JP2009180911A - Substrate lamination method, substrate lamination apparatus, and display device manufactured by using method or apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate lamination method capable of improving lamination accuracy and preventing inclusion of air without increasing equipment cost and time cost. <P>SOLUTION: The substrate lamination method for laminating a first substrate (K1) having flexibility and a second substrate (K2) having flexibility or no flexibility includes: disposition steps (S1, S2, S3) of disposing the first substrate (K1) and the second substrate (K2) with the respective lamination faces (K11, K21) opposing to and close to each other; a first pressurizing step (S4) of pressurizing an approximate center line (J1) and proximity regions (R1) in both sides of the center line on the lamination face (K11) of the first substrate (K1) toward the lamination face (K21) of the second substrate (K2); and a second pressurizing step (S5) of pressurizing the first substrate (K1) while gradually spreading the pressurizing region in a direction (X) perpendicular to the approximate center line (J1). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate bonding method, a substrate bonding apparatus, and a display device manufactured by using these methods or apparatuses. In particular, the invention is suitable for manufacturing a display device using a flexible film for at least one of the upper and lower substrates. In addition, although the display medium of a display is not specifically limited, a liquid crystal, an electrophoresis system, an electronic powder fluid system, etc. correspond.

  Conventionally, a glass substrate has been used for a display device represented by a liquid crystal display. However, in recent years, display devices are required to be lighter and thinner, and have excellent shape flexibility and impact resistance, and it has been studied to use a film substrate instead of a heavy and fragile glass substrate. ing.

  For the film substrate, for example, two first and second substrates that can be bonded to each other are used. Each of these substrates has the following configuration. That is, the first substrate has a configuration in which a color filter and a transparent electrode are formed on a transparent film serving as a base material. The second substrate is configured such that a TFT (Thin Film Transistor) electrode is formed on a film or glass serving as a base material. In addition, a display medium layer is formed on the surface of either the first substrate or the second substrate so that the display medium is sandwiched between the first substrate and the second substrate after bonding. Further, an adhesive layer for bonding is formed on at least one surface of the first substrate and the second substrate. The first substrate and the second substrate are bonded to each other through a spacer so as to maintain a certain gap of several μm to several tens of μm (however, depending on the type of display medium). Thereby, a device for the display apparatus is manufactured. At the time of bonding, it is necessary to accurately align the TFT and the sub-pixel of the color filter.

  As a technique for laminating two film substrates used in a display device, for example, as shown in FIG. 12A, a method of pressing film substrates K10 and K20 arranged in two upper and lower strips between a pair of rolls 101 (See, for example, Patent Document 1). Further, for example, as shown in FIG. 12B, there is a technique of applying pressure in a state where two glass substrates K30 and K40 are bonded to a flat jig 102 in a vacuum atmosphere (for example, Patent Document 2). reference).

JP 2004-258673 A Japanese Patent Laid-Open No. 2007-0473304

  In Patent Document 1, since the film substrate is passed between the pair of rolls, it is possible to prevent air from being caught. However, as shown in FIG. 12A, because of the alignment on one side, even if there is a slight deviation on the side where the alignment is performed, a large deviation may occur on the facing side.

  In patent document 2, since it bonds together in a vacuum atmosphere, prevention of the biting of air can be aimed at. However, means such as a chamber and a vacuum pump for creating a vacuum atmosphere are required, and the apparatus cost is increased. In addition, it takes time to create a vacuum atmosphere.

  The present invention has been made in view of such a problem, and a substrate bonding method capable of improving the bonding accuracy and preventing air biting without increasing the apparatus cost and time cost. And it aims at providing a board | substrate bonding apparatus.

  The above object is achieved by the present invention described below. In addition, the reference numerals in parentheses attached to each component in the “Claims” and “Means for Solving the Problems” indicate correspondence with the specific means described in the embodiments described later. is there.

  The invention of claim 1 is a substrate laminating method for laminating a flexible first substrate (K1) and a flexible or non-flexible second substrate (K2). An arrangement step (S1, S2, S3) for arranging the substrate (K1) and the second substrate (K2) so that the bonding surfaces (K11, K21) face each other, and the first substrate (K1) A first pressurizing step (S4) for pressurizing the approximate center line (J1) on the bonding surface (K11) and its neighboring regions (R1) toward the bonding surface (K21) of the second substrate (K2); And a second pressurizing step (S5) for pressurizing the first substrate (K1) while gradually expanding the pressurizing region of the first substrate (K1) in a direction (X) orthogonal to the approximate center line (J1).

  According to the first aspect of the invention, after the first substrate (K1) and the second substrate (K2) are arranged, first, the approximate center line (J1) on the bonding surface (K11) of the first substrate (K1) and both sides thereof. The vicinity region (R1) is pressurized toward the bonding surface (K21) of the second substrate (K2). Thereby, bonding of the approximate center line (J1) on the bonding surface (K11) of the first substrate (K1) and the regions near both sides (R1) is performed. Next, pressure is applied while gradually expanding the pressure region in the direction (X) perpendicular to the approximate center line (J1). Thereby, bonding advances from the fixed center toward both sides simultaneously, and bonding of an outer side area | region (R2) is made. As a result, displacement in the horizontal plane direction can be suppressed, and the bonding accuracy between the bonding surface (K11) and the bonding surface (K21) can be improved. Moreover, the biting of air can be remarkably reduced as compared with the case where the entire surface is pressurized simultaneously. The approximate center line (J1) on the bonding surface (K11) of the first substrate (K1) is when the first substrate (K1) is folded in two so that the opposite sides of the first substrate (K1) overlap each other. The line that will be the crease.

  According to the invention of claim 2, in the arranging step (S3), the bonding surface (K11) of the first substrate (K1) and the bonding surface (K21) of the second substrate (K2) are aligned. According to the invention of claim 2, since the alignment is performed, the bonding accuracy is further improved.

  In the invention of claim 3, the first substrate (K1) and the second substrate (K2) are bonded together in an atmospheric pressure atmosphere. According to the invention of claim 3, a large-scale apparatus such as a vacuum chamber is not required, and the apparatus cost can be reduced. In addition, there is no time cost for creating a vacuum atmosphere.

  In the invention of claim 4, the placing step (S1, S2, S3) includes the step (S1) of holding the first substrate (K1) in a flat shape on the bendable first fixing portion (61) and the second fixing. The step (S2) of holding the second substrate (K2) in a flat shape on the part (4) and the bonding surfaces (K11, K21) of the first substrate (K1) and the second substrate (K2) face each other. The step (S3) includes arranging the first fixing portion (61) and the second fixing portion (4) so as to be close to each other. According to the invention of claim 4, the first substrate (K1) is held by using the first fixing portion (61) which can be bent. At that time, since the first substrate (K1) can be held in a planar shape and can be disposed in opposition to and close to the second substrate (K2), misalignment at both ends of the bonding surfaces (K11, K21). Can be prevented, and as a result, the bonding accuracy can be improved. Furthermore, the first pressurization and the second pressurization can be performed by utilizing the curvature of the first fixing portion (61).

  In the invention of claim 5, in the first pressurizing step (S4), the approximate center line (J1) of the first substrate (K1) and the regions near both sides (R1) are bonded surfaces of the second substrate (K2) ( Pressurization is performed by bending the first substrate (K1) so as to come into contact with K21), and in the second pressurization step (S5), the curvature of the curved portion of the first substrate (K1) is gradually reduced. As a result, the outer region (R2) of the approximate center line (J1) and the regions near both sides (R1) is pressurized.

  When the first substrate (K1) held by the first fixing portion (61) is bent and bonded to the second substrate (K2) in the first pressurizing step (S4), the first invention is performed. The first substrate (K1) is held on the first fixing portion (61) so that the first substrate (K1) is not displaced from the fixing portion (61). According to the invention of claim 6, the curved tip can be fixed in a direction other than the direction perpendicular to the second substrate (K2), and the alignment accuracy can be utilized for the bonding accuracy.

  According to the seventh aspect of the present invention, when the first substrate (K1) is fixedly held on the first fixing portion (61), the regions near both sides (R1) of the approximate center line (J1) in the first substrate (K1) are vacuum-adsorbed. The outer region (R2) other than the region (R1) in the vicinity of both sides of the approximate center line (J1) is adhesively held by the adhesive means (612). According to the seventh aspect of the present invention, the approximate centerline (J1) portion of the first substrate (K1), that is, the centerline portion of the curved convex surface, is vacuum-adsorbed, so that the positional deviation at the time of alignment and bonding is achieved. Can be suppressed. On the other hand, portions other than the center line of the convex surface are fixed by the adhesive means (612), and the adhesive means (612) relaxes the expansion and contraction associated with the curvature of the first fixing portion (61). As a result, it is possible to suppress a decrease in bonding accuracy due to bending.

  In the invention of claim 8, the first substrate (K1) and the second substrate (K2) are film substrates for a display device. According to the invention of claim 8, since the electrodes and the sub-pixels of the color filter are accurately positioned on the first substrate (K1) and the second substrate (K2), a display device capable of obtaining a high-quality image is manufactured. It becomes possible.

  Moreover, the board | substrate bonding apparatus of this invention is the 1st board | substrate (K1) which has flexibility, and the 2nd board | substrate (K2) which has flexibility or inflexibility, as described in Claim 9. Is a substrate laminating apparatus (1) for laminating a first substrate (K1) and a second substrate (K2) such that their laminating surfaces (K11, K21) face each other. (6, 4) and the first addition that pressurizes the approximate center line (J1) on the bonding surface (K11) of the first substrate (K1) toward the bonding surface (K21) of the second substrate (K2). The pressure region of the first substrate (K1) that pressurizes the pressure means (61, 63) and the bonding surface (K21) of the second substrate (K2) gradually from above the approximate center line (J1). Second pressurizing means (61, 62) that pressurizes while expanding in a direction (X) perpendicular to the approximate center line (J1). The features.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate bonding method and board | substrate bonding apparatus which can aim at the improvement of bonding precision and prevention of the biting of air are provided, without accompanying the increase in apparatus cost and time cost.

  1 is a schematic configuration diagram of a substrate bonding apparatus according to the present invention, FIG. 2 is a view taken along the line II of FIG. 1, FIG. 3 is a perspective view of a pressurizing unit 6, and FIG. FIG. 5 is a diagram showing the positions of alignment marks on the upper substrate K1 and the lower substrate K2.

  As shown in FIG. 1, the substrate bonding apparatus 1 according to the present invention includes an upper substrate transfer unit 2, a lower substrate transfer unit 3, a substrate stage 4, an imaging unit 5, a pressure unit 6, and a control unit 7. .

  The upper substrate transfer unit 2 includes an upper substrate stocker 21, a transfer table 22, a drive device 23, and the like. The upper substrate stocker 21 is a part for temporarily placing the upper substrate K1 to be bonded to the lower substrate K2 with the bonding surface K11 facing downward. The upper substrate K1 is a sheet-like transparent film substrate, and a color filter, a transparent electrode, and an electrophoretic layer are formed on the bonding surface K11, and further bonded to the surface of the electrophoretic layer. The layer is applied, and the cover film covers the surface of the adhesive layer. In addition, alignment marks M1 and M1 'are formed on the edge of the upper substrate K1 (see FIG. 5A).

  The transfer table 22 is a fork-shaped support member in plan view, and can be driven in each direction of XYZθ by a drive device 23. The movable range of the transfer table 22 is from above the upper substrate stocker 21 to directly below the pressurizing unit 6. The driving device 23 can be constituted by, for example, a ball screw mechanism and a servo motor. Or you may comprise by the robot provided with the movable arm.

  The lower substrate transfer unit 3 includes a lower substrate stocker 31, a transfer table 32, a driving device 33, and the like. The lower substrate stocker 31 is a part for temporarily placing the lower substrate K2 to be bonded to the upper substrate K1 or the bonded display device KD with the bonding surface K21 facing upward. The lower substrate K2 is a sheet-like film substrate, and a TFT electrode is formed on the bonding surface K21 although illustration is omitted. In addition, alignment marks M2 and M2 'are formed on the edge of the lower substrate K2 (see FIG. 5B).

  The transfer table 32 is a fork-shaped support member in plan view, and can be driven in each direction of XYZθ by a drive device 33. The movable range of the transfer table 32 is from above the lower substrate stocker 31 to directly above the substrate stage 4. The driving device 33 can be constituted by, for example, a ball screw mechanism and a servo motor. Or you may comprise by the robot provided with the movable arm.

  The substrate stage 4 has a placement surface 41 having a larger area than the lower substrate K2. As shown in FIG. 2, the mounting surface 41 is provided with a number of vacuum suction holes 42 and a number of lift pin holes 43. The vacuum suction hole 42 is connected to a suction pump through a pipe and an opening / closing valve. From the lift pin hole 43, a lift pin 44 for supporting the lower substrate K2 or the bonded display device KD can be projected and retracted.

  The imaging unit 5 includes an imaging device 5a and an imaging device 5b. The imaging device 5a is a two-view camera equipped with a CCD (Charge Coupled Device), and includes an upper imaging unit 5aU whose imaging direction is upward and a lower imaging unit 5aD whose imaging direction is downward. The imaging device 5a can be moved along the X direction by the drive unit 51a, and can be selectively arranged at the imaging position P1 and the retracted position P2. The imaging position P1 is a position where the alignment mark M1 of the upper substrate K1 enters the field of view of the upper imaging unit 5aU and the alignment mark M2 of the lower substrate K2 enters the field of view of the lower imaging unit 5aD. The retreat position P2 is a position (−X direction) outside the space region formed between the substrate stage 4 and the upper substrate fixing jig 61.

  The imaging device 5b is also configured similarly to the imaging device 5a, and includes an upper imaging unit 5bU with the imaging direction facing upward and a lower imaging unit 5bD with the imaging direction facing downward. Then, it can be moved along the X direction by the drive unit 51b, and can be selectively arranged at the imaging position P1 'and the retracted position P2'. The imaging position P1 'is a position where the alignment mark M1' of the upper substrate K1 enters the field of view of the upper imaging unit 5bU and the alignment mark M2 'of the lower substrate K2 enters the field of view of the lower imaging unit 5bD. The retreat position P <b> 2 ′ is a position on the outside (+ X direction) of the space area formed between the substrate stage 4 and the upper substrate fixing jig 61.

  The pressing unit 6 includes an upper substrate fixing jig 61, a pressing unit main body 62, a central pressing unit 63, a first driving unit 64 and a second driving unit 65.

  As shown in FIG. 4, the upper substrate fixing jig 61 is made of a flexible thin plate material having a rectangular shape in plan view, and a number of vacuum suction holes 611 are formed along the center line J0. An adhesive substance 612 is provided in the outer region of the vacuum suction hole 611. As shown in FIGS. 1 and 3, both ends of the upper substrate fixing jig 61 in the X direction are pulled toward the upper center by wires 61 </ b> W.

  The pressurizing unit main body 62 can be driven in each direction of XYZθ by the first driving unit 64. The central pressurizing portion 63 is slidably inserted in a cavity 62 h opened in the pressurizing portion main body 62, and can protrude downward from the inside of the pressurizing portion main body 62. The central pressure unit 63 can be driven up and down by a driving device 65. The first driving unit 64 and the second driving device 65 can be configured by a ball screw mechanism and a servo motor, or a pneumatic cylinder, respectively.

  The control unit 7 includes an input / output device such as a touch panel, suitable hardware mainly including a memory chip and a microprocessor, a hard disk device incorporating a computer program for operating the hardware, and the substrate laminating device 1. It comprises an appropriate interface circuit that performs data communication with components such as each driving device, and is configured to cause the substrate laminating apparatus 1 to perform a series of laminating operations described below.

  Next, operation | movement of the board | substrate bonding apparatus 1 which concerns on this invention is demonstrated. 6 is a flowchart showing an outline of the operation of the substrate bonding apparatus 1 according to the present invention, FIG. 7 is a diagram for explaining details of each step in FIG. 6, and FIG. 8 is for explaining details of each step in FIG. FIG. 9 is a diagram for explaining details of each step of FIG. 6, FIG. 10 is a partial front sectional view for explaining details of the first pressurization step and the second pressurization step, and FIG. It is a top view for demonstrating the detail of 1 pressurization and a 2nd pressurization step.

[Lower board loading S1]
The carry-in operation of the lower substrate K2 is performed. That is, in the lower substrate transfer unit 3, the transfer table 32 is driven in each direction of XYZθ and receives the lower substrate K2 temporarily placed on the lower substrate stocker 31 (see FIG. 7A). The substrate stage 4 causes the lift pins 44 to protrude from the placement surface 41 (see FIG. 7B). The transfer table 32 is driven again, and the lower substrate K2 is transferred to the tip of the lift pin 44 (see FIG. 7C). After that, the transfer table 32 is retracted (see FIG. 7E). The lift pins 44 are lowered while supporting the lower substrate K2. When the lift pin 44 reaches the lowest position, a suction pressure is generated in the vacuum suction hole 42, and the lower substrate K2 is fixedly held on the placement surface 41 (see FIG. 8F).

[Upper board loading S2]
In parallel with the loading operation of the lower substrate K2, the loading operation of the upper substrate K1 is performed. That is, in the upper substrate transfer unit 2, the transfer table 22 is driven in each direction of XYZθ and receives the upper substrate K1 temporarily placed on the upper substrate stocker 21 (see FIG. 7A), and the upper substrate fixing jig. Bring it so that it is directly below 61 (see FIG. 7B). The upper substrate fixing jig 61 generates a suction pressure in the vacuum suction hole 611. The upper substrate fixing jig 61 descends to the position of the non-bonding surface K12 of the upper substrate K1, and sucks and holds the non-bonding surface K12 of the upper substrate K1 (see FIG. 7D). Thereafter, the transfer table 22 is retracted (see FIG. 8F). At that time, although not shown, the cover film on the bonding surface K11 is removed.

[Upper and lower substrate alignment S3]
The imaging device 5a is disposed at the imaging position P1 (see FIG. 8G). The upper imaging unit 5aU reads the alignment mark M1 formed on the upper substrate K1, and sends the image data to the control unit 7. The lower imaging unit 5aD reads the alignment mark M2 formed on the lower substrate K2, and sends the image data to the control unit 7.

  In parallel with the imaging operation of the imaging device 5a, the imaging device 5b is disposed at the imaging position P1 '(see FIG. 8G). The upper imaging unit 5bU reads the alignment mark M1 ′ formed on the upper substrate K1, and sends the image data to the control unit 7. The lower imaging unit 5bD reads the alignment mark M2 'formed on the lower substrate K2 and sends the image data to the control unit 7. When the imaging is finished, the imaging devices 5a and 5b are retracted to the retracted positions P2 and P2 ', respectively.

  Based on the image data, the control unit 7 matches the XY direction position of the alignment mark M1 of the upper substrate K1 with the XY direction position of the alignment mark M2 of the lower substrate K2, and aligns the alignment mark M1 ′ of the upper substrate K1. The first driving unit 64 is driven and controlled in the XY direction and the θ direction so that the XY direction position matches the XY direction position of the alignment mark M2 ′ of the lower substrate K2. Thereby, alignment with the upper board | substrate K1 and the lower board | substrate K2 is performed.

[First pressurization S4]
The first drive unit 64 drives the pressurizing unit main body 62 to descend in the Z direction. As a result, the upper substrate fixing jig 61 is lowered in a state where the upper substrate K1 is sucked and held, and the upper substrate K1 and the lower substrate K2 are opposed to each other (see FIGS. 8H and 10A). ).

  The second drive unit 65 drives the central pressure unit 63 to descend in the Z direction. Thereby, the center pressurization part 63 becomes a form which protrudes below from the pressurization part main body 62. FIG. The upper substrate fixing jig 61 and the first substrate K1 held by the upper substrate fixing jig 61 are such that the approximate center line J1 on the bonding surface K11 and the regions near both sides (R1) are the bonding surface (K21) of the second substrate (K2). Curve to touch. That is, the second substrate K2 is curved so as to have a convex shape protruding with respect to the bonding surface K21. As a result, the curved portion is pressurized toward the bonding surface K21 of the second substrate K2, and the bonding of the portion is performed (see FIGS. 8I and 10B).

[Second pressure S5]
The first drive unit 64 drives the pressurizing unit main body 62 to descend in the Z direction. Accordingly, the pressurizing unit main body 62 pressurizes the first substrate K1 in such a manner that the central pressurizing unit 63 enters the pressurizing unit main body 62. That is, as in the regions R1 and R2 shown in FIGS. 10 and 11, the pressurizing region of the first substrate K1 that pressurizes toward the bonding surface K21 of the second substrate K2, that is, the first substrate K1 is pressurized. The region is gradually expanded from above the approximate center line J1 in a direction X perpendicular to the approximate center line J1 (see FIG. 8J). As a result, the outer portion of the tip portion curved in a convex shape is applied toward the bonding surface K21 of the second substrate K2 while gradually expanding from above the approximate center line J1 in the direction X perpendicular to the approximate center line J1. And the part is bonded. In other words, by gradually reducing the curvature of the curved portion of the first substrate K1, pressure is applied to the outline center line J1 and the outer region R2 of the region R1 near both sides (see FIG. 9K). After a predetermined pressing force is applied for a predetermined time, the upper substrate K1 and the lower substrate K2 are bonded to complete the display device KD (see FIG. 10D).

[Display device unloading S6]
When the bonding of the upper substrate K1 and the lower substrate K2 is completed, first, the vacuum suction by the upper substrate fixing jig 61 is released, and the first driving unit 64 raises the pressure unit main body 62 (FIG. 9L) reference). Next, the suction pressure generated in the vacuum suction hole 43 is destroyed. Next, the lift pins 44 protrude and are raised while supporting the display device KD formed by bonding the upper substrate K1 and the lower substrate K2 (see FIG. 9M). When the lift pins 44 reach the uppermost position, the transfer table 32 is driven in each direction of XYZθ (see FIG. 9N), and the display device KD is transferred to the lower substrate stocker 31 (see FIG. 9O). .

  As described above, according to the substrate laminating apparatus 1 according to the present invention, after the arrangement of the first substrate K1 and the second substrate K2, first, the approximate center line J1 on the bonding surface K11 of the first substrate K1 and its The both-side vicinity region R1 is pressurized toward the bonding surface K21 of the second substrate K2. Thereby, bonding of the approximate center line J1 on the bonding surface K11 of the first substrate K1 and the regions R1 on both sides thereof is performed. Next, pressurization is performed while gradually expanding the pressurization region in the direction X orthogonal to the approximate center line J1. Thereby, bonding is advanced simultaneously from the fixed center toward both sides, and bonding of the outer region R2 is performed. As a result, it is possible to suppress displacement in the horizontal plane direction, and it is possible to improve the bonding accuracy between the bonding surface K11 and the bonding surface K21. Moreover, the biting of air can be remarkably reduced as compared with the case where the entire surface is pressurized simultaneously.

  Moreover, since the alignment is performed using the alignment mark at the time of bonding, the bonding accuracy is further improved. Further, since the bonding is performed under an atmospheric pressure atmosphere, a large-scale apparatus such as a vacuum chamber is not required, and the apparatus cost can be reduced. And it does not cost time to make a vacuum atmosphere.

  Further, the upper substrate fixing jig 61 that can be bent is used to hold the first substrate K1. At this time, since the first substrate K1 can be held in a flat shape and disposed opposite to and in close proximity to the second substrate K2, it is possible to prevent misalignment at both ends of the bonding surfaces K11 and K21. As a result, the bonding accuracy can be improved. Furthermore, the first pressurization and the second pressurization can be performed by utilizing the curvature of the upper substrate fixing jig.

  Further, in the first pressurizing step S4, the alignment accuracy is bonded by fixing the tip curved in a convex shape with respect to a direction other than the direction perpendicular to the counter substrate (direction along the bonding surface). It can be used for accuracy. Moreover, the position shift at the time of alignment and bonding can be suppressed by vacuum-sucking the approximate center line J1 portion of the first substrate K1, that is, the center line portion of the curved convex surface. On the other hand, the part other than the center line of the convex surface is fixed with an adhesive substance 612, and the adhesive substance 612 relaxes the expansion and contraction accompanying the curvature of the first fixing part 61. As a result, it is possible to suppress a decrease in bonding accuracy due to bending. Since the electrodes and the sub-pixels of the color filter are accurately positioned on the first substrate K1 and the second substrate K2, a display device capable of obtaining a high-quality image can be manufactured.

  As mentioned above, although embodiment of this invention was described, embodiment disclosed above is an illustration to the last, Comprising: The scope of the present invention is not limited to this embodiment. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. For example, the second substrate K2 may be inflexible like a glass substrate, for example. Further, it may be applied to a so-called roll-to-roll process in which at least one of the substrate 1 and the substrate 2 is a continuous body.

It is a composition schematic diagram of a substrate pasting device concerning the present invention. It is the II arrow directional view of FIG. It is a perspective view of a pressurizing part. It is the top view which looked at the upper substrate fixing jig from the lower part. It is a figure which shows the position of the alignment mark in an upper board | substrate and a lower board | substrate. It is a flowchart which shows the operation | movement outline | summary of the board | substrate bonding apparatus which concerns on this invention. It is a figure for demonstrating the detail of each step of FIG. It is a figure for demonstrating the detail of each step of FIG. It is a figure for demonstrating the detail of each step of FIG. It is a front fragmentary sectional view for demonstrating the detail of a 1st pressurization and a 2nd pressurization step. It is a top view for demonstrating the detail of a 1st pressurization and a 2nd pressurization step. It is a figure for demonstrating the conventional method of bonding an upper board | substrate and a lower board | substrate.

Explanation of symbols

1 Substrate laminating device 4 Substrate stage (second fixing part, arrangement means)
5 Imaging unit (positioning means)
6 Pressurization part (arrangement means)
61 Upper substrate fixing jig (first pressing means, second pressing means, first fixing portion)
62 Pressurizing body (second pressurizing means)
63 Central pressure part (first pressure means)
64 1st drive part (drive means, alignment means)
611 Vacuum suction hole (holding means, vacuum suction means)
612 Adhesive substance (holding means, adhesive means)
J1 Approximate center line K1 1st board | substrate K2 2nd board | substrate K11 Laminating surface K21 Laminating surface R1 Both sides vicinity area R2 Outer area S1 Arrangement step S2 Arrangement step S3 Arrangement step S4 1st pressurization step S5 2nd pressurization step S1 step S2 step S3 step X orthogonal direction

Claims (18)

A substrate laminating method for laminating a flexible first substrate (K1) and a flexible or inflexible second substrate (K2),
An arrangement step (S1, S2, S3) for arranging the first substrate (K1) and the second substrate (K2) so that the bonding surfaces (K11, K21) face each other;
A first pressure is applied to pressurize the approximate center line (J1) on the bonding surface (K11) of the first substrate (K1) and the region (R1) near both sides thereof toward the bonding surface (K21) of the second substrate (K2). Pressure step (S4);
And a second pressurizing step (S5) in which the pressurizing region of the first substrate (K1) is gradually expanded in a direction (X) perpendicular to the approximate center line (J1). Matching method.   The board | substrate bonding method of Claim 1 which aligns the bonding surface (K11) of a 1st board | substrate (K1), and the bonding surface (K21) of a 2nd board | substrate (K2) in an arrangement | positioning step (S3). .   The substrate bonding method according to claim 1 or 2, wherein the first substrate (K1) and the second substrate (K2) are bonded in an atmospheric pressure atmosphere.   The placement step (S1, S2, S3) includes a step (S1) for holding the first substrate (K1) in a flat shape on the bendable first fixing part (61) and a second fixing part (4). A step (S2) of holding the substrate (K2) in a planar shape, and a first fixing of the first substrate (K1) and the second substrate (K2) so that the bonding surfaces (K11, K21) face each other. The board | substrate bonding method in any one of Claims 1-3 which consists of a step (S3) which arrange | positions a part (61) and a 2nd fixing | fixed part (4).   In the first pressurizing step (S4), the approximate center line (J1) of the first substrate (K1) and the regions near both sides (R1) are in contact with the bonding surface (K21) of the second substrate (K2). Pressurization is performed by curving the first substrate (K1), and in the second pressurization step (S5), the curvature of the curved portion of the first substrate (K1) is gradually reduced to increase the approximate center. The board | substrate bonding method in any one of Claims 1-4 which pressurizes the outer area | region (R2) of a line | wire (J1) and its both-sides vicinity area | region (R1).   In the first pressurizing step (S4), when the first substrate (K1) held by the first fixing portion (61) is bent and bonded to the second substrate (K2), the first fixing portion (61) starts to The board | substrate bonding method of Claim 4 or Claim 5 which hold | maintains a 1st board | substrate (K1) to a 1st fixing | fixed part (61) so that 1 board | substrate (K1) may not shift | deviate.   When the first substrate (K1) is fixedly held on the first fixing portion (61), the region (R1) near both sides of the approximate center line (J1) on the first substrate (K1) is suction-held by the vacuum suction means (611). And the board | substrate bonding method in any one of Claims 4-6 to which the outer side area | region (R2) of the both-sides vicinity area | region (R1) of a general | schematic centerline (J1) is adhesively hold | maintained by the adhesion means (612).   The substrate bonding method according to any one of claims 1 to 7, wherein the first substrate (K1) and the second substrate (K2) are film substrates for a display device. A substrate laminating apparatus (1) for laminating a flexible first substrate (K1) and a flexible or inflexible second substrate (K2),
Arrangement means (6, 4) for arranging the first substrate (K1) and the second substrate (K2) so that the bonding surfaces (K11, K21) face each other, and
A first pressure is applied to pressurize the approximate center line (J1) on the bonding surface (K11) of the first substrate (K1) and the region (R1) near both sides thereof toward the bonding surface (K21) of the second substrate (K2). Pressure means (61, 63);
The first substrate (K1) to be pressed toward the bonding surface (K21) of the second substrate (K2) is pressurized while gradually expanding in the direction (X) perpendicular to the approximate center line (J1). A substrate bonding apparatus comprising: a second pressurizing unit (61, 62).   The substrate according to claim 9, further comprising alignment means (5, 64) for aligning the bonding surface (K11) of the first substrate (K1) and the bonding surface (K21) of the second substrate (K2). Laminating device.   The board | substrate bonding apparatus of Claim 9 or Claim 10 comprised so that bonding of a 1st board | substrate (K1) and a 2nd board | substrate (K2) might be performed in atmospheric pressure atmosphere.   The placement means (6, 4) includes a first bendable portion (61) for holding the first substrate (K1) in a flat shape and a first fixing portion (61) for holding the second substrate (K2) in a flat shape. The first fixing portion (61) and the second fixing portion (4) and the first fixing portion (61) and the second fixing portion (4) so that the bonding surfaces (K11, K21) of the first substrate (K1) and the second substrate (K2) face each other. The board | substrate bonding apparatus in any one of Claims 9-11 which consists of a drive means (64) which drives a fixing | fixed part (4) relatively.   In the first pressurizing means (61, 63), the approximate center line (J1) of the first substrate (K1) and the regions near both sides (R1) are in contact with the bonding surface (K21) of the second substrate (K2). In this way, the first substrate (K1) is configured to pressurize and the second pressurizing means (61, 62) gradually reduces the curvature of the curved portion of the first substrate (K1). 13. The pressurization of the outer region (R2) of the approximate center line (J1) and the region (R1) in the vicinity of both sides thereof is performed as described in any one of claims 9 to 12. Substrate laminating equipment.   In the first pressurizing step (S4), when the first substrate (K1) held by the first fixing portion (61) is bent and bonded to the second substrate (K2), the first fixing portion (61) starts to The board | substrate bonding apparatus of Claim 12 or Claim 13 provided with the holding means (611,612) which hold | maintains the 1st board | substrate (K1) in the 1st fixing | fixed part (61) so that 1 board | substrate (K1) may not shift | deviate. .   The holding means (611, 612) includes a vacuum suction means (611) that holds the vicinity (R1) of both sides of the approximate center line (J1) in the first substrate (K1) by vacuum suction, and both sides of the approximate center line (J1). The board | substrate bonding apparatus of Claim 14 which consists of the adhesion means (612) which carries out adhesion holding | maintenance of the outer side area | region (R2) of a near field (R1).   The substrate bonding apparatus according to any one of claims 9 to 15, wherein the first substrate (K1) and the second substrate (K2) are film substrates for a display device.   A display device manufactured using the substrate bonding method according to claim 1.   A display device manufactured using the substrate bonding apparatus according to claim 9.

Images