscher Mix 36 312XP/Inventive Manual (Supplement)/95-09/95116834 10 1294351 for dry blending. <Manufacture of laminated body> Use 3 kinds of 5 The layer T-mold device sets the set temperature of the extruder and the set temperature of the T-~mold to 290 ° C, and is manufactured by co-extrusion from the surface layer (Α) / • the subsequent layer (B) / buffer layer (〇 / The layer 400-layer of the layer of the layer (B) / the surface layer (A) is formed. The thickness of the obtained layered body and the evaluation results of the physical properties are shown in Table 1 - J. Embodiment 1 is similarly The single-layer film of the layer (B) and the buffer layer (C) was separately molded, and MFRi was measured. The results are shown in Table 14. [Example 6] <Surface layer (A)> The same as Example 1 was used. Methyl-1 monopentene copolymer. <Back layer (B)&gt; The same adhesive resin composition as in Example 1 was used. <Buffer layer (C)> (cl)-a: As melting point 19 ( The heat-resistant resin of rc or more is used in an amount of 3% by mass of the 4-methyl-pentene-based copolymer which is the same as in Example 1. (Heart: soft ash as a melting point (10) or less. Alkene random copolymer [丨-butene content: 25 mass% 110 ° C, MFR1 ··6·Og/10 min] 70 mass%. ” · Next, the above (cl)_a, (c2)-c Use, BA ra dry blending. ❹ _ _ mixer to manufacture <layered body> Using three kinds of five-layer T-mold device, the set temperature of the extrusion and 312XP / invention manual (supplement) / 95-09/95116834 37

1294351 The setting temperature of the mold is set to 29 (rc, manufactured by co-extrusion from the surface layer (A) / the subsequent layer (B) / the buffer layer (C) / the subsequent layer (B) / the surface layer (4) The thickness of the laminate of the above-mentioned laminate is shown in Table 1 to 2. The thickness of the obtained laminate and the evaluation results of the respective properties are shown in Table 1 - 2. In addition, in the same manner as in the first embodiment, the adhesive layer (B) and The single layer film of the buffer layer (C) was separately molded, and MFRi was measured. The results are shown in Table 1-2. [Example 7], <Surface layer (A)> _ The same thiol group as in Example 1 was used - 1-Pentylene-based copolymer. <Adhesion layer (B)&gt; The same adhesive resin composition as in Example 1 was used. <Buffer layer (C)> (cl)-a · As a melting point of 190 ° C or higher The heat resistant resin was used in an amount of 5% by mass of the 4-mercapto-1 -pentene copolymer in the same manner as in Example 1. (c2)-d: a soft resin having a melting point of n〇 ° C or less, and a propylene homopolymer was used. [Melting point: 16 (TC, MFR1: 2.0 g/l 〇 minute) 85 mass%. • Next, the above (cl)-a, (c2)-d was subjected to dry blending using a Hanschel mixer. Manufacture of laminates Three kinds of 5-layer T-die devices, the set temperature of the extruder and the set temperature of the die-die are set to 290 ° C, and the surface layer (A) / the subsequent layer (B) / buffer layer are manufactured by co-extrusion. (a 400 mm wide layered product composed of five layers of 〇/sublayer (B)/surface layer (A). The thickness of the obtained laminate and the evaluation results of the physical property values are shown in Table 1-2. 312XP/fat In the same manner as in the first embodiment, a single layer film of the underlayer layer and the buffer layer (c) was molded, and MFR1 was measured. The results are shown in Table 1. - [Example 8] "<Surface layer (A)&gt; The same 4-methyl-1-pentene-based copolymer as in Example 1 was used. <Next layer (B)> Use and Example 1 The same (b)_a, α2_η, and (b2_2) were used as the following resin composition. 9 (bl)-a· 4 methyl-1-pentane-based copolymer 2% by mass. (b2 -l): ethylene/1-butene random copolymer 3 〇 mass%. (b2-2) : 1-butene-ethylene random copolymer 5 enamel 缓冲 <buffer layer (C) &gt; ' Example 2 Similarly, setting (ci)-a to 3 〇% by mass, (c2)-a was 70% by mass, and dry blending was carried out using a Hanschel mixer. <Manufacturing of laminated body> Using three kinds of five-layer T-die devices, the set temperature of the extruder and Τ1•Mold set temperature is set to 290X:, by coextrusion manufacturing by surface layer (A) / «connector layer (B) / buffer layer (C) / connector layer (B) / surface layer (a A wide 400mm laminate made up of 5 layers. The thickness constitution of the obtained laminate and the evaluation results of the respective properties and properties are shown in Table 1-2. Further, in the same manner as in the first embodiment, the single layer films of the adhesive layer (B) and the buffer layer (c) were separately molded to measure MFR1. The results are shown in Table 1__2. [Example 9] <Surface layer (A)&gt; 312XP/Inventive specification (supplement)/95_〇9/95116834 39 1294351 The same 4-meridyl group as the example <adhesion layer (B) &gt; A pentoene-based copolymer. (b2 to 1) and (b2-2), using the same composition ratio as the following (bl)-a in the same manner as in Example 1, the content of the terpene resin composition (bl)-a : 4-mercapto-1 - pentene-based copolymer mass%, MFR2 ··5 g/10 min] 50% by mass. (b2-l)···········································································

(b2-2): a butene/ethylene random copolymer [suppressed, ethylene content: 10% by mass, MFR1 ··0.4g/10 minutes] 4 〇 mass 0/〇. <Cushion layer (C) &gt; ' In the same manner as in Example 2, (c〇-a was set to 3 〇 mass%, and (c2) - a was set to 70 mass%, and dry blending was performed using a Hanschel mixer. <Manufacturing of laminated body> Using three kinds of five-layer T-die devices', the set temperature of the extruder and the set temperature of the τ-die are set to 290 °C, and the surface layer (a)/ a wide layer of 50 layers formed of five layers of layer (B) / buffer layer (C) / adhesion layer (B) / surface layer (A). The thickness of the resulting laminate is composed of various physical properties. The evaluation results are shown in Table 1-2. Further, in the same manner as in Example 1, the single layer films of the adhesive layer (B) and the buffer layer (c) were each molded, and MFR1 was measured. The results are shown in Table 1-2. Example 10] <Surface layer (A)&gt; The same 4-mercapto-1-pentene copolymer was used as in Example 1. 40 312XP/Invention specification (supplement)/95-09/95116834 1294351 Next, the layer (B) &gt; used the same adhesive resin composition as in Example 1. <Buffer layer (C)> - The same (cl)-b, (c2)-a and (C2) as in Example 4 )-b, the same as in the fourth embodiment The composition ratio was dry blended using a Hanschel mixer. 0 <layer (D)> 'The same (cl)-b polyamide 6 was used as in Example 4 [Mitsubishi Engineering_Plastic (stock) system, commodity "N〇vamidl〇2〇C", melting point: 218 ° C, MFR 2 : 35 g / l 〇 min]. <Manufacture of laminates> Using four 4-layer T-die devices, the set temperature of the extruder and τ—The set temperature of the mold is set to 290 ° C, and the width of the surface layer (Α) / the subsequent layer (Β) / the buffer layer (C) / layer (D) is 4 by the co-extrusion. The thickness of the obtained laminate and the evaluation results of the physical property values are not in Table 1-2. • In the same manner as in the first embodiment, the adhesive layer (B), the buffer layer (C), and the layer are provided. • The single layer film of (D) was separately molded and measured by mfri. The results are shown in Table 1-2. [Example 11] The surface of the laminate obtained in Example 2 was heated at a temperature of 130 ° C. b is subjected to compression treatment to obtain a laminate having a surface roughness Ry of 1 μm. The subsequent strength before the heating and pressure treatment of the obtained laminate is 5·2 N/15 mm, and after heating and pressurization The intensity is 2. 3N/15mm, the excess is 2mm, and the buffer amount is 600 /zm. 312XP/Inventive Manual (Supplement)/95·〇9/95丨丨6834 41 1294351 [Comparative Example 1] <surface layer (A) &gt; The same layer as the first embodiment (the following layer (B) &gt;&quot; pentene copolymer was used. The same adhesive resin composition as in Example 1 was used. <Buffer layer (c)&gt; w 2) The heat-resistant resin having a melting point of 19 rc or more, 7 g mass % of the base + pentene copolymer which is the same as & (c2)-a: As a soft resin having a melting point of 17 or less, 30% by mass of the low-density polyethylene similar to that of Example 1 was used. Next, the above (cl)-a and (c2)_a were dry-fitted using a Hanschel mixer. <Manufacturing of laminated body> Using three kinds of five-layer T-die devices, the set temperature of the extruder and the set temperature of the τ_mold were set to 29 (rc, manufactured by co-extrusion from the surface layer (α) / subsequent layer ( Β) / buffer layer (C) / layer (Β) / surface layer (4) of the five layers of the width of the 400mm layered body. The thickness of the resulting layered structure and the evaluation of the physical properties are shown in Further, in the same manner as in Example 1, the single-layer films of the adhesive layer (B) and the buffer layer (C) were each molded, and MFR1 was measured. The results are shown in Table 2-1. Example 2] <Surface layer (A)&gt; The same 4-methyl-1-pentene-based copolymer as in Example 1 was used. <Next layer (B)> 312XP/Inventive specification (supplement y95-09 /95116834 42 1294351 The same adhesive resin composition as in Example 1 was used. <Buffer layer (c)> (cU-a: as a melting point 19 (heat resistant resin of rc or higher, used and &quot;Example 1 60% by mass of the same 4-methyl-1-pentene copolymer. -, (c2)_a: 40% by mass of the low-density polyethylene similar to that of Example 1 was used as the soft resin having a melting point not or less.Next, the above (cl)-a and (c2)_a are blended using a Hanschel mixer _ dry. Manufacture of the laminated body. Using three kinds of five-layer T-die devices, the set temperature of the extruder and τ—The set temperature of the mold is set to 290 〇C, and the surface layer (A) / the subsequent layer (B) / the buffer layer (C) / the subsequent layer (B) / the surface layer (5 layers of the surface layer) are manufactured by co-extrusion. The thickness of the laminate having a width of 400 mm is shown in Table 2-1. The thickness of the obtained laminate and the evaluation results of the physical properties are shown in Table 2-1. Further, in the same manner as in the first embodiment, the adhesive layer (B) and the buffer layer (c) are used. The monolayer film was separately molded and the MFR1 was measured. The results are shown in Table 2d. Spring [Comparative Example 3] < Surface layer (A)&gt; The same 4-mercapto-1-pentene system as in Example 1 was used. The following is the same as the adhesive resin composition of the first embodiment. <Buffer layer (C)> (cl)-a: a heat-resistant resin having a melting point of 190 ° C or higher, The same 4-mercapto-1-pentene copolymer was used in the same manner as in Example 1. 5 〇/〇. 312χΡ/发发明说明(补件)/95-09/95116834 43 1294351 (c2)-a Point below 170 ° C For the soft resin, the same low-density polyethylene as in Example 1 was used at 95% by mass. Next, the above (cl)-a and (c2)-a were dry blended using a Hanschel mixer. Manufacture > Using three kinds of 5-layer Τ-die devices, the set temperature of the extruder and the set temperature of the Dingyi mold are set to 290 ° C, and the surface layer (Α) 接着 • the subsequent layer (B) is produced by co-extrusion. / / buffer layer (C) / layer (B) / surface layer (A) of the five layers of the structure of the width of 400mm layered body. The thickness constitution of the obtained laminate and the evaluation results of the respective physical properties are shown in Table 2-1. Further, in the same manner as in Example 1, the single layer films of the adhesive layer (B) and the buffer layer (c) were separately molded, and MFR1 was measured. The results are shown in Table π. [Comparative Example 4] <Surface layer (A)&gt; The same 4-mercapto-1-pentene copolymer was used as in Example 1. <Adhesion layer (B)&gt; Φ The same adhesive resin composition as in Example 1 was used. <Buffer layer (〇> (c2) - a · As a soft resin having a melting point of 170 ° C or less, only the same low-density polyethylene as in Example 1 is used. <Manufacture of laminated body> Three types of 5 are used. Layer T-die device, set the temperature of the extruder and the set temperature of the τ-mold to 290 ° C, and manufacture by surface extrusion (a) / connector layer (B) / buffer layer (C) /layer layer (B) / surface layer (a) 5 layer structure 312XP / invention description (supplement) / 95-09/95116834 44 1294351 into a width of 40 〇 mm laminate. The resulting laminate The evaluation results of the thickness configuration and the physical property values are shown in Table 2-1. In the same manner as in Example 1, the single layer films of the adhesive layer (... and the buffer layer (c) were separately molded, and MFR1 was measured. In Table 2-1. ''[Comparative Example 5] <Surface layer (A)&gt; The same 4-mercapto-1-pentene-based copolymer as in Example 1 was used. <Sublayer (B)&gt; Φ (Μ) · As the resin of the adhesive layer (B), ethylene/propylene rubber is used [MFR · 2g/l〇 minutes (Mitsui Chemical Co., Ltd., trade name "Mitsui Ερτ 4021"). ) &gt; (c2)-a : as For the soft resin having a melting point of 170 〇, only the same low-density polyethylene as in Example 1 was used. <Manufacture of laminate> Three sets of 5-layer T-die devices were used to set the temperature of the extruder and the mold The set temperature was set to 290 ° C, and the five layers of the surface layer (A) / • the subsequent layer (B) / the buffer layer (C) / the subsequent layer (B) / the surface layer (A) were fabricated by co-extrusion. The width of the laminate is 400. The thickness of the obtained laminate and the evaluation results of the properties are shown in Table 2-1. - In the same manner as in the first embodiment, the adhesive layer (B) and The single layer film of the buffer layer (C) was separately molded, and MFR1 was measured. The results are shown in Table 2-1. [Comparative Example 6] <Surface layer (A)&gt; 312XP/Inventive specification (supplement)/95-09 /95116834 45 1294351 The same 4-mercapto-1 -pentane-based copolymer as in Example 1 was used. <Sublayer (B)&gt; The adhesive layer (B) was not used. <Buffer layer (C)&gt; In the same manner as in Example 2, 'cl)-a was 30% by mass, and (c2) - a was 70% by mass, and dry blending was carried out using a Hanschel mixer. <Manufacture of laminated body> _ Use 3 types of 5 layers The T-plate device 'sets the set temperature of the extruder and the set temperature of the τ__mold to 290X: by surface extrusion 1 (A) / buffer layer (C) / surface layer (A) The thickness of the multilayer structure of the three layers was set as follows. The thickness of the obtained laminated body and the evaluation results of the physical property values are shown in Table 2-1. Further, in the same manner as in Example 1, the single layer film of the adhesive layer ("and the buffer layer (c) was separately molded, and MFR1 was measured. The results are shown in Table 2-1. [Comparative Example 7] <Surface layer (A)&gt;

The same 4-mercapto-l-pentanose <adhesion layer (B) &gt; ^ copolymer was used as in Example 1. The subsequent layer (B) is not used. <Buffer layer (C)&gt; (cl)-a: As melting point 190. . The above heat-resistant resin was subjected to the same method as the 4-methyl + pentane copolymer 3 〇 mass (added as a solvent, point 170. The following enamel resin, the same low density of the same as in Example 1 Ethylene 50% by mass. /, Μ 312 ΧΡ / issued invention specification (supplement) / 9 said 951! View 46 1294351 (c2)-e: using a random copolymer of propylene [melting point: 138. [, MFRi: 7.〇 g/10 minutes (Mitsui Chemical Co., Ltd., trade name "Mitsui p〇lypr〇F327")] 20% by mass. Next, the above (cl)-a, (c2)-a and (c2)-e Dry blending using a Hanschel mixer. <Manufacturing of laminated body> Using three 5-layer T-die devices, the set temperature of the extruder and the set temperature of the τ-die are set to 290 °C. A wide 4 mm thick laminate composed of three layers of the surface layer (A) / the buffer layer (C) / the surface layer (A) is produced by co-extrusion. The thickness of the obtained laminate is composed and the physical properties are obtained. The evaluation results are shown in Table 2-1. Further, in the same manner as in Example 1, the single layer films of the underlayer layer and the buffer layer (C) were separately molded, and MFR1 was measured. The results are shown in the table. [Comparative Example 8] <Surface layer (A)&gt; A 4-methyl-1-pentene copolymer was used in the same manner as in Example _ &lt;Layer layer (B)&gt;. Using the same (10)-a, (bM), and (b2_2) as in Example 1, the following composition ratio of the adhesive resin composition was used. (bl)-a : 4-mercapto-1-pentene copolymer of 1% by mass. (b2-l): ethylene/b-butene random copolymer 4% by mass. (b2-2): Butene/ethylene random copolymer 5 〇 <Buffer layer (C)> ' In the same manner as in Example 2, (cl)_a was set to 30% by mass (.2)-a 312XP / Inventive Manual (Supplement) / 95-09/95116834 47 1294351 Set to 70% by mass, dry blending using a Hanschel mixer. <Manufacturing of laminated body> Using three kinds of five-layer T-die devices, the set temperature of the extruder and the set temperature of the mold are set to 290 ° C, and the surface is manufactured by extrusion ( ) / / layer (B) / Buffer layer (C) / Adhesion layer (B) / Surface layer (A) 5 ^ wide 400mm laminate. The thickness constitution of the obtained laminate and the evaluation results of the respective physical properties are shown in Table 2-1. Further, in the same manner as in Example 1, the single layer films of the adhesive layer (B) and the buffer layer (c) were each molded, and MFR1 was measured. The results are shown in Table 24. [Comparative Example 9] <Surface layer (A)&gt; The same 4-methyl-1-pentene copolymer was used as in Example 1. <Adhesive layer (B)&gt; The same adhesive composition as the following composition ratio was used in the same manner as in Example 1 (b〇-a, α2_υ, (b2_2). (bl)-a : 4-methyl-1 - pentene-based copolymer 2% by mass. • (b2 - 丨): ethylene-b-butene random copolymer 5 〇 mass 〇 / 〇. (b2 - 2) · · Butene - ethylene random copolymerization In the same manner as in the second embodiment, (cl)-a is set to 3% by mass, and (c2)-a is set to 70% by mass. Dry blending by the Michelle mixer. <Manufacturing of laminated body> / Using three kinds of 5-layer Τ-die devices, the set temperature of the extruder and the set temperature of τ_ mold are set to 29 (rc, manufactured by co-extrusion) From the surface layer (α) / 312 ΧΡ / issued invention instructions (supplement) / 95-09/95116834 48 1294351 then layer (B) / buffer layer (C) / layer (B) / surface layer (magic 5 layer The thickness of the laminated body is 40 mm. The thickness of the obtained laminated body and the evaluation results of the respective physical properties are shown in Table 2-1. In the same manner as in the first embodiment, the adhesive layer (B) and the buffer layer are provided. (C) single layer film Molding was carried out, and MFR1 was measured. The results are shown in Table 2-2. [Comparative Example 10] <Surface layer (A)&gt; The same 4-mercapto-1-pentene copolymer was used as in Example 1. <Adhesive layer (B)&gt; The same (b)-a: 4 was used as in the case of (b1)-a, (b2 - υ, (b2 - 2), and the following composition ratio was used. - mercapto-1-pentene copolymer 4 〇% by mass. (b2-1) ······························ In the same manner as in the second embodiment, (ci) - a is set to 3 % by mass, and (c2) - a # is set to 70% by mass. Dry mixing by the Michelle mixer. <Manufacturing of laminated body> • Using three 5-layer T-die devices, the set temperature of the extruder and the set temperature of the τ-die are set to 290 ° C. A 400 mm wide laminate consisting of 5 layers of surface layer (a) / .sublayer layer (B) / buffer layer (C) / adhesion layer (B) / surface layer (A) is produced. The thickness of the resulting laminate is obtained. The evaluation results of the composition and the physical property values are shown in Table 2-2. Single the same manner as in Example, the adhesive layer 1 (B) and the buffer layer (c) of the Embodiment

312XP/Inventive Manual (Supplement)/95-09/95116834 49 1294351 The film was separately formed and the MFR1 was measured. The results are shown in Table 2_2. [Comparative Example 11] <surface layer (A)&gt;; The same 4-methyl+pentene copolymer as in Example 1 was used. 1 <Adhesion layer (B)&gt; The same composition ratio of the following composition (b)_a, α2_υ, (b2_2) was used, and the following composition ratio was used. - (bl) One a : 4 - fluorenyl - 1 - pentene copolymer 6 〇 mass %. (b2-D: ethylene-b-butene random copolymer 5 mass%. (b2-2): 1-butene/ethylene random copolymer 35 <buffer layer (〇&gt; ' Same as Example 2 Ground, (ci)-a is set to 3〇% by mass, and (c2)-a is set to 70% by mass%. 'The Hansler mixer is used for dry blending. <Layer manufacturing> Three types of 5 layers are used. T-die device, set the extruder set temperature and τ-mold set temperature to 290 ° C, by co-extrusion manufacturing from surface layer (a) / • adhesion layer (B) / buffer layer (C) / Next, a layered body having a width of 400 mm composed of five layers of the layer (B)/surface layer (A) is shown in Table 2-2, and the results of evaluation of the thickness of the obtained layered product and the respective physical property values are shown in Table 2-2. In the same manner, the single layer films of the adhesive layer (B) and the buffer layer (c) were separately molded, and MFR1 was measured. The results are shown in Table 2-2. [Comparative Example 12] <Surface layer (A)> Use The same 4-mercapto-1 -pentene-based copolymer as in Example 1. 50 312XP/Inventive Specification (Supplement)/95-09/95116834 1294351 <Bottom Layer (B)> Use the same as Example 1. (bl)-a, α2-1), (b2_ 2) The following composition ratio is used as the adhesive resin composition. (bl)-a : 4-methyl-1-pentene-based copolymer 25 mass%. (b2-l) · ethylene · 1-butene (b2-2) · 1-butene-acetamethylene random copolymer mass%. <Buffer layer (C)> - In the same manner as in Example 2, (cl)-a 30% by mass, (c2)-a, and 70% by mass in spring, and dry blending using a Hanschel mixer. <Manufacturing of laminated body> Using three kinds of 5-layer T-die devices, the extruder was used. The set temperature and the set temperature of the τ-die are set to 29 (TC, manufactured by co-extrusion from the surface layer (A) / the subsequent layer (B) / the buffer layer (C) / the subsequent layer (B) / the surface layer (a) A wide-width 400-layer laminate composed of two layers, and the thickness of the obtained laminate and the evaluation results of the physical property values are shown in Table 2-1. Further, in the same manner as in the first embodiment, the adhesive layer (8) was used. The single layer film of the buffer layer (c) was separately molded, and MFR1 was measured. The results are shown in Table 2-1. [Comparative Example 13] <Surface layer (A)> Use and Example <Bottom layer (B) &gt; 1 identical 4-methyl-1-pentene copolymerization Quantity (bl)-b: 4-mercapto-one-pentene-based copolymer [1-decene contains 312XP/inventive specification (supplement)/95·〇9/95116834 51 1294351 mass%, soluble Point: 222 ° C, MFR 2 : 250 g / i 〇 minutes, density: 835 kg / m 3 (ASTM D1 505)] 35 mass %. (b2-l): 15% by mass of an ethylene·1-butene random copolymer. u (b2_2) · 1-butyl fine • Ethylene random copolymer mass%. <Cushion Layer (C)> In the same manner as in Example 2, (ci)-a was set to 3% by mass, (^) and &amp;&gt; was set to 70% by mass, and dried using a Hanschel mixer. Blending. <Manufacturing of laminated body> Lu# uses three kinds of five-layer T-die devices, and sets the set temperature of the extruder and the set temperature of the τ_mold to 290 〇C, and manufactures the surface layer (Α)/ The layer (8) / the buffer layer (C) / the subsequent layer (8) / the surface layer (1) "the width of the layer 4 m is 胄. The thickness of the obtained laminate and the evaluation results of the physical properties are shown in Table 2-2. In the same manner as in Example 1, the single layer films of the adhesive layer (B) and the buffer layer (C) were each molded, and MFR was measured, and the results are shown in Table 2-2. [Comparative Example 14] Φ <surface layer (A) &gt; The same 4-methyl+pentanthene copolymer group as in Example 1 was used. <Adhesion layer (B)&gt; The same adhesive resin composition as in Example 1 was used. <Buffer layer (c)&gt; (:l -a : As a heat-resistant resin having a melting point or higher, the 4-methyl-1-pentene copolymer of the same type as in Table 4 (A) is used in an amount of 3% by mass. (10)|As a soft resin of (four) 17th generation or less, Use low density 312XP / invention manual (supplement) / 95-09/95116834 52 1294351 polyethylene [melting point: 110 °c, MFR1: 0 · 6g / l 〇 minutes, density · 920kg / m3 (ASTM D1 505)] 70% by mass. Next, the above (cl)-a and (c2)-f were subjected to 'dry blending using a Hanschel mixer. \ <Manufacture of laminated body> Three kinds of 5-layer T-die devices were used. The set temperature of the extruder and the set temperature of the τ-die are set to 290 ° C, and the surface layer (a) / the carrier layer (B) / the buffer layer (C) / the subsequent layer (B) are manufactured by co-extrusion. / The layer of the 400 mm wide layer of the surface layer (a) is formed in the same manner as in the first embodiment, and the thickness of the obtained layered product and the evaluation results of the respective physical properties are shown in Table 2-2. The single layer films of the next layer (B) and the buffer layer (c) were separately molded, and MFR1 was measured. The results are shown in Table 2-2. [Comparative Example 15] <Surface layer (A)> Use and Example 1 The same 4-mercapto-1-pentene-based copolymer. <Adhesion layer (B)> • The same adhesive resin composition as in Example 1 was used. • <Buffer layer (C)&gt; - (Cl) - a: The heat-resistant resin having a melting point of 190 ° C or higher is 30% by mass of the 4-methyl-non-pentene-based copolymer which is the same as the surface layer (A). (c2)-g: as the melting point 17 (Soft resin below TC' use Low-density polyethylene [melting point: 11 (TC, MFR1: 30 g / 1 min, density: 920 kg/m3 (ASTM D1 505)] 70% by mass. Next, the above (cl)-a and (c2)-g are used. The Hanschel mixer is 312XP/inventive specification (supplement)/95-09/95116834 53 1294351 dry blending. <Manufacturing of laminated body> Using three kinds of five-layer T-die devices, the set temperature of the extruder and the set temperature of the T-\ mold were set to 290 ° C, and the surface layer (A) / ' was produced by co-extrusion. Next, a layer of 400 mm wide consisting of five layers of layer (B) / buffer layer (C) / adhesion layer (B) / surface layer (A). The thickness constitution of the obtained laminate and the evaluation results of the physical property values are shown in Table 2-2. Further, in the same manner as in Example 1, the single φ layer films of the adhesive layer (B) and the buffer layer (C) were each molded, and MFR1 was measured. The results are shown in Table 2-2.

312XP/Inventive Manual (supplement)/95-09/95116834 54 1294351 (Ts LO (k 4-mercapto-1-pentene copolymer) g ? g X r-jH S fr^H 0.06 35/15/ 50 Oj W 1' 1 A oo oo 20/60/20 1 1 1 1 1 1 A/B/C/B/A 25/10/50/10/25 cd (NI CO οα s LO inch I m 4- Mercapto-1-pentene copolymerization 1 body g ϊ 4 CjJ g Λ ϊ—H s 5 ii 0.06 35/15/50 X Cj eg A\ ϊ—H CO oi 20/60/20 1 1 1 1 1 1 A/B/C/B/A 25/10/50/10/25 οα ιή oo CNi (Nl ◦ S CO 1 Κ 4- 4-yl-p-pentene copolymer gi 1 X r-jH &lt;NI f T—&lt; 0.06 35/15/50 (cl)-a/(c2)-a LO ◦· 40/60 1 1 1 1 1 1 A/B/C/B/A 25/10/50/10 /25 LO CD CD oi τ-Η o wear 03 I ik 4-mercapto-p-pentene copolymer ◦ (bl)-a/(b2-l)/(b2-2) 0.06 35/15/50 ( Cl)-a/(c2)-a OO 〇· 30/70 1 1 1 1 1 1 A/B/C/B/A 25/10/50/10/25 inch LO CD oi οα os Example 1 4 - mercapto-1-pentaylene copolymer gi 1 cja g Λ ϊ 1 isigc=&gt; 35/15/50 (cl)-a/(c2)-a tH 20/80 1 1 1 1 1 1 A/ B/C/B/A 25/10/50/10/25 OO inch · οα CD S 〇IBp 1 1 ψ ◦ mass% 1 1 φ\ &lt;=) face c 1 1 Φ\ tea ο 1 1 φ\ 茶ο white 1 N/15mm 1 N/15mm painting ε resin type Ϊ 1 composition 1 I composition 1 ratio 1 resin species 1 δ3 layer thickness of each layer thickness heating and pressure treatment before the subsequent strength heating and addition Subsequent strength after pressure treatment exceeds φ4 Surface layer (A) Next layer (B) Buffer layer (c) Layer (D) s^s^s - X3 9 $SBS4 is f§s?l-iocdAp) (T§ Xs s^s^sss^i - xs 9^ifgft4: ◦1(0) ||^铋沭^墀装to·装 hl:Q—zq) inch S911s/60iA6/ffiii)_K?iiK distilling ^ΜΧίΝΐΓη 1294351 (2丨一&lt;) Example 10 4-mercapto-1-pentene-based copolymer g 1 i (bl)-a/(b2-l)/(b2-2) 0.06 35/15/50 (cl )-b/(c2)-a/(c2)-b CO cvi 20/60/20 (cl)-b CJi g A/B/C/D 25/10/50//25 τ—Η inch·CO (Ni &lt;NI ο another 03 I 4-mercapto-1-pentene-based copolymer g ι—Η cva 1 ( Λ i—4 i A cr&gt; 〇· 50/10/40 73 § Λ i—H oo ◦· 30/70 1 1 1 1 1 1 VB/C/B/A 25/10/50/10/25 CO LO 卜CNi rH ο in 〇〇¥ 4-mercapto-1-pentene-based copolymer gg A i H ! i &quot; H LO CN1 ◦· 20/30/50 (cl)-a/(c2)-a oo CD 30/70 1 1 1 1 1 1 A/B/C/B/A 25/ 10/50/10/25 inch (N 1 s CO Example 7 4-mercapto-1-1-pentene copolymer g τ—Η cji g r-jH έ Λ r^H g &lt;〇35/15/50 (cl)-a/(c2) -d LO rH 15/85 1 1 1 1 1 1 A/B/C/B/A 25/10/50/10/25 卜LO od (NI o CD I 4-mercapto-1-pentene Copolymers g ι—Η Cp H ^N r^H 0.06 35/15/50 (cl)-a/(c2)-c ΟΪ CO 30/70 1 1 1 1 1 1 A/B/C/B/A 25/10/50/10/25 OO ζό LO CO οα C3 gs olnp 1 1 ◦ ♦1 1 1 φ\ l CD s φ| ®DC 1 1 Marriage: o 1 1 ψ ◦ Mass % ε 3 -1 N/ 15mm N/15mm circumference B Resin type S Proportion composition I Jj % Proportion resin type I Thickness of each layer of the layered layer. Subsequent strength heating and pressure treatment before heating and pressure treatment: Substitute strength excess surface layer (A) Next layer (B) Buffer layer (c) Layer (9) ϋ 铋沭嚓 铋沭嚓 铋沭嚓 h h h h h h h h h h h h h h h h h h h h h h h h h h h h h h h h h h h h —§ q—(sf§ f(p)Ms (z丨§ (i) Ms inch eoo9 IIlr&gt;6/60^6/(t=3i)_s?ss fractionation/dx(NI ε 12943 t tender column 8 L/i 4-甲奸·系微8 r_— (bl)^/(b2-l)/(b2-2) ο Η 10/40/50 (cl)-a/(c2)-a 〇〇30 /70 WC7B/A 25/1 0/50/10/25 LO ◦· οα ◦· 寸g oo (column 7 4-Ape-contact system 8 1 (cl)-a/(c2)-a/(c2H LO 30/50/20 M7A 25 /70/25 1 1 1 1 CO CZ) LO (NI Bu_column 6 4-A-1) Copolymer g 1_ (cl)-^/(c2)-a 〇〇CD 30/70 A/C7A 25/ 70/25 1 1 1 1 but g delete 5 4-methyl·1_· copolymer gg Q (Ni g (c2)-a CM τ·-Η gii A/M7B/A 25/10/50/10/ 25 LO ◦· Τ-Η C5 CD § 匕_column 4 4-A H-liner copolymerization S rH s Λ 1 5 s ◦· 35/15/50 (c2)-a (N1 r-H s T-^ k/WUWK 25/10/50/10/25 m inch · C3 oi CO s oo thlii column 3 4-A trait scale copolymer g 9 &gt;si &gt; 0.06 35/15/50 (cl)-a/( C2)-a CD rH s A/M7B/A 25/10/50/10/25 oo inch · 1 &lt; oi CO C5 S butterfly 2 4-mercapto 4-contact copolymer g 1 έ &gt; /^N s 0.06 35/15/50 (cl)-a/(c2)-a &lt;=&gt; 60/40 WC7B/A 25/10/50/10/25 οα 00 τ—Η LO CO r—H t— H st tender column 1 4-A H-Jewish copolymerization ί Total s 1 έ &gt; /^NS 0.06 35/15/50 (cl)-a/(c2)-at-H o ◦' 70/30 A/ B/C/B/A 25/10/50/10/25 22.3 Bub·rH s & ί S Green! 1 1 ί AH &lt;=&gt; m〇t N/15mm N/15mm 1 ϊ 醤1 s ΟΛ 1 1 ί Lin Huan green thickness 53 Ϊ t ^ 2 3 excess &quot;mm*&quot;&quot;&quot;&quot;&quot; Table &f(A) Next layer (8) mmco 锲命铋爱ν-ιΫ5Η丨 inch 1) (i cd丨(lq) Διο 0丨§MsMs 17es9I^6/6s6/ff}«)_s^K^#/dx(NIcn 1294351 (73⁄4 t tender 歹丨 J15 4-甲壮麟 共聚 S r r bl (b)-a/(b2-l)/(b2-2) sc=&gt; 35/15/50 ! 30/70 ymm 25/10/50/10/25 LO 〇 J 1 LO § t tender column 14 4-mercaptopurine-liner copolymerization edge S 9 苕ss ◦· 35/15/50 (cl)-a/(c2)-f CO ◦· 30/70 A/M7B/ A 25/10/50/10/25 〇j Cvl CN1 § Canned J13 4-Azolla cymbal copolymer SC£5 &lt;=5 35/15/50 (cl)-a/(c2)-a Oo ◦· 30/70 mimik 25/10/50/10/25 LO CO (Νί oo § 列列 12 4-methyl 4-lane copolymerization S rH (bl&gt;a/(b2-l)/(b ^) ◦· 25/5/70 (cl)-a/(c2)-a oo 〇· 30/70 mimik 25/10/50/10/25 CNI C&lt;i CD CO § t-face 11 4-A &; 4-麟系徽徽s s (bl)-a/(b2-l)/(b2-2) |t-H c=&gt; 60/5/35 (cl)-a/(c2&gt;a oo C =) 30/70 rnmik 25/10/50/10/25 LO oi CO CO § 列列 10 4-曱H-麟系聚绿s s 9 1 SQ· 40/35/ 25 (cl)-a/(c2)-a OO 30/70 25/10/50/10/25 CO § Lai Lie 9 4-A Zhuanglin Copolymer miscellaneous sl-i 1 1 CO &lt;=&gt;* 20/50/30 (cl)-a/(c2)-a oo ◦· 30/70 mimik 25/10/50/10/25 05 inch! % % ! 1 1 ! 1 1 imc t Wldm N/15im t Ϊ 1 1 ΛΧ Ϊ 1 5 1 1 1 输 4 4 total level force tends ΜάΛ Table®^(A) mm) IIC〇二/^,,-Ν II τ—I &lt;ΝΙ /^Ν Ζ^Ν II τ—Η τ—· 〇νί CO JD JD Χ5 VS_^ · β—^ 丨 s svs^s—3^—^ S^S0^ ssfs s^sw^s4^n^^viii^&- ^

τ-Η (Nl &lt;NI (NI ο ο ο ο Sw / inch 2911 s/60tA6/ff; purple) _ shrinking s distillation / dxCNIcn 1294351 (industrial availability) The layered body of the present invention It is excellent in heat resistance, release property and cushioning property, and when the heating and pressurization in FPC production, the buffer layer is extremely small, and it is particularly suitable for use as a release film for FPC production. The extrusion molding of the mold device makes it easy to manufacture a film having a large surface roughness and thickness, and a wide film, and has an extremely high industrial value.

312XP/Inventive Manual (supplement)/95-09/95116834 59

Claims (1)

1294351 X. Patent application scope: (8) The latter, the vertical: = the surface layer (1) and the buffer layer (C) have an adhesive layer between the eight layers, and the surface layer (A) contains 80 to 100% by mass of 4_methyl- A 1-pentene-based polymer, and a slow-acting, ^, V, and a layer (C) contains a soft resin (10) having a melting point of 190 ° C and a melting point of 2 or less and a melting point of 17 or less. The layered body of the 专利 申 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 / Methyl + pentane polymer (bl) and a polymer (10) containing r = 2 to 4 olefins, not determined: a C measured by the _ ^ buffer layer (6) contains 10, quality % melting point 190~25吖 resistance resin (cl), and 50~90 mass 7 ί) 17 , resin ((2), and 矜 will? He point 7 (M7GC soft 'J and what weight 2.16kg, The melt production rate (MFR1) measured by the temperature 230 is 0.4 to 1 〇 g / i 〇 minutes. The knife L 3 is the laminate of the second item of the patent application, wherein the above (B) contains 20~ 50% by mass of 4-甲美]屮p5 曰1, 敝乙乙稀.丁J二基赵=Polymer (10), 卜丁(四)(2)细―1) and 3 W as patent application scope 2 The layered body of the item, wherein the heat resistant resin (8) is selected from at least one of the group + base group, and the soft f resin (10) is selected from the group consisting of low density 312XP/inventive specification ( Replenishment y95-09/95丨丨6834 埽, linear low-density polyethylene, high-density polyethylene, propylene homogenate, ethylene·propylene copolymer, ethylene·propylene/butene copolymer: 1294351 Butene Polymer, B, Knee, and the like: olefin copolymer, propylene and butene copolymer 5. At least one species of the patented modified polymer. (A) contains 4_A & a laminate body, wherein the surface layer is a homopolymer of 4-methyl+pentafluorene or a 4-methyl-p-pentamate, a layer of a copolymer of olefins having a carbon number (d), wherein The thickness of the laminated body and the thickness of the surface layer (A) is the laminated body. 6 · For example, the second patent of the 5th patent is the outermost layer of the surface layer (A), and the thickness of the body is 5 to 50%. It is called the laminated body of the second item of the patent range, in which 'heating and pressurizing _ is the benchmark measurement: = the strength of the joint transmitted by the JIS d疋 between the buffer layers (C) is 1~20N/15mm. ^ The layered body of claim 2, wherein the outermost layer of the laminated body is the surface layer (A), and the surface roughness Ry of the surface layer (A) is 〇. 〇1 〜20//Π10 ^ The laminate according to the second aspect of the patent application, wherein each of the above layers is formed by a co-extrusion method. I 〇·- a release film containing the patent application range 丨9 to 9. A laminated body for manufacturing a flexible printed circuit board, which comprises the laminated body of any one of claims 1 to 9. 31ZXP/Inventive Manual (Repair) /95-09/95116834 61