JP2014066917A - Plate-like body holding mechanism, substrate sticking device, and substrate sticking method - Google Patents

Abstract

An object of the present invention is to correct warping of a plate-like body.
A plate-like body holding mechanism (5) for holding a cover substrate (121) disposed in a vacuum vessel (10) set to a first pressure, comprising a flat plate portion (511), a pipe (53), a second vacuum pump (54), A pressure balancer 56 and a suction part 52 are provided. A suction opening 514 is formed in the flat plate portion 511, and one end of the pipe 53 communicates with the suction opening 514. The second vacuum pump 54 is connected to the other end of the pipe 53 and performs a suction operation of sucking the gas in the pipe 53 and setting the internal pressure of the pipe 53 to a second pressure higher than the first pressure. The pressure balancer 56 opens the communication hole 561 when the internal pressure of the vacuum container 10 is lower than the internal pressure of the pipe 53, and the communication part 561 in which the communication hole 563 that connects the inside of the vacuum container 10 and the inside of the pipe 53 is formed. A lid portion 562 that closes the communication hole 563 when the internal pressure of the vacuum vessel 10 is higher than the internal pressure of the pipe 53. The suction part 52 holds the cover substrate 121 drawn to the flat plate part 511.
[Selection] Figure 4

Description

  The present invention relates to a plate-like body holding mechanism for holding a rectangular plate-like plate-like body, for example, a display substrate or a cover substrate, a substrate bonding apparatus for bonding two substrates using the plate-like body holding mechanism, and The present invention relates to a substrate bonding method.

  The display unit of the display device is provided with a cover substrate such as a substrate with a touch sensor and a protective substrate on a polarizing plate provided on a display substrate such as a liquid crystal module or an organic light emitting diode module. In recent years, such a display unit is produced through a process of attaching a cover substrate to a display substrate.

  The step of attaching the cover substrate to the display substrate is performed in a vacuum environment in order to prevent bubbles from entering between the substrates. Patent Document 1 discloses a display device manufacturing apparatus in which a drive panel having an alignment mark for alignment and a sealing panel are bonded together in a vacuum container. This manufacturing apparatus has a vacuum container that can be evacuated. The vacuum container includes a base on which the drive panel is placed, a moving mechanism that supports the sealing panel and moves relative to the driving panel, and an adhesive resin between the driving panel and the sealing panel. A pressurizing member is disposed for intimate contact with each other.

JP 2005-243413 A

By the way, when a display substrate and a cover substrate are formed in a multilayer shape by laminating a plurality of members, large and small warping may occur in these substrates.
In the manufacturing apparatus disclosed in Patent Document 1, when any panel is warped, a large gap is generated between the panels due to the warp when the panels are bonded together. In this case, both panels cannot be bonded well.

  This invention is made | formed in view of the said situation, and it aims at providing the plate-shaped body holding | maintenance mechanism, board | substrate bonding apparatus, and board | substrate bonding method which correct | amend the curvature of a plate-shaped body.

In order to achieve the above object, the plate-like body holding mechanism of the present invention is a plate that holds a rectangular plate-like plate-like body arranged in a vacuum vessel in which the internal pressure can be set to a first pressure lower than atmospheric pressure. A state body holding mechanism, which includes a flat plate portion, piping, a suction portion, a pressure balancer, and a holding portion.
The flat plate portion is provided in the vacuum vessel and has one surface on which a suction opening is formed. One end of the pipe communicates with the suction opening. The suction part is connected to the other end of the pipe, and performs a suction operation of sucking the gas in the pipe and setting the internal pressure of the pipe to a second pressure lower than the atmospheric pressure and higher than the first pressure. . The pressure balancer is provided in the vacuum vessel, opens a communication hole when the internal pressure of the vacuum vessel is lower than the internal pressure of the piping, and a communication portion in which a communication hole that communicates the inside of the vacuum vessel and the inside of the piping is formed, And a lid for closing the communication hole when the internal pressure of the vacuum vessel is higher than the internal pressure of the pipe. The holding part holds the plate-like body drawn to the flat plate part by the operation of the suction part.

The substrate bonding apparatus of the present invention includes a vacuum vessel, a first substrate holding unit, a plate-like body holding mechanism, and a driving unit.
The vacuum container can set the internal pressure to a first pressure lower than the atmospheric pressure. The first substrate holding unit is provided in the vacuum vessel and holds the first substrate having a rectangular plate shape. The plate-like body holding mechanism holds a rectangular plate-like second substrate, and makes the first substrate held by the first substrate holding portion and the second substrate face each other. The drive unit relatively moves the first substrate holding unit and the plate-like body holding mechanism to bring the first substrate and the second substrate into contact with each other via an adhesive.
The plate-like body holding mechanism is connected to the flat plate portion provided in the vacuum vessel and having a surface on which the suction opening is formed, a pipe having one end communicating with the suction opening, and the other end of the pipe. A suction part that performs a suction operation to suck the gas in the pipe and set the internal pressure of the pipe to a second pressure lower than the atmospheric pressure and higher than the first pressure; A communication part in which a communication hole is formed for communication between the inside of the container and the pipe, and a communication hole is opened when the internal pressure of the vacuum vessel is lower than the internal pressure of the pipe, and the internal pressure of the vacuum vessel is higher than the internal pressure of the pipe. A pressure balancer that closes the communication hole when it is high, and a second substrate holding part that holds the second substrate drawn to the flat plate part by the operation of the suction part.

  Further, in the substrate bonding method of the present invention, using the substrate bonding apparatus, the internal pressure of the pipe of the plate-like body holding mechanism is set to the second pressure, and the flat plate portion draws the second substrate, The second substrate holding unit holds the second substrate, the internal pressure of the vacuum vessel is set to the first pressure, the drive unit relatively moves the plate-like body holding mechanism and the substrate holding unit, The first substrate and the second substrate are brought into contact with each other through an adhesive.

  In the plate-like body holding mechanism, the substrate bonding apparatus, and the substrate bonding method of the present invention, the plate-like body (second substrate) in which the holding portion (second substrate holding portion) is drawn to the flat plate portion by the operation of the suction portion. ). Therefore, the plate-like body is elastically deformed following the one surface of the flat plate portion, and the warpage of the plate-like body is corrected. Therefore, the corrected plate-like body can be reliably held.

The pressure balancer has a lid that opens the communication hole when the internal pressure of the vacuum vessel is lower than the internal pressure of the pipe, and closes the communication hole when the internal pressure of the vacuum vessel is higher than the internal pressure of the pipe. ing.
For this reason, when the lid portion closes the communication hole, by setting the inside of the pipe to the second pressure, the plate-like body is drawn to the flat plate portion in which the suction opening that communicates with one end of the pipe is formed. Can do.
Further, when the internal pressure of the vacuum vessel is set to the first internal pressure while the plate-like body is attracted to the flat plate portion, the internal pressure of the vacuum vessel is lower than the internal pressure of the pipe. At this time, the lid portion opens the communication hole and allows the inside of the vacuum vessel and the inside of the pipe to communicate with each other. For this reason, since the equilibrium between the internal pressure of the pipe and the internal pressure of the vacuum container is maintained, air in the pipe does not flow out from the suction opening of the flat plate portion into the vacuum container. Therefore, it is possible to prevent the air flowing out from the suction opening from elastically deforming or moving the plate-like body.

  According to the present invention, the warpage of the plate-like body can be corrected and held.

It is explanatory drawing which shows the display board | substrate which is one board | substrate bonded together by the board | substrate bonding apparatus which concerns on embodiment of this invention. It is explanatory drawing which shows the cover board | substrate which is the other board | substrate bonded together by the board | substrate bonding apparatus which concerns on embodiment of this invention. It is a figure which shows the board | substrate bonding apparatus which concerns on embodiment of this invention, A is principal part front sectional drawing, B is principal part side sectional drawing. It is a schematic diagram which shows the plate-shaped object holding mechanism of the board | substrate bonding apparatus of FIG. It is a bottom view which shows the flat plate part of the plate-shaped body holding mechanism of FIG. It is a schematic diagram which shows the pressure balancer of the plate-shaped body holding mechanism of FIG. It is a schematic diagram which shows the press part in the board | substrate bonding apparatus of FIG. It is a block diagram which shows the control system in the board | substrate bonding apparatus of FIG. It is explanatory drawing which shows the state in which the display substrate holding part of the substrate bonding apparatus of FIG. 3 hold | maintained the display substrate. It is explanatory drawing which shows the state which made the plate-shaped body holding mechanism of the board | substrate bonding apparatus of FIG. 9 hold | maintain a cover substrate. It is a figure explaining the effect | action at the time of pulling the cover board | substrate with which both ends warp upwards to the flat plate part of the plate-shaped body holding | maintenance mechanism of FIG. 9, A shows the state before pulling, B pulled the cover board | substrate. Shown later. It is a figure explaining the effect | action at the time of pulling the cover board | substrate with which both ends are curled downward to the flat plate part of the plate-shaped body holding mechanism of FIG. 9, A shows the state before pulling, B pulled the cover board | substrate. Shown later. It is explanatory drawing which shows the state which the correction | amendment part of the board | substrate bonding apparatus of FIG. 10 raised. It is explanatory drawing which shows the state which the lower member of the board | substrate bonding apparatus of FIG. 13 raised and the vacuum vessel was formed. It is explanatory drawing which shows the state which the correction | amendment part of the board | substrate bonding apparatus of FIG. 14 descend | falls and the board | substrate with a touch sensor and the display board were made to contact. 15 is an explanatory diagram showing a state where the lower member of the substrate bonding apparatus is lowered to the initial position. It is principal part front sectional drawing which shows the modification of the board | substrate bonding apparatus which concerns on embodiment of this invention.

<First Embodiment>
Hereinafter, a plate-like body holding mechanism 5 according to an embodiment of the present invention, a substrate bonding apparatus 1 including the plate-like body holding mechanism 5, and a method of bonding substrates using the substrate bonding apparatus 1 will be described with reference to FIGS. Reference is made to FIG. In addition, the same code | symbol is attached | subjected to the common member in each figure.

[Display board]
First, a display substrate (first substrate) 101 as an example of a plate-like body will be described with reference to FIG.
FIG. 1 is an explanatory diagram showing a configuration of a display substrate 101 which is one substrate to be bonded by the substrate bonding apparatus 1.

As shown in FIG. 1, the display substrate 101 is, for example, an LCD module (LCM), a substrate main body 102 using liquid crystal, a frame 103 that accommodates one surface of the substrate main body 102 exposed, and a substrate main body. A polarizing plate 104 attached to one surface of 102 is provided.
The display substrate 101 according to the present invention may be an organic light emitting diode (OLED) module or other display module.

  The substrate body 102 is formed in a rectangular plate shape, and one surface serves as a display surface. In addition, the substrate body 102 is formed in a multilayer shape including a layer formed by frame printing formed by laminating a plurality of members into a rectangular frame shape (not shown). The contour of the inner periphery of the frame printing is substantially equal to the contour of the outer periphery of the polarizing plate 104. The frame printing is formed, for example, by sputtering metal chromium on the substrate body 102 and removing unnecessary portions by etching.

The frame 103 covers the four sides of the substrate body 102 and the other surface of the substrate body 102.
The polarizing plate 104 is formed in a rectangular shape and has a smaller outer contour than the substrate body 102. That is, the contour of the outer periphery of the polarizing plate 104 is formed to have a size approximately equal to the display area of the substrate body 102. The polarizing plate 104 side of the display substrate 101 is attached to a cover substrate 121 described later via an adhesive member, for example, an ultraviolet curable resin. The adhesive member is not limited to the ultraviolet curable resin. For example, other photocuring resins or thermosetting resins may be used.

[Board with touch sensor]
Next, as another example of the plate-like body, a cover substrate (plate-like body, second substrate) 121 that is a substrate with a touch sensor will be described with reference to FIG.
FIG. 2 is an explanatory diagram showing the configuration of the cover substrate 121.

As shown in FIG. 2, the cover substrate 121 has a substrate body 122, and frame printing 123 is applied to one surface of the substrate body 122. The substrate body 122 is formed in a rectangular plate shape. The outer peripheral contour of the cover substrate 121 is formed larger than the outer peripheral contour of the frame 103 in the display substrate 101.
The frame printing 123 is formed, for example, by sputtering metal chromium on one surface of the substrate body 122 and removing unnecessary portions by etching.

  In the present embodiment, the cover substrate 121 is described as an example of the cover substrate. However, the cover substrate according to the present invention is not limited to the cover substrate 121, and is, for example, a protective substrate formed of a glass material. Also good.

[Board bonding equipment]
Next, the structure of the board | substrate bonding apparatus 1 of this embodiment is demonstrated with reference to FIG. 3A and 3B.
FIG. 3A shows a front cross-sectional view of the main part of the substrate bonding apparatus 1, and FIG. 3B shows a side cross-sectional view of the main part. 3A and 3B, illustration of the transport unit 2 (see FIG. 8) of the substrate bonding apparatus 1 that transports the display substrate 101 and the cover substrate 121 to predetermined positions is omitted. Further, only the inner bottom surface 3 of the enclosure that accommodates the substrate bonding apparatus 1 and prevents the diffusion of the organic solvent is shown, and the other configurations of the enclosure are not shown. In the following description, one direction along the inner bottom surface 3 of the enclosure on which the substrate bonding apparatus 1 is placed is defined as an X direction, and a direction parallel to the inner bottom surface 3 and perpendicular to the X direction is defined as a Y direction. . A direction orthogonal to the X direction and the Y direction is defined as a Z direction (up and down direction).

As shown in FIGS. 3A and 3B, the substrate bonding apparatus 1 includes a support frame 4. The support frame 4 includes a flat plate-like suspension portion 41 that extends along the X direction, and a pair of leg portions 42 that extend downward from both ends of the suspension portion 41 in the X direction. A correction unit moving mechanism 12 described later is fixed to a substantially central portion of the suspension unit 41 in the X direction and the Y direction, and the correction unit moving mechanism 12 supports a correction unit 51 described later so as to be movable in the vertical direction. ing.
A lower portion of the leg portion 42 is fixed to the inner bottom surface 3 of the enclosure. A peripheral wall portion 72 of the upper member 7 described later is fixed to the upper portion of the leg portion 42.

The substrate bonding apparatus 1 includes an upper member 7, a lower member 8, and a lower member moving mechanism 9.
The upper member 7 and the lower member 8 are in contact with each other, thereby forming a vacuum container 10 having a vacuum chamber 10a (see FIG. 14) which is a sealed internal space.

  The upper member 7 is formed in a hollow rectangular parallelepiped shape having an open lower portion, and has an upper lid portion 71 formed in a square plate shape and a peripheral wall portion 72 that extends downward continuously from the four sides of the upper lid portion 71. doing. The peripheral wall portion 72 includes wall pieces 72a and 72b that face in the X direction and wall pieces 72c and 72d that face in the Y direction.

The wall piece 72c is formed with an exhaust port 73 for degassing the inside of the vacuum vessel 10 (the vacuum chamber 10a) and an intake port 74 for sucking outside air into the vacuum chamber 10a. The exhaust port 73 is provided with an exhaust valve 75 (see FIG. 8) for opening or closing the exhaust port 73, and the intake port 74 is provided with an intake valve 76 (see FIG. 8) for opening or closing the intake port 74. Yes. One end of a wiring (not shown) is connected to the exhaust valve 75 and the intake valve 76. The other end of the wiring is connected to a control unit 14 (see FIG. 8) described later.
When the intake port 74 is opened by the intake valve 76, the vacuum chamber 10 a communicates with the space in the enclosure through the intake port 74.

  One end of an exhaust pipe (not shown) is connected to the exhaust port 73. The other end of the exhaust pipe is connected to a first vacuum pump 77 (see FIG. 8) serving as a first suction unit. When the exhaust port 73 is opened by the exhaust valve 75 and the first vacuum pump 77 is driven, the gas (air) in the vacuum chamber 10a is exhausted through the exhaust port 73 and the exhaust pipe. The exhaust port 73 and the intake port 74 may be formed in any of the wall pieces 72a, 72b, 72d instead of the wall piece 72c. Further, as the first suction unit, a suction facility provided in a factory or the like may be used.

  A plate-like body holding mechanism 5 is provided on the upper lid portion 71 of the upper member 7. The plate-like body holding mechanism 5 holds the cover substrate 121. The plate-like body holding mechanism 5 is configured so that the long sides of the cover substrate 121 facing each other extend along the X direction, and the surface of the cover substrate 121 to which the ultraviolet curable resin is applied becomes the lower surface. Hold.

The plate-like body holding mechanism 5 includes a correction unit and a suction unit (holding unit, second substrate holding unit) 52. As shown in FIG. 4, the plate-like body holding mechanism 5 includes a pipe 53, a second vacuum pump (suction unit) 54 as a second suction unit, a pressure balancer 56, and a valve unit 55. . In addition, as a 2nd suction part, you may use the suction equipment with which the factory etc. were equipped. In FIG. 3, illustrations other than the correction part 51 and the suction part 52 of the plate-like body holding mechanism 5 are omitted.
As shown in FIG. 3, the correction unit 51 includes a rectangular plate-shaped flat plate portion 511, a cylindrical portion 512 extending upward from a substantially central portion of the flat plate portion 511, and a cylindrical hole (not shown) of the cylindrical portion 512. And a shaft 513 that can move in the vertical direction.

  The upper end portion of the shaft 513 passes through the upper lid portion 71 in the vertical direction and is fixed to a piston rod (not shown) of the correction portion moving mechanism 12 described later. The lower end portion of the shaft 513 is provided with a substantially disc-shaped disc portion (not shown) that engages with the inner edge portion at the upper end of the cylindrical portion 512. The disc portion prevents the shaft 513 from coming out of the tube hole.

  The correction unit moving mechanism 12 is composed of an air cylinder, for example, and is fixed to the support frame 4. One end of a wiring (not shown) is connected to the correction unit moving mechanism 12. The other end of the wiring is connected to a control unit 14 (see FIG. 8) described later. One end of the piston rod of the correction unit moving mechanism 12 is fixed to the upper end of the shaft 513 of the correction unit 51. The correction unit moving mechanism 12 moves the correction unit 51 in the same direction by moving the shaft 513 in the vertical direction (Z direction). That is, the correction unit moving mechanism 12 supports the correction unit 51 so as to be movable in the vertical direction.

  The long sides facing each other of the flat plate portion 511 in the straightening portion 51 supported by the straightening portion moving mechanism 12 extend along the X direction, and the short sides facing each other extend along the Y direction. Further, as shown in FIG. 5, a suction opening 514 is provided on the lower surface of the flat plate portion 511. A total of seven suction openings 514 are formed at the four corners and the central portion of the lower surface of the flat plate portion 511 and the center of the long side portion of the flat plate portion 511.

The suction part 52 (see FIG. 4) is a rectangular electrostatic chuck sheet in which an application electrode is enclosed in an insulating film. As shown in FIG. 5, the long sides facing each other of the adsorbing part 52 extend along the X direction, and the short sides facing each other extend along the Y direction. One surface of the suction portion 52 is fixed to the lower surface of the flat plate portion 511 with an adhesive. The suction portion 52 is provided with an exposure hole 521 penetrating in the vertical direction, and the suction opening 514 of the flat plate portion 511 is exposed from the exposure hole 521.
The application electrode of the adsorption | suction part 52 is connected to the control part 14 (refer FIG. 8) mentioned later. The adsorption unit 52 is controlled by the control unit 14 and electrostatically adsorbs the cover substrate 121 conveyed by the conveyance unit 2 as described later.

  One end of the pipe 53 (see FIG. 4) branches into seven and communicates with the suction opening 514 of the flat plate portion 511. The other end of the pipe 53 is connected to the second vacuum pump 54. The second vacuum pump 54 performs a suction operation of sucking ambient air through a gas (air) in the connected pipe 53 and a suction opening 514 communicating with one end of the pipe 53. The second vacuum pump 54 is connected to one end of a wiring (not shown). The other end of the wiring is connected to a control unit 14 (see FIG. 8) described later. The suction operation of the second vacuum pump 54 is controlled by the control unit 14.

  The valve portion 55 (see FIG. 4) is provided in the pipe 53. One end of a wiring (not shown) is connected to the valve portion 55. The other end of the wiring is connected to a control unit 14 (see FIG. 8) described later. The valve unit 55 is selectively set by the control unit 14 to a suction state, a closed state, and an air release state. The suction state is a state in which the piping 53 and the second vacuum pump 54 are communicated to enable a suction operation by the second vacuum pump 54. The closed state is a state in which the pipe 53 is closed and the suction operation by the second vacuum pump 54 and the inflow of the atmosphere are impossible. The air release state is a state in which the pipe 53 is opened to the atmosphere, and the atmosphere can be introduced into the enclosure.

Next, the pressure balancer 56 will be described with reference to FIG. FIG. 6 is a schematic diagram showing the pressure balancer 56 of the plate-like body holding mechanism 5.
The pressure balancer 56 is provided between one end of the pipe 53 in the pipe 53 and the valve portion 55 (see FIG. 4), and when the vacuum container 10 (see FIG. 14) is formed as will be described later, Placed in. In the present embodiment, the pressure balancer 56 is fixed to the peripheral wall portion 72 (see FIG. 3) of the upper member 7.

The pressure balancer 56 includes a communication part 561 and a lid part 562.
The communication part 561 is formed in a hollow rectangular parallelepiped shape. A communication hole 563 that penetrates in the vertical direction is provided on the upper surface of the communication portion 561. The communication hole 563 is shielded by a lid portion 562 made of a rectangular plate spring. One of the short side portions of the lid portion 562 facing each other is a fixed end portion 565 that is fixed to the upper surface of the communication portion 561 with a bolt, and the other is movable in the vertical direction along with elastic deformation of the leaf spring. This is a free end 566.

  A through-hole 564 that penetrates in a direction orthogonal to the up-down direction is formed on each side surface of the communication portion 561 facing each other. A pipe 53 is connected to each of the through holes 564. As a result, the internal space of the communication portion 561 and the inside of the pipe 53 communicate with each other.

  The lid portion 562 shields the communication hole 563 of the communication portion 561 when the internal pressure of the pipe 53 is equal to the pressure outside the pipe 53, for example, the internal pressure of the vacuum vessel 10 (see FIG. 14) or lower than the internal pressure inside the vacuum vessel 10. To do. On the other hand, as will be described later, when the internal pressure in the pipe 53 becomes higher than the internal pressure of the vacuum vessel 10, the lid 562 is pressed by the air that is about to move from the pipe 53 into the vacuum vessel 10, and the free end 566. Is elastically deformed so as to move upward. When the lid portion 562 is elastically deformed in this manner, the communication hole 563 is opened, and the internal space of the communication portion 561 communicates with the inside of the vacuum vessel 10.

  Next, the lower member moving mechanism 9 will be described with reference to FIG. As shown in FIG. 3, the lower member moving mechanism 9 is fixed to the inner bottom surface 3 of the enclosure. The lower member moving mechanism 9 moves or rotates the lower member 8 in the θ direction centered on axes extending in the X direction, the Y direction, the Z direction, and the Z direction (hereinafter, simply referred to as movement).

  As shown in FIG. 3, the lower member 8 is formed in a hollow rectangular parallelepiped shape having an open top, and extends upward continuously from the bottom 81 formed in a square plate shape and the four sides of the bottom 81. A peripheral wall portion 82 is provided. The contour of the outer periphery of the peripheral wall portion 82 is formed smaller than the contour of the outer periphery of the peripheral wall portion 72 of the upper member 7. Further, the inner peripheral contour of the peripheral wall portion 82 is formed to have a size substantially equal to the inner peripheral contour of the peripheral wall portion 72 of the upper member 7.

  A seal member 83 is attached to the distal end portion of the peripheral wall portion 82. The seal member 83 comes into contact with and closely contacts the upper member 7, and seals between the front end portion of the peripheral wall portion 82 and the upper member 7. As a material of the seal member 83, for example, a rubber member such as natural rubber, isoprene rubber, silicone rubber, urethane rubber, or the like can be used.

  When the lower member 8 is moved by the lower member moving mechanism 9 and comes into contact with the upper member 7 via the seal member 83, a vacuum container 10 (see FIG. 14) is formed, and between the upper member 7 and the lower member 8 A vacuum chamber 10a (see FIG. 14) is formed therebetween.

  The bottom 81 of the lower member 8 is provided with a substantially rectangular flat plate-like first pedestal 84 and a second pedestal 85 provided at a substantially central portion of the first pedestal 84. At the four corners of the first pedestal 84, the pressing portions 13 are provided.

  The second pedestal 85 supports a display substrate holder (first substrate holder) 86 from below. The display substrate holding part 86 is formed in a rectangular flat plate shape. The display substrate holding unit 86 supports the display substrate 101 transported by the transport unit 2 (see FIG. 8) and placed on the upper surface from below. The display substrate holding unit 86 supports the display substrate 101 such that the long sides facing the display substrate 101 extend along the X direction.

  The area of the upper surface of the display substrate holder 86 is smaller than the area of the surface of the display substrate 101 that contacts the display substrate holder 86. Therefore, the display substrate holding unit 86 supports a predetermined region inside the display substrate 101 and does not support the outer edge portion of the display substrate 101.

  The display substrate holding unit 86 moves in the X direction, the Y direction, the Z direction, and the θ direction as the lower member 8 is moved by the lower member moving mechanism 9.

Next, the structure of the press part 13 of this embodiment is demonstrated with reference to FIG. FIG. 7 is a diagram illustrating the configuration of the pressing portion 13.
The pressing unit 13 includes a voice coil motor 131 and a pressing member 132.

  The voice coil motor 131 includes a coil 133, a magnet 134 disposed around the coil 133, and a shaft 135. The shaft 135 is made of, for example, iron and has a base portion 136 and a cylindrical portion 137. The base portion 136 is formed in a substantially circular flat plate shape, and the columnar portion 137 extends from a substantially central portion of the base portion 136. The cylindrical portion 137 is inserted through the inside of the coil 133 along the central axis of the coil 133. A pressing member 132 is joined to the tip of the cylindrical portion 137. The pressing member 132 is formed in a substantially cylindrical shape by an elastic member, for example, rubber or resin. And the front-end | tip part of the press member 132 is formed in the spherical surface.

  When a current flows through the coil 133, the shaft 135 and the pressing member 132 move upward or downward in accordance with the amount and direction of the flowing current. One end of wiring (not shown) is connected to the voice coil motor 131. The other end of this wiring is connected to a servo driver 20 (see FIG. 8) described later.

[Control system for substrate bonding equipment]
Next, a control system of the substrate bonding apparatus 1 will be described with reference to FIG.
FIG. 8 is a block diagram showing a control system of the bonding apparatus 1.

  As shown in FIG. 8, the substrate bonding apparatus 1 includes a control unit 14. The control unit 14 includes, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory) for storing programs executed by the CPU, and a RAM (Random Access Memory) used as a work area of the CPU. And have.

  The control unit 14 is electrically connected to the imaging unit 6, the first pressure sensor 15, the second pressure sensor 16, and an analog / digital converter (hereinafter referred to as A / D converter) 17. Yes. The control unit 14 is electrically connected to the transport unit 2, the valve unit 55, the second vacuum pump 54, and the suction unit 52. The control unit 14 is electrically connected to the lower member moving mechanism 9, the exhaust valve 75, the intake valve 76, the first vacuum pump 77, the correction unit moving mechanism 12, and the servo driver 20. Yes.

  The imaging unit 6 is attached to the support frame 4 and images the display substrate 101 and the cover substrate 121 held by the substrate bonding apparatus 1 through an imaging window (not shown) provided in the upper lid 71. In addition, the imaging unit 6 detects the horizontal position and the center position of both the substrates 101 and 121 and the relative positions of both, and outputs them to the control unit 14.

  The control unit 14 controls the operation of the transport unit 2 and arranges each of the display substrate 101 and the cover substrate 121 at a predetermined bonding position. In the ROM of the control unit 14, position data indicating a predetermined bonding position is stored in advance for each of the display substrate 101 and the cover substrate 121. The position data indicating the predetermined bonding position for the display substrate 101 is such that the long sides facing each other of the display substrate 101 extend along the X direction, and the center of the display substrate 101 is the center of the display substrate holder 86. It is set to overlap. The position data indicating the predetermined bonding position for the cover substrate 121 is such that the long sides facing each other of the cover substrate 121 extend along the X direction, and the center of the cover substrate 121 and the center of the flat plate portion 511 overlap. Is set to The control unit 14 may arrange each of the display substrate 101 and the cover substrate 121 at a predetermined bonding position based on a signal output from the imaging unit 6.

  Further, the control unit 14 controls the operation of the transport unit 2 to place the display substrate 101 arranged at a predetermined bonding position on the display substrate holding unit 86. The control unit 14 controls the operation of the transport unit 2 so that the surface of the display substrate 101 on the frame 103 side is in contact with the display substrate holding unit 86 and the surface to which the polarizing plate 104 is attached faces upward.

The control unit 14 controls the operation of the valve unit 55 to selectively set the valve unit 55 to a suction state, a closed state, or an atmospheric release state.
The second pressure sensor 16 is provided in the pipe 53 between one end of the pipe 53 and the valve part 55. The second pressure sensor 16 detects the internal pressure of the pipe 53 and outputs the detection result to the control unit 14.
The control unit 14 controls the driving of the second vacuum pump 54 to cause the second vacuum pump 54 to perform a suction operation. Thereby, the inside of the piping 53 is deaerated. The control unit 14 sets the internal pressure of the pipe 53 to the second pressure based on the detection result of the second pressure sensor 16. The second pressure is set to a value lower than the atmospheric pressure and a value higher than the first pressure described later, for example, 30 × 10 ^{3 to} 60 × 10 ³ Pa.

The control unit 14 controls the adsorption operation of the adsorption unit 52 by controlling the application of voltage to the application electrode of the adsorption unit 52.
The control unit 14 controls the drive of the lower member moving mechanism 9 to move (lift) the lower member 8 upward from a predetermined initial position so as to contact the upper member 7. Thus, the vacuum container 10 is formed by the upper member 7 and the lower member 8.

  The control unit 14 controls the operations of the exhaust valve 75 and the intake valve 76 to close or open the exhaust port 73 and the intake port 74. For example, the control unit 14 drives the exhaust valve 75 and the intake valve 76 to completely open the exhaust port 73 and the intake port 74, and a small amount open state in which the open amount is small compared to the open state. Set to the fully closed state. Note that the opening amounts of the exhaust port 73 and the intake port 74 in the small amount open state can be arbitrarily set.

  The first pressure sensor 15 is provided on the first pedestal 84. The first pressure sensor 15 detects the internal pressure of the vacuum vessel 10 (see FIG. 14) formed by the upper member 7 and the lower member 8 and outputs the detection result to the control unit 14.

  The control unit 14 controls the driving of the first vacuum pump 77 to suck the air in the vacuum chamber 10 a of the vacuum container 10 through the exhaust port 73. Thereby, the vacuum chamber 10a is deaerated. Based on the detection result of the first pressure sensor 15, the control unit 14 drives the exhaust valve 75, the intake valve 76, and the first vacuum pump 77 to set the internal pressure of the vacuum vessel 10 to the first pressure. Note that the first pressure is set to a value lower than the atmospheric pressure, for example, 10 to 100 Pa.

  The control unit 14 controls driving of the correction unit moving mechanism 12 to move the correction unit 51 in the Z direction. For example, the control unit 14 lowers the correction unit 51 holding the cover substrate 121 in the vacuum container 10. As a result, the internal pressure of the vacuum container 10 is set to the first pressure, that is, in the vacuum state, the cover substrate 121 held by the correction unit 51 and the display substrate 101 held by the display substrate holding unit 86 are applied to each other. Make contact.

The A / D converter 17 is connected to the amplifier 18. The amplifier 18 is connected to a displacement detection sensor 19.
The displacement detection sensor 19 is provided in the vicinity of the voice coil motor 131 (see FIG. 7) in each pressing portion 13 provided on the first pedestal 84. Each displacement detection sensor 19 outputs to the amplifier 18 a voltage that changes as the base portion 136 of each voice coil motor 131 moves in the vertical direction. In the present embodiment, the output voltage of the displacement detection sensor 19 is maximized when the base 136 and the displacement detection sensor 19 are closest to each other. Further, this output voltage decreases as the base portion 136 rises and moves away from the displacement detection sensor 19, and becomes minimum when the base portion 136 and the displacement detection sensor 19 are farthest from each other.

  The amplifier 18 amplifies the voltage output from the displacement detection sensor 19. The A / D converter 17 generates a digital signal based on the amplified voltage, and transmits the generated digital signal to the control unit 14.

  Each servo driver 20 is controlled in operation by the control unit 14 and drives the voice coil motor 131 of the pressing unit 13 with the direction and amount of current instructed by the control unit 14. The control unit 14 determines the direction and amount of current based on the digital signal transmitted from the A / D converter 17, and controls each servo to drive the voice coil motor 131 with the determined direction and amount of current. An instruction signal is transmitted to the driver 20. That is, the control unit 14 controls driving of each pressing unit 13.

[Operation of substrate bonding equipment]
Next, operation | movement and an effect | action of the board | substrate bonding apparatus 1 and the plate-shaped object holding | maintenance mechanism 5 are demonstrated with reference to FIGS. 9-16 is explanatory drawing explaining operation | movement and an effect | action of the board | substrate bonding apparatus 1 and the plate-shaped body holding mechanism 5. FIG.
First, the display substrate 101 and the cover substrate 121 are prepared. And an ultraviolet curable resin is apply | coated to the inner side of the frame printing 123 in the surface in which the frame printing 123 of the cover board | substrate 121 is formed by the resin application part not shown.

Next, the control unit 14 controls the transport unit 2 to transport the display substrate 101 to a predetermined bonding position and place it on the display substrate holding unit 86 as shown in FIG.
Moreover, the control part 14 controls the conveyance part 2, conveys the cover board | substrate 121 to a predetermined bonding position, and makes the plate-shaped body holding mechanism 5 hold | maintain as shown in FIG. Specifically, the control unit 14 sets the valve unit 55 that has been previously set to the atmosphere open state to the suction state, and causes the pipe 53 and the second vacuum pump 54 to communicate with each other. Then, the control unit 14 causes the second vacuum pump 54 to start a suction operation.

  When the second vacuum pump 54 starts the suction operation, the air in the pipe 53 and the air around the suction opening 514 in the flat plate portion 511 are sucked. As a result, the plate-like body holding mechanism 5 sucks the cover substrate 121 transported to the predetermined bonding position by the transport unit 2 and draws the cover substrate 121 toward the flat plate portion 511. The cover substrate 121 is in close contact with the suction portion 52 fixed to the lower surface of the flat plate portion 511 and is elastically deformed following the lower surface of the flat plate portion 511.

  Here, the display substrate 101 and the cover substrate 121 formed by laminating a plurality of members as described above are likely to be irregularly warped. For example, when the cover substrate 121 is arranged so that the long side portions facing each other extend along the X direction, the cover substrate 121 moves from the central portion in the longitudinal direction (X direction) toward both ends in the same direction. , Easy to warp upward or downward.

  In the plate-like body holding mechanism 5 of the present embodiment, the cover substrate 121 is pulled toward the flat plate portion 511 and elastically deformed following the lower surface of the flat plate portion 511 as described above. For this reason, the curvature of the cover substrate 121 can be corrected.

  For example, as shown in FIG. 11A, when the cover substrate 121 is warped upward from the central portion in the longitudinal direction (X direction) toward both ends in the same direction, the central portion of the cover substrate 121 is drawn toward the flat plate portion 511. It is done. The central portion of the cover substrate 121 is in close contact with the central portion of the suction portion 52 and is elastically deformed following the lower surface of the flat plate portion 511. For this reason, as shown to FIG. 11B, the curvature of the cover board | substrate 121 is corrected.

  For example, as shown in FIG. 12A, when the cover substrate 121 warps downward from the central portion in the longitudinal direction (X direction) toward both end portions in the same direction, the both end portions are attracted to the flat plate portion 511. . Then, both end portions in the longitudinal direction of the cover substrate 121 are in close contact with both end portions in the longitudinal direction of the suction portion 52 and elastically deform along the lower surface of the flat plate portion 511. For this reason, as shown to FIG. 12B, the curvature of the cover board | substrate 121 is corrected.

Next, the control unit 14 (see FIG. 8) continues the suction operation by the second vacuum pump 54 until the internal pressure of the pipe 53 output from the second pressure sensor becomes the second pressure. When the internal pressure of the pipe 53 becomes the second pressure, the control unit 14 ends the suction operation by the second vacuum pump 54 and sets the valve unit 55 from the suction state to the closed state. As a result, substantially the entire upper surface of the cover substrate 121 whose warpage has been corrected comes into close contact with the lower surface of the suction portion 52, and the cover substrate 121 is sucked and held by the plate-like body holding mechanism 5.
Since the internal pressure of the pipe 53 and the pressure outside the pipe 53 are equal until the suction operation by the second vacuum pump 54 is started, the lid portion 562 of the pressure balancer 56 (see FIG. 6) shields the communication hole 563. Further, when the suction operation by the second vacuum pump 54 is started, the internal pressure of the pipe 53 becomes lower than the pressure outside the pipe 53, so that the cover 562 blocks the communication hole 563 by being pressed by the atmosphere outside the pipe 53. Is maintained.

  Next, the control unit 14 applies a voltage to the application electrode of the suction unit 52 to start the suction operation of the suction unit 52. When the adsorption unit 52 starts the adsorption operation, the cover substrate 121 is electrostatically adsorbed to the adsorption unit 52.

Next, as shown in FIG. 13, the control unit 14 drives the correction unit moving mechanism 12 to raise the correction unit 51 and arrange the cover substrate 121 inside the upper member 7.
Then, as shown in FIG. 14, the control unit 14 drives the lower member moving mechanism 9 to raise the lower member 8. As a result, the lower member 8 contacts the upper member 7, and the upper member 7 and the lower member 8 form a vacuum container 10.

  Next, the control unit 14 drives the intake valve 76 to set the intake port 74 in a closed state. Further, the exhaust valve 75 is driven to set the exhaust port 73 to a small open state, and the first vacuum pump 77 is driven to start deaeration (evacuation) of the vacuum chamber 10a. When the internal pressure of the vacuum vessel 10 detected by the first pressure sensor 15 becomes lower than a predetermined pressure after starting the deaeration, the control unit 14 drives the exhaust valve 75 to set the exhaust port 73 to a fully open state. To do. This accelerates the progress of deaeration of the vacuum chamber 10a.

  And the control part 14 stops the drive of the 1st vacuum pump 77, when the internal pressure of the vacuum vessel 10 turns into 1st pressure. Thereby, the control unit 14 can set the internal pressure of the vacuum vessel 10 to the first pressure, that is, the inside of the vacuum vessel 10 can be set in a vacuum state. First, the exhaust port 73 is set in a small open state to prevent the internal pressure of the vacuum vessel 10 from rapidly decreasing. Accordingly, it is possible to prevent the display substrate 101 from being broken by the rapid expansion of air remaining between the layers in the display substrate 101 formed in a multilayer shape. Further, when the internal pressure of the vacuum vessel 10 becomes lower than a predetermined pressure, the exhaust port 73 is set to a fully open state, and the progress of deaeration of the vacuum chamber 10a is accelerated, so that the time required for making the vacuum state is shortened. Can do.

  When the degassing of the vacuum chamber 10a is started, the lid 562 of the pressure balancer 56 (see FIG. 6) shields the communication hole 563, and between the one end of the pipe 53 and the closed valve 55. The internal pressure of the space (hereinafter sometimes referred to as space A) is maintained at the second pressure. When the deaeration progresses and the internal pressure of the vacuum vessel 10 becomes lower than the second pressure, the lid 562 is elastically deformed by being pressed by the air in the space A to be moved to the vacuum chamber 10a, and the free end 566. Moves upward to open the communication hole 563.

When the communication hole 563 is opened, the space A communicates with the inside of the vacuum vessel 10. When the internal pressure in the space A becomes equal to the internal pressure in the vacuum vessel 10, the lid 562 is released from the pressure, the free end 566 moves downward, and the lid 562 shields the communication hole 563.
In addition, when the deaeration of the vacuum chamber 10a is continued when the cover part 562 shields the communication hole 563, the internal pressure of the vacuum vessel 10 is increased by the progress of the deaeration until the deaeration is completed. The opening and shielding of the communication hole 563 by the lid portion 562 are repeated each time it becomes lower. That is, the pressure balancer 56 functions to keep the internal pressure of the vacuum vessel 10 and the internal pressure of the space A in equilibrium. For this reason, when the internal pressure of the vacuum vessel 10 becomes the first pressure and the deaeration of the vacuum chamber 10a is finished, the internal pressure of the space A is also substantially equal to the first pressure.
Further, when the cover 562 opens the communication hole 563 and the internal pressure of the space A becomes equal to the internal pressure of the vacuum vessel 10, the cover substrate 121 is released from the suction holding by the plate-like body holding mechanism 5. However, since the cover substrate 121 is electrostatically attracted and held by the suction portion 52, it does not fall downward.

  Next, as shown in FIG. 15, the control unit 14 drives the correction unit moving mechanism 12 to lower the correction unit 51. Specifically, the control unit 14 drives the correction unit moving mechanism 12 to lower the shaft 513 by a predetermined distance. This predetermined distance is set to be longer than the distance between the cover substrate 121 held by the correction unit 51 before being lowered and the display substrate 101 held by the display substrate holding unit 86.

  Therefore, before the shaft 513 is lowered by a predetermined distance, the cover substrate 121 and the display substrate 101 come into contact with each other, and both the substrates 101 and 121 are disposed at the bonding position. After the contact, the engagement between the disc portion of the shaft 513 and the cylindrical portion 512 is released, and the shaft 513 moves downward in the cylindrical hole of the cylindrical portion 512 and stops after driving for a predetermined distance. To do.

  In addition, after both the substrates 101 and 121 are arranged at the bonding position, the load of the flat plate portion 511 and the cylindrical portion 512 of the correction portion 51 and the cover substrate 121 is applied to the display substrate 101. With this load, the cover substrate 121 and the display substrate 101 are bonded together with an ultraviolet curable resin interposed between the substrates 101 and 121. The control unit 14 may drive the correction unit moving mechanism 12 and lower the correction unit 51 in parallel with the deaeration of the vacuum chamber 10a. Thus, the time required for bonding the substrates can be shortened.

  Next, the control unit 14 raises the pressing member 132 of the pressing unit 13. Accordingly, the pressing members 132 of the pressing unit 13 push up the four corners of the display substrate 101, and the four corners of the display substrate 101 are reliably brought into contact with the cover substrate 121.

  The operation of the substrate bonding apparatus 1 when the pressing member 132 of the pressing unit 13 pushes up the four corners of the display substrate 101 will be specifically described. First, the control unit 14 instructs the servo driver 20 (see FIG. 8) to drive the voice coil motor 131 by specifying the direction and amount of current to be supplied in order to raise the pressing member 132 of the pressing unit 13. To do. The servo driver 20 drives the voice coil motor 131 in accordance with the designated current direction and current amount, and raises the shaft 135 (see FIG. 7) and the pressing member 132 of the voice coil motor 131.

  The control unit 14 receives the output voltage of the displacement detection sensor 19 (see FIG. 8) that changes as the shaft 135 and the pressing member 132 move, as a digital signal via the amplifier 18 and the A / D converter 17. To do.

  If the output voltage of the displacement detection sensor 19 does not change, it is considered that the shaft 135 did not rise at the current amount specified last time, so the servo driver is configured to flow a larger amount of current than the current amount specified last time. 20

  On the other hand, when the output voltage of the displacement detection sensor 19 has changed (becomes small), the servo driver is configured to flow the current of the current amount instructed in order to continuously raise the shaft 135 and the pressing member 132. 20

  When the shaft 135 and the pressing member 132 of each pressing portion 13 are raised, the pressing member 132 comes into contact with the four corners of the display substrate 101 from below. Then, the pressing member 132 pushes up the four corners of the display substrate 101 and contacts the four corners of the cover substrate 121. As a result, the outer edges of both substrates 101 and 121 come into contact with each other.

  When the four corners of the display substrate 101 come into contact with the four corners of the cover substrate 121, the upward movement of the pressing member 132 and the shaft 135 is restricted. Therefore, thereafter, the output voltage of the displacement detection sensor 19 becomes constant, and the amount of current that the control unit 14 instructs the servo driver 20 continues to increase. Therefore, the amount of change in the amount of current in a predetermined time increases.

  Each time the controller 14 instructs the servo driver 20 to drive the voice coil motor 131, the controller 14 monitors the amount of change in the current amount, and determines whether or not the rate of change in the current value over a predetermined time has exceeded a predetermined threshold value.

  When the amount of change exceeds a predetermined threshold, the amount of current supplied to the voice coil motor 131 to the servo driver 20 is fixed to the current value immediately before the change rate of the monitored current value changes suddenly. That is, the voice coil motor 131 is instructed to be pressed with a minimum force so that both substrates come into contact with each other. Thus, the four corners of the display substrate 101 are not pressed more than necessary after the two substrates 101 and 121 come into contact with each other. Therefore, it is possible to prevent the ultraviolet curable resin from protruding between the two substrates 101 and 121.

  Next, the control unit 14 drives the exhaust valve 75 to set the exhaust port 73 in a closed state. Further, the intake valve 76 is driven, the intake port 74 is set to a small open state, and the air in the enclosure is sucked from the intake port 74 into the vacuum chamber 10a. When the internal pressure of the vacuum container 10 detected by the first pressure sensor 15 becomes higher than a predetermined pressure after starting the intake of air, the control unit 14 drives the intake valve 76 to fully open the intake port 74. Set. This accelerates the progress of air inhalation.

  When the internal pressure of the vacuum vessel 10 becomes equal to the atmospheric pressure, when a relatively small gap is generated between the substrates 101 and 121, the surrounding ultraviolet curable resin is sucked into the gap and the gap can be crushed.

  While air is sucked into the vacuum chamber 10a and the internal pressure of the vacuum vessel 10 becomes equal to the atmospheric pressure, the lid 562 of the pressure balancer 56 (see FIG. 6) is pressed and communicated with the air sucked into the vacuum chamber 10a. The state where the hole 563 is closed is maintained. Therefore, the internal pressure of the space A is maintained at a pressure substantially equal to the first pressure.

Next, the control unit 14 inspects whether the relative positions of both the substrates 101 and 121 are shifted to a predetermined allowable range from the images of both the substrates 101 and 121 captured by the imaging unit 6. When both the substrates 101 and 121 are displaced from a predetermined reference or more, the lower member moving mechanism 9 moves the lower member 8 in the X direction, the Y direction, and the θ direction to move the display substrate 101 with respect to the cover substrate 121. Move the relative position for alignment.
Thus, the assembly of the substrate assembly 150 in which the display substrate 101 and the cover substrate 121 are bonded together is completed.

Next, the control unit 14 stops the application of the voltage to the application electrode of the adsorption unit 52 and stops the adsorption operation of the adsorption unit 52. When the suction operation of the suction part 52 is stopped, the cover substrate 121 is released from electrostatic suction by the suction part 52. In addition, the control unit 14 sets the valve unit 55 to the atmosphere open state, and causes the air in the enclosure to flow into the pipe 53 so that the internal pressure of the pipe 53 is equal to the atmospheric pressure. For this reason, the board assembly 150 is released from the state of being held by suction by the plate-like body holding mechanism 5 and becomes movable.
Subsequently, as shown in FIG. 16, the control unit 14 drives the lower member moving mechanism 9 to lower the lower member 8 to a predetermined initial position.

  And the control part 14 drives the conveyance part 2, and conveys the board | substrate assembly 150 to a resin hardening part (illustration omitted). The resin curing unit cures the UV curable resin of the supplied substrate assembly 150.

In the substrate bonding apparatus 1 of the present embodiment, the plate-like body holding mechanism 5 draws the cover substrate 121 to the flat plate portion 511 by the operation of the second vacuum pump 54, and holds it by suction. For this reason, the cover substrate 121 can be elastically deformed so as to follow the lower surface of the flat plate portion 511. Therefore, when the cover substrate 121 is warped, the warp can be corrected so that the cover substrate 121 is parallel to a horizontal plane in the vertical direction.

Further, when the inside of the vacuum vessel 10 is set to a vacuum state, the internal pressure of the vacuum vessel 10 and the internal pressure of the space A can be kept in equilibrium by the lid portion 562 of the pressure balancer 56 opening the communication hole 563. . For this reason, the air in the space A can be prevented from flowing into the vacuum vessel 10 from the suction opening 514 of the flat plate portion 511. Therefore, the air flowing out from the suction opening 514 can be prevented from elastically deforming or moving downward (falling) the cover substrate 121 held by the plate-like body holding mechanism 5.

  Further, substantially the entire upper surface of the cover substrate 121 whose warpage has been corrected is in close contact with the lower surface of the suction portion 52. For this reason, the suction part 52 can reliably hold the cover substrate 121 by suction.

  The embodiment of the plate-like body holding mechanism 5, the substrate bonding apparatus 1, and the substrate bonding method of the present invention has been described above including the effects thereof. However, the plate-like body holding mechanism, the substrate bonding apparatus, and the substrate bonding method of the present invention are not limited to the above-described embodiments, and do not depart from the spirit of the invention described in the claims. Various modifications are possible.

  For example, in the present embodiment, a total of seven suction openings 514 are formed at the four corners and the central portion of the lower surface of the flat plate portion 511 and the center of the long side portion of the flat plate portion 511. However, the number and positions of the suction openings 514 can be set as appropriate as long as the warpage of the cover substrate 121 can be corrected.

  Further, in the present embodiment, the plate-like body holding mechanism 5 including the suction portion 52 has been described as an example of the holding portion. However, instead of the suction portion 52, an arm portion 57 may be provided as shown in FIG. Good.

  As shown in FIG. 17, the arm portion 57 includes a rectangular plate-shaped arm support portion 571 that extends outward from a substantially central portion of each side of the flat plate portion 511 in parallel with the upper surface of the flat plate portion 511, and an outside of the arm support portion 571. An arm portion main body 572 extending downward from the lower surface of the end portion. The arm portion main body 572 is pivotally supported by the arm support portion 571 so that the lower end portion of the arm portion main body 572 approaches and separates from the center of the flat plate portion 511.

  One end of a wiring (not shown) is connected to the arm portion main body 572. The other end of the wiring is connected to the control unit 14 (see FIG. 8). The arm part main body 572 is selectively set to a holding state or a released state by the control unit 14. The holding state is a state in which the lower end portion of the arm portion main body 572 approaches the center of the flat plate portion 511 and can hold each side of the cover substrate 121. The released state is a state in which the lower end portion of the arm portion main body 572 is separated from the center of the flat plate portion 511 so that the flat plate portion 511 can receive the cover substrate 121 or the held cover substrate 121 is released. It is a state to do.

After correcting the warp of the cover substrate 121 as described above, the plate-like body holding mechanism 5 sets the arm portion main body 572 from the released state to the held state, and holds the cover substrate 121.

In the present embodiment, the mode in which the plate-like body holding mechanism 5 holds the cover substrate 121 has been described, but instead, the plate-like body holding mechanism 5 may hold the display substrate 101.
Further, the display substrate holding part 86 may have the same configuration as the plate-like body holding mechanism 5. In this case, the warp of the display substrate 101 can be corrected, and the display substrate 101 can be held by an adsorption unit similar to the adsorption unit 52 included in the display substrate holding unit 86 or an arm unit similar to the arm unit 57.

  Further, a through hole penetrating in the vertical direction may be provided in a substantially central portion of the suction portion 52, and a projecting portion capable of appearing and retracting through the through hole may be provided in a substantially central portion on the lower surface of the flat plate portion 511. The projecting portion is set to a projecting state projecting downward by the control unit 14 and an accommodation state accommodated in the flat plate portion 511. When the controller 14 drives the lower member moving mechanism 9 to lower the lower member 8 to a predetermined initial position after the assembly of the board assembly 150 is completed as described above, the controller 14 protrudes from the housed state. Set to. As a result, even if the substrate assembly 150 remains electrostatically attracted to the attracting portion 52 due to the voltage remaining in the attracting portion 52, the substrate assembly 150 is separated from the attracting portion 52 by the protruding portion, and Reliable release from adsorption.

Further, instead of the projecting portion, a discharge opening for discharging the air discharged from the pump may be provided at the substantially central portion of the flat plate portion 511. In this case, after the assembly of the substrate assembly 150 is completed as described above, the control unit 14 drives the lower member moving mechanism 9 to lower the lower member 8 to a predetermined initial position. Drive the pump so that it is exhaled. As a result, even if the substrate assembly 150 remains electrostatically attracted to the suction portion 52 due to the voltage remaining in the suction portion 52, the substrate assembly 150 is moved by the air discharged from the discharge opening to the suction portion 52. It is possible to release from the electrostatic adsorption with certainty.

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate bonding apparatus, 5 ... Plate-shaped body holding mechanism, 7 ... Upper member, 8 ... Lower member, 10 ... Vacuum container, 12 ... Correction part moving mechanism, 13 ... Press part, 14 ... Control part, 51 ... Correction 52: Suction unit (holding unit, second substrate holding unit), 53 ... Pipe, 54 ... Second vacuum pump (suction unit), 55 ... Valve unit, 56 ... Pressure balancer, 86 ... Display substrate holding unit ( First substrate holding portion), 101 ... Display substrate (first substrate), 121 ... Cover substrate (plate-like body, second substrate), 511 ... Flat plate portion, 514 ... Suction opening, 563 ... Communication hole

Claims (5)

A plate-like body holding mechanism for holding a rectangular plate-like plate-like body arranged in a vacuum vessel capable of setting the internal pressure to a first pressure lower than atmospheric pressure,
A flat plate portion provided in the vacuum vessel and having a surface on which a suction opening is formed;
A pipe having one end communicating with the suction opening;
Connected to the other end of the pipe, sucks the gas in the pipe and performs a suction operation to set the internal pressure of the pipe to a second pressure lower than the atmospheric pressure and higher than the first pressure. A suction part;
A communication portion provided in the vacuum vessel and formed with a communication hole for communicating the inside of the vacuum vessel and the inside of the pipe; and when the internal pressure of the vacuum vessel is lower than the internal pressure of the pipe, A pressure balancer having a lid portion that opens and closes the communication hole when the internal pressure of the vacuum vessel is higher than the internal pressure of the pipe;
A holding part for holding the plate-like body drawn to the flat plate part by the operation of the suction part;
A plate-like body holding mechanism. The plate-like body holding mechanism according to claim 1, wherein the suction opening is disposed at a position facing at least four corners of the plate-like body on one surface of the flat plate portion. The holding portion is provided on one surface of the flat plate portion, and is an adsorption portion that electrostatically adsorbs the plate-like body,
After the suction part sucks the gas in the pipe and sets the internal pressure of the pipe to a second pressure lower than the atmospheric pressure and higher than the first pressure, the suction part becomes the plate-like body. The plate-like body holding mechanism according to any one of claims 1 and 2. A vacuum vessel capable of setting the internal pressure to a first pressure lower than atmospheric pressure;
A first substrate holding part that is provided in the vacuum vessel and holds a rectangular plate-shaped first substrate;
A plate-like body holding mechanism that holds a rectangular plate-like second substrate, and that makes the first substrate held by the first substrate holding portion face the second substrate;
A drive unit that relatively moves the first substrate holding unit and the plate-like body holding mechanism to bring the first substrate and the second substrate into contact with each other via an adhesive;
The plate-like body holding mechanism is
A flat plate portion provided in the vacuum vessel and having a surface on which a suction opening is formed;
A pipe having one end communicating with the suction opening;
Connected to the other end of the pipe, sucks the gas in the pipe and performs a suction operation to set the internal pressure of the pipe to a second pressure lower than the atmospheric pressure and higher than the first pressure. A suction part;
A communication portion provided in the vacuum vessel and formed with a communication hole for communicating the inside of the vacuum vessel and the inside of the pipe; and when the internal pressure of the vacuum vessel is lower than the internal pressure of the pipe, A pressure balancer having a lid portion that opens and closes the communication hole when the internal pressure of the vacuum vessel is higher than the internal pressure of the pipe;
A substrate bonding apparatus, comprising: a second substrate holding unit that holds the second substrate drawn to the flat plate portion by the operation of the suction unit. A vacuum vessel capable of setting the internal pressure to a first pressure lower than atmospheric pressure;
A first substrate holding part that is provided in the vacuum vessel and holds a rectangular plate-shaped first substrate;
A plate-like body holding mechanism that holds a rectangular plate-like second substrate, and that makes the first substrate held by the first substrate holding portion face the second substrate;
A driving unit configured to relatively move the first substrate holding unit and the plate-like body holding mechanism to bring the first substrate and the second substrate into contact with each other via an adhesive; ,
The plate-like body holding mechanism is
A flat plate portion provided in the vacuum vessel and having a surface on which a suction opening is formed;
A pipe having one end communicating with the suction opening;
Connected to the other end of the pipe, sucks the gas in the pipe and performs a suction operation to set the internal pressure of the pipe to a second pressure lower than the atmospheric pressure and higher than the first pressure. A suction part;
A communication portion provided in the vacuum vessel and formed with a communication hole for communicating the inside of the vacuum vessel and the inside of the pipe; and when the internal pressure of the vacuum vessel is lower than the internal pressure of the pipe, A pressure balancer having a lid portion that opens and closes the communication hole when the internal pressure of the vacuum vessel is higher than the internal pressure of the pipe;
Using a substrate bonding apparatus having a second substrate holding portion that holds the second substrate drawn to the flat plate portion by the operation of the suction portion,
The internal pressure of the pipe of the plate-like body holding mechanism is set to the second pressure, and the flat plate portion draws the second substrate,
The second substrate holding unit holds the second substrate;
Setting the internal pressure of the vacuum vessel to a first pressure;
The drive unit relatively moves the plate-like body holding mechanism and the first substrate holding unit to bring the first substrate and the second substrate into contact with each other through an adhesive. Pasting method.