TWI272662B - Substrate treating apparatus and substrate treating method and substrate treating program - Google Patents
Substrate treating apparatus and substrate treating method and substrate treating program Download PDFInfo
- Publication number
- TWI272662B TWI272662B TW095102301A TW95102301A TWI272662B TW I272662 B TWI272662 B TW I272662B TW 095102301 A TW095102301 A TW 095102301A TW 95102301 A TW95102301 A TW 95102301A TW I272662 B TWI272662 B TW I272662B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- stage
- substrate processing
- pad
- coating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 289
- 238000000034 method Methods 0.000 title description 6
- 238000000576 coating method Methods 0.000 claims description 81
- 239000011248 coating agent Substances 0.000 claims description 68
- 238000012545 processing Methods 0.000 claims description 63
- 238000001179 sorption measurement Methods 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 25
- 238000003672 processing method Methods 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 56
- 230000032258 transport Effects 0.000 description 33
- 238000001816 cooling Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 13
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- 238000010586 diagram Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 244000007853 Sarothamnus scoparius Species 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
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- 230000005489 elastic deformation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
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- 239000005416 organic matter Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 208000037804 stenosis Diseases 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Health & Medical Sciences (AREA)
- Coating Apparatus (AREA)
- Animal Behavior & Ethology (AREA)
- Physical Education & Sports Medicine (AREA)
- Rehabilitation Therapy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pain & Pain Management (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Epidemiology (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005053239A JP4378301B2 (ja) | 2005-02-28 | 2005-02-28 | 基板処理装置及び基板処理方法及び基板処理プログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200631074A TW200631074A (en) | 2006-09-01 |
| TWI272662B true TWI272662B (en) | 2007-02-01 |
Family
ID=36947127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095102301A TWI272662B (en) | 2005-02-28 | 2006-01-20 | Substrate treating apparatus and substrate treating method and substrate treating program |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4378301B2 (ja) |
| KR (1) | KR101061611B1 (ja) |
| CN (1) | CN100407367C (ja) |
| TW (1) | TWI272662B (ja) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4884871B2 (ja) * | 2006-07-27 | 2012-02-29 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
| JP5265099B2 (ja) * | 2006-09-11 | 2013-08-14 | オリンパス株式会社 | 基板検査装置 |
| JP4318714B2 (ja) * | 2006-11-28 | 2009-08-26 | 東京エレクトロン株式会社 | 塗布装置 |
| JP4652351B2 (ja) * | 2007-02-02 | 2011-03-16 | 大日本印刷株式会社 | 基板支持装置、基板支持方法 |
| JP2009018917A (ja) * | 2007-07-12 | 2009-01-29 | Tokyo Ohka Kogyo Co Ltd | 塗布装置、基板の受け渡し方法及び塗布方法 |
| JP5188759B2 (ja) * | 2007-08-07 | 2013-04-24 | 東京応化工業株式会社 | 塗布装置及び塗布方法 |
| JP5308647B2 (ja) * | 2007-09-19 | 2013-10-09 | 東京応化工業株式会社 | 浮上搬送塗布装置 |
| JP4541396B2 (ja) | 2007-11-02 | 2010-09-08 | 東京エレクトロン株式会社 | 塗布膜形成装置、基板搬送方法及び記憶媒体 |
| JP4495752B2 (ja) | 2007-11-06 | 2010-07-07 | 東京エレクトロン株式会社 | 基板処理装置及び塗布装置 |
| JP5315013B2 (ja) * | 2008-02-05 | 2013-10-16 | オリンパス株式会社 | 基板搬送装置、及び、基板搬送方法 |
| JP2009231717A (ja) * | 2008-03-25 | 2009-10-08 | Toppan Printing Co Ltd | 基板移動装置および基板搬送装置および基板撮像装置 |
| JP5563752B2 (ja) * | 2008-06-26 | 2014-07-30 | 東京応化工業株式会社 | 塗布装置及び塗布方法 |
| JP5182628B2 (ja) * | 2008-07-02 | 2013-04-17 | 大日本印刷株式会社 | カラーフィルタの製造方法 |
| JP5373331B2 (ja) * | 2008-07-29 | 2013-12-18 | 株式会社日立ハイテクノロジーズ | 基板処理装置 |
| JP2010093125A (ja) * | 2008-10-09 | 2010-04-22 | Toray Eng Co Ltd | 基板処理システムおよび基板処理方法 |
| JP5391671B2 (ja) * | 2008-12-03 | 2014-01-15 | セイコーエプソン株式会社 | 液滴吐出装置 |
| KR101057355B1 (ko) * | 2009-08-21 | 2011-08-17 | 주식회사 나래나노텍 | 기판 부상 유닛, 및 이를 구비한 기판 이송 장치 및 코팅 장치 |
| KR101071583B1 (ko) | 2009-08-21 | 2011-10-10 | 주식회사 케이씨텍 | 부상식 기판 코터 장치 |
| JP4916035B2 (ja) | 2009-08-28 | 2012-04-11 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
| KR101051767B1 (ko) * | 2009-09-01 | 2011-07-25 | 주식회사 케이씨텍 | 부상식 기판 코터 장치 |
| JP4896236B2 (ja) * | 2010-01-21 | 2012-03-14 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
| JP5189114B2 (ja) * | 2010-01-29 | 2013-04-24 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| DE102010008233A1 (de) * | 2010-02-11 | 2011-08-11 | Schmid Technology GmbH, 68723 | Vorrichtung und Verfahren zum Transport von Substraten |
| CN102763209B (zh) * | 2010-02-17 | 2017-02-08 | 株式会社尼康 | 搬送装置、搬送方法、曝光装置、以及元件制造方法 |
| TW201214609A (en) | 2010-09-27 | 2012-04-01 | Toray Eng Co Ltd | Substrate conveying apparatus |
| JP5663297B2 (ja) * | 2010-12-27 | 2015-02-04 | 東京応化工業株式会社 | 塗布装置 |
| KR101255106B1 (ko) * | 2011-01-27 | 2013-04-19 | 에이피시스템 주식회사 | 웹 처리 시스템 |
| KR102193251B1 (ko) * | 2011-05-13 | 2020-12-22 | 가부시키가이샤 니콘 | 기판의 교환 장치 |
| CN103065998A (zh) * | 2011-10-21 | 2013-04-24 | 东京毅力科创株式会社 | 处理台装置及使用该处理台装置的涂布处理装置 |
| KR101818070B1 (ko) | 2012-01-18 | 2018-01-12 | 주식회사 케이씨텍 | 기판 처리 장치 |
| CN104380435B (zh) * | 2012-05-29 | 2018-04-06 | 周星工程股份有限公司 | 基板加工装置及基板加工方法 |
| JP6055253B2 (ja) * | 2012-09-25 | 2016-12-27 | 東レエンジニアリング株式会社 | 基板浮上装置および基板浮上量測定方法 |
| CN103035556B (zh) * | 2012-12-29 | 2015-09-02 | 山东凯胜电子股份有限公司 | 接触式智能卡模块载带气动悬浮装置 |
| KR102072390B1 (ko) * | 2013-06-18 | 2020-02-04 | (주)테크윙 | 테스트핸들러 |
| JP6340693B2 (ja) * | 2013-07-18 | 2018-06-13 | 株式会社ブイ・テクノロジー | 基板の保持装置及び密着露光装置並びに近接露光装置 |
| CN108307587B (zh) * | 2016-03-08 | 2019-12-06 | 苏州市相城区黄桥工业园经济发展有限公司 | 一种bga基板的涂布吸附装置的工作方法 |
| CN105947675B (zh) * | 2016-06-24 | 2018-11-30 | 京东方科技集团股份有限公司 | 一种传送装置 |
| CN110520798B (zh) * | 2017-03-31 | 2021-11-16 | 株式会社尼康 | 物体交换装置、物体处理装置、平板显示器的制造方法、元件制造方法、物体交换方法、以及物体处理方法 |
| CN107116914B (zh) * | 2017-05-10 | 2019-10-29 | 京东方科技集团股份有限公司 | 工作基台及其控制方法、喷墨打印系统 |
| JP2019102540A (ja) * | 2017-11-29 | 2019-06-24 | 三星ダイヤモンド工業株式会社 | 基板搬出装置 |
| KR102057836B1 (ko) | 2019-03-11 | 2019-12-20 | 주식회사 케이씨텍 | 기판 처리 장치 |
| JP7336955B2 (ja) * | 2019-10-10 | 2023-09-01 | 東京エレクトロン株式会社 | 基板処理システム、及び基板処理方法 |
| KR102357463B1 (ko) * | 2020-05-13 | 2022-02-04 | (주)에스티아이 | 다중 기판 처리 장치 및 이를 이용한 ocr 잉크젯 시스템 |
| KR102392519B1 (ko) * | 2020-05-29 | 2022-04-29 | (주)에스티아이 | 다중 기판 처리 장치 및 이를 이용한 ocr 잉크젯 시스템 |
| KR102624573B1 (ko) * | 2020-08-20 | 2024-01-15 | 세메스 주식회사 | 기판 처리 장치 및 잉크젯 장치 |
| KR102766053B1 (ko) * | 2022-09-19 | 2025-02-13 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151074A (ja) * | 1998-11-17 | 2000-05-30 | Nec Toyama Ltd | 薄板基板の液体レジスト塗布方法 |
| JP2000164671A (ja) * | 1998-11-27 | 2000-06-16 | Tokyo Electron Ltd | 基板処理装置 |
| JP4845280B2 (ja) * | 2001-03-21 | 2011-12-28 | 株式会社半導体エネルギー研究所 | レーザアニール装置 |
| JP2002353125A (ja) | 2001-05-29 | 2002-12-06 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
| JP3933524B2 (ja) * | 2002-05-30 | 2007-06-20 | 東京エレクトロン株式会社 | 基板処理装置 |
-
2005
- 2005-02-28 JP JP2005053239A patent/JP4378301B2/ja not_active Expired - Fee Related
-
2006
- 2006-01-20 TW TW095102301A patent/TWI272662B/zh not_active IP Right Cessation
- 2006-02-27 KR KR1020060018737A patent/KR101061611B1/ko not_active Expired - Fee Related
- 2006-02-28 CN CN2006100580604A patent/CN100407367C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100407367C (zh) | 2008-07-30 |
| CN1828828A (zh) | 2006-09-06 |
| TW200631074A (en) | 2006-09-01 |
| KR101061611B1 (ko) | 2011-09-01 |
| JP2006237482A (ja) | 2006-09-07 |
| KR20060095504A (ko) | 2006-08-31 |
| JP4378301B2 (ja) | 2009-12-02 |
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|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |