1260180 ★ 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種SMD(表面黏著裝置）可能有向性電 容式麥克風，更明確地說，係關於一種即使在套用SMD之 後仍具有預期的有向性特徵的有向性電容式麥克風。 【先前技術】 一般而言，麥克風可分為全向性麥克風以及有向性麥 φ 克風。有向性麥克風則可分為雙向麥克風與單向麥克風。 雙向麥克風係用於充份產生前向入射聲音以及後向入射聲 音並且衰減橫向入射聲音，以便表示一種形狀8的聲源極 性圖案。此外，雙向麥克風普遍使用於體育場之類的場所 中，這係因為其具有近場特徵。單向麥克風係用於響應寬 廣的前向入射聲音以保持輸出值。於單向麥克風中，後向 入射聲源的輸出值會被衰減，以改良前向入射聲源與後向 入射聲源之間的S/N比。單向麥克風可作為聲音辨識裝置， ❿因為其具有非常清晰的特徵。 不過，很難將SMD套用於駐極電容式麥克風，因為含 有背板以形成駐極（electret)之習用有向性電容式麥克風的 * 每個組件均非利用高溫材料構成。此外，即使用者每個組 件均係利用南溫材料構成’該駐極的電何值在南溫下仍會 改變，從而降低其靈敏度。換言之，已經有人開發一種電 子產品的製造方法以微型化電子產品的尺寸◦為製造微型 化電子產品，SMT(表面黏著技術）已經被廣泛使用。很難將 6 1260180 SMT套用至低溫組件中，因為在SMD回流製程中會施加高 溫至該等電子組件中。不過，因為駐極麥克風係藉由將電 子強制植入被熱黏結於金屬板上的有機膜（舉例來說， FEP、PET、PET、PTFE··.等）之中而構成的，所以，駐極的 效能會在高濕高溫環境下因電子遷徙而下降。 【發明内容】 據此，本發明的目的係提供一種SMD可能有向性電容 • 式麥克風，其結構為利用一具有絕緣特徵的基板來覆蓋駐 極以便利用抗熱材料避免在高溫下讓駐極特徵惡化，並且 • 避免於SMD回流製程中因駐極電位下降而讓麥克風的靈敏 • 度惡化。 為達上面目的，本發明提供一種SMD可能有向性電容 式麥克風，其包括：一外殼，其底侧會形成一聲孔，用以 收集前向聲音，其開放侧會面向該底侧，該開放侧則呈捲 I 曲狀；一插入該外殼中的絕緣環，用以保護内部元件避免 受到外部熱的影響並且提供絕緣功能；一被連接至該外殼 底側的極環，其係位於該絕緣環内部；一碰觸到該極環的 隔膜，其係位於該絕緣環内部；一碰觸到該隔膜的分隔體， 其係位於該絕緣環内部；一面向該隔膜的背板，其係位於 該絕緣環内部，該分隔體係被置於該背板與該隔膜之間； 一導體環，用以支撐該背板，其係位於該絕緣環内部，並 且提供一條連接至該背板的電連接路徑；以及一 PCB，其 會經由該導體環被電連接至該背板，該PCB會經由該外殼 1260180 被電連接至該隔膜，該PCB具有一聲孔用以收集後向聲 音，藉此該麥克風便可提供雙向特徵。 【實施方式】 現在將詳細地參考本發明，其範例圖解於附圖之中。 可能的話，在所有圖式中將以相同的元件符號來代表相同 或類似的部件。 [雙向電容式麥克風] 第一圖為根據本發明之雙向電容式麥克風總結構的剖 面圖。 參考第一圖，有一聲孔l〇2a形成於本發明之電容式麥 克風100的底面上，以便收集前向聲音。一由抗高溫絕緣材 料製成的柱狀絕緣環112係被插入柱狀外殼102之中，以便 保護内部元件。 於該絕緣環112的内部會安裝：一極環104，用以支撐 一隔膜106，並且將該隔膜106電連接至該外殼102，該隔膜 106會依照聲音壓力產生振動；一分隔體108 ; —背板110， 其具有被熱黏結至一金屬層的有機膜以及一形成於該有機 膜之上的駐極；以及一導體環114，用以將該背板電連接至 PCB 116。該絕緣環112與該導體環114均係受撐於PCB 116，該PCB 116含有1C與MLCC之類的組件以及一聲孔 116a。此外，可藉由捲曲外殼102以支撐該PCB 116 ◦ 隔膜106會於外殼102中受撐於極環104。背板110會經 由該柱狀導體環114被連接至且受撐於該PCB 116。聲孔 81260180 ★ IX. Description of the invention: [Technical field of the invention] The present invention relates to a SMD (surface mount device) possible directional capacitive microphone, and more particularly to an expectation even after applying SMD A directional condenser microphone with directional characteristics. [Prior Art] In general, the microphone can be divided into an omnidirectional microphone and a directional microphone. The directional microphone can be divided into a two-way microphone and a one-way microphone. The two-way microphone is used to sufficiently generate forward incident sound as well as backward incident sound and attenuate lateral incident sound to represent a sound source polar pattern of shape 8. In addition, two-way microphones are commonly used in places such as stadiums because of their near-field characteristics. A unidirectional microphone is used to respond to a wide range of forward incident sounds to maintain an output value. In a unidirectional microphone, the output value of the backward incident source is attenuated to improve the S/N ratio between the forward incident source and the backward incident source. A unidirectional microphone can be used as a sound recognition device, because it has very clear features. However, it is difficult to apply SMD to electret condenser microphones because of the conventional directional condenser microphones that have a backplane to form an electret. * Each component is not constructed of a high temperature material. In addition, each component of the user is made up of a material of south temperature. The electrical value of the electret still changes at south temperature, thereby reducing its sensitivity. In other words, an electronic product manufacturing method has been developed to miniaturize the size of electronic products to manufacture miniaturized electronic products, and SMT (Surface Adhesion Technology) has been widely used. It is difficult to apply 6 1260180 SMT to low temperature components because high temperatures are applied to these electronic components during the SMD reflow process. However, since the electret microphone is constructed by forcibly implanting electrons into an organic film (for example, FEP, PET, PET, PTFE, etc.) that is thermally bonded to a metal plate, Extreme performance will decline due to electron migration in high humidity and high temperature environments. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an SMD possible directional capacitive microphone that is constructed to cover a resident pole with a substrate having an insulating feature to avoid the use of a heat resistant material to avoid electret at high temperatures. The characteristics deteriorate, and • Avoid the deterioration of the sensitivity of the microphone due to the drop in the electret potential during the SMD reflow process. In order to achieve the above object, the present invention provides an SMD possible directional condenser microphone, comprising: a casing having a sound hole formed on a bottom side thereof for collecting forward sound, the open side of which faces the bottom side, The open side is in the form of a roll I; an insulating ring inserted into the outer casing to protect the internal components from external heat and providing an insulating function; a pole ring connected to the bottom side of the outer casing is located Inside the insulating ring; a diaphragm that touches the pole ring is located inside the insulating ring; a separator that touches the diaphragm is located inside the insulating ring; and a back plate facing the diaphragm Located inside the insulating ring, the partition system is disposed between the back plate and the diaphragm; a conductor ring for supporting the back plate, located inside the insulating ring, and providing a connection to the back plate a connection path; and a PCB electrically connected to the backplane via the conductor loop, the PCB being electrically connected to the diaphragm via the housing 1260180, the PCB having an acoustic aperture for collecting backward sound The wheat Wind can provide two-way feature. [Embodiment] Reference will now be made in detail to the present invention exemplary embodiments Wherever possible, the same reference numerals will be used to refer to the [Two-way condenser microphone] The first figure is a cross-sectional view showing the overall structure of a two-way condenser microphone according to the present invention. Referring to the first figure, a sound hole 102a is formed on the bottom surface of the condenser microphone 100 of the present invention to collect forward sound. A columnar insulating ring 112 made of a high temperature resistant insulating material is inserted into the cylindrical casing 102 to protect the internal components. The inside of the insulating ring 112 is mounted with a pole ring 104 for supporting a diaphragm 106 and electrically connecting the diaphragm 106 to the outer casing 102. The diaphragm 106 generates vibration according to sound pressure; a partition 108; The backing plate 110 has an organic film thermally bonded to a metal layer and a resident electrode formed on the organic film, and a conductor ring 114 for electrically connecting the backing plate to the PCB 116. The insulating ring 112 and the conductor ring 114 are both supported by the PCB 116. The PCB 116 includes components such as 1C and MLCC and a sound hole 116a. In addition, the diaphragm 106 can be supported by the outer casing 104 in the outer casing 102 by crimping the outer casing 102 to support the PCB 116. The backing plate 110 is coupled to and supported by the PCB 116 via the columnar conductor ring 114. Sound hole 8
(S 1260180 116a係形成於該pcb 116之上，以便從一後方聲源中收集該 後向聲音的聲波。 黏著在背板110上的駐極、分隔體118、隔膜106、以及 絕緣環112均係由耐熱耐化學作用的氟材料、聚合材料、以 及塑膠材料製作而成。換言之，本發明的SMD可能有向性 電容式麥克風係利用耐高溫材料的部件製作而成。該等耐 高溫材料可分為氟材料、聚合材料、以及塑膠材料。利用 該等耐高溫材料可形成薄膜、片狀、捲狀、以及巨大的形 狀。明確地說，該等聚合材料包含ASA、Nylon 6、Nylon 66、(S 1260180 116a is formed on the pcb 116 to collect the sound waves of the backward sound from a rear sound source. The electret, the separator 118, the diaphragm 106, and the insulating ring 112 adhered to the backing plate 110 are both It is made of a fluorine-resistant material, a polymer material, and a plastic material which are resistant to heat and chemical resistance. In other words, the SMD of the present invention may be made of a directional condenser microphone using a member of a high temperature resistant material. Divided into fluorine materials, polymeric materials, and plastic materials. These high temperature resistant materials can be used to form films, sheets, rolls, and huge shapes. Specifically, these polymeric materials include ASA, Nylon 6, Nylon 66,
Nylon 46、LCP、PBT、PC、PC/ABS、PC/PBT、PEEK、PEN、 PES、PET、PMMA、POM、PTFE、SAN、PPS、SBR、以 及TPU ;而該等氟化物樹脂材料則包含PTFE(TFE)、FEP、 PFA、ETFE、CTFE、PVDF、PVE、PCTFE、ECTFE、EPE、Nylon 46, LCP, PBT, PC, PC/ABS, PC/PBT, PEEK, PEN, PES, PET, PMMA, POM, PTFE, SAN, PPS, SBR, and TPU; and these fluoride resin materials contain PTFE (TFE), FEP, PFA, ETFE, CTFE, PVDF, PVE, PCTFE, ECTFE, EPE,
Nylon 6、PP、以及硬pvC。 此外，為防止PCB(116)的組件脫落，可利用高溫用膠 狀焊弹j將该專組件黏著於該PCB之上。於本發明的較佳具體 貝施例中’邊專南溫用膠狀焊劑為§n/Ag、§n/cu、Nylon 6, PP, and hard pvC. In addition, in order to prevent the components of the PCB (116) from falling off, the high-temperature adhesive jig can be used to adhere the component to the PCB. In the preferred embodiment of the present invention, the "adhesive flux for the south" is §n/Ag, §n/cu,
Sn/Ag/Cu、Sn/Ag/Cu/Sb(註冊為 CASTIN™ 的合金）、以及 Sn/Ag/Cu/Bi (註冊為〇ΑΤΕΥΤΜ的合金）。 同時，如第一圖所示，設置在該PCB裸露端上的複數個 連接終端118與120會凸出高於外殼102的捲曲端，以便利用 SMD法將麥克風1〇〇黏著至主PCB，舉例來說，蜂巢式電、 的PCB。如第二圖所示，於該等連接終端的内侧會形成〜_ 形終端120以便被連接至Vdd。於該等連接終端外侧規律間 1260180 隔處則會形成1形接地終端118。接地終端u ::二紋13°分割成三部份，以便排出SMD黏著製程所產生 古的詳細說明中將會明白本發明的雙向電容式麥 克風的運作方式。 、夂 當本發明的雙向電容式麥克風1〇〇的連接 120被直接連接至主㈣或是經由-固定器被連接=主= 時，便可利用vdd與GND來操作本發明的雙向電容 100此日守’隔膜106會經由極環與外殼⑽被電 PCB 116此外’背板nG也會經由導體環114被電連接至pcB 116 〇 此日㈣向I音便會經由外殼的聲孔·從前方 Π6^^116^ 月板no的琴孔ma從後方聲源被傳送至隔膜刚。 據此’前向聲音與後向聲音便會振動隔賴 曾改變隔m〇6與背板11G之間的間隙。藉由 $ :間隙變化來改變隔膜106與背板u。所形成=致 ::獲:：因於聲波的電信號變化。該等電信號 ^妾線被傳送至安裝在PCB116之上犹以進行放大。料 、。放大的―號會被輸出至連接終端118旬2〇。 人如亡述丄該雙向電容式麥克風具有雙向特徵，复 :人=:前向聲音與後向聲音靈敏度並且會衰減橫：聲 因為:、#、㈣外殼的聲孔1G2a諸㈣ 由PCB的聲孔ll6a來收集後向聲音。 工且、、·二 1260180 第五圖為用於闡述本發明之雙向電容式麥克風的特徵 的極性圖案◦第五圖中，周邊上的角度表示的係從以麥克 風為中心的所有360°的方向，而同心圓表示的則係與該麥 克風相距的距離。第五圖中，0°與180°的方向分別表示前方 與後方◦此外，90°與270°表示的則係橫向方向。參考第五 / 圖中所示的極性圖案51，該極性圖案的形狀類似8的形狀， " 其表示前向聲音與後向聲音具有良好的靈敏度，而橫向聲 音則具有衰減特徵。此外，本發明的雙向電容式麥克風可 • 藉由近場特徵而對雜音環境提供極佳的抗衡效果。 [單向電容式麥克風] SMD可能單向電容式麥克風係藉由將一聲阻器（sound resistor)插入第一圖中所述之雙向電容式麥克風之中以衰 減後向聲音而構成者。如第三圖所示，倘若該聲阻器具有 導電特徵的話，便可將該聲阻器安裝於欲由該導體環114來 支撐的背版的後端處。然而，如第四圖所示，倘若該聲阻 I 器並不具導電特徵的話，則可將該聲阻器安裝於該導體環 114的内侧處。 第三圖為本發明之單向電容式麥克風的第一具體實施 _ 例的剖面圖。第四圖為本發明之單向電容式麥克風的第二 具體實施例的剖面圖。 因為第一圖、第三圖與第四圖中具有相同元件符號的 元件表示的係相同的元件，所以，下文將省略其進一步說 明，以免贅述。 參考第三圖，除了於背板110的後端上形成聲阻器210 1260180 Γ電卜容= 電容式麥克風的結構均和第-圖中所述的雙 俜由呈有^數^相R。本發明第—具體實施例的聲阻器2 i 0 二^：==結金屬所構成的。此 相同並且被電連接於導體二:背：。=、和背板110 以外除了 :背板110物上形成聲阻器， 均和第一圖中所具體““列的早向電容式麥克風的結構 π弟时所迷的雙向電容式麥克風相同。 發明第二具體實施例的情況中，因為聲 有 ^體衣114被电連接至PCB 116。 克風==細說明中將會明白本發明的單向電容式麥 二= 的單向電容式麥克風200與3°。的連接終端 士η被直接連接至主PCB或是經由固定器被連接至主 日守’便可稭由施加Vdd與GND來操作本發明的雙向電容 ii=:广隔膜廳會經由極環m與咖 體==;r^ ，時前向聲音便會經由外殼的聲孔lG2a從前方聲源被 至隔M06。後向聲音則會經由pcB ιΐ6的聲孔叫 :方賴傳送至隔膜106。該後向聲音會被聲阻器21〇: ’’或是該後向聲音的相位會被該聲阻器移動，接著該^ (8 12 1260180 2:勺後向耸音或是該已相移的後向 聲孔陶皮傳送至隔請。此時 ：二由二板的 立二1 向聲音會振動隔膜1%。據此，前向聲 曰“辰動隔膜⑽，從而便會改變隔膜 耳 :::二由因聲壓所導致之間_咖變 來說，電二Γ容’便可獲得肇因於聲波的電信號(舉例 袭在)又匕。料電信號會經由電連接線被傳送至安 之上的IC以進行放大。該等經放大的電η卜 被輸出至連接終端118與120。 大H虎冒 妹由tt述，本發明的該等單向電容式麥克風細與_係 ^ 42的聲孔购之前聲源來收集前向聲音並且經 116的聲孔116a^後聲源綠錢向聲音。該等單向 電容式麥克風200與300具有單向特徵用以導引前向聲音: =後向聲音會被聲阻器210與22G衰減而橫向聲音也;被 第六圖為用於闡述本發明之單向電容式麥克風 =性圖m圖中’周邊上的角度表示的係從以麥i :為中心的所有36G。的方向，而.圓表示的則係鱼料 ，風相距的距離。第六财，G。與刚。的方向分別表示前二 ㈣方。此外，90。與270。表示的則係横向方向。 丄 圖中所示的極性圖案52，該極性圖案表示出前向聲音具^ ^好的靈敏度，而後向聲音與橫向聲音則具有衰減:徵。 =。，本發明的單向電容式麥克風可提供另人滿意的清晰 13 1260180 同時，本發明的駐極麥克風100、200、以及300包含由 耐高溫絕緣材料所構成的絕緣環112，用以包圍麥克風的聲 音組件（隔膜、分隔體、以及背板）。據此，該駐極的特徵便 不會於SMD回流製程的高溫下而惡化。換言之，因為絕緣 環112可於高溫下避免發生駐極放電現象，所以便可保護該 _ 駐極。 • 產業應用性 從前文中可知，本發明提供提供一種SMD可能有向性 • 電容式麥克風，其具有絕緣材料結構用以利用聚合物或塑 膠型或氟化物樹脂型的耐高溫絕緣材料來包圍聲音組件。 據此，雖然在230°以上的溫度下無法對習用的有向性電容 式麥克風實施回流製程，但是卻可在260。以上的高溫下對 本發明的有向性電容式麥克風實施SMD回流製程。據此， 使用本發明之有向性電容式麥克風的產品的製程便可獲改 良，從而降低製造成本與錯誤率。 【圖式簡單說明】 - 從上面較佳具體實施例的說明中，配合附圖，將可非 . 常清楚本發明上面及其它的目的與特點，其中： 第一圖為根據本發明之雙向麥克風的剖面圖； 第二圖為根據本發明之雙向麥克風的透視圖； 第三圖為本發明之單向麥克風的第一較佳具體實施例 的剖面圖； 第四圖為本發明之單向麥克風的第二較佳具體實施例 14 1260180 的剖面圖；以及 第五圖與第六圖為本發明之麥克風的操作特徵的極性 圖案。Sn/Ag/Cu, Sn/Ag/Cu/Sb (alloy registered as CASTINTM), and Sn/Ag/Cu/Bi (alloy registered as bismuth). Meanwhile, as shown in the first figure, the plurality of connection terminals 118 and 120 disposed on the bare end of the PCB may protrude above the curled end of the outer casing 102 to adhere the microphone 1 to the main PCB by the SMD method. For example, the honeycomb type, the PCB. As shown in the second figure, a ~-shaped terminal 120 is formed inside the connection terminals to be connected to Vdd. A 1-shaped ground terminal 118 is formed at the 1260180 space between the outer sides of the connection terminals. The grounding terminal u: two-grain 13° is divided into three parts to discharge the SMD adhesion process. The detailed description of the bidirectional capacitive microphone of the present invention will be understood in the detailed description. When the connection 120 of the bidirectional condenser microphone of the present invention is directly connected to the main (four) or connected via the -fixer = main =, the bidirectional capacitor 100 of the present invention can be operated by using vdd and GND. The shovel 'the diaphragm 106 will be electrically connected to the outer casing (10) via the electrical PCB 116. In addition, the 'backplane nG will also be electrically connected to the pcB 116 via the conductor ring 114. This day (four) to the I sound will pass through the sound hole of the outer casing.琴6^^116^ The hole ma of the moon plate no is transmitted from the rear sound source to the diaphragm just. According to this, the forward sound and the backward sound vibrate and the gap between the partition m〇6 and the back plate 11G is changed. The diaphragm 106 and the backing plate u are changed by a change in the gap of $:. Formed = to :: get: due to the electrical signal changes of the sound wave. The electrical signal is transmitted to the PCB 116 for amplification. Material, . The enlarged ― number will be output to the connection terminal 118. The two-way condenser microphone has a two-way characteristic, complex: person =: forward sound and backward sound sensitivity and will attenuate the horizontal: sound because:, #, (four) the sound hole of the outer casing 1G2a (four) by the sound of the PCB Hole ll6a is used to collect the backward sound. The second figure is a polarity pattern for illustrating the features of the bidirectional condenser microphone of the present invention. In the fifth diagram, the angle on the periphery is expressed in all 360° directions centered on the microphone. Concentric circles indicate the distance from the microphone. In the fifth figure, the directions of 0° and 180° indicate the front and the rear, respectively, and the 90° and 270° indicate the lateral direction. Referring to the polarity pattern 51 shown in the fifth/picture, the shape of the polarity pattern is similar to the shape of 8, " which means that the forward sound and the backward sound have good sensitivity, and the lateral sound has an attenuation characteristic. In addition, the two-way condenser microphone of the present invention can provide an excellent counterbalance to the noise environment by the near field feature. [One-way condenser microphone] The SMD may be a one-way condenser microphone by constituting a sound resistor into the two-way condenser microphone described in the first figure to attenuate the backward sound. As shown in the third figure, if the snoring device has a conductive characteristic, the snoring device can be mounted at the rear end of the backing plate to be supported by the conductor ring 114. However, as shown in the fourth figure, if the acoustic resistance device does not have a conductive characteristic, the acoustic resistor can be mounted at the inner side of the conductor ring 114. The third figure is a cross-sectional view of a first embodiment of the unidirectional condenser microphone of the present invention. Figure 4 is a cross-sectional view showing a second embodiment of the unidirectional condenser microphone of the present invention. Since elements having the same component symbols in the first, third, and fourth figures are the same components, further description thereof will be omitted below, so as not to be described again. Referring to the third figure, in addition to forming the acoustic resistor 210 1260180 on the rear end of the back plate 110, the structure of the condenser microphone and the double microphone described in the first figure are represented by the phase R. The acoustic resistor 2 i 0 of the first embodiment of the present invention is composed of a metal. This is the same and is electrically connected to the conductor two: back:. In addition to the backplane 110, the acoustic resistors are formed on the backplane 110, which are the same as the two-way condenser microphones of the "column of the early condenser microphones" in the first figure. In the case of the second embodiment of the invention, the body coating 114 is electrically connected to the PCB 116 because of the sound. The wind direction == fine description will understand the unidirectional capacitive type mai s unidirectional condenser microphone 200 of the present invention and 3°. The connection terminal η is directly connected to the main PCB or is connected to the main day via the holder. The bidirectional capacitor ii= can be operated by applying Vdd and GND to the ii=: the wide diaphragm chamber is connected via the pole ring m When the coffee body ==; r^, the forward sound will be transmitted from the front sound source to the M06 via the sound hole lG2a of the outer casing. The backward sound is transmitted to the diaphragm 106 via the sound hole of the pcB ιΐ6. The backward sound will be stunned by the snoring device 21: ''or the phase of the backward sound will be moved by the snoring resistor, and then the ^ (8 12 1260180 2: scooping back to the towering or the phase shifting The back sound hole is transferred to the compartment. At this time: the sound of the diaphragm is 1% from the vertical direction of the second board. According to this, the forward sound 曰 "the diaphragm (10), thus changing the diaphragm ear :::Secondly, due to the difference between the sound pressure and the voltage change, the electric two-capacitance can obtain the electric signal due to the sound wave (in the example) and the electric signal will be connected via the electric connection line. The ICs transmitted to the upper side are amplified for amplification. The amplified electric powers are output to the connection terminals 118 and 120. The large H tigers are described by the tt, and the unidirectional condenser microphones of the present invention are fine and _ The sound hole of ^ 42 purchases the previous sound source to collect the forward sound and the sound source green money to the sound after the sound hole 116a of 116. The one-way condenser microphones 200 and 300 have a one-way feature for guiding the forward direction. Sound: = the backward sound will be attenuated by the snoring resistors 210 and 22G and the lateral sound is also; the sixth figure is used to illustrate the unidirectional condenser microphone of the present invention = sex In the figure m, the angle on the periphery indicates the direction from all 36G in the center of Mai i:, and the circle indicates the distance between the fish and the wind. The sixth fiscal, G. and Gang. The directions indicate the first two (four) squares. In addition, 90 and 270 indicate the lateral direction. The polarity pattern 52 shown in the figure shows the sensitivity of the forward sound and the backward sound. And lateral sounds have attenuation: sign. The unidirectional condenser microphone of the present invention can provide satisfactory clarity 13 1260180. Meanwhile, the electret microphones 100, 200, and 300 of the present invention are comprised of high temperature resistant insulating materials. The insulating ring 112 is configured to surround the sound components (separator, separator, and back plate) of the microphone. Accordingly, the characteristics of the electret are not deteriorated at the high temperature of the SMD reflow process. In other words, because of the insulating ring 112 can avoid the phenomenon of electret discharge at high temperature, so the _ electret can be protected. • Industrial Applicability As disclosed in the foregoing, the present invention provides a SMD possible directionality • Capacitive microphone with The insulating material structure is used to surround the sound component with a polymer or plastic type or a fluoride resin type high temperature insulating material. Accordingly, although the conventional directional condenser microphone cannot be reflowed at a temperature of 230° or higher. However, the SMD reflow process of the directional condenser microphone of the present invention can be performed at a high temperature of 260 or higher. Accordingly, the process of using the directional condenser microphone of the present invention can be improved, thereby reducing manufacturing. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 2 is a perspective view of a two-way microphone according to the present invention; and FIG. 3 is a cross-sectional view of a first preferred embodiment of the unidirectional microphone of the present invention; A second preferred embodiment of the unidirectional microphone of the invention 14 is a cross-sectional view of the 1260180; and the fifth and sixth figures are the operation of the microphone of the present invention. The polarity pattern of the sign.
【主要元件符號說明】 100 雙向電容式麥克風 102 外殼 102a 聲孔 104 極環 106 隔膜 108 分隔體 110 背板 110a 聲孔 112 絕緣環 114 導體環 116 印刷電路板 116a 聲孔 118 連接終端 120 連接終端 130 排氣溝紋 200 單向電容式麥克風 210 聲阻器 220 聲阻器 300單向電容式麥克風[Main component symbol description] 100 bidirectional condenser microphone 102 housing 102a sound hole 104 pole ring 106 diaphragm 108 separator 110 back plate 110a sound hole 112 insulation ring 114 conductor ring 116 printed circuit board 116a sound hole 118 connection terminal 120 connection terminal 130 Exhaust groove 200 one-way condenser microphone 210 acoustic resistor 220 acoustic resistor 300 one-way condenser microphone