1286627 玖、發明說明： 【發明所屬^技術領域】 發明所屬之技術領域 本發明係有關於液晶顯示裝置之基板貼合裝置。 5 【先前技 習知技術 液晶顯不裝置由一對基板及插入該等基板間之液晶所 構成。例如’一對基板之其中一基板為形成TFT2TFT基 板，而另一基板為形成濾光片之濾光片基板。於其中一基 10板形成由光硬化性密封劑所構成之環狀密封劑，在貼合一 對基板後’藉由照射紫外線使環狀密封劑硬化。液晶則插 入環狀密封劑所圍住的領域。 在過去的液晶顯示裝置之製造方法中，液晶係在貼合 一對基板後，在真空室内從設於環狀密封劑之注入孔注 15入。然後，當環狀密封劑之注入孔堵塞時，則將由一對基 板所構成之液晶面板搬送至真空室外部，並對環狀密封劑 加壓，以形成適當的液晶盒間隙。 最近，出現稱作滴下注入法之液晶顯示裝置的製造方 法(例如，參照專利文獻1)。滴下注入法係在其中一基板形 20 成環狀密封劑，且將液晶滴至該基板之環狀密封劑内。然 後，在真空室内貼合一對基板。然後，藉由照射紫外線或 併用照射紫外線與加熱使環狀密封劑硬化。利用滴下注入 法，可縮短製造步驟，並降低液晶顯示裝置之製造成本。 【專利文獻1】 1286627 曰本專利公開公報特開平U 一 326857號 發明欲解決之課題 為了在真空室内貼合一對基板，因此，分別藉由基板 搬送臂部將一對基板搬送至真空室内一對靜電真空吸盤的 5位置。其中一基板係載置於位於下方之靜電真空吸盤上， 另基板則配置於位於上方之靜電真空吸盤下。由於在可 保持於位於上方之靜電真空吸盤之基板的基板下面側形成 有U小圖案，故必須保持基板之周邊部來搬送該基板，使 基板搬送臂部不要接觸到微小圖案，因此，基板之中央部 ⑺會/又有支撐物，如此一來，會有在基板之中央部因重力而 彎曲之狀態下搬送該基板之傾向。 靜電真空吸盤包含用以產生靜電吸附力之電極及藉由 真空吸附力來保持基板之真空吸附孔。基板一開始藉由真 空吸附力來保持，後來則藉由靜電吸附力來保持。當藉由 15靜電真空吸盤來真空吸附基板時，隨著基板之大型化，會 有基板在育曲成某種程度之狀態下搬送至靜電真空吸盤的 位置並進行真空吸附的情況發生。此時，由於從最初與靜 電真空吸盤接觸的部分(周邊部）來吸附基板，因此，會從基 板之周邊部開始產生真空吸附，最後再吸附中央部。如此 20 -來，、相會集中在基板之中央部，而無法避免彎曲的情 況毛生H1此，在為了貼合一對基板而進行定位時，貼合 標諸無法位於正確的位置，而發生定位不良的問題。 又，為了進行基板之定位，必須在真空中移動載置有 基板之邊電真空吸盤。靜電真空吸盤配置於真空室内，其 1286627 移動機構配置於真空室外。 Γ盤之軸及用以覆蓋該轴之蛇腹狀彈=固^^= D移動之㈣部係透戟 般銘叙产先 弹拴體内之軸使靜電直空势 在為了定位而移動靜電真空吸盤時，蛇腹肤强 降低之虞。 糾體之破知導致設備運轉率 曲地保持於靜電 本發明之目的在於提供可使基板不彎 真空吸盤之基板貼合裝置。 10 本發明之另一目 之基板貼合裝置。 的在於提供可使料耐纽佳地運作 t 明内容2 發明概要 根據本發明之基板貼合裝置包含··真 空吸盤，係配置於前述真空室，且具有用以保持第 15真空吸附孔；第2靜電真空吸盤，係配置於前述真空室中且 與雨述第1靜電真空吸盤相向，且具有用以保持第2基板之 真空吸附孔；及吸盤，係至少設於前述第1及第2靜電真空 吸盤其t~者’且可吸附相關之基板的中央部。 根據該構造，當真空吸附基板時，可從申央部來吸附， 〇 X避免基板之周邊部因吸附導致基板彎曲。 又根據本發明之基板貼合裝置包含：真空室；第1 靜電真空吸盤，係配置於前述真空室，且具有用以保持第1 基板之真空吸附孔；第2靜電真空吸盤，係配置於前述真空 室中且與前述第1靜電真空吸盤相向，且具有用以保持第2 1286627 基板之真空吸附孔；第1移動機構，可使前述第1靜電真空 吸盤升降；及第2移動機構，讀前述第2靜電真空吸盤至 少朝XY方向移動，又，前述第2移動機構包含：轴，係用 以結合位於前述真空室内之前述第2靜電真空吸盤與位於 5前述真空室外之驅動機構；剛性體，係用以覆蓋前述轴； 及磁流體密封劑，係配置於前述軸與前述剛性體之間。 根據該構造，第2移動機構包含··軸，係用以結合可朝 XY方向移動之第2靜電真空吸盤與位於真空室外之驅動機 構，剛性體，係用以覆蓋前述軸；及磁流體密封劑，係配 10置於所述轴與前述剛性體之間。如此一來，藉由以剛性體 及磁密封劑將軸之周圍保持成氣密狀態，可使用以覆蓋輛 之周圍的構造物不會產生應力。 圖式簡單說明 第1圖係顯示一實施例之液晶顯示裝置的其中一基板 15 之透視圖。 第2圖係顯示根據本發明之液晶顯示裝置的基板貼合 裝置。 口 第3圖係顯示上靜電真空吸盤的例子之概略平面圖。 第4圖係顯示基板藉由基板搬送臂部配置於上靜電真 20 空吸盤下之情形。 一 第5圖係顯示基板抵達上靜電真空吸盤下方時吸附墊 下降並吸附基板之中央部的情形。 第6圖係顯示基板吸附於上靜電真空吸盤之情形。 第7圖係顯示本發明之另一實施例。 1286627 第8圖為第7圖之部分放大圖。 I[實方包方式】 發明之實施形態 以下’針對本發明之實施例參照圖式作說明。液晶顯 5示裝置由一對基板10、12及插入一對基板間之液晶14所構 成。液晶顯示裝置藉由滴下注入法來製造。一對基板中之 其中一基板為形成TFT之TFT基板，而另一基板為形成濾光 片之慮光片基板。 第1圖係顯示一實施例之液晶顯示裝置的其中一基板 10之透視圖。其中一基板10包含環狀密封劑13。液晶14從移 動中之分配器16以液滴狀滴至基板1〇上由環狀密封劑13所 圍住的領域。形成環狀密封劑13之密封劑由UV硬化性接著 性樹脂或藉由併用UV與熱來硬化之接著性樹脂所構成。另 準備另一基板12(第2圖中未圖示）。將密封劑塗布於基板 15 10，且在基板10貼合於另一基板12後使其硬化。於另一基 板12塗上將接著劑塗布於間隔材之接著性間隔材。亦可設 置柱狀物來取代間隔材，以省去間隔材散佈步驟。 第2圖係顯示根據本發明之液晶顯示裝置的基板貼合 裝置。第2圖中，液晶顯示裝置之基板貼合裝置20包含真空 2〇室22。真空室22由可動之上殼罩24及固定之下殼罩26所構 成。第2圖係顯示開放真空室22的狀態。由第2圖之狀態可 知，一旦上殼罩24朝下殼罩26下降，則會關閉真空室22。 真空室22為了排出真空室22内的氣體，故與真空泵相連接。 下靜電真空吸盤（或下靜電真空夾盤)28係直接或藉由 1286627 適當的定盤設於下殼罩26，並藉由軸30與ΧΥ0驅動裝置32 相結合。下靜電真空吸盤28具有未圖示之公知電極，藉由 使該電極通電所產生之靜電力將基板保持於下靜電真空吸 盤28上，並將液晶14滴至載置於下靜電真空吸盤28上之基 5 板。又，下靜電真空吸盤28具有真空吸附孔。真空吸附孔 朝下靜電真空吸盤28之表面開口，且藉由從真空源所供給 之真空力來保持配置於下靜電真空吸盤28上之基板。未圖 示之升降桿係可升降地配置於設於下靜電真空吸盤28之垂 直的孔穴内。 10 上靜電真空吸盤（或上靜電真空夾盤）34係直接或藉由 適當的定盤設於上殼罩24，並藉由軸36與升降驅動裝置38 相結合。上靜電真空吸盤34具有未圖示之公知電極，藉由 使該電極通電所產生之靜電力將基板保持於上靜電真空吸 盤34下。又，上靜電真空吸盤34具有真空吸附孔40。 15 第3圖係顯示上靜電真空吸盤34的例子之概略平面 圖。真空吸附孔40係整體地分布配置於上靜電真空吸盤34 表面。下靜電真空吸盤28之真空吸附孔亦相同。上靜電真 空吸盤34之真空吸附孔40及下靜電真空吸盤28之真空吸附 孔分別藉由未圖示之閥與真空源相連接。 20 吸盤42係設於上靜電真空吸盤34之中央部。吸盤42係 配置成其表面與上靜電真空吸盤34之表面成為同一面， 且，該吸盤42可移動，以從上靜電真空吸盤34表面朝下方 突出。吸盤42之軸部係貫通延伸於上靜電真空吸盤34中， 且與未圖示之驅動機構相結合。 10 1286627 第2圖中，上殼罩24與下殼罩26分開，真空室22呈開放 狀態。在該狀態下，第1及第2基板1〇、12分別藉由基板搬 送臂部搬送至真空室22。如第1圖所示，其中一基板10為滴 有液晶之基板，且載置於下靜電真空吸盤28上。另一基板 5 12則配置於上靜電真空吸盤34下。 第4圖係顯示基板12藉由基板搬送臂部44配置於上靜 電真空吸盤34下之情形。由於在可保持於上靜電真空吸盤 34之基板12的基板下面側形成有微小圖案，故必須保持基 板12之周邊部來搬送該基板，使基板搬送臂部44不要接觸 10到微小圖案，因此，基板12之中央部會沒有支撐物，如此 一來，基板12之中央部會有因重力而彎曲的傾向。 第5圖係顯示基板12抵達上靜電真空吸盤34下方時吸 盤42下降並吸附基板12之中央部的情形。第6圖係顯示基板 12真空吸附於上靜電真空吸盤34之情形。吸盤42係將基板 15 12之中央部吸起，使基板12從下凸狀態成為上凸狀態。然 後，基板搬送臂部44與吸盤42同時上升，且上靜電真空吸 盤34真空吸附基板12。 如此一來，可使基板12之中央部最先吸附於上靜電真 空吸盤34，且基板π之吸附朝基板12之周邊部擴展，並如 20 第6圖所示，基板12以平坦之姿勢真空吸附於上靜電真空吸 盤34。雖然於實施例中，在上靜電真空吸盤34之中央部設 置吸盤42，但，可將多數吸盤42設於多數位置，且控制吸 附，藉此一面修正彎曲，一面從任一位置進行吸附。另， 由於可保持於下靜電真空吸盤28之基板1〇呈下凸狀態， 1286627 又’藉由未圖示之升降桿下降至下靜電真空吸盤28上，故 不會特別藉由吸盤來調整基板10的姿勢。 基板12、10首先藉由真空吸附力吸附於上下靜電真空 吸盤34、28。然後，使電流流向上下靜電真空吸盤34、28 5的電極’如此一來，基板12、10可藉由靜電吸附力吸附於 上下靜電真空吸盤34、28。因此，在藉由真空吸附將基板 12、10緊密地配置於上下靜電真空吸盤34、28表面之狀態 下使靜電吸附力產生作用，藉此，可在吸附力上得到偏差 少且穩定的靜電吸附力。然後，停止真空吸附。 1〇 然後，將可動之上殼罩24推壓至下殼罩26，以封閉真 空室22。然後，排出真空室22内部的氣體，使真空室22内 部成為真空狀態。接著，使上靜電真空吸盤34朝下靜電真 空吸盤28移動，且將基板12朝基板1〇推壓，使基板12之表 面與基板10之環狀密封劑13接觸，並使基板12之間隔材與 15基板1〇之表面接觸。首先，在進行初步貼合後，藉由CCD 照相機等讀取基板12、10之調正標誌，且在該結果下，一 面微調下靜電真空吸盤28的位置，一面對準調正標諸。最 後，-面使上靜電真空吸盤34相對於下靜電真空吸盤職 續下降，並進行加壓，一面進行貼合。 2〇 在藉由至此之一連串的動作結束基板12、10之貼合 後，使真空室22開放於大氣，以開放真空室22。接著，停 止通電至上下靜電真空吸盤34、28之電極，而解除基板i2T、 10之保持。然後，使上靜電真空吸盤34上升，而所貼合之 基板12、職於下靜電真空讀28h接著，使設於下靜 12 1286627 電真空吸盤28之升降桿上升，以抬起貼合完畢之基板 抬起之貼合完畢的基板藉由設置於下游側之搬送機器人朝 下一步驟搬送，且照射紫外線使環狀密封劑13硬化。 第7圖係顯示本發明之另一實施例。第8圖為第7圖之邱 5分放大圖。第7圖及第8圖中，與第2圖之構件相同的構件則 賦予同樣的參照符號，並省略重複的說明。第2圖中， 卜靜 電真空吸盤（或下靜電真空夾盤)28藉由軸3〇與χγ0驅動妒 置32相結合，且軸3〇的周圍藉由例如蛇腹狀彈性體（未圖示） 密封成氣密狀態。 10 第7圖及第8圖中，下靜電真空吸盤（或下靜電真空夹 盤）28藉由軸30與ΧΥ0驅動裝置32相結合，且由剛性管5〇 來覆蓋軸30，並將磁流體密封劑52配置於軸3〇與剛性管外 之間。軸30的周圍由磁流體密封劑52密封成氣密狀態。 即’用以使下靜電真空吸盤28移動之移動裝置由用以 15結合位於真空室22内之下靜電真空吸盤28與位於真空室22 外之ΧΥ0驅動裝置（驅動機構)32之軸3〇、用以覆蓋軸3〇之 剛性管（剛性體）及配置於軸30與剛性管5〇之間的磁流體密 封劑52所構成。而且，永久磁石54配置於剛性管5〇之内面 側’且與永久磁石5 4接觸之磁極片5 6、5 8會將磁力傳達至 2〇磁流體密封劑52。磁流體密封劑52可藉由永久磁石54的磁 力保持於預定位置。 由於將下靜電真空吸盤28之移動裝置設置於真空室22 内會使真空室22的容積變大，而對製作真空時不利，故設 置於真空至22外之大氣中。移動裝置的運動係透過軸3〇傳 13 1286627 達至下靜電真空吸盤28。為了使軸30之周圍成為真空領域 60，且將該部分保持成真空，因此使用磁流體密封劑52。 藉由使用磁流體密封劑52，可提供剛性體50不會產生應 力，且零件可耐久性佳地運作之基板貼合裝置。另，亦可 5 將第7圖及第8圖之實施例的特徵加入第2實施例。 發明之效果 如上所述，根據本發明，可得到基板不彎曲、零件之 耐久性佳、產率、運轉率高之基板貼合裝置。 I：圖式簡單說明3 10 第1圖係顯示一實施例之液晶顯示裝置的其中一基板 之透視圖。 第2圖係顯示根據本發明之液晶顯示裝置的基板貼合 裝置。 第3圖係顯示上靜電真空吸盤的例子之概略平面圖。 15 第4圖係顯示基板藉由基板搬送臂部配置於上靜電真 空吸盤下之情形。 第5圖係顯示基板抵達上靜電真空吸盤下方時吸附墊 下降並吸附基板之中央部的情形。 第6圖係顯示基板吸附於上靜電真空吸盤之情形。 20 第7圖係顯示本發明之另一實施例。 第8圖為第7圖之部分放大圖。 【圖式之主要元件代表符號表】 10、12…基板 14…液晶 13…環狀密封劑 16…分配器 14 1286627[Technical Field] The present invention relates to a substrate bonding apparatus for a liquid crystal display device. 5 [Prior Art] A liquid crystal display device is composed of a pair of substrates and a liquid crystal interposed between the substrates. For example, one of the substrates of the pair of substrates is a TFT2 TFT substrate, and the other substrate is a filter substrate forming a filter. An annular sealant composed of a photocurable sealant is formed on one of the base sheets 10, and after the pair of substrates are bonded, the annular sealant is cured by irradiation of ultraviolet rays. The liquid crystal is inserted into the area enclosed by the annular sealant. In the conventional method of manufacturing a liquid crystal display device, after a pair of substrates are bonded to each other, the liquid crystal is injected from an injection hole provided in an annular sealant in a vacuum chamber. Then, when the injection hole of the annular sealant is clogged, the liquid crystal panel composed of a pair of substrates is transferred to the outside of the vacuum chamber, and the annular sealant is pressurized to form a proper cell gap. Recently, a manufacturing method of a liquid crystal display device called a dropping injection method has appeared (for example, refer to Patent Document 1). The dropping injection method is formed into a ring-shaped sealant in one of the substrates, and the liquid crystal is dropped into the annular sealant of the substrate. Then, a pair of substrates are bonded in the vacuum chamber. Then, the annular sealant is cured by irradiation with ultraviolet rays or by irradiation with ultraviolet rays and heating. With the dropping injection method, the manufacturing steps can be shortened and the manufacturing cost of the liquid crystal display device can be reduced. [Patent Document 1] Japanese Patent Application Laid-Open No. Hei No. 326 857. The object of the invention is to solve the problem of bonding a pair of substrates in a vacuum chamber. Therefore, a pair of substrates are transported to the vacuum chamber by the substrate transfer arm portions. 5 positions on the electrostatic vacuum chuck. One of the substrates is placed on the electrostatic vacuum chuck located below, and the other substrate is placed under the electrostatic vacuum chuck located above. Since the U small pattern is formed on the lower surface side of the substrate which can be held on the substrate of the electrostatic vacuum chuck located above, it is necessary to hold the peripheral portion of the substrate to transport the substrate, so that the substrate transfer arm does not contact the minute pattern, and therefore, the substrate The central portion (7) will have a support, and in this case, the substrate will be conveyed in a state where the center portion of the substrate is bent by gravity. The electrostatic vacuum chuck includes an electrode for generating electrostatic attraction and a vacuum adsorption hole for holding the substrate by vacuum adsorption. The substrate is initially held by the vacuum adsorption force and then held by the electrostatic adsorption force. When the substrate is vacuum-adsorbed by the 15 electrostatic vacuum chuck, as the substrate is enlarged, the substrate is transferred to the position of the electrostatic vacuum chuck in a state of being bent to some extent, and vacuum adsorption occurs. At this time, since the substrate is adsorbed from the portion (peripheral portion) that first comes into contact with the electrostatic vacuum chuck, vacuum suction is generated from the peripheral portion of the substrate, and finally the central portion is adsorbed. In this way, the phase is concentrated in the central portion of the substrate, and the bending cannot be avoided. In the case of positioning for bonding a pair of substrates, the bonding target cannot be located at the correct position. Poor positioning. Further, in order to position the substrate, it is necessary to move the electric vacuum chuck on which the substrate is placed in a vacuum. The electrostatic vacuum chuck is disposed in the vacuum chamber, and the 1286627 moving mechanism is disposed outside the vacuum chamber. The axis of the disk and the snake-shaped bullet that covers the axis = solid ^ ^ = D movement (four) is the same as the axis of the first body of the magazine, so that the electrostatic straight space moves the electrostatic vacuum for positioning. When the sucker is sucked, the snake's stomach is strongly reduced. The breakage of the correcting body results in a device operating rate. The object is to maintain the static electricity. The object of the present invention is to provide a substrate bonding apparatus which can prevent the substrate from bending the vacuum chuck. 10 Another object of the present invention is a substrate bonding apparatus. The present invention provides a substrate bonding apparatus comprising: a vacuum chuck disposed in the vacuum chamber and having a 15th vacuum adsorption hole; The electrostatic vacuum chuck is disposed in the vacuum chamber and opposed to the first electrostatic vacuum chuck of the rain, and has a vacuum adsorption hole for holding the second substrate; and the suction cup is provided at least in the first and second static electricity The vacuum chuck has a t~' and can adsorb the central portion of the associated substrate. According to this configuration, when the substrate is vacuum-adsorbed, it can be adsorbed from the center portion, and 〇X prevents the peripheral portion of the substrate from being bent due to adsorption. Further, the substrate bonding apparatus according to the present invention includes: a vacuum chamber; the first electrostatic vacuum chuck is disposed in the vacuum chamber and has a vacuum suction hole for holding the first substrate; and the second electrostatic vacuum chuck is disposed in the foregoing a vacuum chamber that faces the first electrostatic vacuum chuck and has a vacuum suction hole for holding the second 1286627 substrate; the first moving mechanism can raise and lower the first electrostatic vacuum chuck; and the second moving mechanism reads the foregoing The second electrostatic vacuum chuck moves at least in the XY direction, and the second moving mechanism includes a shaft for coupling the second electrostatic vacuum chuck located in the vacuum chamber and a driving mechanism located outside the vacuum chamber 5; the rigid body; And a magnetic fluid sealant disposed between the shaft and the rigid body. According to this configuration, the second moving mechanism includes a shaft for combining the second electrostatic vacuum chuck movable in the XY direction and a driving mechanism located outside the vacuum chamber, and the rigid body is for covering the shaft; and the magnetic fluid seal The agent 10 is placed between the shaft and the aforementioned rigid body. In this way, by surrounding the shaft with a rigid body and a magnetic sealant in an airtight state, it is possible to use a structure for covering the periphery of the vehicle without generating stress. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a substrate 15 of a liquid crystal display device of an embodiment. Fig. 2 is a view showing a substrate bonding apparatus of a liquid crystal display device according to the present invention. Port 3 is a schematic plan view showing an example of an electrostatic vacuum chuck. Fig. 4 shows a case where the substrate is placed under the upper electrostatic chuck by the substrate transfer arm. A fifth figure shows a case where the adsorption pad is lowered and the central portion of the substrate is adsorbed when the substrate reaches the upper electrostatic vacuum chuck. Figure 6 shows the substrate adsorbed to the upper electrostatic vacuum chuck. Figure 7 shows another embodiment of the present invention. 1286627 Figure 8 is a partial enlarged view of Figure 7. I [Solid Package Method] Embodiments of the Invention Hereinafter, embodiments of the present invention will be described with reference to the drawings. The liquid crystal display device is composed of a pair of substrates 10, 12 and a liquid crystal 14 interposed between a pair of substrates. The liquid crystal display device is manufactured by a dropping injection method. One of the pair of substrates is a TFT substrate on which a TFT is formed, and the other substrate is a light-sensitive sheet substrate on which a filter is formed. Fig. 1 is a perspective view showing one of the substrates 10 of the liquid crystal display device of an embodiment. One of the substrates 10 includes an annular sealant 13. The liquid crystal 14 is dropped from the dispenser 16 in the movement into the field surrounded by the annular sealant 13 in the form of droplets. The sealant forming the annular sealant 13 is composed of a UV curable adhesive resin or an adhesive resin which is cured by using UV and heat in combination. Another substrate 12 (not shown in Fig. 2) is prepared. The sealant is applied to the substrate 15 10 and cured after the substrate 10 is bonded to the other substrate 12. An adhesive spacer is applied to the other substrate 12 to apply an adhesive to the spacer. Columns may be provided instead of spacers to eliminate the spacer spreading step. Fig. 2 is a view showing a substrate bonding apparatus of a liquid crystal display device according to the present invention. In Fig. 2, the substrate bonding apparatus 20 of the liquid crystal display device includes a vacuum chamber 22. The vacuum chamber 22 is constructed of a movable upper casing 24 and a fixed lower casing 26. Fig. 2 shows the state of the open vacuum chamber 22. As is apparent from the state of Fig. 2, once the upper casing 24 is lowered toward the lower casing 26, the vacuum chamber 22 is closed. The vacuum chamber 22 is connected to a vacuum pump in order to discharge the gas in the vacuum chamber 22. The lower electrostatic vacuum chuck (or lower electrostatic vacuum chuck) 28 is attached to the lower casing 26 either directly or by a suitable disk of 1286627 and is coupled to the 驱动0 drive unit 32 by the shaft 30. The lower electrostatic vacuum chuck 28 has a known electrode (not shown), and the substrate is held on the lower electrostatic vacuum chuck 28 by the electrostatic force generated by energizing the electrode, and the liquid crystal 14 is dropped onto the lower electrostatic vacuum chuck 28. Based on 5 boards. Further, the lower electrostatic vacuum chuck 28 has a vacuum suction hole. The vacuum suction hole is opened toward the surface of the lower electrostatic vacuum chuck 28, and the substrate disposed on the lower electrostatic vacuum chuck 28 is held by the vacuum force supplied from the vacuum source. The lifter, not shown, is vertically movable in a vertical hole provided in the lower electrostatic vacuum chuck 28. The upper electrostatic vacuum chuck (or upper electrostatic vacuum chuck) 34 is attached to the upper casing 24 directly or by a suitable plate and is coupled to the lift drive 38 by a shaft 36. The upper electrostatic vacuum chuck 34 has a known electrode (not shown), and the substrate is held under the upper electrostatic vacuum chuck 34 by an electrostatic force generated by energizing the electrode. Further, the upper electrostatic vacuum chuck 34 has a vacuum suction hole 40. 15 Fig. 3 is a schematic plan view showing an example of the upper electrostatic vacuum chuck 34. The vacuum adsorption holes 40 are integrally distributed on the surface of the upper electrostatic vacuum chuck 34. The vacuum suction holes of the lower electrostatic vacuum chuck 28 are also the same. The vacuum suction holes 40 of the upper electrostatic chuck 34 and the vacuum suction holes of the lower electrostatic vacuum chuck 28 are connected to a vacuum source by valves (not shown). 20 The suction cup 42 is disposed at a central portion of the upper electrostatic vacuum chuck 34. The chuck 42 is disposed such that its surface is flush with the surface of the upper electrostatic vacuum chuck 34, and the chuck 42 is movable to protrude downward from the surface of the upper electrostatic vacuum chuck 34. The shaft portion of the suction cup 42 extends through the upper electrostatic vacuum chuck 34 and is coupled to a drive mechanism (not shown). 10 1286627 In Fig. 2, the upper casing 24 is separated from the lower casing 26, and the vacuum chamber 22 is open. In this state, the first and second substrates 1 and 12 are transported to the vacuum chamber 22 by the substrate transfer arm portions, respectively. As shown in Fig. 1, one of the substrates 10 is a substrate on which liquid crystal is dropped, and is placed on the lower electrostatic vacuum chuck 28. The other substrate 5 12 is disposed under the upper electrostatic vacuum chuck 34. Fig. 4 shows a case where the substrate 12 is placed under the upper static vacuum chuck 34 by the substrate transfer arm portion 44. Since a minute pattern is formed on the lower surface side of the substrate that can be held by the upper electrostatic vacuum chuck 34, it is necessary to hold the peripheral portion of the substrate 12 to transport the substrate, so that the substrate transfer arm portion 44 does not contact 10 to a minute pattern. There is no support in the central portion of the substrate 12, and as a result, the central portion of the substrate 12 tends to be bent by gravity. Fig. 5 is a view showing a state in which the chuck 42 is lowered and the central portion of the substrate 12 is adsorbed when the substrate 12 reaches below the upper electrostatic vacuum chuck 34. Fig. 6 shows the case where the substrate 12 is vacuum-adsorbed to the upper electrostatic vacuum chuck 34. The chuck 42 sucks up the central portion of the substrate 15 12 to bring the substrate 12 from the lower convex state to the upper convex state. Then, the substrate transfer arm portion 44 and the suction cup 42 are simultaneously raised, and the upper electrostatic vacuum suction cup 34 vacuum-adsorbs the substrate 12. In this way, the central portion of the substrate 12 can be first adsorbed to the upper electrostatic vacuum chuck 34, and the adsorption of the substrate π is expanded toward the peripheral portion of the substrate 12, and as shown in Fig. 6, the substrate 12 is vacuumed in a flat posture. Adsorbed to the upper electrostatic vacuum chuck 34. In the embodiment, the suction cup 42 is provided at the center of the upper electrostatic vacuum chuck 34. However, the plurality of suction cups 42 can be placed at a plurality of positions, and the suction can be controlled, whereby the bending can be performed while adsorbing from any position. In addition, since the substrate 1 可 which can be held by the lower electrostatic vacuum chuck 28 is in a downward convex state, 1286627 is further lowered onto the lower electrostatic vacuum chuck 28 by a lifting rod (not shown), so that the substrate is not adjusted particularly by the suction cup. 10 poses. The substrates 12, 10 are first adsorbed to the upper and lower electrostatic vacuum chucks 34, 28 by vacuum suction. Then, the current is caused to flow up and down the electrodes of the electrostatic vacuum chucks 34, 28 5 such that the substrates 12, 10 can be adsorbed to the upper and lower electrostatic vacuum chucks 34, 28 by electrostatic attraction. Therefore, when the substrates 12 and 10 are closely placed on the surfaces of the upper and lower electrostatic vacuum chucks 34 and 28 by vacuum suction, the electrostatic adsorption force acts, whereby the adsorption force can be less and the stable electrostatic adsorption can be obtained. force. Then, the vacuum adsorption is stopped. 1〇 Then, the movable upper casing 24 is pushed to the lower casing 26 to close the vacuum chamber 22. Then, the gas inside the vacuum chamber 22 is discharged, and the inside of the vacuum chamber 22 is brought into a vacuum state. Next, the upper electrostatic vacuum chuck 34 is moved toward the lower electrostatic vacuum chuck 28, and the substrate 12 is pressed toward the substrate 1 to bring the surface of the substrate 12 into contact with the annular sealant 13 of the substrate 10, and the spacer of the substrate 12 is placed. It is in contact with the surface of the 15 substrate. First, after the preliminary bonding, the alignment marks of the substrates 12 and 10 are read by a CCD camera or the like, and under the result, the position of the electrostatic vacuum chuck 28 is finely adjusted on one side, and the alignment marks are aligned. Finally, the upper surface of the electrostatic vacuum chuck 34 is lowered relative to the lower electrostatic vacuum chuck, and pressed to perform bonding. 2〇 After the bonding of the substrates 12 and 10 is completed by a series of operations up to this point, the vacuum chamber 22 is opened to the atmosphere to open the vacuum chamber 22. Then, the energization to the electrodes of the upper and lower electrostatic vacuum chucks 34, 28 is stopped, and the holding of the substrates i2T, 10 is released. Then, the upper electrostatic vacuum chuck 34 is raised, and the bonded substrate 12 is operated by the lower electrostatic vacuum reading for 28 hours, and then the lifting rod provided on the lower static 12 1286627 electric vacuum chuck 28 is raised to lift the bonding. The substrate to which the substrate has been lifted and bonded is transported to the next step by the transfer robot provided on the downstream side, and the annular sealant 13 is cured by irradiation with ultraviolet rays. Figure 7 shows another embodiment of the present invention. Figure 8 is a magnified view of Qiu 5 of Figure 7. In the seventh and eighth aspects, the same members as those in the second embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. In Fig. 2, the electrostatic vacuum chuck (or lower electrostatic vacuum chuck) 28 is coupled to the χγ0 driving device 32 by the shaft 3〇, and the periphery of the shaft 3〇 is made of, for example, a bellows-like elastic body (not shown). Sealed into an airtight state. 10 In Figures 7 and 8, the lower electrostatic vacuum chuck (or lower electrostatic vacuum chuck) 28 is coupled to the 驱动0 drive unit 32 by the shaft 30, and the shaft 30 is covered by the rigid tube 5〇, and the magnetic fluid is The sealant 52 is disposed between the shaft 3〇 and the outside of the rigid tube. The periphery of the shaft 30 is sealed in an airtight state by the magnetic fluid sealant 52. That is, the moving device for moving the lower electrostatic vacuum chuck 28 is used to 15 combine the electrostatic vacuum chuck 28 located under the vacuum chamber 22 with the axis of the 驱动0 driving device (driving mechanism) 32 located outside the vacuum chamber 22, The rigid tube (rigid body) for covering the shaft 3〇 and the magnetic fluid sealant 52 disposed between the shaft 30 and the rigid tube 5〇 are formed. Further, the permanent magnets 54 are disposed on the inner side of the rigid tube 5' and the pole pieces 56, 58 which are in contact with the permanent magnets 5 4 transmit the magnetic force to the magnetic fluid sealant 52. The magnetic fluid sealant 52 can be held at a predetermined position by the magnetic force of the permanent magnet 54. Since the moving device of the lower electrostatic vacuum chuck 28 is disposed in the vacuum chamber 22, the volume of the vacuum chamber 22 is increased, which is disadvantageous in the case of vacuum production, and is therefore placed in a vacuum outside the atmosphere of 22. The movement of the mobile device is transmitted through the shaft 3 13 1386627 to the lower electrostatic vacuum chuck 28. The magnetic fluid sealant 52 is used in order to make the periphery of the shaft 30 a vacuum field 60 and to maintain the portion in a vacuum. By using the magnetic fluid sealant 52, it is possible to provide a substrate bonding apparatus in which the rigid body 50 does not generate stress and the parts can operate with high durability. Alternatively, the features of the embodiments of Figs. 7 and 8 may be added to the second embodiment. Advantageous Effects of Invention As described above, according to the present invention, it is possible to obtain a substrate bonding apparatus in which the substrate is not bent, the durability of the component is good, and the productivity and the operation rate are high. I: BRIEF DESCRIPTION OF THE DRAWINGS 3 10 Fig. 1 is a perspective view showing one of the substrates of the liquid crystal display device of an embodiment. Fig. 2 is a view showing a substrate bonding apparatus of a liquid crystal display device according to the present invention. Fig. 3 is a schematic plan view showing an example of an electrostatic vacuum chuck. 15 Fig. 4 shows a case where the substrate is placed under the upper electrostatic vacuum chuck by the substrate transfer arm. Fig. 5 shows a case where the adsorption pad is lowered and the central portion of the substrate is adsorbed when the substrate reaches the upper electrostatic vacuum chuck. Figure 6 shows the substrate adsorbed to the upper electrostatic vacuum chuck. 20 Fig. 7 shows another embodiment of the present invention. Fig. 8 is a partial enlarged view of Fig. 7. [The main components of the diagram represent the symbol table] 10, 12... substrate 14... liquid crystal 13... annular sealant 16... distributor 14 1286627
20...基板貼合裝置 38…升降驅動裝置 22...真空室 40·.·真空吸附孔 24·.·上殼罩 42...吸盤 26...下殼罩 44...基板搬送臂部 28…下靜電真空吸盤 50...剛性管 30、36···軸 52...磁流體密封劑 32...XY0驅動裝置 54…永久磁石 34...上靜電真空吸盤 56、58...磁極片20...substrate bonding device 38...lifting drive device 22...vacuum chamber 40·.·vacuum suction hole 24·.·upper cover 42...suction cup 26...lower cover 44...substrate Transfer arm portion 28...electrostatic vacuum chuck 50...rigid tube 30,36···shaft 52...magnetic fluid sealant 32...XY0 drive device 54...permanent magnet 34...electrostatic vacuum chuck 56 , 58... pole piece
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