五、新型說明： 【新型所屬之技術領域】 本創作係有關一種散熱器扣具，尤其是一種可快速將散 熱器固定或拆離於晶片組的扣具。 【先前技術】 一般電腦的晶片組（包括BGA、QFP及CPU等），在啟動運 异時會產生高溫，若不能將其及時排除，則會影響其性能， 甚至燒毁，尤其運异速度愈快之晶片組所產生之熱量愈高， 其影響更為顯著，因此任何電腦主機均必須設有散熱裝置以 排除晶片組所產生之熱量。 所謂的散熱裝置，一般經由風扇（fans)、高熱傳導係數 的鋁(A1)、銅(Cu)所組成，透過將高熱傳導係數金屬材料與 發熱體表面層緊密黏貼，將發熱體產生的熱量傳送至該金屬 尾端，並以風扇加以吹拂，透過對流方式，維持發熱體於一 疋的工作溫度下運轉，是基本散熱模組的設計理念。 為了使得由高熱傳導係數金屬材料製作的散熱器與晶片 表面層緊密黏貼，一般皆會利用一扣件將散熱器與晶片互相 固定在一起。如第一A圖所示，習知技術之散熱器之扣件側 視圖，其中，扣件la係由框架1〇a、侧板lla以及卡條12a 所構成，侧板11a與框架l〇a的連接處尚具有複數個孔洞 13a ’而側板lla的内側亦具有一凸件i4a。 如第一 B圖所示，扣件la係藉由卡條12a與散熱器I5a 所具有的複數個散熱鰭片120a相卡固，以便將散熱器i5a 固定在正確的位置，再利用侧板lla上的凸件14a扣住晶片 M383765 16a的邊緣，使得散熱器i5a之底面能與晶片16a的表面互 相貼合’達成排除晶片16a所產生之熱能的目的。 然而習知技術之缺點在於拆組時非常不便，尤其拆卸 時’由於扣件的框架本體較厚實（這樣在貼合散熱器以及晶片 時才能具備較大的固定力量），因此單用手指的力量較不易將 扣件拆卸下來，一般是以一支一字型的螺絲起子插入扣件的 框架本體上所具有之細之後’翻向外侧财式(也就是 和配，時相反的方向）將其拆卸下來，拆卸手續非常麻須，並 且也容易傷及晶片’因此業界需要快速方便組裝拆卸之 散熱器扣具。 【新型内容】V. New description: [New technical field] This creation is about a heat sink clip, especially a clip that can quickly fix or detach the heat sink from the wafer set. [Prior Art] The general computer chipset (including BGA, QFP, CPU, etc.) will generate high temperature when starting the transport, if it can not be removed in time, it will affect its performance, even burn, especially the speed of transport The higher the heat generated by the fast chipset, the more significant the impact, so any computer host must have a heat sink to eliminate the heat generated by the chipset. The so-called heat sink is generally composed of a fan, a high thermal conductivity aluminum (A1), and copper (Cu). The heat generated by the heat generating body is transmitted by closely bonding the high heat conductivity metal material to the surface layer of the heat generating body. To the end of the metal, and blowing with a fan, through the convection method, to maintain the heating element operating at a working temperature, is the design concept of the basic cooling module. In order to make the heat sink made of a high thermal conductivity metal material closely adhere to the surface layer of the wafer, a fastener is generally used to fix the heat sink and the wafer to each other. As shown in FIG. A, a side view of a fastener of a conventional heat sink, wherein the fastener la is composed of a frame 1a, a side plate 11a and a strip 12a, and the side plate 11a and the frame 10a The joint has a plurality of holes 13a' and the inner side of the side plate 11a also has a convex member i4a. As shown in FIG. B, the fastener 1a is fastened by the card strip 12a and the plurality of heat dissipation fins 120a of the heat sink I5a to fix the heat sink i5a in the correct position, and then use the side panel 11a. The upper projection 14a is fastened to the edge of the wafer M383765 16a so that the bottom surface of the heat sink i5a can be brought into contact with the surface of the wafer 16a to achieve the purpose of eliminating the heat energy generated by the wafer 16a. However, the disadvantage of the prior art is that it is very inconvenient to disassemble, especially when disassembling 'because the frame body of the fastener is thick (so that it can have a large fixing force when the heat sink and the wafer are attached), so the power of the finger alone It is not easy to disassemble the fastener, generally it is inserted into the frame body of the fastener with a flat-shaped screwdriver, and then it is turned to the outer side (that is, in the opposite direction of the match). Disassembled, the dismantling procedure is very numb, and it is easy to damage the wafer. Therefore, the industry needs to quickly assemble and disassemble the radiator clip. [New content]
。本創作的主要目的在於提供一種散熱器扣具，在將散執 器安裝於^ _，或職熱器從晶版拆卸時，只需透單 手按壓散熱H扣具即可輕鬆快速地完麟卸或組裝，如此則 不為使用額外工具’因此非常省時省力，並且 易且結構精簡，可使用於各式散熱器扣具上。㈣作谷 體，諸技射段触含有一框 部份連結於邊框垂ί延设有一側板，該側板之中間 ^〜£ ’細喊贿鋪巧料—壓合部， 該側板低於該框體之邮八支' 邊形成有突出的至少::鉤:當二==:面: 因此本創作可有效解決技術之缺失，提供使用者一 4 M383765 種方便又快速地將㈣賴晶片互_定或分離之方式。 【實施方式】 以下配合圖式及元件符騎本創作之實施 的=，俾錄料項轉者細讀核财舰據 ,閱第-®，本創作之主要元件组合_之立體分解 圖，參閱第五®，賴叙主要元餘合叙平面剖視圖。 本創作係有關-種快速拆組式散熱器扣具，係包含有一框體 卜該框體1之形狀係可對應於散熱鄕狀或晶片形狀之至 少其中之一，如本實施例所示，該框體丨係呈矩形，該 1之至少一邊框u垂直延設有一側板13，該側板13 ^中間 郤^7係相連於該邊框11，該側板13高於該框體1之部分為 一壓合部131 ’該壓合部131可供手指按壓或藉其他適當方 式按壓，且其具有適當大小。. 該侧板13低於該框體1之部分為一固定部丨33，該固定 部133的内側面下邊形成有突出的至少一扣鉤1331，或本實 施例所示可設置兩扣勾1331，如圖所示，該壓合部〖Μ與固 定部133分別位於該側板13之上下端，因此當由外向内按壓 上端之壓合部131時，則連帶使得下端之該固定部133由内 向外被撐開，當放開壓合部131時，則固定部133回復至原 位。 一般用來將晶片組3所產生的熱量排除的散熱元件是如 第二圖所示的散熱器2，該散熱器2可以是一種鋁擠型的導 熱及散熱元件，其具有形成於一基座20上面的複數彼此平行 的散熱鰭片22，該晶片組3 ’係晶片31與載板32之相互結 5 合組成。 體圖參Ιΐί圖’本創作之第二圖之元件組合後之狀態之立 -,閱弟四圖’本創作之散熱器扣具欲組合於晶片組時 視圖。本創作所提供的前述散熱器扣具1，其 m2固定於晶片組3的組合方式，是直接將散熱器2 川庇；日日組3上面，使得晶片31接觸於散熱器2之基座 '面’然後將散熱杰扣具i套於散熱器2上，其中本創作 '裝散熱器扣具1時’只需透過直接按壓該 ^裔扣具丨的壓合部⑶，使得固定部133向外被撐開， ^日夺令散熱器扣具1的側板13的扣鉤則對合於載板32 t緣’再放開壓合部131即可扣住於晶片組3的載板32邊 、，:欲卸除散熱ϋ扣具1時，同樣地先按壓該散熱器扣具工 的屢口 4 13卜咖定部133向外被撐開，即可將散熱器2 連同散熱器2脫離晶片組3。， 、參閱第六圖至第八圖，分別顯示本創作之不同實施方 式’如圖六所不’該散熱器扣具i可於框體i之相對兩邊框 分別垂直延設_板13 ’村於框體丨另姆兩邊框内侧壁 叹置有彈性桿111以增加HJ定性，或者亦可如第七圖及第八 圖所示在框體1之二個邊框及四個邊框皆設置側板a，要 注意的是，細板1之配置位置及數量視實際需要而定，在 此僅是說·的實例而已，並_嫌制本創作的範圍。 以上所述者僅為用以解釋本創作之較佳實施例並非企 圖據以對本創作做任何形式上之限制，是以，凡有在相同之 創作精神下所作有關本創作之任何修飾或變更，皆仍應包括 在本創作意圖保護之範疇。 謂3765 【圖式簡單說明】 第一A圖為顯示習知技術之散熱器之扣件側視圖。 第一B圖為顯示第一A圖之扣件固定散熱器之示意圖。 第二圖為顯示本創作之主要元件組合關係之立體分解 圖。 第三圖為顯示本創作之第二圖之元件組合後之狀態之立 體圖。 第四圖為顯示本創作之散熱器扣具欲組合於晶片. The main purpose of this creation is to provide a heat sink clip. When the bulk device is mounted on the ^ _, or the heat exchanger is removed from the crystal plate, the heat can be easily and quickly completed by simply pressing the heat sink H button with one hand. Unloading or assembling, so it is not for the use of additional tools' so it is very time-saving and labor-saving, and easy and compact, can be used on all kinds of radiator clips. (4) For the grain body, the technical shots contain a frame part connected to the frame and are provided with a side plate. The middle side of the side plate is smashed into a squeezing piece, which is lower than the frame. The body of the eight-pieces has a prominent edge at least:: Hook: When two ==: face: Therefore, this creation can effectively solve the lack of technology, providing users with a 4 M383765 kind of convenient and fast (4) reliance on the wafer _ The way to set or separate. [Embodiment] The following is a description of the implementation of the drawing and the component of the creation of the original, and the recording of the item is read by the nuclear power ship, and the reading of the -®, the main component combination of the creation is shown in the perspective of the stereoscopic exploded view. The fifth®, the main meta-section of the main element of Lai Xu. The present invention relates to a quick-disassembling heat sink clip, which comprises a frame body, and the shape of the frame body 1 can correspond to at least one of a heat dissipation shape or a wafer shape, as shown in this embodiment. The frame body has a rectangular shape, and at least one frame u of the 1 is vertically extended with a side plate 13 , and the side plate 13 ^ is connected to the frame 11 in the middle, and the side plate 13 is higher than the frame 1 The nip 131' can be pressed by a finger or pressed in other suitable manners, and it has an appropriate size. The portion of the side panel 13 that is lower than the frame body 1 is a fixing portion 丨 33. The lower side of the inner side surface of the fixing portion 133 is formed with at least one hook 1331 protruding therefrom, or two hooks 1331 can be disposed as shown in this embodiment. As shown in the figure, the nip portion and the fixing portion 133 are respectively located at the lower end of the side plate 13, so that when the nip portion 131 of the upper end is pressed inwardly, the connecting portion 133 causes the fixing portion 133 of the lower end to be inward. The outer portion is opened, and when the nip portion 131 is released, the fixing portion 133 is returned to the original position. The heat dissipating component generally used to remove the heat generated by the wafer set 3 is the heat sink 2 as shown in the second figure. The heat sink 2 may be an aluminum extruded heat conducting and dissipating component having a base formed on a base. The upper plurality of heat dissipation fins 22 are parallel to each other, and the wafer set 3' is formed by a combination of the wafer 31 and the carrier 32. The figure of the figure is the state of the combination of the components of the second picture of this creation - and the four figures of the reading brother's heat sink clips of this creation are to be combined in the wafer group view. The above-mentioned heat sink clip 1 provided by the present invention has a m2 fixed to the combination of the wafer set 3, and directly connects the heat sink 2; the top of the day group 3, so that the wafer 31 contacts the base of the heat sink 2' Then, the heat-dissipating clip i is placed on the heat sink 2, wherein the original 'installation of the heat-dissipating clip 1' is only required to directly press the nip portion (3) of the 扣 buckle, so that the fixing portion 133 The outer cover is opened, and the hook of the side plate 13 of the heat sink clip 1 is engaged with the carrier edge 32 t edge and the nip portion 131 is released to be fastened to the side of the carrier 32 of the chip set 3 ,: When the heat-dissipating buckle 1 is to be removed, the heat-dissipating device can be disengaged from the heat sink 2 by first pressing the heat-dissipating device of the heat-dissipating device. Wafer group 3. , refer to the sixth to eighth figures, respectively showing different implementations of the creation 'as shown in Figure 6'. The radiator clip i can be vertically extended in the opposite frame of the frame i. The elastic rod 111 is slanted on the inner side wall of the frame and the other side of the frame to increase the HJ character, or the side plate a may be disposed on the two frames and the four frames of the frame 1 as shown in the seventh and eighth figures. It should be noted that the position and quantity of the thin plate 1 are determined according to actual needs, and this is only an example of the case, and the scope of the creation is suspected. The above description is only for the purpose of explaining the preferred embodiment of the present invention and is not intended to limit the present invention in any way. Therefore, any modification or alteration of the creation made in the same creative spirit, They should still be included in the scope of this creative intent. 3765 [Simple description of the drawing] The first A is a side view of the fastener showing the heat sink of the prior art. The first B is a schematic view showing the fastener fixing the heat sink of the first A diagram. The second figure is a perspective exploded view showing the main component combination relationship of this creation. The third figure is a perspective view showing the state of the components of the second drawing of the present creation. The fourth picture shows the heat sink clips of this creation to be combined on the wafer.
組時之 平面動作剖視圖。 =五圖為顯示本創作之主要元餘合後之平面剖視圖 第六圖為顯示本創作之散熱器扣具之第—實施例。 第七圖為顯示本創作之％ 、 第八圖顯示為本以=扣具之第二實施例。 政熱器扣具之第三實施例。 【主要元件符號說明】A cross-sectional view of the plane action in the group. = Figure 5 is a plan sectional view showing the main meta-combination of the creation. The sixth figure shows the first embodiment of the heat sink fastener of the present invention. The seventh figure shows the % of the present creation, and the eighth figure shows the second embodiment of the present. A third embodiment of a thermal heater. [Main component symbol description]
la 扣件 10a框架 12a卡條 13a孔洞 14a凸件 I 框體 II 邊框 13、11a側板 131壓合部 133固定部 7 M383765 1331扣鉤 2、15a散熱器 20基座 22、120a散熱鰭片 3晶片组 16a、31晶片 32載板La fastener 10a frame 12a clip 13a hole 14a projection I frame II frame 13, 11a side plate 131 nip portion 133 fixing portion 7 M383765 1331 clasp 2, 15a heat sink 20 base 22, 120a heat sink fin 3 wafer Group 16a, 31 wafer 32 carrier board