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TWI292000B - - Google Patents

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Publication number
TWI292000B
TWI292000B TW091116592A TW91116592A TWI292000B TW I292000 B TWI292000 B TW I292000B TW 091116592 A TW091116592 A TW 091116592A TW 91116592 A TW91116592 A TW 91116592A TW I292000 B TWI292000 B TW I292000B
Authority
TW
Taiwan
Prior art keywords
plating
tank
plating solution
plating treatment
glass
Prior art date
Application number
TW091116592A
Other languages
English (en)
Chinese (zh)
Inventor
Keiichi Sawai
Hajime Oda
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Application granted granted Critical
Publication of TWI292000B publication Critical patent/TWI292000B/zh

Links

Classifications

    • H10W72/012—
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • H10P14/47—
    • H10W72/251—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW091116592A 2001-07-25 2002-07-25 TWI292000B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001225130A JP4014827B2 (ja) 2001-07-25 2001-07-25 メッキ処理装置

Publications (1)

Publication Number Publication Date
TWI292000B true TWI292000B (ja) 2008-01-01

Family

ID=19058174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091116592A TWI292000B (ja) 2001-07-25 2002-07-25

Country Status (6)

Country Link
US (1) US20040206622A1 (ja)
JP (1) JP4014827B2 (ja)
KR (1) KR100591706B1 (ja)
CN (1) CN1292099C (ja)
TW (1) TWI292000B (ja)
WO (1) WO2003010366A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295032B2 (ja) * 2003-07-22 2009-07-15 大日本スクリーン製造株式会社 めっき装置
JP4707941B2 (ja) * 2003-09-02 2011-06-22 アルメックスＰｅ株式会社 めっき処理装置およびめっき処理方法
BRPI0418677A (pt) * 2004-03-23 2007-06-05 Glomax S R L processo aparelho e planta para o revestimento eletrogalvánico de artigos metálicos
CN103834974B (zh) * 2012-11-20 2016-10-05 宝山钢铁股份有限公司 一种实现金属带镀层厚度均匀分布的水平式电镀槽装置
JP6180893B2 (ja) * 2013-11-13 2017-08-16 矢崎総業株式会社 メッキ装置
EP3000918B1 (de) * 2014-09-24 2018-10-24 topocrom systems AG Verfahren zum galvanischen aufbringen einer oberflächenbeschichtung
KR20180081094A (ko) 2015-11-05 2018-07-13 토포크롬 시스템스 아게 표면 코팅의 전기화학적 적용을 위한 방법 및 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446331A (en) * 1944-02-14 1948-08-03 William Marsh Rice Inst For Th Electrodeposition of aluminum
US4322281A (en) * 1980-12-08 1982-03-30 Olin Corporation Method for controlling foaming within gas-liquid separation area
JP2624703B2 (ja) * 1987-09-24 1997-06-25 株式会社東芝 バンプの形成方法及びその装置
JP2535454Y2 (ja) * 1992-06-29 1997-05-14 新日本製鐵株式会社 金属板の両面電解装置
JP3308333B2 (ja) * 1993-03-30 2002-07-29 三菱電機株式会社 電解メッキ装置，及び電解メッキ処理方法
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
US6010610A (en) * 1996-04-09 2000-01-04 Yih; Pay Method for electroplating metal coating(s) particulates at high coating speed with high current density
US5911865A (en) * 1997-02-07 1999-06-15 Yih; Pay Method for electroplating of micron particulates with metal coatings
US6231728B1 (en) * 1996-11-22 2001-05-15 Hubert F. Metzger Electroplating apparatus
US6113769A (en) * 1997-11-21 2000-09-05 International Business Machines Corporation Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal
US6151558A (en) * 1998-02-10 2000-11-21 Conant; James R Ultrasonic marine speedometer system
US6576110B2 (en) * 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US6413390B1 (en) * 2000-10-02 2002-07-02 Advanced Micro Devices, Inc. Plating system with remote secondary anode for semiconductor manufacturing

Also Published As

Publication number Publication date
CN1535331A (zh) 2004-10-06
KR100591706B1 (ko) 2006-06-20
CN1292099C (zh) 2006-12-27
KR20040019355A (ko) 2004-03-05
JP4014827B2 (ja) 2007-11-28
US20040206622A1 (en) 2004-10-21
JP2003034897A (ja) 2003-02-07
WO2003010366A1 (en) 2003-02-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees