JP2003276140A - Method for molding release multilayered film and cover lay - Google Patents
Method for molding release multilayered film and cover layInfo
- Publication number
- JP2003276140A JP2003276140A JP2002083653A JP2002083653A JP2003276140A JP 2003276140 A JP2003276140 A JP 2003276140A JP 2002083653 A JP2002083653 A JP 2002083653A JP 2002083653 A JP2002083653 A JP 2002083653A JP 2003276140 A JP2003276140 A JP 2003276140A
- Authority
- JP
- Japan
- Prior art keywords
- release
- layer
- resin
- intermediate layer
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000000465 moulding Methods 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920001577 copolymer Polymers 0.000 claims abstract description 24
- 229920000306 polymethylpentene Polymers 0.000 claims abstract description 21
- 239000011116 polymethylpentene Substances 0.000 claims abstract description 21
- 239000004711 α-olefin Substances 0.000 claims abstract description 17
- 239000004743 Polypropylene Substances 0.000 claims abstract description 13
- -1 acrylic ester Chemical class 0.000 claims abstract description 13
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 229920001155 polypropylene Polymers 0.000 claims abstract description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000005977 Ethylene Substances 0.000 claims abstract description 9
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 5
- 239000000155 melt Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 claims description 3
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 claims description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 238000010030 laminating Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000037303 wrinkles Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000004840 adhesive resin Substances 0.000 description 4
- 229920006223 adhesive resin Polymers 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 230000000740 bleeding effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005629 polypropylene homopolymer Polymers 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板の製造工程において用いられる離型多層フィ
ルムとそのフィルムを使用したカバーレイ成形方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a release multilayer film used in a manufacturing process of a flexible printed wiring board and a coverlay molding method using the film.
【０００２】[0002]
【従来の技術】フレキシブルプリント配線板（以下、Ｆ
ＰＣという）の製造工程においては、絶縁基材、例えば
ポリイミド樹脂フィルム表面に所定の回路を有するフレ
キシブル回路基板上を、絶縁及び回路保護を目的として
接着剤付き耐熱樹脂フィルムであるカバーレイ（以下、
ＣＬという）で被覆し、離型フィルムを用いて、プレス
ラミネートすることが通常行われている。この製造工程
においては、ＦＰＣと当板との離型性、ＦＰＣの凹凸に
十分追従することによるＣＬ端面からの接着剤フロー抑
制、導体汚染防止及び後工程でのメッキ付き性、さらに
ＦＰＣ全体を包み込むことによる圧力の均一化、即ち離
型性、対形状追従性、メッキ付き性、ＦＰＣ全体を包み
込むことによる脱ボイド性（以下、成形性という）の他
に、ＦＰＣの仕上がり外観シワに優れた離型フィルムが
求められていた。2. Description of the Related Art Flexible printed wiring boards (hereinafter referred to as F
In a manufacturing process of (PC), a coverlay (hereinafter, referred to as a heat-resistant resin film with an adhesive for the purpose of insulation and circuit protection) on an insulating base material, for example, a flexible circuit board having a predetermined circuit on the surface of a polyimide resin film.
It is usually performed by coating with a release film and press-laminating with a release film. In this manufacturing process, the mold releasability between the FPC and the contact plate, the adhesive flow control from the CL end face by sufficiently following the unevenness of the FPC, the conductor contamination prevention and the plating property in the subsequent process, and the entire FPC In addition to making the pressure uniform by wrapping, that is, releasability, conformability to shape, plating property, devoid property by wrapping the entire FPC (hereinafter referred to as moldability), it has excellent finish appearance wrinkles. Release films have been sought.
【０００３】[0003]
【発明が解決しようとする手段】本発明では、離型性、
対形状追従性、均一な成形性、メッキ付き性を維持しな
がら、従来の離型多層フィルムでは不満足であったＦＰ
Ｃの仕上がり外観シワが発生しにくい離型多層フィルム
及びそれを用いたカバーレイ成形方法を提供するもので
ある。In the present invention, the releasability,
While maintaining conformability to shape, uniform formability, and plating property, FP was not satisfactory with conventional release multilayer films
Provided are a release multi-layer film in which finish appearance wrinkles of C hardly occur and a coverlay molding method using the same.
【０００４】[0004]
【課題を解決するための手段】本発明は、［１］ 離型
側層、中間層、離型反対側層の３層を有する離型多層フ
ィルムにおいて、離型側層の樹脂がポリメチルペンテン
又はポリメチルペンテンとαオレフィンとの共重合体、
中間層の樹脂がエチレン、ブテン、ペンテン、ヘキセ
ン、メチルペンテンから選ばれたαオレフィン共重合体
又は多元共重合体、エチレンとアクリル酸エステル又は
メタクリル酸エステルの共重合体、エチレンと酢酸ビニ
ル、アクリル酸又はメタクリル酸との共重合体及びそれ
らの部分イオン架橋物から選ばれた共重合体、又はそれ
らの混合物、離型反対側層の樹脂がポリプロピレンで、
中間層の樹脂が、メルトフローレート０．３〜１０．０
ｇ／１０分、融点５０〜１５０℃で、離型側層の樹脂
が、ロックウェル硬度６５〜８８、厚み１０〜１００μ
ｍで、離型側層と中間層の間の剥離強度が０．１ｇ／２
５ｍｍ〜２００ｇ／２５ｍｍであることを特徴とする離
型多層フィルム、［２］中間層の樹脂厚みが、２０〜２
９０μｍである第［１］項記載の離型多層フィルム
［３］フレキシブルプリント配線板の製造工程におい
て、第［１］項又は［２］項記載の離型多層フィルムを
カバーレイのプレスラミネートに用いることを特徴とす
るカバーレイ成形方法、である。The present invention relates to [1] a release multilayer film having three layers of a release side layer, an intermediate layer and a release opposite side layer, wherein the resin of the release side layer is polymethylpentene. Or a copolymer of polymethylpentene and α-olefin,
The resin of the intermediate layer is ethylene, butene, pentene, hexene, α-olefin copolymer or multi-component copolymer selected from methylpentene, copolymer of ethylene and acrylic ester or methacrylic ester, ethylene and vinyl acetate, acrylic A copolymer selected from an acid or a methacrylic acid copolymer and a partial ionic crosslinked product thereof, or a mixture thereof, and the resin of the release opposite layer is polypropylene,
The resin of the intermediate layer has a melt flow rate of 0.3 to 10.0.
g / 10 minutes, melting point 50 to 150 ° C., resin of release side layer has Rockwell hardness of 65 to 88, thickness of 10 to 100 μm
m, the peel strength between the release side layer and the intermediate layer is 0.1 g / 2.
5 mm to 200 g / 25 mm, the release multilayer film, [2] the resin thickness of the intermediate layer is 20 to 2
In the manufacturing process of the release multilayer film [3] flexible printed wiring board according to item [1], the release multilayer film according to item [1] or [2] is used for press lamination of a coverlay. A cover lay molding method characterized by the above.
【０００５】[0005]
【発明の実施形態】本発明の離型側層に用いる樹脂は、
ポリメチルペンテン又はポリメチルペンテンとαオレフ
ィンの共重合体である。ポリメチルペンテンとは、以下
の式（１）で示されるものである。
BEST MODE FOR CARRYING OUT THE INVENTION The resin used in the release side layer of the present invention is
It is polymethylpentene or a copolymer of polymethylpentene and α-olefin. Polymethylpentene is represented by the following formula (1).
【０００６】ポリメチルペンテンとαオレフィンの共重
合体の共重合比率、αオレフィンの種類については特に
限定しない。ポリメチルペンテン又はポリメチルペンテ
ンとαオレフィンの共重合体のロックウェル硬度は、６
５〜８８であり、好ましくは７５〜８５が望ましい。６
５未満だとＦＰＣとの対形状追従性、特にメッキ付き性
が劣り、８８を越えると離型性が悪くなり破れる。ロッ
クウェル硬度を６５〜８８にするには、ポリメチルペン
テン又はポリメチルペンテンとαオレフィンとの共重合
体は、単独でも２種以上の混合物として用いても良い。
本発明でのロックウェル硬度は、ＡＳＴＭ Ｄ７８５の
Ｒスケールに準じて測定するものである。The copolymerization ratio of the polymethylpentene / α-olefin copolymer and the type of α-olefin are not particularly limited. The Rockwell hardness of polymethylpentene or a copolymer of polymethylpentene and α-olefin is 6
It is 5 to 88, preferably 75 to 85. 6
If it is less than 5, the conformability to shape with FPC, particularly the plating property, is poor, and if it exceeds 88, the releasability deteriorates and the film is broken. In order to set the Rockwell hardness to 65 to 88, polymethylpentene or a copolymer of polymethylpentene and α-olefin may be used alone or as a mixture of two or more kinds.
The Rockwell hardness in the present invention is measured according to the R scale of ASTM D785.
【０００７】ポリメチルペンテン又はポリメチルペンテ
ンとαオレフィンとの共重合体の厚みは、１０〜１００
μｍである。好ましくは１５〜５０μｍが望ましい。１
０μｍ未満プレスラミネート後にポリメチルペンテン又
はポリメチルペンテンとαオレフィンとの共重合体が破
れ、ＦＰＣと離型多層フィルムを分離する際に、ＦＰＣ
側にポリメチルペンテン又はポリメチルペンテンとαオ
レフィンとの共重合体が残ってしまう。１００μｍを越
えると対形状追従性が悪くなりＣＬに付着している接着
剤のフロー量が多くなる。The thickness of polymethylpentene or a copolymer of polymethylpentene and α-olefin is 10 to 100.
μm. It is preferably 15 to 50 μm. 1
When less than 0 μm press lamination, polymethylpentene or a copolymer of polymethylpentene and α-olefin is broken, and when separating FPC and release multilayer film, FPC
Polymethylpentene or a copolymer of polymethylpentene and α-olefin remains on the side. When it exceeds 100 μm, the conformability to shape is deteriorated and the flow amount of the adhesive agent adhering to CL is increased.
【０００８】本発明の中間層に用いる樹脂は、エチレ
ン、プロピレン、ブテン、ペンテン、ヘキセン、メチル
ペンテンから選ばれたαオレフィン共重合体又は多元共
重合体、エチレンと酢酸ビニル、アクリル酸又はメタク
リル酸との共重合体及びそれらの部分イオン架橋物から
選ばれた共重合体、それらの混合物である。この中間層
の樹脂のメルトフローレートは０．３〜１０．０ｇ／１
０分である。０．３ｇ／１０分未満だと対形状追従性等
の成形性が悪く、１０．０ｇ／１０分を越えると離型多
層フィルムの端面から樹脂の染み出しが多くなり作業性
が悪くなる。本発明でのメルトフローレートは、ＡＳＴ
Ｍ Ｄ１２３８に準じて測定するものである。The resin used in the intermediate layer of the present invention is an α-olefin copolymer or multi-component copolymer selected from ethylene, propylene, butene, pentene, hexene and methylpentene, ethylene and vinyl acetate, acrylic acid or methacrylic acid. And a copolymer selected from a partially ionically crosslinked product thereof, and a mixture thereof. The resin in this intermediate layer has a melt flow rate of 0.3 to 10.0 g / 1.
0 minutes. If it is less than 0.3 g / 10 minutes, the moldability such as conformability to shape is poor, and if it exceeds 10.0 g / 10 minutes, the exudation of the resin from the end surface of the release multilayer film is increased and the workability is deteriorated. The melt flow rate in the present invention is AST
It is measured according to MD1238.
【０００９】中間層の樹脂の融点は、５０〜１５０℃で
ある。５０℃未満だとバラシ作業時の作業性が劣り、１
５０℃を越えるとＣＬ接着剤フロー量が多くなる。中間
層の樹脂厚みは、２０〜２９０μｍが好ましい。２０μ
ｍ未満だと成形性が悪く、２９０μｍを越えると離型多
層フィルムの端面からの染み出しが多くなり、作業性が
悪くなり好ましくない。本発明での融点は、示差走査型
熱量計で測定（昇温速度１０℃／分）するものである。The melting point of the resin of the intermediate layer is 50 to 150 ° C. If it is less than 50 ° C, the workability during the disassembling work is poor, and 1
If it exceeds 50 ° C, the CL adhesive flow amount increases. The resin thickness of the intermediate layer is preferably 20 to 290 μm. 20μ
If it is less than m, the moldability is poor, and if it exceeds 290 μm, the exudation from the end face of the release multilayer film is increased and the workability is deteriorated, which is not preferable. The melting point in the present invention is measured with a differential scanning calorimeter (heating rate 10 ° C./min).
【００１０】本発明の離型反対側層に用いる樹脂は、ポ
リプロピレンである。これは耐熱性、コスト、押し出し
成形性等のバランスによる。ポリプロピレンとしては、
ホモポリマー、ランダムコポリマー、ブロックコポリマ
ーが挙げられる。ポリプロピレンの種類については特に
限定するものではない。離型反対側層にポリプロピレン
を用いる３層構成とすることにより、プレスラミネート
成形方式法においてクッション材の挿入をしなくともよ
く、煩雑な積層工程を簡略化できる。The resin used in the layer opposite to the mold release layer of the present invention is polypropylene. This depends on the balance of heat resistance, cost, extrudability and the like. For polypropylene,
Examples include homopolymers, random copolymers, and block copolymers. The type of polypropylene is not particularly limited. By using a three-layer structure in which polypropylene is used for the layer on the side opposite to the mold release, it is not necessary to insert a cushion material in the press laminate molding method, and the complicated laminating process can be simplified.
【００１１】本発明の離型多層フィルムは、離型側層、
中間層、離型反対側層の３層からなり、離型側層と中間
層の層間には、接着樹脂は存在しないものである。離型
多層フィルムの総厚みとしては、５０〜３００μｍが好
ましく、５０μｍ未満だと成形性が悪く、３００μｍを
越えると離型多層フィルム端面での染み出しが多くなり
作業性が悪くなるので好ましくない。本発明での離型多
層フィルムの離型側層とは、ＦＰＣに接する層のことを
指す。離型側層と中間層の層間に接着樹脂層が存在しな
いことから、層間の接着は離型フィルムの製造時の離型
側層と中間層の樹脂の粘着もしくは融着により達成さ
れ、接着剤を用いた場合に較べて、離型側層と中間層の
剥離強度を低く抑えることができる。The release multilayer film of the present invention comprises a release side layer,
It is composed of an intermediate layer and a layer opposite to the release layer, and no adhesive resin is present between the release layer and the intermediate layer. The total thickness of the release multilayer film is preferably from 50 to 300 μm, and when it is less than 50 μm, the moldability is poor, and when it exceeds 300 μm, the exudation on the end face of the release multilayer film is increased and the workability is deteriorated, which is not preferable. The release side layer of the release multilayer film in the present invention refers to a layer in contact with FPC. Since there is no adhesive resin layer between the release side layer and the intermediate layer, the adhesion between the layers is achieved by sticking or fusing the resin of the release side layer and the intermediate layer during the production of the release film. The peel strength between the release side layer and the intermediate layer can be suppressed to a lower level than in the case of using.
【００１２】本発明の離型側層と中間層との剥離強度
は、０．１ｇ／２５ｍｍ〜２００ｇ／２５ｍｍである。
好ましくは、０．１／２５ｍｍ〜１００ｇ／２５ｍｍ望
ましい。２００ｇ／２５ｍｍを越えると離型側層と中間
層の熱的特性の違いから離型側層にシワが発生し、ＦＰ
Ｃの仕上がり外観シワとなる。０．１ｇ／２５ｍｍ未満
だとフィルムがバラバラになりセット作業時の作業性に
劣る。本発明でのラミネート強度は、ＪＩＳ Ｋ ６８
５４（測定巾２５ｍｍ）に準拠して測定するものであ
る。The peel strength between the release side layer and the intermediate layer of the present invention is 0.1 g / 25 mm to 200 g / 25 mm.
Preferably, 0.1 / 25 mm to 100 g / 25 mm is desirable. When it exceeds 200 g / 25 mm, wrinkles are generated in the release side layer due to the difference in thermal characteristics between the release side layer and the intermediate layer, and FP
The appearance of C becomes wrinkled. If it is less than 0.1 g / 25 mm, the film will be scattered and the workability during setting work will be poor. The laminate strength according to the present invention is JIS K 68.
54 (measurement width 25 mm).
【００１３】本発明に用いる離型多層フィルムの製法
は、共押し出しラミネート工法、押し出しラミネート工
法、ドライラミネート工法のいずれの工法でもよい。本
発明の離型多層フィルをＦＰＣの製造工程において、Ｃ
Ｌのプレスラミネートに用い、加圧積層する成形方法と
しては、例えば当板の間に、離型多層フィルム、ＦＰ
Ｃ、離型多層フィルムの順に重ねた構成からなる被プレ
ス物を１０〜３０枚載置し、所定の条件で加熱加圧後、
後硬化をすればよい。The release multilayer film used in the present invention may be produced by any of a coextrusion laminating method, an extrusion laminating method and a dry laminating method. In the FPC manufacturing process, the release multilayer fill of the present invention is
As a molding method for pressure laminating, which is used for L press lamination, for example, a releasing multilayer film, FP
C, 10 to 30 press-worked objects having a constitution in which a release multilayer film is laminated in this order are placed, and after heating and pressurizing under predetermined conditions,
It may be post-cured.
【００１４】[0014]
【実施例】以下に本発明を実施例によって、さらに詳細
に説明するが、本発明はこれらの実施例に限定されるも
のではない。以下に示す実施例及び比較例において使用
した原材料の特性は、以下の通りである。ポリメチルペ
ンテンとαオレフィンとの共重合体（ＴＰＸ）：品番Ｍ
Ｘ００２［ロックウェル硬度６２］、品番ＭＸ００４
［ロックウェル硬度８０］、品番ＲＴ１８［ロックウェ
ル硬度８９］（三井化学（株）製）
エチレン−酢酸ビニル共重合体（ＥＶＡ）：試作品［酢
酸ビニル含量（ＶＡＣ）１０重量％、融点９３℃、メル
トフローレート（ＭＦＲ）＝０．１ｇ／１０分］、品番
エバフレックスＶ−５７１６ＲＣ［酢酸ビニル含量（Ｖ
ＡＣ）１０重量％、融点９３℃、メルトフローレート
（ＭＦＲ）＝２．５ｇ／１０分］、試作品［酢酸ビニル
含量（ＶＡＣ）１０重量％、融点９３℃、メルトフロー
レート（ＭＦＲ）＝１５ｇ／１０分］（三井・デュポン
ケミカル（株）製）
ポリエチレン（ＰＥ）：品番スミカセンＬ２１１［メル
トフローレート（ＭＦＲ）＝２．０ｇ／１０分、融点１
１２℃］（住友化学工業（株）製）
エチレン−メチルアクリレート共重合体（ＥＭＭＡ）：
品番アクリフトＷＤ２０３−１［メルトフローレート
（ＭＦＲ）＝２．０ｇ／１０分、融点９０℃］（住友化
学工業（株）製）
ポリプロピレン（ＰＰ１）：品番ＦＳ２０１１ＤＧ［ホ
モポリプロピレン、融点１６０℃］（住友化学工業
（株）製）
ポリプロピレン（ＰＰ２）：品番ＦＳ２０１１ＤＧ［ホ
モポリプロピレン、融点１６０℃］（住友化学工業
（株）製）
接着樹脂：アドマーＱＢ５５０（三井化学（株）製）EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited to these examples. The characteristics of the raw materials used in the examples and comparative examples shown below are as follows. Copolymer of polymethylpentene and α-olefin (TPX): Part number M
X002 [Rockwell hardness 62], Part number MX004
[Rockwell hardness 80], product number RT18 [Rockwell hardness 89] (manufactured by Mitsui Chemicals, Inc.) Ethylene-vinyl acetate copolymer (EVA): prototype [vinyl acetate content (VAC) 10% by weight, melting point 93 ° C] , Melt flow rate (MFR) = 0.1 g / 10 min], product number Evaflex V-5716RC [vinyl acetate content (V
AC) 10% by weight, melting point 93 ° C., melt flow rate (MFR) = 2.5 g / 10 minutes], prototype [vinyl acetate content (VAC) 10% by weight, melting point 93 ° C., melt flow rate (MFR) = 15 g / 10 minutes] (Mitsui-Dupont Chemical Co., Ltd.) Polyethylene (PE): Part number Sumikasen L211 [melt flow rate (MFR) = 2.0 g / 10 minutes, melting point 1]
12 ° C] (Sumitomo Chemical Co., Ltd.) Ethylene-methyl acrylate copolymer (EMMA):
Product number Acryft WD203-1 [melt flow rate (MFR) = 2.0 g / 10 minutes, melting point 90 ° C] (Sumitomo Chemical Co., Ltd.) Polypropylene (PP1): Product number FS2011DG [Homopolypropylene, melting point 160 ° C] (Sumitomo Chemical Industry Co., Ltd.) Polypropylene (PP2): Part number FS2011DG [Homopolypropylene, melting point 160 ° C.] (Sumitomo Chemical Co., Ltd.) Adhesive resin: Admer QB550 (Mitsui Chemicals, Inc.)
【００１５】実施例１
離型多層フィルムは、３台の押出機にそれぞれ離型側層
としてＴＰＸ、中間層としてＥＶＡ、離型反対側層とし
てＰＰを三層ダイスにより押出し、積層一体化して作成
した。実施例２〜７、比較例１〜８については、表１、
表２に示す特性の樹脂を用いて同様に作成した。なお、
比較例６は、４台の押出機にそれぞれ離型側層としてＴ
ＰＸ、接着樹脂層としてアドマーＱＢ５５０、中間層と
してＥＶＡ、離型反対側層としてＰＰを四層ダイスによ
り押出し、積層一体化して作成した。離型側層と離型反
対側層の間の剥離強度については、実施例１〜５が６０
ｇ／２５ｍｍ〜８０ｇ／２５ｍｍ、実施例６が４０ｇ／
２５ｍｍ〜６０ｇ／２５ｍｍ、実施例７が８０ｇ／２５
ｍｍ〜１００ｇ／２５ｍｍ、比較例１〜５が６０ｇ／２
５ｍｍ〜８０ｇ／２５ｍｍ、比較例６が２９０ｇ／２５
ｍｍ〜３２０ｇ／２５ｍｍ、比較例７、８が６０ｇ／２
５ｍｍ〜８０ｇ／２５ｍｍであった。多段型プレス機を
用い、離型多層フィルム、ＦＰＣ、前記離型多層フィル
ムの順に重ね、１５０℃、３０ｋｇ／ｃｍ2で、６０分
加圧後、５０℃になるまで加圧冷却した後、以下の評価
項目で評価した。評価結果を表１、表２に示す。Example 1 A mold release multilayer film was prepared by extruding TPX as a mold release side layer, EVA as an intermediate layer, and PP as a mold release opposite side layer into three extruders by a three-layer die and laminating and integrating them. did. For Examples 2-7 and Comparative Examples 1-8, Table 1,
A resin having the characteristics shown in Table 2 was similarly used. In addition,
In Comparative Example 6, T was used as a release side layer in each of the four extruders.
PX, Admer QB550 as an adhesive resin layer, EVA as an intermediate layer, and PP as a layer opposite to the mold release were extruded by a four-layer die and laminated and integrated. Regarding the peeling strength between the release side layer and the release side layer, Examples 1 to 5 were 60.
g / 25 mm to 80 g / 25 mm, Example 6 is 40 g /
25 mm to 60 g / 25 mm, Example 7 is 80 g / 25
mm to 100 g / 25 mm, Comparative Examples 1 to 5 are 60 g / 2
5 mm to 80 g / 25 mm, Comparative Example 6 is 290 g / 25
mm-320 g / 25 mm, Comparative Examples 7 and 8 are 60 g / 2
It was 5 mm-80 g / 25 mm. Using a multi-stage press, the release multi-layer film, the FPC and the release multi-layer film were stacked in this order, pressurized at 150 ° C. and 30 kg / cm 2 for 60 minutes, and then cooled under pressure to 50 ° C. The evaluation items were evaluated. The evaluation results are shown in Tables 1 and 2.
【００１６】成形性
○：ボイド発生率 ２．０％未満
×：ボイド発生率 ２．０％以上
ＣＬ接着剤のフロー量（ＣＬ端面からの染み出し長さ）
○：フロー量 １５０μｍ未満
×：フロー量 １５０μｍ以上
フィルム端面からの染み出し量
○：染み出し量 ５ｍｍ未満
×：染み出し量 ５ｍｍ以上
ＴＰＸ（離型側層）の破れ
○：破れ発生率 ２．０％未満
×：破れ発生率 ２．０％以上
メッキ付き性（必要面積の９０％以上にメッキが付いて
いるものを良品）
○：良品が９８％以上
×：良品が９８％未満
仕上がり外観シワ
○：シワ発生率 ２．０％未満
×：シワ発生率 ２．０％以上Moldability ○: Void generation rate less than 2.0% ×: Void generation rate 2.0% or more CL adhesive flow amount (exudation length from CL end face) ○: Flow amount less than 150 μm ×: Flow Amount 150 μm or more Bleeding amount from film end surface ○: Bleeding amount less than 5 mm ×: Bleeding amount 5 mm or more TPX (release side layer) breakage ○: Breakage occurrence rate less than 2.0% ×: Breakage occurrence rate 2. 0% or more Plating property (90% or more of required area is plated) Good: 98% or more of good products ×: Less than 98% of good products Wrinkle appearance ○: Wrinkle occurrence rate of less than 2.0% ×: Wrinkle occurrence rate of 2.0% or more
【００１７】[0017]
【表１】 [Table 1]
【００１８】[0018]
【表２】 [Table 2]
【００１９】[0019]
【発明の効果】本発明は、離型性、対形状追従性、メッ
キ付き性、均一な成形性に優れた特性を維持しながら、
従来の型多層フィルムでは達成できなかったＦＰＣ仕上
がり外観シワに優れた特性を付与し、かつクッション材
を挿入しなくてもよく、積層工程を簡略化できる離型多
層フィルムである。EFFECTS OF THE INVENTION The present invention maintains excellent characteristics such as releasability, conformability to shape, plating property, and uniform moldability,
It is a release multi-layer film which has excellent characteristics of finished appearance of FPC which cannot be achieved by the conventional type multi-layer film, and which does not require a cushion material to be inserted and which can simplify the laminating process.
フロントページの続き Ｆターム(参考） 4F100 AK04B AK07 AK07C AK08 AK08A AK08B AK08J AK09B AK25B AK68 AK68B AK70B AK71B AL01 AL01A AL01B AL05B BA03 BA07 BA15 BA16 EH20 EJ97 GB43 JA04B JA06B JA20B JK06A JK06B JK12A JL01 JL02 JL14 YY00A YY00B 5E314 AA24 BB01 FF06 GG19 GG24Continued front page F term (reference) 4F100 AK04B AK07 AK07C AK08 AK08A AK08B AK08J AK09B AK25B AK68 AK68B AK70B AK71B AL01 AL01A AL01B AL05B BA03 BA07 BA15 BA16 EH20 EJ97 GB43 JA04B JA06B JA20B JK06A JK06B JK12A JL01 JL02 JL14 YY00A YY00B 5E314 AA24 BB01 FF06 GG19 GG24
Claims (3)
を有する離型多層フィルムにおいて、離型側層の樹脂が
ポリメチルペンテン又はポリメチルペンテンとαオレフ
ィンとの共重合体、中間層の樹脂がエチレン、ブテン、
ペンテン、ヘキセン、メチルペンテンから選ばれたαオ
レフィン共重合体又は多元共重合体、エチレンとアクリ
ル酸エステル又はメタクリル酸エステルの共重合体、エ
チレンと酢酸ビニル、アクリル酸又はメタクリル酸との
共重合体及びそれらの部分イオン架橋物から選ばれた共
重合体、又はそれらの混合物、離型反対側層の樹脂がポ
リプロピレンで、中間層の樹脂が、メルトフローレート
０．３〜１０．０ｇ／１０分、融点５０〜１５０℃で、
離型側層の樹脂が、ロックウェル硬度６５〜８８、厚み
１０〜１００μｍで、離型側層と中間層の間の剥離強度
が０．１ｇ／２５ｍｍ〜２００ｇ／２５ｍｍであること
を特徴とする離型多層フィルム。1. In a release multi-layer film having three layers of a release side layer, an intermediate layer and a release opposite side layer, the resin of the release side layer is polymethylpentene or a copolymer of polymethylpentene and α-olefin. Combined, the resin of the intermediate layer is ethylene, butene,
Α-olefin copolymers or multi-component copolymers selected from pentene, hexene and methylpentene, copolymers of ethylene and acrylic acid ester or methacrylic acid ester, copolymers of ethylene and vinyl acetate, acrylic acid or methacrylic acid And a copolymer selected from those partially ionically crosslinked products, or a mixture thereof, the resin of the layer on the opposite side of the mold release is polypropylene, and the resin of the intermediate layer has a melt flow rate of 0.3 to 10.0 g / 10 min. , Melting point 50-150 ° C.,
The resin of the release side layer has a Rockwell hardness of 65 to 88 and a thickness of 10 to 100 μm, and the peel strength between the release side layer and the intermediate layer is 0.1 g / 25 mm to 200 g / 25 mm. Release multilayer film.
である請求項１記載の離型多層フィルム。2. The resin thickness of the intermediate layer is 20 to 290 μm.
The release multilayer film according to claim 1, wherein
において、請求項１又は２記載の離型多層フィルムをカ
バーレイのプレスラミネートに用いることを特徴とする
カバーレイ成形方法。3. A coverlay molding method, wherein the release multilayer film according to claim 1 or 2 is used for press lamination of a coverlay in a process of manufacturing a flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083653A JP2003276140A (en) | 2002-03-25 | 2002-03-25 | Method for molding release multilayered film and cover lay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083653A JP2003276140A (en) | 2002-03-25 | 2002-03-25 | Method for molding release multilayered film and cover lay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003276140A true JP2003276140A (en) | 2003-09-30 |
Family
ID=29206922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002083653A Pending JP2003276140A (en) | 2002-03-25 | 2002-03-25 | Method for molding release multilayered film and cover lay |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003276140A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006120983A1 (en) * | 2005-05-13 | 2006-11-16 | Mitsui Chemicals, Inc. | Laminate comprising 4-methyl-1-pentene polymer and release film comprising the same |
| JP2010253854A (en) * | 2009-04-27 | 2010-11-11 | Sekisui Chem Co Ltd | Multi-layer release film |
| JP2012210762A (en) * | 2011-03-31 | 2012-11-01 | Sumitomo Bakelite Co Ltd | Mold release film |
| JP2014121830A (en) * | 2012-12-21 | 2014-07-03 | Sumitomo Bakelite Co Ltd | Release film |
| JP2014221558A (en) * | 2011-10-31 | 2014-11-27 | 住友ベークライト株式会社 | Mold release film |
| WO2019069656A1 (en) * | 2017-10-03 | 2019-04-11 | 日本メクトロン株式会社 | Multilayer releasing film, method for producing multilayer releasing film, and method for producing flexible printed circuit |
-
2002
- 2002-03-25 JP JP2002083653A patent/JP2003276140A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006120983A1 (en) * | 2005-05-13 | 2006-11-16 | Mitsui Chemicals, Inc. | Laminate comprising 4-methyl-1-pentene polymer and release film comprising the same |
| JPWO2006120983A1 (en) * | 2005-05-13 | 2008-12-18 | 三井化学株式会社 | Laminated body containing 4-methyl-1-pentene polymer and release film comprising the same |
| JP4786657B2 (en) * | 2005-05-13 | 2011-10-05 | 三井化学株式会社 | Laminated body containing 4-methyl-1-pentene polymer and release film comprising the same |
| JP2010253854A (en) * | 2009-04-27 | 2010-11-11 | Sekisui Chem Co Ltd | Multi-layer release film |
| JP2012210762A (en) * | 2011-03-31 | 2012-11-01 | Sumitomo Bakelite Co Ltd | Mold release film |
| JP2014221558A (en) * | 2011-10-31 | 2014-11-27 | 住友ベークライト株式会社 | Mold release film |
| JP2014121830A (en) * | 2012-12-21 | 2014-07-03 | Sumitomo Bakelite Co Ltd | Release film |
| WO2019069656A1 (en) * | 2017-10-03 | 2019-04-11 | 日本メクトロン株式会社 | Multilayer releasing film, method for producing multilayer releasing film, and method for producing flexible printed circuit |
| JP2019064200A (en) * | 2017-10-03 | 2019-04-25 | 日本メクトロン株式会社 | Multilayer release film, method for producing multilayer release film, and method for producing flexible printed circuit board using the multilayer release film |
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