1274521 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電容式麥克風，更明確地說，其係 關於一種具有平行管形狀的電容式麥克風，即使該麥克風 具有兩個以上的電連接終端，該平行管形狀亦易於SMD製 程中來確認某組件的方向。 【先前技術】 典型的電容式麥克風包含一電壓偏壓元件，其通常由 下面所組成：複數個駐極；一對隔膜/背板，用以形成可響 應聲壓而改變的電容C ;以及一 JFET(接面場效電晶體）， 用以緩衝處理輸出信號。 第一圖為習用之一般電容式麥克風的概略示意圖。 如第一圖所示，典型的電容式麥克風10具有一柱狀金 屬外殼，其包含：一極環；一隔膜；一分隔體；一背板； 一第一基底，其具有由絕緣材料製成的環狀；一第二基底， 其係由導體材料所製成；以及一位於其中的PCB。該典型 電容式麥克風的外觀為柱狀，且於該PCB中會形成兩個連 接終端。 同時，於表面黏著製程期間，該主PCB的終端必須和 該電容式麥克風的終端正確地相連。不過，上述的習用柱 狀電容式麥克風的構造並不適用於表面黏著裝置（SMD)。因 為終端表面低於該外殼的捲曲表面，所以於該表面黏著製 程期間可能會導致焊接黏著失效。明確地說，假使其中提 1274521 供複數個終端的話，便難以確認連接終端的方向。因此， 所導致的問題為，在該表面黏著製程期間該等連接終端的 極性發生改變的情況下該等連接終端會被不適當地連接或 是會因為連接終端表面脫離的關係而使得該等連接終端表 . 面僅有部份被連接，因而便會提高連接失效的機率。 【發明内容】 本發明希望解決上述的問題。本發明的目的係提供一 • 種平行管型電容式麥克風，其中可輕易地確認某組件的方 向，而且即使該麥克風具有數個連接終端亦可套用SMD製 程。 ^ 為達成本發明的目的，根據本發明一具體實施例之電 容式麥克風包括：一正方形盒狀的外殼，該外殼具有一開 放表面與一由用於收集聲音的複數個聲孔所構成的封閉底 表面；一環狀的隔膜部件，該隔膜部件係被插入該外殼之 ^ 中；一環狀的薄分隔體；一柱狀的絕緣環，其具有一開放 頂端與底部部份；一碟狀的背板，其具有從中穿過的複數 個聲孔；一環狀的導體環，用以將該背板電連接至一 PCB ; 以及該正方形板狀的PCB，該PCB具有被安置於該PCB其 中一表面上的複數個電子組件以及形成於其另一表面上的 複數個凸出終端。此處，該隔膜部件、該分隔體、該絕緣 環、該背板、該導體環、以及該PCB均會依序被配置於該 外殼之中，然後再利用捲曲該外殼的一末端來整合組裝該 電容式麥克風。 1274521 _ 為達成本發明的目的，根據本發明另一具體實施例之 電容式麥克風包括：一正方形盒狀的外殼，該外殼具有一 開放表面與一由用於收集前向聲音的複數個聲孔所構成的 封閉底表面；一環狀的隔膜部件，該隔膜部件係被插入該 . 外殼之中；一環狀的薄分隔體；一環圈狀的盾環，用以絕 _ 緣一背板；該碟狀的背板，其具有從中穿過的複數個聲孔； 一整合式基底，其具有一柱狀絕緣體與一導體層，該柱狀 絕緣體具有開放頂端與底部部份，而該導體層則可於該背 ® 板與一 PCB間提供電連接並且係形成於該絕緣體的内表面 之中；以及該正方形板狀的PCB，該PCB具有被安置於該 PCB其中一表面上的複數個電子組件以及形成於其另一表 ‘面上的複數個凸出終端。此處，該隔膜部件、該分隔體、 該盾環、該背板、該整合式基底、以及該PCB均會依序被 配置於該外殼之中，然後再利用捲曲該外殼的一末端來整 合組裝該電容式麥克風。 【實施方式】 下文中將參考該等附圖來詳細說明本發明較佳具體實 施例。 第二圖為根據本發明之平行管型麥克風的透視圖。 如第二圖所示，根據本發明之電容式麥克風100〜600 包含一可於其中插入組件的平行管外殼，並且被調適成可 經由其PCB —表面上所形成之凸出終端被連接至一主PCB 。本發明的此等電容式麥克風100〜600均具有平行管形狀BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a condenser microphone, and more particularly to a condenser microphone having a parallel tube shape, even if the microphone has more than two electrical connections. The terminal, the parallel tube shape is also easy to confirm the orientation of a component in the SMD process. [Prior Art] A typical condenser microphone includes a voltage biasing element, which is generally composed of: a plurality of electrets; a pair of diaphragms/back plates for forming a capacitor C that changes in response to sound pressure; and a JFET (junction field effect transistor) to buffer the output signal. The first figure is a schematic diagram of a conventional condenser microphone. As shown in the first figure, a typical condenser microphone 10 has a columnar metal casing comprising: a pole ring; a diaphragm; a separator; a backing plate; a first substrate having an insulating material a ring-shaped; a second substrate made of a conductor material; and a PCB located therein. The typical condenser microphone has a cylindrical appearance and two connection terminals are formed in the PCB. At the same time, the terminal of the main PCB must be properly connected to the terminal of the condenser microphone during the surface mount process. However, the above-described configuration of the conventional cylindrical condenser microphone is not suitable for a surface mount device (SMD). Since the terminal surface is lower than the curled surface of the outer casing, solder adhesion failure may occur during the surface sticking process. Specifically, if 1274521 is provided for a plurality of terminals, it is difficult to confirm the direction of the connection terminal. Therefore, the problem is that the connection terminals may be improperly connected in the case where the polarity of the connection terminals is changed during the surface adhesion process, or the connection may be made due to the disconnection of the connection terminal surface. The terminal table. Only a part of the face is connected, thus increasing the probability of connection failure. SUMMARY OF THE INVENTION The present invention is intended to solve the above problems. SUMMARY OF THE INVENTION An object of the present invention is to provide a parallel tube type condenser microphone in which the orientation of a component can be easily confirmed, and the SMD process can be applied even if the microphone has a plurality of connection terminals. In order to attain the object of the present invention, a condenser microphone according to an embodiment of the present invention comprises: a square box-shaped casing having an open surface and a closed by a plurality of sound holes for collecting sound a bottom surface; an annular diaphragm member inserted into the outer casing; an annular thin separator; a cylindrical insulating ring having an open top and bottom portion; a dish a back plate having a plurality of sound holes therethrough; an annular conductor ring for electrically connecting the back plate to a PCB; and the square plate-shaped PCB having the PCB disposed thereon a plurality of electronic components on one of the surfaces and a plurality of protruding terminals formed on the other surface thereof. Here, the diaphragm member, the separator, the insulating ring, the back plate, the conductor ring, and the PCB are sequentially disposed in the casing, and then the assembly is integrated by crimping one end of the casing. The condenser microphone. 1274521 _ In order to achieve the object of the present invention, a condenser microphone according to another embodiment of the present invention includes: a square box-shaped outer casing having an open surface and a plurality of sound holes for collecting forward sound a closed bottom surface; an annular diaphragm member inserted into the outer casing; an annular thin separator; a ring-shaped shield ring for the rim-back plate; The dish-shaped back sheet has a plurality of sound holes therethrough; an integrated substrate having a columnar insulator and a conductor layer, the column insulator having an open top and bottom portion, and the conductor layer Providing an electrical connection between the backing plate and a PCB and formed in an inner surface of the insulator; and the square plate-shaped PCB having a plurality of electrons disposed on one surface of the PCB A component and a plurality of protruding terminals formed on the other surface of the table. Here, the diaphragm member, the separator, the shield ring, the back plate, the integrated substrate, and the PCB are sequentially disposed in the casing, and then integrated by crimping one end of the casing Assemble the condenser microphone. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The second figure is a perspective view of a parallel tube microphone according to the present invention. As shown in the second figure, the condenser microphones 100 to 600 according to the present invention comprise a parallel tube housing into which components can be inserted, and are adapted to be connected to a via terminal formed on the surface of the PCB. Main PCB. The condenser microphones 100 to 600 of the present invention each have a parallel tube shape
Cs 1274521 . ◦所以，於進行表面黏著時可輕易地調整組件的方向，而 此結果便能夠解決連接該主PCB之連接終端的表面的問題 ，並且解決該電容式麥克風可能脫離的情形或其方向可能 改變的情形。本發明之平行管型電容式麥克風可由各種組 ‘. 件所構成。下文將詳細說明第一至第六具體實施例。 _ [第一具體實施例] 第三圖為根據本發明之平行管型電容式麥克風之第一 具體實施例的分解透視圖。 ® 參考第三圖，根據本發明之電容式麥克風100包括： 一 一正方形盒狀的外殼102,其具有一開放表面與一由用於收 集聲音的複數個聲孔l〇2a所構成的封閉底表面；一環狀的 隔膜部件104，其係被插入該正方形盒狀的外殼之中；一環 狀的薄分隔體106 ; —柱狀的絕緣環108，其具有一開放頂 端與底部部份；一碟狀的背板110，其具有從中穿過的複數 個聲孔110a; —環狀的導體環112,用以將該背板110電連 'φ接至一印刷電路板（PCB)114 ;以及該正方形板狀的PCB . 114，其具有被安置於該PCB其中一表面上的複數個組件 (1C、MLCC)以及形成於其另一表面上的複數個凸出終端 116。此處，該隔膜部件104包含一極環104a，用以電連接 至外殼102 ;以及一隔膜104b，其會被聲壓振動。背板110 包括一金屬板，其上會熔接一由複數個駐極所構成的有機 膜。進一步言之，吾人希望外殼102於其底表面的中央部 份處不具有聲孔，因為該外殼的底表面的中央為SMD製程 中用於從膠帶盤封裝（tape & reel package)拾取該麥克風的 9 1274521 位置。 [第二具體實施例] 第四圖為根據本發明之平行管型電 具體貫施例的分解透視圖。 容式麥克風 之第 . 參考第四圖，根據本發明之電容式麥克風200包括· ^ 一正方形盒狀的外殼202,其具有一開放表面與一由用於收 集耸音的複數個聲孔2〇2a所構成的封閉底表面；一隔膜部 •件204,其具有一被插入該正方形盒狀的外殼2〇2之中的正 方形周圍表面以及一形成於其内部之上的圓形隔膜；一分 隔體206 ’其具有一正方形周圍表面以及一圓形内周圍表 面；一正方形盒狀的絕緣環208，其具有一開放頂端與底部 部份；一正方形形狀的背板210,其具有從中穿過的複數個 聲孔210a ; —導體環212，其具有一正方形周圍表面用以 將該背板210電連接至一 pCB 214，及一圓形内周圍表面； 以及該正方形板狀的pCB 214，其具有被安置於該PCB其 φ中一表面上的複數個組件（IC、MLCC)以及形成於其另一表 面上的複數個凸出終端216。此處，該隔膜部件204包含一 極環204a ’用以電連接至外殼202 ;以及一隔膜204b，其 會被聲壓振動。背板210包括一金屬板，其上會熔接一由 複數個駐極所構成的有機膜。進一步言之，吾人希望外殼 202於其底表面的中央部份處不具有聲孔，因為該外殼的底 表面的中央為SMD製程中用於從膠帶盤封裝(tape & reel Package)拾取該麥克風的位置。 [第二具體實施例] 1274521 第五圖為根據本發明之平行管型電容式麥克風之第三 具體實施例的分解透視圖。 參考第五圖，根據本發明之電容式麥克風300包括： 一正方形盒狀的外殼302,其具有一開放表面與一由用於收 . 集聲音的複數個聲孔302a所構成的封閉底表面；一隔膜部 件304,其具有一被插入該正方形盒狀的外殼之中的正方形 周圍表面以及一形成於其内部之上的圓形隔膜；一分隔體 306，其具有一正方形周圍表面以及一正方形内周圍表面； ® 一正方形盒狀的絕緣環308，其具有一開放頂端與底部部 份；一正方形形狀的背板310,其具有從中穿過的複數個聲 孔310a ; —導體環312,其具有一正方形周圍表面用以將 該背板310電連接至一 PCB 314，及一正方形内周圍表面； 以及該正方形板狀的PCB 314，其具有被安置於該PCB其 中一表面上的複數個組件（1C、MLCC)以及形成於其另一表 面上的複數個凸出終端316。此處，該隔膜部件304包含一 -⑩極環304a，用以電連接至外殼302 ;以及一隔膜304b，其 會被聲壓振動。背板310包括一金屬板，其上會溶接一由 複數個駐極所構成的有機膜。進一步言之，吾人希望外殼 302於其底表面的中央部份處不具有聲孔，因為該外殼的底 表面的中央為SMD製程中用於從膠帶盤封裝(tape & reel package)拾取該麥克風的位置。 [第一至第三具體實施例的運作方式] 第六圖為本發明之第一、第二、第三具體實施例的組 裝的側剖視圖。該等組件的元件符號係以第一具體實施例 d 1274521 中的元件符號來表示。 參考第六圖，第一至第三具體實施例的電容式麥克風 100〜300分別具有一正方形盒狀的外殼1〇2，其中會依序酉5己 置隔膜部件l〇4a、104b、分隔體1〇6、絕緣環1〇8、背 110、導體環112、以及正方形板狀的pCB 114。接著， 捲曲該外殼1〇2的末端以組|與建構該等電容式麥克口 此處，可視該等組㈣製造與組裝方便㈣置換 杜 以組裝每一個組件。 、、件Cs 1274521 . Therefore, the orientation of the component can be easily adjusted when the surface is adhered, and the result can solve the problem of connecting the surface of the connection terminal of the main PCB, and solve the situation that the condenser microphone may be detached or its direction A situation that may change. The parallel tube type condenser microphone of the present invention can be constructed of various groups. The first to sixth specific embodiments will be described in detail below. [First Embodiment] The third figure is an exploded perspective view of a first embodiment of a parallel tube type condenser microphone according to the present invention. Referring to the third diagram, the condenser microphone 100 according to the present invention comprises: a square box-shaped casing 102 having an open surface and a closed bottom formed by a plurality of sound holes 102a for collecting sound a ring-shaped diaphragm member 104 that is inserted into the square box-shaped outer casing; an annular thin separator 106; a columnar insulating ring 108 having an open top and bottom portion; a disk-shaped back plate 110 having a plurality of sound holes 110a passing therethrough; an annular conductor ring 112 for electrically connecting the back plate 110 to a printed circuit board (PCB) 114; And the square plate-shaped PCB 114 having a plurality of components (1C, MLCC) disposed on one surface of the PCB and a plurality of protruding terminals 116 formed on the other surface thereof. Here, the diaphragm member 104 includes a pole ring 104a for electrically connecting to the outer casing 102, and a diaphragm 104b which is vibrated by sound pressure. The backing plate 110 includes a metal plate on which an organic film composed of a plurality of electrets is welded. Further, it is desirable for the outer casing 102 to have no acoustic holes at the central portion of its bottom surface because the center of the bottom surface of the outer casing is used in the SMD process for picking up the microphone from a tape & reel package. 9 1274521 location. [Second embodiment] The fourth figure is an exploded perspective view of a parallel tube type electrical specific embodiment according to the present invention. Referring to the fourth figure, the condenser microphone 200 according to the present invention includes a square box-shaped outer casing 202 having an open surface and a plurality of sound holes 2 for collecting the muffles. a closed bottom surface formed by 2a; a diaphragm portion 204 having a square surrounding surface inserted into the square box-shaped outer casing 2〇2 and a circular diaphragm formed on the inner portion thereof; Body 206' has a square surrounding surface and a circular inner peripheral surface; a square box-shaped insulating ring 208 having an open top and bottom portion; a square shaped backing plate 210 having a pass therethrough a plurality of acoustic holes 210a; a conductor ring 212 having a square peripheral surface for electrically connecting the back plate 210 to a pCB 214, and a circular inner peripheral surface; and the square plate-shaped pCB 214 having A plurality of components (IC, MLCC) disposed on a surface of the φ of the PCB and a plurality of protruding terminals 216 formed on the other surface thereof. Here, the diaphragm member 204 includes a pole ring 204a' for electrically connecting to the outer casing 202, and a diaphragm 204b which is vibrated by sound pressure. The backing plate 210 includes a metal plate on which an organic film composed of a plurality of electrets is welded. Further, it is desirable for the outer casing 202 to have no acoustic holes at the central portion of its bottom surface because the center of the bottom surface of the outer casing is used in the SMD process for picking up the microphone from the tape & reel package. s position. [Second embodiment] 1274521 The fifth figure is an exploded perspective view of a third embodiment of the parallel tube type condenser microphone according to the present invention. Referring to a fifth diagram, a condenser microphone 300 according to the present invention comprises: a square box-shaped outer casing 302 having an open surface and a closed bottom surface formed by a plurality of sound holes 302a for collecting sound; a diaphragm member 304 having a square surrounding surface inserted into the square box-shaped outer casing and a circular diaphragm formed on the inner portion thereof; a partition 306 having a square surrounding surface and a square Surrounding surface; a square box-shaped insulating ring 308 having an open top and bottom portion; a square-shaped backing plate 310 having a plurality of sound holes 310a therethrough; a conductor ring 312 having a square surrounding surface for electrically connecting the backplane 310 to a PCB 314, and a square inner peripheral surface; and the square plate-shaped PCB 314 having a plurality of components disposed on one of the surfaces of the PCB ( 1C, MLCC) and a plurality of protruding terminals 316 formed on the other surface thereof. Here, the diaphragm member 304 includes a -10 pole ring 304a for electrical connection to the outer casing 302, and a diaphragm 304b which is vibrated by sound pressure. The backing plate 310 includes a metal plate on which an organic film composed of a plurality of electrets is dissolved. Further, it is desirable for the outer casing 302 to have no acoustic holes at the central portion of its bottom surface because the center of the bottom surface of the outer casing is used in the SMD process for picking up the microphone from the tape & reel package. s position. [Operation Modes of First to Third Embodiments] Fig. 6 is a side cross-sectional view showing the assembly of the first, second, and third embodiments of the present invention. The component symbols of the components are denoted by the component symbols in the first embodiment d 1274521. Referring to the sixth figure, the condenser microphones 100 to 300 of the first to third embodiments respectively have a square box-shaped outer casing 1〇2 in which the diaphragm members 104a, 104b, and the separator are sequentially disposed. 1〇6, insulating ring 1〇8, back 110, conductor ring 112, and square plate-shaped pCB 114. Next, the ends of the outer casing 1〇2 are crimped in groups | and the capacitive microphone ports are constructed. Here, it is convenient to manufacture and assemble the four (4) replacement units to assemble each component. , pieces
於PCB 114的裸露表面上會形成複數個凸 m’而且該等凸出終端會凸出超過該捲曲表面 = SMD方法中將該等電容式麥克風1〇〇〜黏著至乂可： PCB(舉例來說’ 一蜂巢式電話的pcB)。該 係:連祕端與接地終 而定，第-至第三具體實施Γ 造與組裝方便性 圓形形狀之中的邊緣，致:=方形組件具有形成於-於該PCB之中的冗包二^等邊緣可彼此接觸。被安置 類比至數位(A/D)轉換器；效電晶體(臟）；放大器； 該類比至數位(A/D)轉換器所^成八^’。其為由該放大器與 下 弟一至第三具體實施例的電容式麥克風的運作方式如 根據本發明之電容式來 會被連接至主PCB的連接终：。：：該等凸出终端116 加至該等凸出終端。據此 # GND電源會被施 极據本發明的電容式麥克風 12 1274521 100〜300中，隔膜104b便會經由外殼102與極環104a被電 連接至PCB 114,而背板110則會經由導體環112被電連接 至 PCB 114。 於此情況中，源自外界聲源的聲音便會經由該外殼的 . 聲孔102a流入該麥克風内部並且會傳送至隔膜104b。被收 集至背部腔室中的聲音會經由背板110的聲孔ll〇a傳送至 隔膜104b。 因此，隔膜104b會被聲壓振動。接著，便會改變隔膜 參 104b與背板110之間的間隙。隔膜104b與背板110所產生 的靜電容量會改變，因而便可達到依照聲波來改變電信號 (電壓）的目的。此信號會沿著上面的電連接路徑傳送至被安 ~ 置於該PCB 114之中的1C進行放大，接著便會經由該等凸 出終端116被輸出至一外部電路。 [第四具體實施例] 第七圖為根據本發明之電容式麥克風之第四具體實施 ，·例的分解透視圖。 參考第七圖，本發明之電容式麥克風400包括：一正 方形盒狀的外殼402,其具有一開放表面與一由用於收集聲 音的複數個聲孔402a所構成的封閉底表面；一環狀的隔膜 部件404，其係被插入該正方形盒狀的外殼之中；一環狀的 薄分隔體406; —環圈狀的盾環408,用以絕緣一背板410 ; 該碟狀的背板410，其具有從中穿過的複數個聲孔410a ; 一整合式基底412，其具有一導體層412b，該導體層可於 該背板410與該PCB 414間提供電連接並且係形成於一具A plurality of convex m's are formed on the exposed surface of the PCB 114 and the protruding terminals may protrude beyond the curled surface. In the SMD method, the capacitive microphones are adhered to the :: PCB (for example Say 'a PCB for a cellular phone'. The system: the secret end and the grounding end, the first to the third specific implementation and assembly of the edge of the circular shape, so that: = square component has a redundant package formed in the PCB The edges can be in contact with each other. Analog to digital (A/D) converter; effect transistor (dirty); amplifier; analog to digital (A/D) converter. It is a mode of operation of the condenser microphone from the amplifier and the following third to third embodiments, such as the capacitive type according to the present invention, which is connected to the main PCB. :: The bulging terminals 116 are added to the bulging terminals. According to this, the GND power supply is applied to the condenser microphone 12 1274521 100 to 300 according to the present invention, the diaphragm 104b is electrically connected to the PCB 114 via the outer casing 102 and the pole ring 104a, and the back plate 110 passes through the conductor ring. 112 is electrically connected to the PCB 114. In this case, the sound from the external sound source flows into the inside of the microphone through the sound hole 102a of the outer casing and is transmitted to the diaphragm 104b. The sound collected into the back chamber is transmitted to the diaphragm 104b via the sound hole 11〇a of the back plate 110. Therefore, the diaphragm 104b is vibrated by sound pressure. Then, the gap between the diaphragm ginseng 104b and the backing plate 110 is changed. The electrostatic capacitance generated by the diaphragm 104b and the backing plate 110 is changed, so that the purpose of changing the electrical signal (voltage) in accordance with the sound wave can be achieved. This signal is transmitted along the upper electrical connection path to 1C placed in the PCB 114 for amplification, and then output to an external circuit via the protruding terminals 116. [Fourth embodiment] Fig. 7 is an exploded perspective view showing a fourth embodiment of a condenser microphone according to the present invention. Referring to the seventh figure, the condenser microphone 400 of the present invention comprises: a square box-shaped outer casing 402 having an open surface and a closed bottom surface formed by a plurality of sound holes 402a for collecting sound; The diaphragm member 404 is inserted into the square box-shaped outer casing; an annular thin partition 406; a ring-shaped shield ring 408 for insulating a back plate 410; the dish-shaped back plate 410 having a plurality of sound holes 410a therethrough; an integrated substrate 412 having a conductor layer 412b, the conductor layer being electrically connectable between the back plate 410 and the PCB 414 and formed in one
Cs 1274521 . 有開放頂端與底部部份的柱狀絕緣體412a的内表面之中β 以及 一正方形板狀的PCB 414，其具有被安置於該其 中一表面上的複數個組件（1C、MLCC)以及形成於其另—參 - 面上的複數個凸出終端416。 • 此處，該隔膜部件404包含一極環404a，用以電連接 至外殼402 ;以及一隔膜404b，其會被聲壓振動。背板41〇 包括一金屬板，其上會熔接一由複數個駐極所構成的有機 籲膜。進一步言之，吾人希望外殼402於其底表面的中央部 份處不具有聲孔，因為該外殼的底表面的中央為SMD製程 中用於從膠帶盤封裝（tape & reel package)拾取該麥克風的 位置。 該整合式基底412的構造為以該中空柱狀絕緣體412& 作為一利用PCB技術的pcb，然後於該中空柱狀絕緣體 412a的兩侧與内周圍表面中形成一由金屬板製成的導體層 • 412b，該金屬板的外徑小於其周圍外徑。 籲 相同的係，根據本發明的整合式基底412的構造為實 施習用絕緣功能的第一基底與實施導體功能的第二基底可 能係由一整合式基底所構成。該金屬板的外徑應該小於該 絕緣體的外徑，俾使不至於接觸到該外殼。此處，該絕緣 體較佳的係可由下面所組成：玻璃環氧化物基底、樹脂基 底、成是pvc型的絕緣印刷板。 雖然，圖中並未特別顯示，不過，絕緣體412a除了實 施絕緣功能以外遂能夠藉由下面方式來提供導體功能：於 14 1274521 二二-側中形成-金屬電鑛層接觸到制膜部件4i〇以 德：、另一側中形成一金屬電鍍層接觸到豸PCB 4M，缺 灸利用—穿透孔錢道孔來連接料頂端與底部金屬電錢 尽，致使該金屬電鍍層能夠被電連接。 [第五具體實施例] 容式麥克風之第五具體實施 第八圖為根據本發明之電 例的分解透視圖。Cs 1274521. Among the inner surfaces of the columnar insulator 412a having open top and bottom portions, β and a square plate-shaped PCB 414 having a plurality of components (1C, MLCC) disposed on one of the surfaces and A plurality of protruding terminals 416 are formed on the other surface thereof. • Here, the diaphragm member 404 includes a pole ring 404a for electrical connection to the outer casing 402, and a diaphragm 404b that is vibrated by sound pressure. The back plate 41A includes a metal plate on which an organic film composed of a plurality of electrets is welded. Further, it is desirable for the outer casing 402 to have no acoustic holes at the central portion of its bottom surface because the center of the bottom surface of the outer casing is used in the SMD process for picking up the microphone from the tape & reel package. s position. The integrated substrate 412 is configured to form a conductor layer made of a metal plate in the inner peripheral surface of the hollow columnar insulator 412a and a pcb using a PCB technology. • 412b, the outer diameter of the metal plate is smaller than the outer diameter of the surrounding. Referring to the same system, the first substrate of the integrated substrate 412 according to the present invention configured to implement the conventional insulating function and the second substrate for performing the conductor function may be constituted by an integrated substrate. The outer diameter of the metal plate should be smaller than the outer diameter of the insulator so as not to come into contact with the outer casing. Here, the insulator may preferably be composed of a glass epoxy substrate, a resin substrate, and an insulating printed plate of a pvc type. Although not specifically shown in the drawings, the insulator 412a can provide a conductor function in addition to the insulating function: the formation of the metal electric ore layer in contact with the film forming member 4i in the 14 1274521 In Germany, a metal plating layer is formed on the other side to contact the 豸PCB 4M, and the lack of moxibustion uses a through-hole hole to connect the top and bottom metal materials, so that the metal plating layer can be electrically connected. [Fifth Embodiment] Fifth Embodiment of Capacitive Microphone Fig. 8 is an exploded perspective view of an electric circuit according to the present invention.
乂茶考第八圖，本發明之電容式麥克風5〇。包括：一正 =形盒狀的外殼5〇2,其具有1放表面與—由用於收集聲 =複數個聲孔5G2a所構成的封閉底表面；_隔膜部件 /、具有一被插入该正方形倉狀的外殼之中的正方形周 圍表面以及一正方形的内周圍隔膜；一分隔體5〇6，其具有 正方形周圍表面以及一正方形内周圍表面；一正方形環 狀的盾裱508，用以絕緣一背板51〇 ;該正方形形狀的背板 510 ’其具有從中穿過的複數個聲孔51〇a ; 一整合式基底 12其具有一導體層512b，該導體層可於該背板510與該 PCB 514間提供電連接並且係形成於一具有開放頂端與底 部部份的正方形盒狀絕緣體512a的内表面之中；以及該正 方形板狀的PCB 514，其具有被安置於該pCB其中〜表面 上的複數個組件（1C、MLCC)以及形成於其另一表面上的複 數個凸出終端516。 此處’該隔膜部件504包含一極環504a，用以電連接 至外殼502 ;以及一隔膜504b，其會被聲壓振動。背板510 包括一金屬板，其上會熔接一由複數個駐極所構成的有機 15 1274521 膜。進一夕言之，吾人希望外殼502於其底表面的中央部 份處不具有聲孔，因為該外殼的底表面的中央為SMD製程 中用於從膠帶盤封裝（tape & reel package)拾取該麥克風的 . 位置。 _ 該整合式基底512的構造為以該中空柱狀絕緣體512a 作為一利用PCB技術的PC]B，然後於該中空柱狀絕緣體 512a的兩側與内周圍表面中形成一由金屬板製成的導體層 512b，該金屬板的外徑小於其周圍外徑。 Φ 相同的係，根據本發明的整合式基底512的構造為實 施習用絕緣功能的第一基底與實施導體功能的第二基底可 • 能係由一整合式基底所構成。該金屬板的外徑應該小於該 • 絕緣體的外徑，俾使不至於接觸到該外殼。此處，該絕緣 體較佳的係可由下面所組成：玻璃環氧化物基底、樹脂基 底、或是PVC型的絕緣印刷板。 雖然’圖中並未特別顯示’不過’絕緣體512a除了實 -馨施絕緣功能以外還能夠藉由下面方式來提供導體功能：於 •其其中-側中形成-金屬電鑛層接觸到該隔膜部件510以 及於其另-側中形成-金屬電錢層接觸到該PCB 514，铁 後利用-穿透孔或通道孔來連接該等頂端與底部金屬電鑛 層，致使該金屬電鍍層能夠被電連接。 [第六具體實施例] 風之第六具體實施 第九圖為根據本發明之電容式麥克 例的分解透視圖。 風600包括：一正 參考第九圖，本發明之電容式麥克 1274521 方形盒狀的外殼602,其具有一開放表面與一由用於收集聲 音的複數個聲孔602a所構成的封閉底表面；一隔膜部件 604，其具有一被插入該正方形盒狀的外殼之中的正方形周 圍表面以及一圓形的内周圍隔膜；一分隔體6〇6，其具有二 正方形周圍表面以及一圓形内周圍表面；一盾環6〇8，其具 有一正方形周圍表面用以絕緣一背板610以及一圓形内門 圍表面；該碟狀的背板610，其具有從中穿過的複數個聲孔 61〇a ; —整合式基底612，其具有一絕緣體612a，該絕緣 體612a具有開放頂端與底部部份、一正方形周圍表面、以 及一柱狀内周圍表面，該整合式基底612還具有一導體声 612b，該導體層可於該背板610與PCB 614間提供電連接 並且係形成於該絕緣體612 a的内表面之中；以及該正方妒 板狀的PCB 614，其具有被安置於該pCB其中一表面上的 複數個組件（1C、MLCC)以及形成於其另一表面上的複數個 凸出終端616。 此處’该隔膜部件604包含一極環604a，用以電連接 至外殼602 ;以及一隔膜604b，其會被聲壓振動。背板61〇 包括一金屬板，其上會熔接一由複數個駐極所構成的有機 膜。進一步言之，吾人希望外殼602於其底表面的中央部 份處不具有聲孔’因為該外殼的底表面的中央為SMD製程 中用於從膠帶盤封裝（tape & reel package)拾取該麥克風的 位置。 該整合式基底612的構造為以該中空柱狀絕緣體612a 作為一利用PCB技術的PCB，然後於該中空柱狀絕緣體 (§ 17 1274521 612a的兩側與内周圍表面中形成一由金屬板製成的導體層 612b，該金屬板的外徑小於其周圍外徑。 相同的係，根據本發明的整合式基底612的構造為實 施習用絕緣功能的第一基底與實施導體功能的第二基底可 . 能係由一整合式基底所構成。該金屬板的外徑應該小於該 絕緣體的外徑，俾使不至於接觸到該外殼。此處，該絕緣 體較佳的係可由下面所組成：玻璃環氧化物基底、樹脂基 底、或是PVC型的絕緣印刷板。 ® 雖然，圖中並未特別顯示，不過，絕緣體612a除了實 施絕緣功能以外還能夠藉由下面方式來提供導體功能：於 其中一侧中形成一金屬電鍍層接觸到該隔膜部件610以及 於其另一側中形成一金屬電鍍層接觸到該PCB 614，然後 利用一穿透孔或通道孔來連接該等頂端與底部金屬電鍍 層，致使該金屬電鍍層能夠被電連接。 [第四至第六具體實施例的運作方式] φ 第四至第六具體實施例的電容式麥克風的運作方式如 下。 第十圖為本發明之第四至第六具體實施例的組裝的侧 剖視圖。該等組件的元件符號係以第四具體實施例中的元 件符號來表示。 參考第十圖，第四至第六具體實施例的電容式麥克風 400〜600分別具有一正方形盒狀的外殼402，其中會依序配 置隔膜部件404、分隔體406、盾環408、背板410、整合 式外殼412、以及正方形板狀的PCB 114。接著，可捲曲該 18 1274521 外殼402的末端以細壯 可視該等組件的製造構該等電容式麥克風。此處， 每-個組件。 〜蹲方便性來置換料組件以組裝 於PCB 414的祿霞 、^ 且該等凸出終端會6^表面上會形成魏個凸出終端，而 法中將該等電容式麥^過該捲錄面，所以可於SMD方 飞麥克風4〇〇〜600黏著至一主PCB(舉例 况，一蜂果式電話的pThe eighth picture of the tea test, the condenser microphone of the present invention is 5 inches. The utility model comprises: a positive-shaped box-shaped outer casing 5〇2, which has a discharge surface and a closed bottom surface formed by collecting sounds = a plurality of sound holes 5G2a; a diaphragm member/, having one inserted into the square a square surrounding surface of the warehouse-like outer casing and a square inner peripheral diaphragm; a partition 5〇6 having a square surrounding surface and a square inner peripheral surface; a square annular shield 508 for insulating one a back plate 51 〇; the square-shaped back plate 510 ′ having a plurality of sound holes 51 〇 a therethrough; an integrated substrate 12 having a conductor layer 512 b , the conductor layer being detachable from the back plate 510 An electrical connection is provided between the PCBs 514 and formed in an inner surface of a square box-shaped insulator 512a having an open top and bottom portion; and the square plate-shaped PCB 514 having a surface disposed on the pCB A plurality of components (1C, MLCC) and a plurality of protruding terminals 516 formed on the other surface thereof. Here, the diaphragm member 504 includes a pole ring 504a for electrically connecting to the outer casing 502, and a diaphragm 504b which is vibrated by sound pressure. The backing plate 510 includes a metal plate on which an organic 15 1274521 film composed of a plurality of electrets is fused. In the first place, it is desirable for the outer casing 502 to have no acoustic holes at the central portion of its bottom surface because the center of the bottom surface of the outer casing is used in the SMD process for picking up from the tape & reel package. The position of the microphone. The integrated substrate 512 is configured such that the hollow columnar insulator 512a is used as a PC technology using PCB technology, and then a metal plate is formed on both sides and inner peripheral surfaces of the hollow columnar insulator 512a. The conductor layer 512b has an outer diameter smaller than an outer diameter of the periphery thereof. Φ The same system, the first substrate of the integrated substrate 512 according to the present invention configured to implement the conventional insulating function and the second substrate for performing the conductor function may be constructed of an integrated substrate. The outer diameter of the metal plate should be smaller than the outer diameter of the insulator so that it does not come into contact with the outer casing. Here, the insulator may preferably be composed of a glass epoxy substrate, a resin substrate, or a PVC type insulating printed board. Although the 'illustration' is not particularly shown in the figure, the insulator 512a can provide a conductor function in addition to the sinter insulation function: in the middle side thereof, the metal electric ore layer contacts the diaphragm member. 510 and forming a metal electric money layer in the other side thereof contacts the PCB 514, and the iron is connected to the top and bottom metal electric ore layers by using a through hole or a via hole, so that the metal plating layer can be electrically connection. [Sixth embodiment] Sixth embodiment of wind The ninth diagram is an exploded perspective view of a condenser type microphone according to the present invention. The wind 600 includes: a reference to the ninth diagram, the capacitive microphone 1274521 rectangular box-shaped outer casing 602 of the present invention, having an open surface and a closed bottom surface formed by a plurality of sound holes 602a for collecting sound; a diaphragm member 604 having a square surrounding surface inserted into the square box-shaped outer casing and a circular inner peripheral diaphragm; a partition 6〇6 having a square surrounding surface and a circular inner circumference a shield ring 6〇8 having a square surrounding surface for insulating a backing plate 610 and a circular inner door surrounding surface; the dish-shaped backing plate 610 having a plurality of sound holes 61 therethrough整合a; an integrated substrate 612 having an insulator 612a having an open top and bottom portion, a square surrounding surface, and a cylindrical inner peripheral surface, the integrated substrate 612 also having a conductor sound 612b The conductor layer can be electrically connected between the backplane 610 and the PCB 614 and formed in the inner surface of the insulator 612a; and the square-shaped PCB 614 having the disposed The pCB wherein the plurality of components on a surface (1C, MLCC) and forming thereon a plurality of projections on the other surface of the terminal 616. Here, the diaphragm member 604 includes a pole ring 604a for electrically connecting to the outer casing 602, and a diaphragm 604b which is vibrated by sound pressure. The back plate 61A includes a metal plate on which an organic film composed of a plurality of electrets is welded. Further, it is desirable for the outer casing 602 to have no acoustic holes at the central portion of its bottom surface because the center of the bottom surface of the outer casing is used in the SMD process for picking up the microphone from a tape & reel package. s position. The integrated substrate 612 is configured to use the hollow columnar insulator 612a as a PCB using PCB technology, and then form a metal plate in the hollow columnar insulator (the sides and inner peripheral surfaces of § 17 1274521 612a) The conductor layer 612b, the outer diameter of the metal plate is smaller than the outer diameter of the periphery. The same system, the integrated substrate 612 according to the present invention is configured to implement a first substrate with a conventional insulating function and a second substrate for performing a conductor function. The outer surface of the metal plate should be smaller than the outer diameter of the insulator so as not to contact the outer casing. Here, the insulator preferably consists of the following: glass epoxy a substrate, a resin substrate, or a PVC-type insulating printed board. Although not shown in the drawings, the insulator 612a can provide a conductor function in addition to the insulating function: in one of the sides Forming a metal plating layer contacting the diaphragm member 610 and forming a metal plating layer on the other side thereof to contact the PCB 614, and then utilizing a through hole or The via holes are connected to the top and bottom metal plating layers so that the metal plating layer can be electrically connected. [Fourth to Sixth Embodiments] Φ The fourth to sixth embodiments of the condenser microphone The operation mode is as follows: Fig. 11 is a side cross-sectional view showing the assembly of the fourth to sixth embodiments of the present invention, and the component symbols of the components are denoted by the component symbols in the fourth embodiment. The condenser microphones 400 to 600 of the fourth to sixth embodiments each have a square box-shaped outer casing 402 in which the diaphragm member 404, the partition 406, the shield ring 408, the back plate 410, and the integrated casing 412 are sequentially disposed. And a square plate-shaped PCB 114. Then, the end of the 18 1274521 outer casing 402 can be crimped to make it possible to make the capacitive microphones visible in the manufacture of the components. Here, each component is replaced by convenience. The material assembly is assembled on the PCB 414 by Lu Xia, and the protruding terminals will form a convex terminal on the surface of the 6^, and the capacitive type is passed through the recording surface, so SM D side fly microphone 4〇〇~600 sticks to a main PCB (for example, a bee fruit phone p
B)。该些終端416可能係Vdd連接 終端與接=端1及如卜功用所需的終端。 —進#步5之視該等正方形組件的製造與組裝方便性 而疋第四至第’、具體實施例的正方形组件具有形成於一 B1H狀之中的邊緣’致使該等邊緣可彼此接觸。被安置 於該PCB之中的IC &含接面場效電晶體(JFET广放大器； 類比至數位(A/D)轉換器；或是置，其為由該放大器與 該類比至數位(A/D)轉換器所製成的Ic。 第四至第六具體實施例的電容式麥克風的運作方式如 下0 根據本么月之&谷式麥克風的該等凸出終端416會被 連接至主PCB的連接終端。與GND電源會被施加至 該等凸出終端。據此，於根據本發明的電容式麥克風 400〜600中，隔膜404b便會經由外殼4〇2與極環4〇乜被電 連接至PCB 414 ’而背板41G則會經由整合式基底412的 導體層412b被電連接至pcb 414。 於此情況中，源自外界聲源的聲音便會經由該外殼的 聲孔402a流入該麥克風内部並且會傳送至隔膜4〇4b。被收 19 1274521 集至背部腔室中的聲音會經由背板410的聲孔410a傳送至 隔膜404b。 因此，隔膜404b會被聲壓振動。接著，便會改變隔膜 404b與背板410之間的間隙。隔膜404b與背板410所產生 . 的靜電容量會改變，因而便可達到依照聲波來改變電信號 (電壓）的目的。此信號會沿著上面的電連接路徑傳送至被安 置於該PCB 414之中的1C進行放大，接著便會經由該等凸 出終端416被輸出至一外部電路。 • 產業應用性 如上述，根據本發明之電容式麥克風，因為可於表面 黏著裝置（SMD)製程期間確認某個組件的方向，所以便能夠 輕易地互相調整該組件的兩個以上終端連接。據此，便可 防止主PCB的連接終端的連接表面與該電容式麥克風的連 接終端的連接表面產生脫離，同時還可減低可能因為該等 連接終端的連接情形改變或方向（極性）改變所造成的連接 0 失效率。 雖然已經參考本發明的較佳具體實施例於上面說明過 本發明，不過，熟習本技術的人士便可暸解，在不脫離隨 附申請專利範圍中所述之本發明的範疇與概念下仍可對其 進行各種修正或變更。 【圖式簡單說明】 從上面較佳具體實施例的說明中，配合附圖，將可非 常清楚本發明上面及其它的目的與特點，其中·· (§ 1274521 I 第一圖為習用之一般電容式麥克風的概略示意圖； 第二圖為根據本發明之平行管型電容式麥克風的透視 圖； 第三圖為根據本發明之電容式麥克風之第一具體實施 , 例的分解透視圖； _ 第四圖為根據本發明之電容式麥克風之第二具體實施 例的分解透視圖， 第五圖為根據本發明之電容式麥克風之第三具體實施 β例的分解透視圖； 第六圖為本發明之第一、第二、第三具體實施例的組 裝的侧剖視圖； 第七圖為根據本發明之電容式麥克風之第四具體實施 例的分解透視圖； 第八圖為根據本發明之電容式麥克風之第五具體實施 例的分解透視圖； ^ 第九圖為根據本發明之電容式麥克風之第六具體實施 例的分解透視圖；以及 第十圖為本發明之第四、第五、第六具體實施例的組 裝的侧剖視圖。 【主要元件符號說明】 10 電容式麥克風 100 電容式麥克風 102 外殼 21 聲孔 隔膜部件 極環 隔膜 分隔體 絕緣環 背板 聲孔 導體環 印刷電路板 凸出終端 電容式麥克風 外殼 聲孔 隔膜部件 極環 隔膜 分隔體 絕緣環 背板 聲孔 導體環 印刷電路板 凸出終端 22 電容式麥克風 外殼 聲孔 隔膜部件 極環 隔膜 分隔體 絕緣環 背板 聲孔 導體環 印刷電路板 凸出終端 電容式麥克風 外殼 聲孔 隔膜部件 極環 隔膜 分隔體 盾環 背板 聲孔 基底 23 絕緣體 導體層 印刷電路板 凸出終端 電容式麥克風 外殼 聲孔 隔膜部件 極壞 隔膜 分隔體 盾環 背板 聲孔 基底 絕緣體 導體層 印刷電路板 凸出終端 電容式麥克風 外殼 聲孔 隔膜部件 極環 1274521 604b 隔膜 606 分隔體 608 盾環 610 背板 610a 聲孔 612 基底 612a 絕緣體 612b 導體層 614 印刷電路板 616 凸出終端B). The terminals 416 may be connected to the terminal and the terminal 1 and the terminal required for the function. The manufacturing and assembly convenience of the square components is as follows. In the fourth to the fourth embodiment, the square assembly of the embodiment has an edge formed in a B1H shape such that the edges can contact each other. An IC & junction-in-effect transistor (JFET wide amplifier; analog to digital (A/D) converter) placed in the PCB; or set, by the amplifier to analog to digital (A /D) Ic made by the converter. The condenser microphones of the fourth to sixth embodiments operate as follows. 0 The protruding terminals 416 according to the Month & Valley microphone are connected to the main The connection terminal of the PCB and the GND power source are applied to the protruding terminals. Accordingly, in the condenser microphones 400 to 600 according to the present invention, the diaphragm 404b is connected to the pole ring 4 via the housing 4〇2 Electrically connected to PCB 414' and backplane 41G is electrically coupled to pcb 414 via conductor layer 412b of integrated substrate 412. In this case, sound from an external source will flow through sound hole 402a of the housing The microphone is internally and transmitted to the diaphragm 4〇4b. The sound collected in the back chamber is transmitted to the diaphragm 404b via the sound hole 410a of the back plate 410. Therefore, the diaphragm 404b is vibrated by sound pressure. The gap between the diaphragm 404b and the backing plate 410 is changed. The electrostatic capacitance generated by 04b and the backplane 410 changes, so that the electrical signal (voltage) can be changed according to the sound wave. This signal is transmitted along the upper electrical connection path to be placed in the PCB 414. The 1C is amplified and then output to an external circuit via the protruding terminals 416. • Industrial Applicability As described above, the condenser microphone according to the present invention can be confirmed during the surface mount device (SMD) process The orientation of the components so that the two or more terminal connections of the component can be easily adjusted to each other. Accordingly, it is possible to prevent the connection surface of the connection terminal of the main PCB from being separated from the connection surface of the connection terminal of the condenser microphone, and at the same time It is also possible to reduce the connection 0 failure rate which may be caused by the change of the connection condition or the change of the direction (polarity) of the connection terminals. Although the invention has been described above with reference to the preferred embodiments of the present invention, it is familiar with the present technology. It will be appreciated by those skilled in the art that the scope and concept of the invention described in the scope of the appended claims can still be Various modifications and changes will be made. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects and features of the present invention will be apparent from the description of the preferred embodiments of the invention, 1 is a schematic view of a conventional condenser microphone according to the present invention; the second diagram is a perspective view of a parallel tube type condenser microphone according to the present invention; and FIG. 3 is a first embodiment of a condenser microphone according to the present invention, 4 is an exploded perspective view of a second embodiment of a condenser microphone according to the present invention, and FIG. 5 is an exploded perspective view of a third embodiment of a condenser microphone according to the present invention; Figure 6 is a side cross-sectional view showing the assembly of the first, second, and third embodiments of the present invention; and Figure 7 is an exploded perspective view of the fourth embodiment of the condenser microphone according to the present invention; An exploded perspective view of a fifth embodiment of a condenser microphone according to the present invention; ^ ninth is a sixth embodiment of a condenser microphone according to the present invention It exploded perspective view; and a fourth graph a tenth of the present invention, a fifth, a side sectional view of the assembled embodiment of a sixth specific embodiment. [Main component symbol description] 10 Capacitive microphone 100 Capacitive microphone 102 Case 21 Sound hole diaphragm member Polar ring diaphragm separator Insulation ring Back plate Sound hole Conductor ring Printed circuit board Protruding terminal Capacitive microphone housing Sound hole diaphragm member Polar ring Diaphragm Separator Insulation Ring Backplane Sound Hole Conductor Ring Printed Circuit Board Protruding Terminal 22 Capacitive Microphone Housing Sound Hole Diaphragm Parts Polar Ring Diaphragm Separator Insulation Ring Back Plate Sound Hole Conductor Ring Printed Circuit Board Protruding Terminal Capacitive Microphone Housing Sound Hole Diaphragm Parts Polar Ring Diaphragm Separator Shield Ring Backplane Sound Hole Substrate 23 Insulator Conductor Layer Printed Circuit Board Protruding Terminal Capacitive Microphone Housing Sound Hole Diaphragm Parts Very Bad Diaphragm Separator Shield Ring Backplane Sound Hole Base Insulator Conductor Layer Printed Circuit Plate Projection Terminal Capacitive Microphone Housing Sound Hole Diaphragm Parts Polar Ring 1272421 604b Diaphragm 606 Separator 608 Shield Ring 610 Back Plate 610a Sound Hole 612 Substrate 612a Insulator 612b Conductor Layer 614 Printed Circuit Board 616 Projection Terminal